CN211906207U - Computer CPU radiator - Google Patents
Computer CPU radiator Download PDFInfo
- Publication number
- CN211906207U CN211906207U CN202020808165.2U CN202020808165U CN211906207U CN 211906207 U CN211906207 U CN 211906207U CN 202020808165 U CN202020808165 U CN 202020808165U CN 211906207 U CN211906207 U CN 211906207U
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- Prior art keywords
- water
- heat dissipation
- computer cpu
- ceramic substrate
- water pipe
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- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims abstract description 37
- 230000017525 heat dissipation Effects 0.000 claims abstract description 22
- 239000000428 dust Substances 0.000 claims abstract description 21
- 238000001816 cooling Methods 0.000 claims abstract description 9
- 239000000919 ceramic Substances 0.000 claims description 16
- 239000000758 substrate Substances 0.000 claims description 16
- 239000012528 membrane Substances 0.000 claims description 6
- 230000000694 effects Effects 0.000 abstract description 5
- 238000000926 separation method Methods 0.000 abstract description 3
- 238000000034 method Methods 0.000 description 7
- 241000883990 Flabellum Species 0.000 description 4
- 238000010586 diagram Methods 0.000 description 2
- 229920003043 Cellulose fiber Polymers 0.000 description 1
- 230000002411 adverse Effects 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- 239000008358 core component Substances 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 230000000737 periodic effect Effects 0.000 description 1
- 229920000642 polymer Polymers 0.000 description 1
- 238000001179 sorption measurement Methods 0.000 description 1
- 239000002023 wood Substances 0.000 description 1
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- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
The utility model discloses a computer CPU radiator, including the heat dissipation organism, one side of heat dissipation organism is provided with the water-cooling box, the inside of water-cooling box is provided with water pump and water tank, and the water pump is located one side of water tank, the inside of heat dissipation organism is provided with the water pipe, the front end of water pipe is provided with dust keeper, the upper end of water pipe is provided with wet quick sensor. A computer CPU radiator, general wind heat dissipation and water heat dissipation have been combined for radiating effect has obtained great promotion, some devices have still been add and have improved the radiating efficiency, dust keeper has been add behind the fan, can effectual separation dust, radiating effect has been improved, humidity sensitive sensor has been add, can be timely send out the suggestion under the condition of leaking, remind people to leak, let people in time close the power, reduce the harm to CPU, bring better use prospect.
Description
Technical Field
The utility model belongs to the technical field of the computing machine machinery, concretely relates to computer CPU radiator.
Background
Computers are indispensable electronic products in daily life and work, wherein a CPU is one of main devices of electronic computers and is a core accessory in the computers. The computer CPU radiator has the functions of mainly explaining computer instructions and processing data in computer software, a CPU is responsible for reading instructions, decoding the instructions and executing core components of the instructions, however, in hot summer, because the temperature in the atmosphere is too high, the computer can generate heat more quickly and is difficult to dissipate, in the prior art, the CPU heat dissipation is mainly realized in two modes of wind dissipation and water dissipation, in a general wind dissipation structure, after a long service time, a layer of ash can be accumulated in fan blades, the heat dissipation effect can be influenced by continuous use, when water is dissipated suddenly, people cannot know the water dissipation, the service life of the CPU is influenced, certain adverse effect is brought to the use process of people, and the computer CPU radiator is provided.
SUMMERY OF THE UTILITY MODEL
Solves the technical problem
The utility model provides a not enough to prior art, the utility model provides a computer CPU radiator has combined general wind heat dissipation and water heat dissipation for radiating effect has obtained great promotion, has add dust keeper behind the fan, can effectual separation dust, has add humidity sensitive sensor, can be timely send out the suggestion under the condition of leaking, reduces advantages such as the harm to CPU, can effectively solve the problem in the background art.
Technical scheme
In order to achieve the above purpose, the utility model adopts the following technical scheme: the utility model provides a computer CPU radiator, includes the heat dissipation organism, one side of heat dissipation organism is provided with the water-cooling box, the inside of water-cooling box is provided with water pump and water tank, and the water pump is located one side of water tank, the inside of heat dissipation organism is provided with the water pipe, the front end of water pipe is provided with dust keeper, the upper end of water pipe is provided with wet quick sensor.
Furthermore, the humidity-sensitive sensor comprises a buzzer, an output line, an interdigital electrode, a humidity sensing membrane, a ceramic substrate and a pin, wherein the buzzer is located on one side of the ceramic substrate, the output line is located on the outer surface of the front end of the ceramic substrate, the interdigital electrode is located on the outer surface of the upper end of the humidity sensing membrane, and the pin is located on the outer surface of the lower end of the ceramic substrate.
