CN211878228U

CN211878228U - Coupling packaging structure of chip assembly of demultiplexer

Info

Publication number: CN211878228U
Application number: CN202020639453.XU
Authority: CN
Inventors: 张佳伟; 刘权
Original assignee: Suzhou Jialan Zhiyuan Electronic Technology Co ltd
Current assignee: Suzhou Jialan Zhiyuan Electronic Technology Co ltd
Priority date: 2020-04-24
Filing date: 2020-04-24
Publication date: 2020-11-06
Anticipated expiration: 2030-04-24

Abstract

The utility model discloses a demultiplexer chip assembly coupling packaging structure, including optic fibre tail optical fiber subassembly, optic fibre capillary, demultiplexer component, light focusing assembly, the demultiplexer component includes the demultiplexer chip and sets up in the glass cover plate on demultiplexer chip surface, the reflection terminal surface grinding and polishing of demultiplexer component becomes the slope reflection terminal surface, the glass cover plate is as the protective layer in order to improve the grinding and polishing qualification rate of the slope reflection terminal surface of demultiplexer chip, be equipped with the light focusing assembly that is located on the output light path of demultiplexer chip on the glass cover plate, optic fibre tail optical fiber subassembly corresponds with demultiplexer chip coupling through the optic fibre capillary and is connected; the grinding and polishing yield of the demultiplexing device chip is improved, and the cost is reduced.

Description

Coupling packaging structure of chip assembly of demultiplexer

Technical Field

The utility model relates to an optical module field of fiber communication, concretely relates to demultiplexer chip subassembly coupling packaging structure.

Background

With the development of the digital communication field and 5G mobile communication, a high-speed network is becoming a development trend, and the demand for high-speed optical modules is increasing continuously, the core component of the high-speed optical modules is an optical receiving module, the optical receiving module mainly comprises a CWDM Demux chip, a photoelectric conversion component, and an input and output end optical fiber component, and the CWDM Demux component packaging structure is to couple and package the input optical fiber component and the CWDM Demux chip. Because the reflecting end face of the CWDM Demux chip needs to be processed into an inclined reflecting end face with an inclination angle of 40-50 degrees, the input light can conveniently enter the photoelectric conversion assembly for receiving after being deflected by 90 degrees after passing through the inclined reflecting end face. In the whole process, the 40-50-degree inclined reflecting end face of the CWDM Demux chip needs to be formed by grinding and polishing. The CWDM Demux chip comprises a Si substrate layer and a SiO2 waveguide layer grown on the Si substrate layer, wherein the waveguide structure of light is arranged in the SiO2 waveguide layer; optical signals are transmitted in a waveguide layer of the CWDM Demux chip, the thickness of the waveguide layer is only 30um, and in the grinding and polishing treatment of a 40-50-degree inclined output end face of the Demux chip, the tip of the Demux chip is easy to damage and scrap, the qualification rate is low, and the chip cost is high, so that the cost of the CWDM Demux component packaging structure with the Demux chip in the prior art is high.

In view of the shortcomings in the prior art, there is a need for a demultiplexer chip assembly coupling package structure with low-cost demultiplexer elements to reduce the cost of the demultiplexer chip assembly coupling package structure.

SUMMERY OF THE UTILITY MODEL

To the weak point that exists among the prior art, the utility model discloses a main objective provides a demultiplexer chip subassembly coupling packaging structure, and its demultiplexer component processing cost reduces, has reduced multiplexer chip subassembly coupling packaging structure's cost promptly.

In order to realize the above object of the present invention, the present invention provides the following technical solutions:

a demultiplexer chip assembly coupling packaging structure comprises an optical fiber pigtail assembly, an optical fiber capillary tube, a demultiplexer element and a light focusing assembly, wherein the demultiplexer element comprises a demultiplexer chip and a glass cover plate arranged on the surface of the demultiplexer chip, the reflecting end face of the demultiplexer element is ground and polished into an inclined reflecting end face, the glass cover plate is used as a protective layer to improve the grinding and polishing qualification rate of the inclined reflecting end face of the demultiplexer chip, the glass cover plate is provided with the light focusing assembly located on the output light path of the demultiplexer chip, and the optical fiber pigtail assembly is correspondingly connected with the demultiplexer chip through the optical fiber capillary tube in a coupling mode.

