CN211896407U - Complete device for standard discharge and efficient sedimentation of low-concentration copper-containing wastewater in semiconductor industry - Google Patents
Complete device for standard discharge and efficient sedimentation of low-concentration copper-containing wastewater in semiconductor industry Download PDFInfo
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- CN211896407U CN211896407U CN202020302700.7U CN202020302700U CN211896407U CN 211896407 U CN211896407 U CN 211896407U CN 202020302700 U CN202020302700 U CN 202020302700U CN 211896407 U CN211896407 U CN 211896407U
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Abstract
The utility model discloses a semiconductor trade low concentration copper-containing waste water discharge to reach standard and high-efficient integrated equipment that subsides, its structure includes that the first that connects gradually through the pipeline, two, three, four, five reaction tanks and inclined plate sedimentation tank, waste water inlet tube is connected to first reaction tank, the exit tube that has the sludge reflux pump is connected with the pipe-line mixer bottom the inclined plate sedimentation tank, the fourth reaction tank is connected to the pipe-line mixer, the sludge reflux pump is close to the sludge conveying pipe that has the sludge pump of inclined plate sedimentation tank bottom exit tube connection of one side. The utility model has the advantages that: the hydrogen peroxide remover saves the cost of the medicament, has high removal speed and high efficiency; the complex copper is removed by combining the magnesium chloride and the recapture agent, the process is simple, and the investment cost is low; liquid alkali is added into the returned sludge, so that the sludge settling speed is accelerated, the surface load of the inclined plate sedimentation tank is improved, and the floor area of the sedimentation tank is reduced; the volume of the sludge is greatly reduced, the scale of the dehydrator is reduced, and a sludge concentration tank is not required.
Description
Technical Field
The utility model relates to a produced low concentration copper-containing waste water standard discharge and high-efficient integrated equipment who subsides of semiconductor trade belongs to waste water treatment technical field.
Background
Various waste waters are generated in semiconductor manufacturing processes, including copper-containing waste waters with a high water content. At present, the high-concentration copper-containing waste liquid is generally recovered by adopting a commission treatment mode, and the low-concentration copper-containing waste liquid is independently discharged into a waste water treatment system for treatment. The pollutants in the copper-containing wastewater mainly comprise hydrogen peroxide, copper ions and complex copper, wherein the content of the complex copper is up to more than 70%, and the complex copper is difficult to precipitate by adding alkali.
In the prior art, the copper-containing wastewater complex breaking mode mainly comprises the processes of catalytic ozonation, Fenton oxidation, addition of a heavy-duty capturing agent and the like, but has the following defects: (1) when the ozone process is adopted to treat the copper-containing wastewater, the ozone utilization rate is low, so that the ozone adding amount is too large, and the investment cost is high; (2) when the Fenton process is adopted to treat the low-concentration copper-containing wastewater, the dosage of ferric salt is large, the sludge production amount is large, the complex copper is removed at a certain efficiency, and the risk that the effluent does not reach the standard exists; (3) the recapture agent is high in price, and the cost of the agent is greatly increased by using the recapture agent alone; (4) the water content of the copper-containing sludge generated by the physicochemical treatment is extremely high and reaches more than 99 percent, so that the volume of the copper-containing sludge is larger, and the sludge disposal cost and the investment cost of a sludge concentration tank are increased.
Chinese patent CN105016532A 'treatment method of low-concentration wastewater containing complex copper', the main process flow is as follows: a pH adjusting tank, a sodium hydrosulfite reduction tank, a quick lime reaction tank, a flocculation tank and a sedimentation tank. The main problems of the process are that sodium hydrosulfite is toxic, is easy to decompose in hot water, emits pungent smell, and generates copper-containing precipitate particles which are very fine and cannot be completely precipitated.
Chinese patent CN106103354A "method and apparatus for treating copper-containing wastewater" decomposes hydrogen peroxide in wastewater by adjusting pH of the wastewater to 4 or more, then adds calcium compound and magnesium compound to generate precipitate under the condition of pH 9-13, and finally performs solid-liquid separation. The process only removes hydrogen peroxide by pH adjustment, the reaction time is long, the removal rate is low, and the residual hydrogen peroxide can also influence the precipitation; the process has large dosage of calcium compound and magnesium compound, and simultaneously increases the sludge yield; the magnesium hydroxide and copper hydroxide precipitate produced by the process has high water content and large sludge volume.