Furthermore, the input end of the output line is electrically connected with the output end of the buzzer, the input end of the interdigital electrode is electrically connected with the output end of the output line, the upper end outer surface of the humidity sensing film is fixedly connected with the lower end outer surface of the interdigital electrode, and the lower end outer surface of the ceramic substrate is fixedly connected with the upper end outer surface of the pin.
Furthermore, the dustproof device comprises a rear bottom plate, a sponge dustproof net, a circle center, a support frame and a front plate, the rear bottom plate is located on the outer surface of the rear end of the sponge dustproof net, the circle center is located at one end of the support frame, and the front plate is located at the front end of the rear bottom plate.
Furthermore, the outer surface of the front end of the rear bottom plate is fixedly connected with the outer surface of the rear end of the sponge dust screen, the outer wall of the circle center is fixedly connected with one end of the support frame, and the outer surface of the rear end of the front plate is fixedly connected with the outer surface of the front end of the sponge dust screen.
Drawings
Fig. 1 is the overall structure schematic diagram of the CPU heat sink of the present invention.
Fig. 2 is a schematic diagram of the humidity sensor of the CPU heat sink of the present invention.
Fig. 3 is a schematic view of a dustproof device of a CPU heat sink of a computer according to the present invention.
In the figure: 1. a conduit pipe; 2. water-cooling the box body; 3. a water pump; 4. a water tank; 5. a moisture sensitive sensor; 6. a heat dissipation machine body; 7. a dust-proof device; 501. a buzzer; 502. an output line; 503. an interdigital electrode; 504. a wetness-sensitive film; 505. a ceramic substrate; 506. a pin; 701. a rear floor; 702. a sponge dust screen; 703. the center of a circle; 704. a support frame; 705. a front plate.
Detailed Description
In order to make the objects, technical solutions and advantages of the embodiments of the present invention clearer, the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are some, but not all, embodiments of the present invention. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative efforts belong to the protection scope of the present invention.
Example 1
As shown in fig. 1-2, a computer CPU radiator, including heat dissipation organism 6, heat dissipation organism 6 is the alloy material of cuboid structure, can be effectual to temperature control, one side of heat dissipation organism 6 is provided with water-cooling box 2, the inside of water-cooling box 2 is provided with water pump 3 and water tank 4, and water pump 3 is located one side of water tank 4, the inside of heat dissipation organism 6 is provided with water pipe 1, be parallel to each other between the water pipe 1, the front end of water pipe 1 is provided with dust keeper 7, the upper end of water pipe 1 is provided with wet quick sensor 5, the quantity of dust keeper 7 is two sets of.
The humidity sensor 5 comprises a buzzer 501, an output line 502, an interdigital electrode 503, a humidity sensing membrane 504, a ceramic substrate 505 and pins 506, wherein the buzzer 501 is composed of a vibrating device and a resonance device and gives out sound warning, the interdigital electrode 503 is an electrode with periodic patterns in the finger-shaped or comb-shaped surface, the buzzer 501 is positioned on one side of the ceramic substrate 505, the output line 502 is positioned on the outer surface of the front end of the ceramic substrate 505, the interdigital electrode 503 is positioned on the outer surface of the upper end of the humidity sensing membrane 504, the pins 506 are positioned on the outer surface of the lower end of the ceramic substrate 505, and the number of the pins 506 is two.
The input end of the output line 502 is electrically connected with the output end of the buzzer 501, the input end of the interdigital electrode 503 is electrically connected with the output end of the output line 502, the upper end outer surface of the humidity sensing film 504 is fixedly connected with the lower end outer surface of the interdigital electrode 503, the lower end outer surface of the ceramic substrate 505 is fixedly connected with the upper end outer surface of the pin 506, when liquid in water heat dissipation accidentally flows out, internal humidity is increased, the moisture is detected by the humidity sensing film 504, the interdigital electrode 503 gives a prompt to the output line 502, the buzzer 501 receives information and gives an alarm to warn people, and when people hear the alarm, the power supply is immediately turned off.
In the case of the example 2, the following examples are given,
as shown in fig. 1 and 3, the dust-proof device 7 includes a rear bottom plate 701, a sponge dust-proof net 702, a circle center 703, a support frame 704 and a front plate 705, the sponge dust-proof net 702 is made of wood cellulose fiber or foamed plastic polymer, and can effectively reduce dust adsorption, the rear bottom plate 701 is located on the outer surface of the rear end of the sponge dust-proof net 702, the circle center 703 is located at one end of the support frame 704, and the front plate 705 is located at the front end of the rear bottom plate 701.