Furthermore, the glass cover plate is arranged on the surface of the demultiplexer chip in a sticking mode.

Further, a positioning gasket is arranged on the surface of the glass cover plate close to the optical fiber capillary.

Further, the inclined reflective end face of the demultiplexer element is ground and polished to an optical plane having an inclination angle in the range of 40 ° to 45 °.

Preferably, the slanted reflective end faces of the demultiplexer elements are ground and polished to optical planes with a slant angle of 45 °.

Furthermore, the coupling end face of the demultiplexer element connected with the optical fiber capillary is ground and polished into an optical plane with the direction matched and the inclination angle ranging from 6 degrees to 10 degrees.

Preferably, the coupling end face of the demultiplexer element connected to the fiber capillary is ground and polished to an optical plane with a direction matching and an inclination angle of 8 °.

Preferably, the light focusing assembly is a lens array.

Furthermore, the thickness of the glass cover plate is 0.1-0.2 mm.

One of the above technical solutions has the following advantages or beneficial effects:

the demultiplexer element of the demultiplexer chip assembly coupling packaging structure comprises a demultiplexer chip and a glass cover plate arranged on the surface of the demultiplexer chip, the glass cover plate is used as a protective layer to cover the surface of the demultiplexer chip and grind and polish the surface of the demultiplexer chip to form an inclined reflecting end face of the demultiplexer element, the tip of the inclined reflecting end face of the demultiplexer chip is effectively protected from being damaged and scrapped due to grinding and polishing, the grinding mode of the traditional demultiplexer chip is changed, and the grinding and polishing qualification rate of the expensive demultiplexer chip is improved; moreover, the glass cover plate is covered on the surface of the demultiplexer chip to serve as a protective layer, even if the tip of the reflecting end face of the demultiplexer chip is only slightly damaged due to grinding and polishing damage, the demultiplexer chip cannot reach the scrapped degree, the demultiplexer chip can be reworked and reused, the loss of the expensive demultiplexer chip is reduced, and the cost is effectively saved;

the lens array positioned on the output light path of the demultiplexer chip is arranged on the glass cover plate, and the multi-path single-wave optical signals output from the demultiplexer element are converged by the lens array and then enter the PD array positioned below the lens array to be received, so that the relative positions of the PD array and the demultiplexer element are not limited by the distance, and the damage of the demultiplexer element can be effectively avoided.

Drawings

Fig. 1 is a schematic diagram of a coupling and packaging structure of a chip assembly of a demultiplexer according to an embodiment of the present invention;

fig. 2 is a schematic structural diagram of a demultiplexer element according to an embodiment of the present invention.

In the figure: 1. the device comprises a light focusing component 2, a demultiplexer chip 3, an optical fiber capillary 4, an optical fiber pigtail component 5, a positioning gasket 6 and a glass cover plate.

Detailed Description

The present invention is further described in detail below with reference to the drawings so that those skilled in the art can implement the invention with reference to the description.

It will be understood that terms such as "having," "including," and "comprising," as used herein, do not preclude the presence or addition of one or more other elements or groups thereof.

In the drawings, the shape and size may be exaggerated for clarity, and the same reference numerals will be used throughout the drawings to designate the same or similar components.