Chinese patent CN105502739A 'a method for breaking complexing and synchronously removing heavy metal by self-reinforced ozone', the main process is as follows: pH adjustment, ozone vein breaking and microporous filtration. When the ozone process is adopted to treat the copper-containing wastewater, the ozone utilization rate is low, so that the ozone adding amount is too large, and the operation cost is high.
Chinese patent CN206266368U, a micro-electrolysis high-density precipitation Fenton oxidation system for treating industrial wastewater, the main process flow of which is as follows: iron-carbon micro-electrolysis, flocculation, hydrogen peroxide/recapture and UV are added, and the sludge directly flows back to the flocculation tank. The process has the following problems: (1) the filler is lost under the acidic condition and needs to be filled periodically; (2) the pH value of the wastewater after micro-electrolysis treatment can rise, and the Fenton reaction efficiency is reduced because the process does not add sulfuric acid and hydrogen peroxide is easy to decompose; (3) if the effluent turbidity is high, the UV utilization rate is low, and the operation cost is high.
From the above, the prior art treatment process has the following problems: when the physicochemical process method is used for treating the low-concentration copper-containing wastewater in the semiconductor industry, in order to ensure that copper ions are discharged after reaching the standard, the dosage of the medicament is large, and the medicament cost is increased; the sludge volume is increased due to high water content of the sludge, and the sludge treatment cost is increased; the surface load of the sedimentation tank is lower, the occupied area is larger, and the like.
SUMMERY OF THE UTILITY MODEL
The utility model provides a semiconductor industry low concentration copper-containing waste water is up to standard discharges and high-efficient settlement integrated equipment, its purpose aims at overcoming the above-mentioned defect that prior art exists, realizes that water quality of water is up to standard, treatment process is simple, the medicament is with low costs, mud is small, index such as sedimentation tank surface load height.
The technical solution of the utility model is as follows: semiconductor trade low concentration copper-containing waste water is up to standard discharges and high-efficient settlement integrated equipment, its structure includes the first reaction tank that connects gradually through the pipeline, the second reaction tank, the third reaction tank, the fourth reaction tank, fifth reaction tank and inclined plate sedimentation tank, the waste water inlet tube is connected to first reaction tank, the exit tube and the pipe-line mixer that have the sludge reflux pump are connected to the inclined plate sedimentation tank bottom, the fourth reaction tank is connected to the pipe-line mixer, the sludge reflux pump is close to the sludge conveying pipe that has the sludge pump of inclined plate sedimentation tank bottom exit tube connection of one side of inclined plate sedimentation tank.
Preferably, one side of the first reaction tank is provided with H2SO4The device comprises a dosing port and a NaOH dosing port, wherein a hydrogen peroxide remover dosing port and a magnesium chloride dosing port are arranged on one side of a second reaction tank, a sodium hydroxide dosing port and a recapture agent dosing port are arranged on one side of a third reaction tank, a ferric chloride dosing port is arranged on a pipeline between the third reaction tank and a fourth reaction tank, a sodium hydroxide dosing port is arranged on one side of the fourth reaction tank, a PAM dosing port is arranged on one side of a fifth reaction tank, and a sodium hydroxide dosing device is arranged at an inlet of a pipeline mixer.
The utility model has the advantages that: firstly, hydrogen peroxide in the wastewater is removed by using a hydrogen peroxide remover, the traditional sodium bisulfite reduction process is replaced, the adding amount of the remover is far less than that of sodium bisulfite, the medicament cost is saved, and the removing speed is high and the efficiency is high.
And secondly, removing the complex copper by adopting a method combining magnesium chloride and a recapture agent, wherein the stability of the copper ions in the effluent is less than 0.3mg/L or 0.1mg/L, the process is simple, and the investment cost is low.
Thirdly, adding liquid caustic soda into the returned sludge to enable OH to be reacted-The copper hydroxide precipitate generated in the sludge circulation process is enlarged in a ring shape to form modified sludge, and water molecules are difficult to be brought in, so that the generated sludge has low water content and high density. When the sludge is settled, the sludge settling speed can be accelerated, the surface load of the inclined plate sedimentation tank can be further improved, and the settlement is reducedThe sedimentation tank occupies the area.