The front end surface of back bottom plate 701 and the rear end surface fixed connection of sponge dust screen 702, the outer wall of centre of a circle 703 and the one end fixed connection of support frame 704, the rear end surface of front bezel 705 and the front end surface fixed connection of sponge dust screen 702, sponge dust screen 702 can dismantle, and when radiator fan worked to a certain time, often the flabellum adsorbs many dusts on the surface back, adds dust keeper 7 behind the flabellum, and the flabellum during operation is owing to the effective separation of the sponge dust screen 702 of installation for the dust can't adsorb on the flabellum, makes radiator fan can the permanent effectual heat dissipation that dispels the heat.
It is noted that, herein, relational terms such as first and second (a, b, etc.) and the like may be used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions. Also, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus. Without further limitation, an element defined by the phrase "comprising an … …" does not exclude the presence of other identical elements in a process, method, article, or apparatus that comprises the element.
The basic principles and the main features of the invention and the advantages of the invention have been shown and described above. It will be understood by those skilled in the art that the present invention is not limited to the above embodiments, and that the foregoing embodiments and descriptions are provided only to illustrate the principles of the present invention without departing from the spirit and scope of the present invention. The scope of the invention is defined by the appended claims and equivalents thereof.
Claims (5)
1. The utility model provides a computer CPU radiator, includes heat dissipation organism (6), its characterized in that: one side of heat dissipation organism (6) is provided with water-cooling box (2), the inside of water-cooling box (2) is provided with water pump (3) and water tank (4), and water pump (3) are located one side of water tank (4), the inside of heat dissipation organism (6) is provided with water pipe (1), the front end of water pipe (1) is provided with dust keeper (7), the upper end of water pipe (1) is provided with wet quick sensor (5).
2. The computer CPU heat sink of claim 1, wherein: the humidity sensor (5) comprises a buzzer (501), an output line (502), an interdigital electrode (503), a humidity sensing membrane (504), a ceramic substrate (505) and a pin (506), wherein the buzzer (501) is positioned on one side of the ceramic substrate (505), the output line (502) is positioned on the outer surface of the front end of the ceramic substrate (505), the interdigital electrode (503) is positioned on the outer surface of the upper end of the humidity sensing membrane (504), and the pin (506) is positioned on the outer surface of the lower end of the ceramic substrate (505).
3. The computer CPU heat sink of claim 2, wherein: the input end of the output line (502) is electrically connected with the output end of the buzzer (501), the input end of the interdigital electrode (503) is electrically connected with the output end of the output line (502), the outer surface of the upper end of the humidity sensing film (504) is fixedly connected with the outer surface of the lower end of the interdigital electrode (503), and the outer surface of the lower end of the ceramic substrate (505) is fixedly connected with the outer surface of the upper end of the pin (506).
4. The computer CPU heat sink of claim 1, wherein: the dustproof device (7) comprises a rear bottom plate (701), a sponge dustproof net (702), a circle center (703), a support frame (704) and a front plate (705), wherein the rear bottom plate (701) is located on the outer surface of the rear end of the sponge dustproof net (702), the circle center (703) is located at one end of the support frame (704), and the front plate (705) is located at the front end of the rear bottom plate (701).
5. The computer CPU heat sink of claim 4, wherein: the outer surface of the front end of the rear bottom plate (701) is fixedly connected with the outer surface of the rear end of the sponge dust screen (702), the outer wall of the circle center (703) is fixedly connected with one end of the support frame (704), and the outer surface of the rear end of the front plate (705) is fixedly connected with the outer surface of the front end of the sponge dust screen (702).
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN202020808165.2U CN211906207U (en) | 2020-05-15 | 2020-05-15 | Computer CPU radiator |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN202020808165.2U CN211906207U (en) | 2020-05-15 | 2020-05-15 | Computer CPU radiator |
Publications (1)
Publication Number | Publication Date |
---|---|
CN211906207U true CN211906207U (en) | 2020-11-10 |
Family
ID=73270149
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
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CN202020808165.2U Active CN211906207U (en) | 2020-05-15 | 2020-05-15 | Computer CPU radiator |
Country Status (1)
Country | Link |
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CN (1) | CN211906207U (en) |
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2020
- 2020-05-15 CN CN202020808165.2U patent/CN211906207U/en active Active
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GR01 | Patent grant | ||
GR01 | Patent grant | ||
CP03 | Change of name, title or address |
Address after: 402760 Factory Buildings 1, 2, 3, and 4, No. 51 Xinli Road, Qinggang Street, Bishan District, Chongqing Patentee after: Chongqing Yingfan Technology Co.,Ltd. Country or region after: China Address before: 402760 No.8 Tangfang West 2nd Road, Qinggang street, Bishan District, Chongqing Patentee before: Chongqing Yingfan Precision Hardware Co.,Ltd. Country or region before: China |
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CP03 | Change of name, title or address |