CN211880367U

CN211880367U - Millimeter wave amplifier

Info

Publication number: CN211880367U
Application number: CN202020494791.9U
Authority: CN
Inventors: 蔡捷
Original assignee: Individual
Current assignee: Individual
Priority date: 2020-04-08
Filing date: 2020-04-08
Publication date: 2020-11-06
Anticipated expiration: 2030-04-08

Abstract

The utility model discloses a millimeter wave amplifier, which comprises a millimeter wave body, a shell, an amplifying chip arranged in the shell and a wire connected with the amplifying chip, wherein the wire extends out of the shell; the heat dissipation assembly comprises a heat dissipation plate arranged outside the shell, heat dissipation holes formed in the heat dissipation plate and a placing groove formed in the shell and matched with the heat dissipation plate; and the mounting component is arranged between the heat dissipation plate and the shell, when the millimeter wave works, the generated heat can be transmitted to the heat dissipation copper plate firstly, then the heat dissipation copper plate transmits the heat to the heat dissipation plate and the heat dissipation holes, and the heat is dissipated outwards.

Description

Millimeter wave amplifier

Technical Field

The utility model relates to an electronic equipment's technical field especially relates to a millimeter wave amplifier.

Background

The electromagnetic wave with the wavelength of 1-10 mm is called millimeter wave, and is located in the overlapping wavelength range of microwave and far-infrared wave, so that the millimeter wave has the characteristics of two wave spectrums, the theory and technology of the millimeter wave are respectively the extension of the microwave to high frequency and the development of the light wave to low frequency, the millimeter wave amplifier is an amplifying circuit for providing power for a load, a part of the millimeter wave amplifier is integrally installed on a circuit board, the millimeter wave can be widely applied to an electronic system by virtue of the unique advantages of the millimeter wave, and can generate special efficiency, and the amplifier is mainly used for the amplifying action of microwave radio-frequency signals.

Because the millimeter wave works and releases heat, and other components and parts transfer heat, the millimeter wave amplifier is easy to burn due to poor heat dissipation.

SUMMERY OF THE UTILITY MODEL

This section is for the purpose of summarizing some aspects of embodiments of the invention and to briefly introduce some preferred embodiments. Some simplifications or omissions may be made in this section and in the abstract of the specification and the title of the application to avoid obscuring the purpose of this section, the abstract of the specification and the title of the application, and such simplifications or omissions are not intended to limit the scope of the invention.

In view of the above-mentioned problem that the heat that produces at the during operation that current millimeter wave amplifier exists is difficult to distribute, provided the utility model discloses.

Therefore, the present invention is directed to a millimeter wave amplifier.

In order to solve the technical problem, the utility model provides a following technical scheme: a millimeter wave amplifier comprises a millimeter wave body, a first signal line, a second signal line and a first signal line, wherein the millimeter wave body comprises a shell, an amplifying chip arranged in the shell and a lead connected with the amplifying chip, and the lead extends out of the shell; the heat dissipation assembly comprises a heat dissipation plate arranged outside the shell, heat dissipation holes formed in the heat dissipation plate and a placing groove formed in the shell and matched with the heat dissipation plate; and a mounting member disposed between the heat dissipation plate and the case.

As a preferred scheme of the millimeter wave amplifier of the present invention, wherein: the standing groove is through the upper surface of the shell and is provided with a heat dissipation copper block, and the heat dissipation plate stretches into the standing groove and is attached to one side of the heat dissipation copper block.

As a preferred scheme of the millimeter wave amplifier of the present invention, wherein: the installation component comprises a pressing plate, a strip block and a matching groove, wherein the pressing plate is rotatably connected to two sides of the heating panel, the strip block is arranged on the side wall of the shell, the matching groove is formed in the pressing plate and matched with the strip block, and a locking component is arranged on the strip block.

As a preferred scheme of the millimeter wave amplifier of the present invention, wherein: the locking part is including offering the chamber of placing in rectangular piece, rotating the gear of connection placing the intracavity and meshing the rack on the gear, wherein, the vertical direction setting in edge of rack, the rack is two and meshes in the gear both sides, the rack with place and be connected with the elastic component between the chamber, place the rectangular piece upper surface of chamber upper end intercommunication.