Fourthly, the concentration of the generated sludge is 5 to 10 percent (the concentration of the copper-containing sludge generated by the existing chemical precipitation method is 0.2 to 0.5 percent), so that the volume of the sludge can be greatly reduced, the treatment scale of the dehydrator can be correspondingly reduced, and meanwhile, a sludge concentration tank is not required to be arranged due to the high concentration of the sludge. Thereby reducing the sludge disposal cost, the investment, the operation cost and the occupied area.
Drawings
FIG. 1 is a schematic structural diagram of the complete device for achieving the discharge standard and the high-efficiency sedimentation of the low-concentration copper-containing wastewater in the semiconductor industry.
In the figure, 1 is a first reaction tank, 2 is a second reaction tank, 3 is a third reaction tank, 4 is a fourth reaction tank, 5 is a fifth reaction tank, 6 is an inclined plate sedimentation tank, 7 is a pipeline mixer, 8 is a sludge reflux pump, 9 is a sludge delivery pump, and 10 is a dosing valve.
Detailed Description
The present invention will be described in further detail with reference to examples and embodiments.
As shown in fig. 1, semiconductor industry low concentration copper-containing waste water is up to standard discharges and high-efficient settlement integrated equipment, its structure includes the first reaction tank 1 that connects gradually through the pipeline, the second reaction tank 2, the third reaction tank 3, the fourth reaction tank 4, fifth reaction tank 5 and inclined plate sedimentation tank 6, waste water inlet tube is connected to first reaction tank 1, the exit tube that has sludge reflux pump 8 is connected with pipe mixer 7 in 6 bottoms of inclined plate sedimentation tank, pipe mixer 7 is connected fourth reaction tank 4, sludge reflux pump 8 is close to the sludge conveying pipe that has sludge transfer pump 9 in 6 bottoms exit tubes connection of inclined plate sedimentation tank of one side of inclined plate sedimentation tank.
One side of the first reaction tank 1 is provided with H2SO4A chemical adding port and a NaOH chemical adding port, a hydrogen peroxide remover chemical adding port and a magnesium chloride chemical adding port are arranged on one side of the second reaction tank 2, a sodium hydroxide chemical adding port and a recapture agent chemical adding port are arranged on one side of the third reaction tank 3, a ferric chloride chemical adding port is arranged on a pipeline between the third reaction tank 3 and the fourth reaction tank 4, a sodium hydroxide chemical adding port is arranged on one side of the fourth reaction tank 4, PAM (polyacrylamide) chemical adding ports are arranged on one side of the fifth reaction tank 5A sodium hydroxide dosing device 10 is arranged at the inlet of the pipeline mixer 7 (namely, at the outlet pipe close to the bottom of the inclined plate sedimentation tank 6).
According to the structure, during work, the pH value of the copper-containing wastewater is adjusted to be neutral; adding a hydrogen peroxide remover and a magnesium chloride solution; then adjusting the pH value to be alkaline, and adding a recapture agent for reaction; respectively and sequentially adding ferric chloride solution and polyacrylamide solution into effluent to carry out coagulation flocculation reaction; then entering an inclined plate sedimentation tank; part of the sludge flows back to the coagulation tank through the pipeline mixer, and a liquid caustic soda dosing device is arranged at the inlet of the pipeline mixer.
The method comprises the following specific steps:
the copper-containing wastewater enters a first reaction tank 1 and is added with NaOH and H2SO4Adjusting the pH value of the wastewater to be neutral, and reacting for 15-20 min;
the effluent of the first reaction tank 1 enters a second reaction tank 2, a hydrogen peroxide remover and a magnesium chloride solution are added, the hydrogen peroxide remover can rapidly decompose hydrogen peroxide in the copper-containing wastewater, magnesium chloride is added to replace part of copper in a complex state to form copper ions, and the reaction time is 15-20 min;
the effluent of the second reaction tank 2 enters a third reaction tank 3, the pH value of the copper-containing wastewater is adjusted to 9-12 by adding a sodium hydroxide solution, a heavy-duty agent is added for a chelation reaction to generate a copper-containing chelated precipitate, and then the copper in a complexed state is further removed, and the reaction lasts for 15-20 min;
the effluent of the third reaction tank 3 enters a fourth reaction tank 4, ferric chloride solution is added into an intermediate pipeline, sodium hydroxide solution is added into the fourth reaction tank 4 when the system just runs in the fourth reaction tank 4, the pH of the wastewater is maintained to be 8-13 (the preferable pH is 9-12, and the optimal pH is 10-11), after the system runs for a period of time, the sodium hydroxide solution is stopped being added into the fourth reaction tank 4, the adding is changed into the adding at the inlet of a pipeline mixer 7, the wastewater reacts with the reflowed modified sludge, the reaction lasts for 15-20 min, and the pH is controlled to be 9-12;
after the reaction in the fourth reaction tank 4 is finished, the wastewater enters a fifth reaction tank 5, and 3-5 mg/L polyacrylamide solution (PAM) is added for flocculation reaction, so that the copper-containing sludge is further increased, and the reaction time is 5-10 min;
the sludge enters an inclined plate sedimentation tank 6 for mud-water separation, part of the sludge is conveyed to a subsequent sludge storage tank through a sludge conveying pump 9, and part of the sludge is conveyed to a pipeline mixer 7 through a sludge return pump 8.
