CN211888948U - Electronic base die-casting die - Google Patents
Electronic base die-casting die Download PDFInfo
- Publication number
- CN211888948U CN211888948U CN202020429441.4U CN202020429441U CN211888948U CN 211888948 U CN211888948 U CN 211888948U CN 202020429441 U CN202020429441 U CN 202020429441U CN 211888948 U CN211888948 U CN 211888948U
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- die
- upper die
- lower die
- fixed
- core
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- 238000004512 die casting Methods 0.000 title claims abstract description 16
- 238000004519 manufacturing process Methods 0.000 abstract description 4
- 238000007493 shaping process Methods 0.000 description 15
- 238000000465 moulding Methods 0.000 description 3
- RVCKCEDKBVEEHL-UHFFFAOYSA-N 2,3,4,5,6-pentachlorobenzyl alcohol Chemical compound OCC1=C(Cl)C(Cl)=C(Cl)C(Cl)=C1Cl RVCKCEDKBVEEHL-UHFFFAOYSA-N 0.000 description 2
- 238000002474 experimental method Methods 0.000 description 2
- 239000007788 liquid Substances 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 229910000838 Al alloy Inorganic materials 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000001125 extrusion Methods 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 238000000034 method Methods 0.000 description 1
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Abstract
The utility model discloses an electronic base die-casting die, which comprises an upper die base, wherein the upper die base comprises an upper die frame, an upper die cavity is arranged in the upper die frame, an upper die core is fixedly arranged in the upper die cavity, upright cores are fixed in a first upper die cavity and a second upper die cavity, a split structure is arranged between the upright cores and the upper die core, the upright cores are embedded in the upper die core, a mounting hole is also formed in the upper die frame between the first upper die cavity and the second upper die cavity, and a sprue bush is fixed in the mounting hole; the die comprises a lower die holder and a lower die holder, wherein the lower die holder comprises a lower die frame, a lower die core is fixedly arranged in the lower die frame, a first lower die cavity and a second lower die cavity are symmetrically arranged in the lower die core, and a runner is arranged between the first lower die cavity and the second lower die cavity. This die mould can two electronic bases of one shot forming, and need not to be equipped with a plurality of mold cores of going up, can produce with different model circuit board assorted electronic base, reduced manufacturing cost.
Description
Technical Field
The utility model belongs to the electron base field, concretely relates to electron base die casting die.
Background
The electronic base structure for installing the PCBA circuit board is more complicated, generally carry out the shaping to it through die casting die at present, but present die casting die once only can shaping an electronic base usually, the efficiency is lower, and simultaneously, in the joint chamber of shaping electronic base, owing to need set up different joint chambeies in the face of different circuit boards, the connecting hole will be set up to the side of enclosing the outer wall in joint chamber, the joint chamber encloses to close the outer wall top surface and outwards expends and has the journal stirrup, and the joint chamber is through the shaping three-dimensional post shaping in the last mold core again, so need be equipped with and sheathe mold core more, cause manufacturing cost to be high or low.
SUMMERY OF THE UTILITY MODEL
In order to solve one or more above-mentioned defects among the prior art, the utility model aims to solve the technical problem that an electron base die casting die is provided, this die casting die can two electron bases of one shot forming, and need not to be equipped with a plurality of upper die cores, can produce with different model circuit board assorted electron base, reduced manufacturing cost.
In order to achieve the purpose, the utility model provides an electronic base die-casting die, which is characterized in that the die comprises an upper die base, the upper die base comprises an upper die frame, an upper die cavity is arranged in the upper die frame, an upper die core is fixedly arranged in the upper die cavity, a first upper die cavity and a second upper die cavity are arranged in the upper die core, column cores are fixed in the first upper die cavity and the second upper die cavity, a split structure is arranged between the column cores and the upper die core, the column cores are embedded in the upper die core, a mounting hole is further formed in the upper die frame between the first upper die cavity and the second upper die cavity, and a sprue bush is fixed in the mounting hole;
the die comprises a lower die holder and is characterized in that the lower die holder comprises a lower die frame, a lower die core is fixedly mounted in the lower die frame, a first lower die cavity and a second lower die cavity are symmetrically arranged in the lower die core, a runner is arranged between the first lower die cavity and the second lower die cavity, a pouring gate is fixed at the starting end of the runner, a movable side core mechanism corresponding to the first lower die cavity and the second lower die cavity is further fixed on the side surface of the lower die holder respectively, the movable side core mechanism comprises a sliding block, a side core is fixed on the side surface of the sliding block, a forming bulge is fixed on the side core, a forming groove is formed in the top surface of the side core, a plurality of ejection holes are formed in the plane areas of the first lower die cavity and the second lower die cavity, and an ejection mechanism is fixed at.