According to an embodiment of the present invention, with reference to fig. 1-2, the demultiplexer chip assembly coupling package structure of the present invention comprises an optical fiber pigtail assembly 4, an optical fiber capillary 3, a demultiplexer element, and a light focusing assembly 1, wherein the demultiplexer element comprises a demultiplexer chip 2 and a glass cover 6, the demultiplexer chip 2 is a planar waveguide grating demultiplexer, and is configured to decompose a received one-path composite optical signal into multiple single-wavelength optical signals with different wavelengths, the thickness of the glass cover is 0.1-0.2 mm, the glass cover is adhered to a single-wavelength optical signal output surface of the demultiplexer chip 2 by an adhesive, a reflection end surface of the demultiplexer element is ground and polished into an inclined reflection end surface, the inclined reflection end surface is an optical plane with an inclination angle ranging from 40 ° to 45 °, preferably an optical plane with an inclination angle of 45 °, so as to conveniently deflect the decomposed multipath single-wave optical signals with different wavelengths by 90 degrees.

The glass cover plate 6 covers the surface of the demultiplexer chip 2 and grinds and polishes the inclined reflecting end face of the molding demultiplexer element together, the glass cover plate which is adhered and covered on the surface of the demultiplexer chip 2 is used as a protective layer to protect the tip of the inclined reflecting end face of the demultiplexer chip 2 from being damaged and scrapped due to grinding and polishing, the grinding and polishing qualification rate of the demultiplexer chip 2 is improved, and the glass cover plate is covered on the surface of the demultiplexer chip 2 to be used as the protective layer, so that even if the tip of the reflecting end face of the demultiplexer chip 2 is damaged due to grinding and polishing, the demultiplexer chip 2 cannot reach the scrapped degree, the demultiplexer chip 2 can be reworked and reused, the loss of the expensive demultiplexer chip 2 is reduced, and the cost can be effectively saved.

The glass cover plate is provided with a light focusing component 1 positioned on the output light path of the demultiplexer chip 2, the light focusing component 1 can adopt a lens array, and a plurality of paths of single-wave optical signals which are reflected by the inclined reflecting end face of the demultiplexer chip 2 and deflected by 90 degrees are output by the demultiplexing component, converged by the lens array and then enter a PD array in the photoelectric conversion component positioned below the lens array for receiving. Because the size of the photosensitive area of the PD array is only 20um, the light spot will be enlarged continuously when the single-wave optical signal is output from the glass cover of the demultiplexer element, under the condition of not using the lens array, in order to ensure the reflective coupling of the demultiplexer chip 2 and the PD array, the distance between the PD array and the surface of the demultiplexer element needs to be kept about 20 micrometers, so that the PD array is easy to touch the demultiplexer element to cause the damage of the demultiplexer element, and by arranging the lens array on the glass cover, the multi-path single-wave optical signal is output from the demultiplexer element, and then enters the PD array to be received after being converged by the lens array, the relative position of the PD array and the demultiplexer element is not limited by the distance, and the damage of the demultiplexer element can be effectively avoided. And a positioning gasket 5 is arranged on the surface of the glass cover plate 6 close to the optical fiber capillary 3, the positioning gasket 5 is a metal positioning gasket or a glass positioning gasket, and the positioning gasket 5 is used for facilitating the packaging of the light receiving module formed by the demultiplexer element and the PD array in the photoelectric conversion assembly.

The optical fiber pigtail component 4 passes through the optical fiber capillary 3 through the single-mode optical fiber and is correspondingly connected with the demultiplexer chip 2 in a coupling mode, the single-mode optical fiber is a flexible short optical fiber, the length of the flexible short optical fiber is 15-100 mm, one end of the single-mode optical fiber is glued with the optical fiber pigtail component 4, the other end of the single-mode optical fiber passes through the optical fiber capillary 3 and is glued in the optical fiber capillary 3, the single-mode optical fiber passes through the capillary and is glued with the demultiplexer chip 2 through glue, the flexible short optical fiber serves as transition between the optical fiber pigtail component 4 and the optical fiber capillary 3, stress generated by hard connection can be effectively avoided, the connection structure is more stable and reliable, and the optical fiber capillary can be used for better supporting one end of the single. The coupling end face of the demultiplexer chip 2 connected with the optical fiber capillary 3 is ground and polished into an optical plane with the direction matched and the inclination angle range of 6-10 degrees, and the optical plane with the inclination angle of 8 degrees is preferably selected, so that the reflection of light is effectively reduced, and the return loss is reduced.