As a preferred scheme of the millimeter wave amplifier of the present invention, wherein: and a torsional spring is arranged at the hinged position between the pressing plate and the heat dissipation plate.

As a preferred scheme of the millimeter wave amplifier of the present invention, wherein: the rack stretches out one end of the placing cavity outwards and is provided with an inclined plane, and the inclined plane faces towards the direction far away from the shell.

As a preferred scheme of the millimeter wave amplifier of the present invention, wherein: the heat dissipation plate is provided with a clamping ring close to the heat dissipation hole, a clamping groove is formed in the clamping ring, a filter ring is connected in the clamping ring, a clamping block matched with the clamping groove is fixed on the side wall of the filter ring, an arc-shaped groove is formed in the side wall of the clamping ring, and the arc-shaped groove is connected with the lower end of the clamping groove.

As a preferred scheme of the millimeter wave amplifier of the present invention, wherein: an operating handle is arranged on the filter ring.

As a preferred scheme of the millimeter wave amplifier of the present invention, wherein: a wiring terminal is arranged outside the shell, the wire is wound on the wiring terminal, and a wiring head is arranged at the front section of the wire.

As a preferred scheme of the millimeter wave amplifier of the present invention, wherein: the outside of the lead is covered with a rubber sleeve.

The utility model has the advantages that: when millimeter waves work, the generated heat can be transmitted to the heat dissipation copper plate firstly, and then the heat dissipation copper plate transmits the heat to the heat dissipation plate and the heat dissipation holes to dissipate the heat outwards.

Drawings

In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings required to be used in the description of the embodiments will be briefly introduced below, and it is obvious that the drawings in the following description are only some embodiments of the present invention, and it is obvious for those skilled in the art that other drawings can be obtained according to these drawings without inventive labor. Wherein:

fig. 1 is a schematic diagram of the overall structure of the millimeter wave amplifier of the present invention.

Fig. 2 is an explosion diagram of the internal structure of the heat dissipation plate and the housing of the millimeter wave amplifier of the present invention.

Fig. 3 is an enlarged schematic view of the terminal structure of the millimeter wave amplifier of the present invention.

Fig. 4 is a longitudinal sectional view of the internal structure of the housing of the millimeter wave amplifier of the present invention.

Fig. 5 is a schematic structural diagram of a locking component of the millimeter wave amplifier of the present invention.

Fig. 6 is an explosion diagram of the internal structure of the heat dissipation hole of the millimeter wave amplifier of the present invention.

Fig. 7 is a schematic diagram of the process of the heat dissipation plate mounting structure of the millimeter wave amplifier of the present invention.

Detailed Description

In order to make the aforementioned objects, features and advantages of the present invention more comprehensible, embodiments accompanying the present invention are described in detail below with reference to the accompanying drawings.

In the following description, numerous specific details are set forth in order to provide a thorough understanding of the present invention, but the present invention may be implemented in other ways different from the specific details set forth herein, and one skilled in the art may similarly generalize the present invention without departing from the spirit of the present invention, and therefore the present invention is not limited to the specific embodiments disclosed below.

Furthermore, the references herein to "one embodiment" or "an embodiment" refer to a particular feature, structure, or characteristic that may be included in at least one implementation of the invention. The appearances of the phrase "in one embodiment" in various places in the specification are not necessarily all referring to the same embodiment, nor are separate or alternative embodiments mutually exclusive of other embodiments.

Furthermore, the present invention will be described in detail with reference to the drawings, and in the detailed description of the embodiments of the present invention, for convenience of illustration, the sectional view showing the device structure will not be enlarged partially according to the general scale, and the drawings are only examples, which should not limit the scope of the present invention. In addition, the three-dimensional dimensions of length, width and depth should be included in the actual fabrication.