Furthermore, the ejection mechanism is fixed at the bottom of the lower die holder and comprises a mounting plate, a connecting hole is formed in the middle of the mounting plate, an ejection plate is fixed above the mounting plate, a plurality of ejector rods are fixed on the ejection plate, and the ejector rods penetrate through the ejection holes and are flush with the plane area.
Furthermore, the movable side core mechanism comprises a slide rail, the slide block is connected in the slide rail in a sliding mode, an inclined hole is formed in the slide block, an inclined rod matched with the inclined hole is fixed in the upper die frame, and a limiting block for preventing the slide block from being separated from the lower die frame is fixed on the lower die frame.
Furthermore, guide posts are fixed on the periphery of the upper die frame, guide holes are formed in the periphery of the lower die frame, and the guide posts of the upper die frame are matched with the guide holes of the lower die frame.
The utility model has the advantages that:
firstly, the die-casting die can be used for molding two electronic bases at one time, a plurality of upper die cores are not required to be arranged, the electronic bases matched with circuit boards of different models can be produced by replacing the molded three-dimensional columns embedded in the die-casting die, and the production cost is reduced;
secondly, after the electronic base is formed, when the upper die holder rises, the movable side core can be quickly ejected out of the electronic base, and the electronic base can be quickly ejected upwards by the ejection mechanism and is demoulded;
and thirdly, the forming protrusion is fixed on the side surface of the side core, the forming groove is formed in the upper surface of the side core, the enclosing of the clamping cavity of the electronic base is enabled to close the forming connecting hole in the side surface of the outer wall, and the enclosing of the clamping cavity is enabled to close the forming support lug on the top surface of the outer wall, so that the appearance requirement of the electronic base is met.
Drawings
Fig. 1 is a schematic structural view of the present invention;
fig. 2 is a schematic structural view of the upper die base of the present invention;
FIG. 3 is a schematic structural view of the lower die holder of the present invention;
fig. 4 is a schematic structural view of the upper mold core of the present invention;
fig. 5 is a schematic structural view of the side core and the pillar core of the present invention.
In the figure: 1. the mold comprises an upper mold base 2, an upper mold frame 3, a first upper mold cavity 4, a second upper mold cavity 5, an upright post core 6, a sprue bush 7, a lower mold base 8, a lower mold frame 9, a lower mold core 10, a first lower mold cavity 11, a second lower mold cavity 12, a runner 13, a sprue 14, a slider 15, a side core 16, a molding protrusion 17, a molding groove 18, a mounting plate 19, an ejector plate 20, an ejector rod 21, a limiting block 22, an inclined rod 23, a guide post 24 and an upper mold core
Detailed Description
The invention will be further explained with reference to the following figures and examples:
referring to fig. 1 to 5, the die-casting mold for the electronic base includes an upper mold base 1, the upper mold base 1 includes an upper mold frame 2, an upper mold cavity is provided in the upper mold frame 2, an upper mold core 24 is fixedly installed in the upper mold cavity, a first upper mold cavity 3 and a second upper mold cavity 4 are provided in the upper mold core 24, a pillar core 5 is fixed in each of the first upper mold cavity 3 and the second upper mold cavity 4, a split structure is provided between the pillar core 5 and the upper mold core 24, the pillar core 5 is embedded in the upper mold core 24, a mounting hole is further provided between the first upper mold cavity 3 and the second upper mold cavity 4 in the upper mold frame 2, and a sprue bush 6 is fixed in the mounting hole;
the die comprises a lower die holder 7, the lower die holder 7 comprises a lower die frame 8, a lower die core 9 is fixedly installed in the lower die frame 8, a first lower die cavity 10 and a second lower die cavity 11 are symmetrically arranged in the lower die core 9, a runner 12 is arranged between the first lower die cavity 10 and the second lower die cavity 11, a sprue 13 is fixed at the starting end of the runner 12, a movable side core 15 mechanism corresponding to the first lower die cavity 10 and the second lower die cavity 11 is further fixed on the side surface of the lower die holder 7 respectively, the movable side core 15 mechanism comprises a slider 14, a side core 15 is fixed on the side surface of the slider 14, a forming bulge 16 is fixed on the side core 15, a forming groove 17 is formed on the top surface of the side core 15, a plurality of ejection holes are formed in the plane areas in the first lower die cavity 10 and the second lower die cavity 11, and an ejection mechanism is fixed at the bottom of the lower die holder 7.