When the sludge amount at the bottom of the inclined plate sedimentation tank 6 reaches the circulation amount, stopping adding the sodium hydroxide solution into the fourth reaction tank 4, adding the sodium hydroxide solution into an inlet of a pipeline mixer 7, controlling the adding amount of the sodium hydroxide through the pH value of the sludge discharged from the pipeline mixer 7, and maintaining the pH value at 9-12; uniformly mixing the returned sludge with sodium hydroxide in a pipeline mixer 7 to form crystalline sludge, and then entering a fourth reaction tank 4 for reaction; the sludge reflux amount is 20-30 times of the sludge production amount, and the circulating sludge concentration is 5-10%; when the sludge concentration reaches 10%, the sludge delivery pump 9 starts to work, and when the sludge concentration is less than 5%, the sludge delivery pump 9 stops working.
All the above components are prior art, and those skilled in the art can use any model and existing design that can implement their corresponding functions.
The foregoing is only a preferred embodiment of the present invention, and it should be noted that, for those skilled in the art, many modifications and improvements can be made without departing from the inventive concept, and all of them belong to the protection scope of the present invention.
Claims (2)
1. Semiconductor trade low concentration copper-containing waste water is up to standard discharges and high-efficient settlement complete set device, its characteristic includes first reaction tank (1) that connects gradually through the pipeline, second reaction tank (2), third reaction tank (3), fourth reaction tank (4), fifth reaction tank (5) and inclined plate sedimentation tank (6), waste water inlet tube is connected in first reaction tank (1), the exit tube that has sludge reflux pump (8) is connected with pipe-line mixer (7) in inclined plate sedimentation tank (6) bottom, fourth reaction tank (4) are connected in pipe-line mixer (7), sludge reflux pump (8) are close to inclined plate sedimentation tank (6) bottom exit tube connection of inclined plate sedimentation tank (6) one side has the sludge conveying pipe of mud delivery pump (9).
2. The complete set of equipment for achieving the discharge standard and the efficient sedimentation of the low-concentration copper-containing wastewater in the semiconductor industry according to claim 1, wherein one side of the first reaction tank (1) is provided with H2SO4The chemical adding port and the NaOH chemical adding port are formed in one side of the second reaction tank (2), the hydrogen peroxide remover chemical adding port and the magnesium chloride chemical adding port are formed in one side of the third reaction tank (3), the sodium hydroxide chemical adding port and the heavy catching agent chemical adding port are formed in one side of the third reaction tank (3), the ferric chloride chemical adding port is formed in the pipeline between the third reaction tank (3) and the fourth reaction tank (4), the sodium hydroxide chemical adding port is formed in one side of the fourth reaction tank (4), the PAM chemical adding port is formed in one side of the fifth reaction tank (5), and the sodium hydroxide chemical adding device (10) is arranged at the inlet of the pipeline mixer (7).
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| Application Number | Priority Date | Filing Date | Title |
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| CN202020302700.7U CN211896407U (en) | 2020-03-12 | 2020-03-12 | Complete device for standard discharge and efficient sedimentation of low-concentration copper-containing wastewater in semiconductor industry |
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| CN202020302700.7U CN211896407U (en) | 2020-03-12 | 2020-03-12 | Complete device for standard discharge and efficient sedimentation of low-concentration copper-containing wastewater in semiconductor industry |
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