Example 1

Referring to fig. 1-2, a schematic diagram of the overall structure of a millimeter-wave amplifier is provided, as shown in fig. 7, the millimeter-wave amplifier includes a millimeter-wave body 100, including a housing 101, an amplifying chip 102 disposed in the housing 101, and a wire 103 connected to the amplifying chip 102, the wire 103 extending outwards from the housing 101; the heat dissipation assembly 200 comprises a heat dissipation plate 201 arranged outside the shell 101, a heat dissipation hole 202 formed in the heat dissipation plate 201, and a placement groove 203 formed in the shell 101 and matched with the heat dissipation plate 201; and a mounting member 300, wherein the mounting member 300 is disposed between the heat sink 201 and the housing 101, the placement groove 203 is disposed to penetrate the upper surface of the housing 101, the heat sink copper block 204 is disposed in the placement groove 203, and the heat sink 201 is attached to the heat sink copper block 204 by extending into the placement groove 203.

Specifically, a millimeter wave amplifier, the main part is millimeter wave body 100, millimeter wave body 100 then includes casing 101, casing 101 is the aluminum alloy material, and whole shape is rectangular block, then still be provided with amplifier chip 102 in casing 101, amplifier chip 102 is mainly used for amplifying the millimeter wave, in this embodiment, amplifier chip 102's model is HMC635, simultaneously in order to receive external signal, still be connected with wire 103 in amplifier chip 102's both sides, wire 103 stretches out casing 101 outwards, when installing millimeter wave body 100, the operator receives wire 103 and external data, and then the signal can be transmitted to amplifier chip 102 by the external world this moment on, carry out the amplification operation of millimeter wave.

Further, the heat dissipation assembly 200 is further included, in this embodiment, the heat dissipation assembly 200 includes a placement groove 203 formed on the housing 101, the placement groove 203 communicates the inside of the housing 101 with the outside, the placement groove 203 is formed in the width direction of the housing 101, then a heat dissipation plate 201 is fittingly connected in the placement groove 203, the heat dissipation plate 201 is detachably connected, the heat dissipation plate 201 is shaped like a "door", then a heat dissipation hole 202 is further formed on the heat dissipation plate 201, the heat dissipation hole 202 penetrates through the inner and outer surfaces of the heat dissipation plate 201 and is connected conveniently, a stepped plate is further disposed at the notch of the placement groove 203, a fitting square groove fitted with the stepped plate is further formed at the lower end of the heat dissipation plate 201, so that the heat dissipation assembly is convenient to install, and in order to enhance the heat dissipation capability, a heat dissipation copper block 204 is further connected in the placement groove 203, the shape of the heat dissipation copper block 204 is the, and one side of the heat dissipation plate 201 is abutted against the outer side of the heat dissipation copper block 204, so that the heat generated by the amplifying chip 102 can be transmitted to the heat dissipation copper block 204 and then is dissipated outside through the heat dissipation plate 201 and the heat dissipation hole 202.

Further, in order to facilitate the mounting of the heat sink 201 by an operator, a mounting member 300 is further provided between the heat sink 201 and the housing 101, and the mounting member 300 facilitates the mounting of the heat sink 201 by the operator.

The operation process is as follows: when using the millimeter wave amplifier, the operator installs the heating panel 201 in the standing groove 203 through the installation part 300 with the heating panel 201 earlier, when the millimeter wave carries out work, the heat of production can transmit to the heat dissipation copper earlier on, then the heat dissipation copper transmits the heat to heating panel 201 and louvre 202 on, outwards radiates the heat.

Example 2

Referring to fig. 4 and 5, this embodiment is different from the first embodiment in that: the mounting component 300 comprises a pressing plate 301 rotatably connected to two sides of the heat dissipation plate 201, a long block 302 arranged on the side wall of the shell 101 and a matching groove 303 formed in the pressing plate 301 and matched with the long block 302, wherein a locking component 400 is arranged on the long block 302, the locking component 400 comprises a placing cavity 401 arranged in the long block 302, a gear 402 rotatably connected in the placing cavity 401 and a rack 403 meshed on the gear 402, the rack 403 is arranged in the vertical direction, the two racks 403 are meshed on two sides of the gear 402, an elastic part 404 is connected between the rack 403 and the placing cavity 401, the upper end of the placing cavity 401 is communicated with the upper surface of the long block 302, a torsion spring 405 is arranged at the hinged position between the pressing plate 301 and the heat dissipation plate 201, an inclined plane 406 is arranged at one end, extending outwards, of the rack 403, of the placing cavity 401, and the inclined plane 406 faces the direction away from the shell.

