CN211867437U

CN211867437U - Polishing device used in semiconductor production process

Info

Publication number: CN211867437U
Application number: CN201922006091.0U
Authority: CN
Inventors: 张军山
Original assignee: DANDONG ANSHUN MICROELECTRONICS CO LTD
Current assignee: DANDONG ANSHUN MICROELECTRONICS CO LTD
Priority date: 2019-11-19
Filing date: 2019-11-19
Publication date: 2020-11-06
Anticipated expiration: 2029-11-19

Abstract

The utility model discloses a burnishing device for in semiconductor production process, the power distribution box comprises a box body, cylinder I is installed to the inner chamber of box, and the top of box is provided with the support frame, and the equal fixed welding in both sides of support frame bottom has the diaphragm, and the top of diaphragm is run through and is provided with the guide bar, and the bottom and the box welding of guide bar, one side that two diaphragms are close to each other all weld and have a polishing barrel, and the inner chamber of polishing barrel is provided with the semiconductor body, and the welding has the connecting plate between two polishing barrels, and the output shaft of cylinder I runs through to the top of box and welds. The utility model discloses can play the effect to the all-round polishing of semiconductor body, carry out the ejection of compact and collect through discharge mechanism after the polishing is accomplished, guarantee this polishing equipment to the quality of semiconductor polishing on the one hand, improve semiconductor machining's efficiency moreover, improve the efficiency of semiconductor production and processing greatly, improve semiconductor production and processing enterprise's economic benefits.

Description

Polishing device used in semiconductor production process

Technical Field

The utility model relates to a semiconductor processing technology field specifically is a burnishing device for in semiconductor production process.

Background

The semiconductor is a material having a conductive property between a conductor and an insulator at normal temperature, and is widely used in the fields of consumer electronics, communication systems, medical instruments, and the like, and with the development of the society, the importance of the semiconductor is very great from the viewpoint of the technological or economic development, and the core units of computers, mobile phones, or digital recorders are closely related to the semiconductor, so that the demand of the semiconductor is increasing.

Semiconductor polishing is one of the important steps in semiconductor production and processing, however, the existing semiconductor polishing equipment is used for clamping a semiconductor and then performing surface polishing operation, but the polishing mode has low efficiency, and the clamped position cannot be polished, so that the quality of the processed semiconductor is poor, the yield is reduced, and the production capacity is low.

SUMMERY OF THE UTILITY MODEL

An object of the utility model is to provide a burnishing device for in semiconductor production process possesses the advantage that polishing efficiency is high, has solved the problem that above-mentioned background art mentioned.

In order to achieve the above object, the utility model provides a following technical scheme: a polishing device used in the production process of semiconductors comprises a box body, wherein a first air cylinder is installed in an inner cavity of the box body, a support frame is arranged above the box body, transverse plates are fixedly welded on two sides of the bottom of the support frame, a guide rod penetrates through the top of each transverse plate, the bottom end of each guide rod is welded with the box body, polishing cylinders are welded on one sides, close to each other, of the two transverse plates, a semiconductor body is arranged in the inner cavity of each polishing cylinder, a connecting plate is welded between the two polishing cylinders, an output shaft of the first air cylinder penetrates through the top of the box body and is welded with the connecting plate, motors are installed on two sides of the top of the inner cavity of the box body, second air cylinders are installed on two sides of the top of the support frame, output ends of the motors and the second air cylinders respectively penetrate through the top of the box body and the, and a discharging mechanism is arranged at the top of the box body.

Preferably, the two polishing disks at the output ends of the motor and the cylinder are positioned on the same vertical line with the polishing barrel, the diameter of each polishing disk is smaller than the inner diameter of the polishing barrel, and the semiconductor body and the polishing disks have the same diameter.

Preferably, a circular plate is welded to the top of the guide rod, a circular hole similar to the circular plate is formed in the top of the transverse plate, and the diameter of the circular plate is larger than the inner diameter of the circular hole.

Preferably, the polishing disc comprises a circular disc, and polishing circular cloth is glued on the surface of the circular disc.

Preferably, the discharging mechanism comprises a first side plate and a second side plate which are symmetrically welded on the front side and the rear side of the top of the box body, a storage rack is welded on the front side of the second side plate, a groove is formed in the top of the storage rack, a third air cylinder is installed on the front side of the first side plate, and an output end of the third air cylinder penetrates through the rear side of the first side plate and is welded with a material pushing plate.

Preferably, the shape of the material pushing plate is concave, and the distance between the two convex parts of the material pushing plate is equal to the distance between the two polishing barrels.

Preferably, the polishing barrel comprises a barrel body, and the inner wall of the barrel body is glued with polishing lining cloth.

Compared with the prior art, the beneficial effects of the utility model are as follows:

1. the utility model discloses a polishing dish that the motor drove its top polishes semiconductor body's bottom, along with two polishing dishes that drive its bottom of cylinder descend and contact with semiconductor body's top and polish, along with the polishing dish that is located upper portion is big more to semiconductor body's pressure, semiconductor body can take place the rotation and polish with the lining cloth friction in the polishing of polishing section of thick bamboo inner wall, can play the effect to the all-round polishing of semiconductor body, carry out the ejection of compact and collection through discharge mechanism after the polishing is accomplished, this polishing equipment's quality to the semiconductor polishing has been guaranteed on the one hand, and semiconductor machining's efficiency has been improved, the efficiency of semiconductor production and processing has been improved greatly, the economic benefits of semiconductor production and processing enterprise is improved.

2. The utility model discloses a cooperation of guide bar and round hole is used and can be to the process that support frame and diaphragm go up and down play the effect of direction, and then has improved the stability that support frame and diaphragm removed the process, has guaranteed polishing dish and polishing barrel normal counterpoint, ensures that the polishing process goes on in order, carries on spacingly to the diaphragm through the plectane, avoids diaphragm and guide bar to break away from.

Drawings

FIG. 1 is a front sectional view of the structure of the present invention;

FIG. 2 is a schematic view of the polishing cartridge and polishing disc of the present invention;

FIG. 3 is a schematic view of the discharging mechanism of the present invention;

fig. 4 is a schematic view of the polishing barrel of the present invention.

In the figure: 1. a box body; 2. a first cylinder; 3. a support frame; 4. a transverse plate; 5. a guide bar; 6. a polishing cartridge; 61. a barrel; 62. polishing the lining cloth; 7. a semiconductor body; 8. a connecting plate; 9. a motor; 10. a second air cylinder; 11. a polishing disk; 111. a disc; 112. polishing the round cloth; 12. a discharging mechanism; 121. a first side plate; 122. a second side plate; 123. a storage rack; 124. a third air cylinder; 125. a material pushing plate; 13. a circular plate; 14. a circular hole.

Detailed Description

The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.

Referring to fig. 1-4, the present invention provides a technical solution: a polishing device used in the production process of semiconductors comprises a box body 1, a cylinder I2 is installed in the inner cavity of the box body 1, a support frame 3 is arranged above the box body 1, transverse plates 4 are fixedly welded on two sides of the bottom of the support frame 3, guide rods 5 are arranged on the top of the transverse plates 4 in a penetrating mode, circular plates 13 are welded on the top of the guide rods 5, round holes 14 matched with the circular plates 13 in a similar mode are formed in the top of the transverse plates 4, the diameters of the circular plates 13 are larger than the inner diameters of the round holes 14, the guide rods 5 and the round holes 14 are matched to play a role in guiding the lifting process of the support frame 3 and the transverse plates 4, the stability of the moving process of the support frame 3 and the transverse plates 4 is further improved, normal alignment of a polishing disk 11 and a polishing barrel 6 is ensured, the polishing process is ensured to be carried out orderly, the transverse plates 4 are limited through, the polishing barrel 6 is welded on one side, close to each other, of each of the two transverse plates 4, each polishing barrel 6 comprises a barrel body 61, polishing lining cloth 62 is glued on the inner wall of each barrel body 61, a semiconductor body 7 is arranged in the inner cavity of each polishing barrel 6, a connecting plate 8 is welded between the two polishing barrels 6, an output shaft of the first air cylinder 2 penetrates through the top of the box body 1 and is welded with the connecting plate 8, motors 9 are mounted on two sides of the top of the inner cavity of the box body 1, air cylinders 10 are mounted on two sides of the top of the supporting frame 3, output ends of the motors 9 and the air cylinders 10 respectively penetrate through the top of the box body 1 and the inner cavity of the supporting frame 3 and are respectively provided with a polishing disc 11, the second air cylinders 10 are rotatably connected with the polishing discs 11 through bearings, the two polishing discs 11 at the output ends of the motors 9 and the air cylinders 10 and the polishing barrels 6 are positioned on the, polishing dish 11 includes disc 111, the surface cementing of disc 111 has polishing circle cloth 112, discharge mechanism 12 is including the curb plate 121 and the curb plate two 122 of symmetric welding in the front and back side of box 1 top, the front side welding of curb plate two 122 has storage frame 123, the top of storage frame 123 is seted up flutedly, cylinder three 124 is installed to the front side of curb plate 121, the output of cylinder three 124 runs through to the rear side of curb plate one 121 and welds scraping wings 125, scraping wings 125's shape is the spill, distance between two convex parts of scraping wings 125 equals with the distance between two polishing barrel 6, the top of box 1 is provided with discharge mechanism 12.

The working principle is as follows: when the utility model is used, a user firstly places the semiconductor body 7 in the inner cavity of the polishing barrel 6, then the motor 9 is started to drive the polishing disc 11 at the top to rotate, the bottom of the semiconductor body 7 is polished, then the cylinder two 10 is started, the cylinder two 10 is utilized to drive the polishing disc 11 at the bottom to be inserted into the inner cavity of the polishing barrel 6, at the moment, the pressure of the two polishing discs 11 on the semiconductor body 7 is smaller, the polishing disc 11 at the bottom polishes the bottom of the semiconductor body 7, the semiconductor body 7 is clamped along with the increase of the pressure at the top of the semiconductor body 7 by the polishing disc 11 at the bottom of the cylinder two 10, the output end of the cylinder two 10 is rotatably connected with the polishing disc 11, the polishing disc 11 at the top of the motor 9 can drive the semiconductor body 7 to rotate, so that the side surface of the semiconductor body 7 can be polished by the polishing, the output end of the second air cylinder 10 is retracted, the first air cylinder 2 is started to lower the positions of the connecting plate 8 and the transverse plate 4, the semiconductor body 7 is exposed out of the inner cavity of the polishing barrel 6, then the third air cylinder 124 is started, and the third air cylinder 124 drives the material pushing plate 125 to move so as to push the semiconductor body 7 out of the inner cavity of the material storage rack 123 for collection.

In summary, the following steps: this a burnishing device for in semiconductor production process, drive the bottom of its top through motor 9 and polish semiconductor body 7 by polishing dish 11, along with cylinder two 10 drive the top contact of polishing dish 11 decline and semiconductor body 7 of its bottom and polish, along with being located the pressure of polishing dish 11 on upper portion to semiconductor body 7 big more, semiconductor body 7 can take place the rotation and polish with the interior lining cloth 62 friction of polishing section of thick bamboo 6 inner wall, can play the effect to the all-round polishing of semiconductor body 7, carry out the ejection of compact and collection through discharge mechanism 12 after the polishing is accomplished, guaranteed the quality of this polishing equipment to semiconductor polishing on the one hand, and improved semiconductor processing's efficiency, the efficiency of semiconductor production and processing has been improved greatly, the economic benefits of semiconductor production and processing enterprise is improved.

It is noted that, herein, relational terms such as first and second, and the like may be used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions. Also, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus.

Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.

Claims

1. A polishing apparatus for use in a semiconductor production process, comprising a case (1), characterized in that: the polishing machine is characterized in that a first cylinder (2) is installed in an inner cavity of the box body (1), a support frame (3) is arranged above the box body (1), transverse plates (4) are fixedly welded on two sides of the bottom of the support frame (3), guide rods (5) are arranged at the top of the transverse plates (4) in a penetrating mode, the bottom end of each guide rod (5) is welded with the box body (1), polishing barrels (6) are welded on one sides, close to each other, of the two transverse plates (4), a semiconductor body (7) is arranged in the inner cavity of each polishing barrel (6), a connecting plate (8) is welded between the two polishing barrels (6), an output shaft of the first cylinder (2) penetrates through the top of the box body (1) and is welded with the connecting plate (8), motors (9) are installed on two sides of the top of the inner cavity of the box body (1), the output ends of the motor (9) and the cylinder II (10) respectively penetrate through the top of the box body (1) and the inner cavity of the support frame (3) and are provided with polishing discs (11), the cylinder II (10) is rotatably connected with the polishing discs (11) through bearings, and the top of the box body (1) is provided with a discharging mechanism (12).

2. A polishing apparatus for use in a semiconductor manufacturing process according to claim 1, wherein: the two polishing disks (11) at the output ends of the motor (9) and the second air cylinder (10) and the polishing barrel (6) are positioned on the same vertical line, the diameter of each polishing disk (11) is smaller than the inner diameter of the polishing barrel (6), and the semiconductor body (7) and the polishing disks (11) have the same diameter.

3. A polishing apparatus for use in a semiconductor manufacturing process according to claim 1, wherein: a circular plate (13) is welded to the top of the guide rod (5), a circular hole (14) similar to the circular plate (13) is formed in the top of the transverse plate (4), and the diameter of the circular plate (13) is larger than the inner diameter of the circular hole (14).

4. A polishing apparatus for use in a semiconductor manufacturing process according to claim 1, wherein: the polishing disc (11) comprises a disc (111), and polishing circular cloth (112) is glued to the surface of the disc (111).

5. A polishing apparatus for use in a semiconductor manufacturing process according to claim 1, wherein: discharge mechanism (12) are including the curb plate one (121) and curb plate two (122) of symmetrical welding in side around box (1) top, the front side welding of curb plate two (122) has storage frame (123), the top of storage frame (123) is seted up flutedly, cylinder three (124) are installed to the front side of curb plate one (121), the output of cylinder three (124) runs through to the rear side of curb plate one (121) and welds scraping wings (125).

6. A polishing apparatus for use in a semiconductor manufacturing process according to claim 5, wherein: the shape of the material pushing plate (125) is concave, and the distance between two convex parts of the material pushing plate (125) is equal to the distance between two polishing barrels (6).

7. A polishing apparatus for use in a semiconductor manufacturing process according to claim 1, wherein: the polishing barrel (6) comprises a barrel body (61), and polishing lining cloth (62) is bonded on the inner wall of the barrel body (61).