The utility model discloses the in-process when using as follows, the molten aluminum alloy liquid gets into from among the runner cover 6 to among the die cavity between mould core 24 and the lower mould core 9 flows down, because two die cavities have all been seted up in last mould core 24 and the lower mould core 9, so after the die cavity of both sides flows in from runner 12 as the metal liquid, can once only shape two electronic bases, in addition, the joint chamber on the electronic base is through the fashioned of stand core 5, and the utility model discloses in, stand core 5 is fixed among last mould core 24 through the mode of inlaying, so when the electronic base that needs the shaping can match the PCBA circuit board of different models, can directly dismantle the change with the shaping stand, thereby can the various electronic base of shaping, need not to be equipped with more upper die base 1. In addition, because be fixed with a shaping arch 16 on side core 15, so can close the outer wall side at the enclosing of the joint chamber of electron base and seted up the connecting hole, and this connecting hole can't carry out the shaping through last mold core 24, so through the shaping of side core 15, simultaneously, the shaping recess 17 of side core 15 top surface, can make the outer wall outside shaping journal stirrup that encloses of the joint chamber on the electron base, after side core 15 shaping, because side core 15 is connected so can remove through slider 14, can withdraw from fast, block the base when avoiding the electron base drawing of patterns, cause the drawing of patterns difficulty.
Further, the ejection mechanism is fixed at the bottom of the lower die holder 7 and comprises a mounting plate 18, a connecting hole is formed in the middle of the mounting plate 18, an ejection plate 19 is fixed above the mounting plate 18, a plurality of ejector rods 20 are fixed on the ejection plate 19, and the ejector rods 20 penetrate through ejection holes and are flush with the plane area. In order to make the utility model discloses an electronic base can break away from in the quick lower die holder 7 after the shaping, is fixed with a mounting panel 18 in 7 bottoms of lower die holder, is fixed with ejector plate 19 on the mounting panel 18, and the cylinder pole of this ejector plate 19 bottom and cylinder is connected, when needs upwards jack-up with electronic base, and the ejector rod on the ejector plate 19 upwards jacks-up, can be ejecting with electronic base.
Further, the mechanism for moving the side core 15 comprises a slide rail, the slide block 14 is slidably connected in the slide rail, an inclined hole is formed in the slide block 14, an inclined rod 22 matched with the inclined hole is fixed in the upper die frame 2, a limit block 21 for preventing the slide block 14 from coming off is fixed on the lower die frame 8, the inclined rod 22 is matched with the inclined hole in the slide block 14 by fixing the inclined rod 22 in the upper die frame 2, when the upper die base 1 descends, the upper die base enters the inclined hole, the slide block 14 is driven to move towards the lower die core 9, finally, the electronic base can form a connecting hole on the side surface of the surrounding outer wall of the clamping cavity, after the electronic base is die-cast, the upper die base 1 moves upwards, and under the extrusion of the inclined rod 22, the outer side of the slide block 14 moves, so that the forming protrusion 16 on the side core 15 is separated from the side surface of the electronic base, and the electronic base.