The working principle is as follows: the optical signal enters through the optical fiber pigtail component 4, is coupled and communicated with the demultiplexer chip 2 through the single-mode optical fiber and the optical fiber capillary 3, and is decomposed into multi-path single-wave optical signals with different wavelengths by the demultiplexer chip 2; because the inclined reflecting end face of the demultiplexer chip 2 is designed to be an optical plane with an angle of 40-45 degrees, optical signals are reflected on the inclined reflecting end face of 40-45 degrees of the demultiplexer chip 2 to enable an optical path to deflect 90 degrees, deflected multipath single-wave optical signals are output through the reflecting light output face of the demultiplexer chip 2, then are converged through a lens array arranged on a glass cover plate and positioned on an output optical path of the demultiplexer chip 2, then enter a PD array in a photoelectric conversion assembly positioned below the lens array to be received, and then are output after photoelectric conversion.

While the embodiments of the invention have been disclosed above, it is not limited to the applications listed in the description and the embodiments, which are fully applicable in all kinds of fields of application suitable for this invention, and further modifications may be readily made by those skilled in the art, and the invention is therefore not limited to the specific details and illustrations shown and described herein, without departing from the general concept defined by the claims and their equivalents.

Claims

1. A demultiplexer chip assembly coupling packaging structure is characterized in that: the optical fiber demultiplexer comprises an optical fiber pigtail component (4), an optical fiber capillary tube (3), a demultiplexer element and a light focusing component (1), wherein the demultiplexer element comprises a demultiplexer chip (2) and a glass cover plate (6) arranged on the surface of the demultiplexer chip (2), the reflection end face of the demultiplexer element is ground and polished into an inclined reflection end face, the glass cover plate (6) serves as a protective layer to improve the grinding and polishing qualification rate of the inclined reflection end face of the demultiplexer chip (2), the light focusing component (1) positioned on the output light path of the demultiplexer chip (2) is arranged on the glass cover plate (6), and the optical fiber pigtail component (4) is correspondingly connected with the demultiplexer chip (2) in a coupling mode through the optical fiber capillary tube (3).

2. The demultiplexer chip assembly coupling package structure of claim 1, wherein: the glass cover plate (6) is arranged on the surface of the demultiplexer chip (2) in a sticking mode.

3. The demultiplexer chip assembly coupling package structure of claim 1, wherein: and a positioning gasket (5) is arranged on the surface of the glass cover plate (6) close to the optical fiber capillary (3).

4. The demultiplexer chip assembly coupling package structure of claim 1, wherein: the inclined reflective end face of the demultiplexer element is ground and polished to an optical plane with an inclination angle in the range of 40-45 deg.

5. The demultiplexer chip assembly coupling package structure of claim 1, wherein: the slanted reflective end faces of the demultiplexer elements are ground and polished to optical planes with a slant angle of 45 °.

6. The demultiplexer chip assembly coupling package structure of claim 1, wherein: the coupling end face of the demultiplexer element connected with the optical fiber capillary (3) is ground and polished into an optical plane with the direction matched with the direction and the inclination angle ranging from 6 degrees to 10 degrees.

7. The demultiplexer chip assembly coupling package structure of claim 1, wherein: the coupling end face of the demultiplexer element connected with the optical fiber capillary (3) is ground and polished into an optical plane with the direction matched and the inclination angle of 8 degrees.

8. The demultiplexer chip assembly coupling package structure of claim 1, wherein: the light focusing assembly (1) is a lens array.

9. The demultiplexer chip assembly coupling package structure of claim 2, wherein: the thickness of the glass cover plate (6) is 0.1-0.2 mm.