Specifically, in this embodiment, the mounting part 300 includes a pressing plate 301 rotatably connected to two sides of the heat dissipation plate 201, a rotation plane of the pressing plate 301 is vertically disposed, and the pressing plate 301 is connected to two ends of the heat dissipation plate 201 that are turned downward, then a long block 302 is further opened on a side wall of the housing 101, the long block 302 is disposed along a length direction of the housing 101, and the long block 302 can be touched after the pressing plate 301 rotates, then a fitting groove 303 matched with the long block 302 is further opened on the side wall of the pressing plate 301, the fitting groove 303 penetrates through the pressing plate 301 and is opened along the length direction of the pressing plate 301, and after the pressing plate 301 rotates, the fitting groove 303 blocks the long block 302, thereby completing locking.

Further, a locking member 400 is further disposed on the strip block 302, the locking member 400 can lock the pressing plate 301 engaged with the strip block 302, so as to prevent the pressing plate 301 from being unscrewed in subsequent use, in this embodiment, the locking member 400 includes a placing cavity 401 disposed in the strip block 302, the placing cavity 401 is rectangular and is upwardly communicated with the upper surface and the lower surface of the strip block 302, then a gear 402 is further rotatably connected in the placing cavity 401, a rotation plane of the gear 402 is vertically disposed, then two racks 403 are slidably connected in the placing cavity 401 in the vertical direction, the two racks 403 are always engaged with the gear 402, one of the racks 403 is engaged on the left side of the gear 402, the other rack is engaged on the right side of the gear 402 and can extend out of the placing cavity 401 after being slid, and an elastic member 404 is further disposed between the racks 403 and the placing cavity 401, in this embodiment, the elastic member 404 is an extension spring, so that the rack 403 always keeps an outward springing state when the rack is not acted by external force.

Further, in order to facilitate the matching of the matching groove 303 and the long strip block 302, an inclined plane 406 is further formed at one end of the rack 403 extending out of the placing cavity 401, the inclined plane 406 faces towards the direction away from the housing 101, and then when the pressing plate 301 is matched, the pressing plate 301 pushes the inclined plane 406, and then pushes the rack 403 into the placing groove 203, and then the pressing plate 301 moves to a proper position when convenient.

Further, a torsion spring 405 is connected to the hinged position of the pressing plate 301 and the heat dissipation plate 201, the torsion spring 405 always drives the pressing plate 301 to move in the direction away from the long bar block 302, and then after the pressing plate 301 rotates to the position, the rack 403 springs outwards, and then the pressing plate 301 moves in the direction close to the rack 403 under the action of the torsion spring 405, so that the connection stability is improved.

The rest of the structure was the same as in example 1.

The operation process is as follows: an operator mounts the heat dissipation plate 201, firstly mounts the drinking bar block 302 in the matching groove 303 on the pressing plate 301, screws down the pressing plate 301, and makes the pressing plate 301 push the rack 403, so that the rack 403 moves into the placing cavity 401, after the rack 403 is moved to the right position, the rack 403 springs outwards, at this moment, the position of the pressing plate 301 is limited, and the heat dissipation plate 201 is mounted.

Example 3

Referring to fig. 6, this embodiment differs from the above embodiment in that: the heat dissipation plate 201 is provided with a clamping ring 500 near the heat dissipation hole 202, the clamping ring 500 is provided with a clamping groove 501, the clamping ring 500 is internally connected with a filter ring 502, a clamping block 503 matched with the clamping groove 501 is fixed on the side wall of the filter ring 502, the side wall of the clamping ring 500 is provided with an arc-shaped groove 504, the arc-shaped groove 504 is connected with the lower end of the clamping groove 501, and the pressing plate 301 is provided with an operating handle 505.

Specifically, when the millimeter wave amplifier is used for a long time, dust is easily accumulated in the heat dissipation holes 202, and then snap ring 500 is further fixed on the inner side of the heat dissipation holes 202, snap ring 500 is circular, and is slightly larger than the aperture of the heat dissipation holes 202, then filter ring 502 is detachably connected in snap ring 500, filter ring 502 mainly comprises a circular frame and filter screens arranged in the frame in a mutually staggered manner, then fixture block 503 is further fixed on the outer side of filter ring 502, fixture block 503 is rectangular in shape and is provided with two fixture blocks 503, two fixture blocks 503 are arranged along the diameter direction of filter ring 502, then clamping groove 501 matched with the fixture block is further formed in the inner wall 503 of snap ring 500, clamping groove 501 is communicated upwards, then arc groove 504 is further communicated with the lower end of clamping groove 501, and arc groove 504 is also formed in the inner wall of snap ring 500.

Further, and then when installing, the operator corresponds draw-in groove 501 with fixture block 503 and installs, then rotatory filter screen, make fixture block 503 enter into arc groove 504 in, the filter screen is installed in snap ring 500 this moment, can play the radiating action to louvre 202, simultaneously for the convenience rotate operation to filter ring 502, still be provided with operating handle 505 on filter ring 502, operating handle 505 is circular, one end is articulated with filter ring 502, the size is the same with filter ring 502's size, and still seted up on filter ring 502 with operating handle 505 cooperation and circular recess, this setting can make things convenient for the operator to filter ring 502's control.

The rest of the structure was the same as in example 2.

The operation process is as follows: the operator corresponds draw-in groove 501 with fixture block 503, then presses down filter ring 502, and filter ring 502 is installed preliminarily this moment, then rotates the filter screen, makes fixture block 503 enter into arc groove 504 to after the filter screen rotates 90, fixture block 503 reaches the innermost side of arc groove 504, accomplishes the installation, and the filter screen is installed in snap ring 500 this moment.

Example 4

Referring to fig. 3, this embodiment differs from the above embodiment in that: a binding post 600 is arranged outside the shell 101, the lead 103 is wound on the binding post 600, a binding post 601 is arranged at the front section of the lead 103, and a rubber sleeve 602 is coated outside the lead 103.

Specifically, in order to connect the internal wire 103, a terminal 600 is further disposed outside the housing 101, the terminal 600 receives the wire 103, and the wire 103 is wound around the terminal 600, in this embodiment, the terminal 600 is made of copper or a conductive metal, and the terminal 600 can receive the wire 103.

Furthermore, in order to facilitate the connection between the wire 103 and an external circuit, a connector 601 is further connected to the end of the wire 103, and a rubber sleeve 602 is wrapped outside the wire 103 to protect and insulate the inside of the wire 103.

The rest of the structure was the same as in example 3.

The concrete expression is as follows: when connecting the lead wire 103 to an external component, an operator mounts and connects the connector 601 on the lead wire 103, or directly connects the connector with the connector 600.

It is important to note that the construction and arrangement of the present application as shown in the various exemplary embodiments is illustrative only. Although only a few embodiments have been described in detail in this disclosure, those skilled in the art who review this disclosure will readily appreciate that many modifications are possible (e.g., variations in sizes, dimensions, structures, shapes and proportions of the various elements, values of parameters (e.g., temperatures, pressures, etc.), mounting arrangements, use of materials, colors, orientations, etc.) without materially departing from the novel teachings and advantages of the subject matter recited in this application. For example, elements shown as integrally formed may be constructed of multiple parts or elements, the position of elements may be reversed or otherwise varied, and the nature or number of discrete elements or positions may be altered or varied. Accordingly, all such modifications are intended to be included within the scope of this invention. The order or sequence of any process or method steps may be varied or re-sequenced according to alternative embodiments. In the claims, any means-plus-function clause is intended to cover the structures described herein as performing the recited function and not only structural equivalents but also equivalent structures. Other substitutions, modifications, changes and omissions may be made in the design, operating conditions and arrangement of the exemplary embodiments without departing from the scope of the present inventions. Therefore, the present invention is not limited to a particular embodiment, but extends to various modifications that nevertheless fall within the scope of the appended claims.

Moreover, in an effort to provide a concise description of the exemplary embodiments, all features of an actual implementation may not be described (i.e., those unrelated to the presently contemplated best mode of carrying out the invention, or those unrelated to enabling the invention).

It should be appreciated that in the development of any such actual implementation, as in any engineering or design project, numerous implementation-specific decisions may be made. Such a development effort might be complex and time consuming, but would nevertheless be a routine undertaking of design, fabrication, and manufacture for those of ordinary skill having the benefit of this disclosure, without undue experimentation.

It should be noted that the above embodiments are only used for illustrating the technical solutions of the present invention and not for limiting, and although the present invention has been described in detail with reference to the preferred embodiments, those skilled in the art should understand that the technical solutions of the present invention can be modified or replaced with equivalents without departing from the spirit and scope of the technical solutions of the present invention, which should be covered by the scope of the claims of the present invention.

Claims

1. A millimeter wave amplifier characterized by: comprises the steps of (a) preparing a mixture of a plurality of raw materials,

the millimeter wave body (100) comprises a shell (101), an amplification chip (102) arranged in the shell (101) and a lead (103) connected with the amplification chip (102), wherein the lead (103) extends out of the shell (101);

the heat dissipation assembly (200) comprises a heat dissipation plate (201) arranged outside the shell (101), heat dissipation holes (202) formed in the heat dissipation plate (201), and a placing groove (203) formed in the shell (101) and matched with the heat dissipation plate (201); and the number of the first and second groups,

a mounting member (300), the mounting member (300) being disposed between the heat dissipation plate (201) and the housing (101).

2. The millimeter-wave amplifier of claim 1, wherein: the placing groove (203) penetrates through the upper surface of the shell (101), a heat dissipation copper block (204) is arranged in the placing groove (203), and the heat dissipation plate (201) stretches into one side of the placing groove (203) and is attached to the heat dissipation copper block (204).

3. The millimeter-wave amplifier of claim 2, wherein: the mounting component (300) comprises a pressing plate (301) rotatably connected to two sides of the heat dissipation plate (201), a long strip block (302) arranged on the side wall of the shell (101) and a matching groove (303) formed on the pressing plate (301) and matched with the long strip block (302),

wherein, the long strip block (302) is provided with a locking component (400).

4. The millimeter-wave amplifier of claim 3, wherein: the locking component (400) comprises a placing cavity (401) arranged in the long strip block (302), a gear (402) rotationally connected in the placing cavity (401) and a rack (403) engaged on the gear (402),

the rack (403) is arranged in the vertical direction, the two racks (403) are meshed with the two sides of the gear (402), an elastic piece (404) is connected between the racks (403) and the placing cavity (401), and the upper end of the placing cavity (401) is communicated with the upper surface of the long strip block (302).

5. The millimeter-wave amplifier of claim 3, wherein: and a torsion spring (405) is arranged at the hinged position between the pressing plate (301) and the heat dissipation plate (201).

6. The millimeter-wave amplifier of claim 4, wherein: one end of the rack (403) extending outwards out of the placing cavity (401) is provided with a slope (406), and the slope (406) faces away from the shell (101).

7. The millimeter-wave amplifier of claim 1, wherein: the heat dissipation plate (201) is provided with a clamping ring (500) at a position close to the heat dissipation hole (202), a clamping groove (501) is formed in the clamping ring (500), a filter ring (502) is connected in the clamping ring (500), a clamping block (503) matched with the clamping groove (501) is fixed on the side wall of the filter ring (502), an arc-shaped groove (504) is formed in the side wall of the clamping ring (500), and the arc-shaped groove (504) is connected with the lower end of the clamping groove (501).

8. The millimeter-wave amplifier of claim 7, wherein: an operating handle (505) is arranged on the filter ring (502).

9. The millimeter-wave amplifier of claim 1, wherein: a binding post (600) is arranged outside the shell (101), the lead (103) is wound on the binding post (600), and a connector lug (601) is arranged at the front section of the lead (103).

10. The millimeter wave amplifier according to claim 1 or 9, wherein: the conducting wire (103) is wrapped with a rubber sleeve (602).