Furthermore, guide posts 23 are fixed on the periphery of the upper die frame 2, guide holes are formed in the periphery of the lower die frame 8, the guide posts 23 of the upper die frame 2 are matched with the guide holes of the lower die frame 8, and the guide posts 23 are fixed on the periphery of the upper die frame 2, so that when the upper die base 1 descends, the upper die base can be accurately matched with the lower die base, the upper die base 1 is prevented from being cheap, and the forming quality of the electronic base is guaranteed.
The foregoing has described in detail preferred embodiments of the present invention. It should be understood that numerous modifications and variations can be devised by those skilled in the art in light of the teachings of the present invention without undue experimentation. Therefore, the technical solutions that can be obtained by a person skilled in the art through logic analysis, reasoning or limited experiments based on the prior art according to the concepts of the present invention should be within the scope of protection defined by the claims.
The foregoing has described in detail preferred embodiments of the present invention. It should be understood that numerous modifications and variations can be devised by those skilled in the art in light of the teachings of the present invention without undue experimentation. Therefore, the technical solutions that can be obtained by a person skilled in the art through logic analysis, reasoning or limited experiments based on the prior art according to the concepts of the present invention should be within the scope of protection defined by the claims.
Claims (4)
1. An electronic base die-casting die is characterized by comprising
The upper die holder comprises an upper die frame, an upper die cavity is arranged in the upper die frame, an upper die core is fixedly arranged in the upper die cavity, a first upper die cavity and a second upper die cavity are arranged in the upper die core, stand cores are fixed in the first upper die cavity and the second upper die cavity respectively, a split structure is arranged between the stand cores and the upper die core, the stand cores are embedded in the upper die core, a mounting hole is further formed in the upper die frame between the first upper die cavity and the second upper die cavity, and a sprue bush is fixed in the mounting hole;
the die comprises a lower die holder and is characterized in that the lower die holder comprises a lower die frame, a lower die core is fixedly mounted in the lower die frame, a first lower die cavity and a second lower die cavity are symmetrically arranged in the lower die core, a runner is arranged between the first lower die cavity and the second lower die cavity, a pouring gate is fixed at the starting end of the runner, a movable side core mechanism corresponding to the first lower die cavity and the second lower die cavity is further fixed on the side surface of the lower die holder respectively, the movable side core mechanism comprises a sliding block, a side core is fixed on the side surface of the sliding block, a forming bulge is fixed on the side core, a forming groove is formed in the top surface of the side core, a plurality of ejection holes are formed in the plane areas of the first lower die cavity and the second lower die cavity, and an ejection mechanism is fixed at.
2. The die-casting die for the electronic base as claimed in claim 1, wherein the ejection mechanism is fixed at the bottom of the lower die holder, the ejection mechanism comprises a mounting plate, a connecting hole is formed in the middle of the mounting plate, an ejection plate is fixed above the mounting plate, a plurality of ejector rods are fixed on the ejection plate, and the ejector rods penetrate through the ejection holes and are flush with the plane area.
3. The die-casting die for the electronic base as claimed in claim 2, wherein the movable side core mechanism comprises a slide rail, the slide block is slidably connected in the slide rail, an inclined hole is formed in the slide block, an inclined rod matched with the inclined hole is fixed in the upper die frame, and a limiting block for preventing the slide block from being separated is fixed on the lower die frame.
4. The die-casting mold for electronic bases as claimed in claim 3, wherein the upper mold frame is fixed with guide posts around, the lower mold frame is provided with guide holes around, and the guide posts of the upper mold frame are matched with the guide holes of the lower mold frame.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202020429441.4U CN211888948U (en) | 2020-03-30 | 2020-03-30 | Electronic base die-casting die |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202020429441.4U CN211888948U (en) | 2020-03-30 | 2020-03-30 | Electronic base die-casting die |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN211888948U true CN211888948U (en) | 2020-11-10 |
Family
ID=73274465
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202020429441.4U Expired - Fee Related CN211888948U (en) | 2020-03-30 | 2020-03-30 | Electronic base die-casting die |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN211888948U (en) |
-
2020
- 2020-03-30 CN CN202020429441.4U patent/CN211888948U/en not_active Expired - Fee Related
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20201110 |