CN211890410U - Diamond chamfering device with spiral groove - Google Patents
Diamond chamfering device with spiral groove Download PDFInfo
- Publication number
- CN211890410U CN211890410U CN202020485887.9U CN202020485887U CN211890410U CN 211890410 U CN211890410 U CN 211890410U CN 202020485887 U CN202020485887 U CN 202020485887U CN 211890410 U CN211890410 U CN 211890410U
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- Prior art keywords
- chamfer
- diamond
- base member
- chamfer ware
- chip removal
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Abstract
The utility model discloses a take diamond chamfer ware of helicla flute, including threaded connection head and chamfer ware base member, the installation end an organic whole of chamfer ware base member is provided with the loading and unloading screens to through loading and unloading screens and threaded connection head fixed mounting, the water cooling hole has been seted up to the inside correspondence of threaded connection head and chamfer ware base member, the terminal an organic whole of chamfer ware base member is provided with the working layer of chamfer structure, the chip removal cooling helicla flute has been seted up to the end that the outside terminal surface of working layer corresponds the water cooling hole. This take diamond chamfer ware of helicla flute has that the cooling effect is good, and the chip removal is fast, appears burning glass, splitting glass or burning out the advantage of phenomenons such as diamond working layer when avoiding diamond and glass abrasive dust, has solved the problem that current chamfer ware can't satisfy diamond and glass at high-speed rotatory abrasive dust in-process cooling effect and chip removal effect.
Description
Technical Field
The utility model relates to a chamfer ware technical field specifically is a take diamond chamfer ware of helicla flute.
Background
The existing glass chamfering device is generally processed and cooled in a way of spraying water during high-speed rotation abrasive dust in a non-groove type mode with a water outlet, and the cooling method cannot meet the cooling effect and the chip removal effect of diamond and glass during the high-speed rotation abrasive dust.
SUMMERY OF THE UTILITY MODEL
An object of the utility model is to provide a take diamond chamfer ware of helicla flute, it is good to have a cooling effect, and the chip removal is fast, appears burning glass, splitting glass or burning out the advantage of phenomenons such as diamond working layer when avoiding diamond and glass abrasive dust, has solved the unable problem that satisfies diamond and glass at high-speed rotatory abrasive dust in-process cooling effect and chip removal effect of current chamfer ware.
In order to achieve the above object, the utility model provides a following technical scheme: the utility model provides a take diamond chamfer ware of helicla flute, includes threaded connection head and chamfer ware base member, the installation end an organic whole of chamfer ware base member is provided with loading and unloading screens to through loading and unloading screens and threaded connection head fixed mounting, the water cooling hole has been seted up to the inside correspondence of threaded connection head and chamfer ware base member, the terminal an organic whole of chamfer ware base member is provided with the working layer of chamfer structure, chip removal cooling helicla flute has been seted up to the end that the outside terminal surface of working layer corresponds the water cooling hole.
Furthermore, 3-6 chip removal cooling spiral grooves are spirally arranged.
Compared with the prior art, the beneficial effects of the utility model are as follows:
1. the utility model discloses a set up chip removal cooling helicla flute on the surface of working layer, lead to water cooling hole to water and directly export to chip removal cooling helicla flute, through chip removal cooling helicla flute to log raft play to the position of working layer to glass processing, it is good to make this device have a cooling effect, and the chip removal is fast, appears burning glass, splitting glass or burns out phenomenons such as diamond working layer when effectively having avoided diamond and glass abrasive dust.
Drawings
Fig. 1 is a schematic view of the overall structure of the present invention.
In the figure: a threaded connector 1; a chamfering machine base body 2; a loading and unloading clamp position 3; water is introduced to cool the holes 4; a working layer 5; and (4) cooling the spiral groove 6 by chip removal.
Detailed Description
The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.
Referring to fig. 1, a diamond chamfering device with a spiral groove comprises a threaded connector 1 and a chamfering device base body 2, wherein a loading and unloading clamping position 3 is integrally arranged at the mounting end of the chamfering device base body 2 and fixedly mounted with the threaded connector 1 through the loading and unloading clamping position 3, a water cooling hole 4 is correspondingly formed in the threaded connector 1 and the chamfering device base body 2, a working layer 5 of a chamfering structure is integrally arranged at the tail end of the chamfering device base body 2, and a chip removal cooling spiral groove 6 is formed in the tail end of the working layer 5 corresponding to the water cooling hole 4.
Specifically, the chip removal cooling spiral groove 6 is spirally provided with 3 to 6 chips.
During the use, through set up chip removal cooling helicla flute 6 on the surface at working layer 5, water cooling hole 4 directly exports chip removal cooling helicla flute 6 to water, and through chip removal cooling helicla flute 6 to the position of log raft play to working layer 5 to glass processing, it is good to make this device have a cooling effect, and the chip removal is fast, appears burning glass, splits glass or burns out phenomenons such as diamond working layer when effectively having avoided diamond and glass abrasive dust.
Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.
Claims (2)
1. The utility model provides a take diamond chamfer ware of helicla flute, includes threaded connection head (1) and chamfer ware base member (2), its characterized in that: the integrative loading and unloading screens (3) that is provided with of installation end of chamfer ware base member (2) to through loading and unloading screens (3) and threaded connection head (1) fixed mounting, water cooling hole (4) have been seted up to threaded connection head (1) inside and chamfer ware base member (2) inside correspondence, the terminal an organic whole of chamfer ware base member (2) is provided with working layer (5) of chamfer structure, chip removal cooling helicla flute (6) have been seted up to the end that the outside terminal surface of working layer (5) corresponds water cooling hole (4).
2. The diamond chamfer machine with the spiral groove according to claim 1, wherein: the chip removal cooling spiral groove (6) is spirally provided with 3-6 chips.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202020485887.9U CN211890410U (en) | 2020-04-07 | 2020-04-07 | Diamond chamfering device with spiral groove |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202020485887.9U CN211890410U (en) | 2020-04-07 | 2020-04-07 | Diamond chamfering device with spiral groove |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN211890410U true CN211890410U (en) | 2020-11-10 |
Family
ID=73273266
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202020485887.9U Active CN211890410U (en) | 2020-04-07 | 2020-04-07 | Diamond chamfering device with spiral groove |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN211890410U (en) |
-
2020
- 2020-04-07 CN CN202020485887.9U patent/CN211890410U/en active Active
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|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant |