CN211860968U - Chip electromagnetic shielding device - Google Patents
Chip electromagnetic shielding device Download PDFInfo
- Publication number
- CN211860968U CN211860968U CN202020782297.2U CN202020782297U CN211860968U CN 211860968 U CN211860968 U CN 211860968U CN 202020782297 U CN202020782297 U CN 202020782297U CN 211860968 U CN211860968 U CN 211860968U
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- chip
- welded
- pressing
- outer cover
- electromagnetic shield
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Abstract
The utility model discloses a chip electromagnetic shield device, including uncovered cuboid dustcoat down, wherein: the inner surface of each side wall of the outer cover is welded with a pressing platform with an inverted L-shaped section, and the pressing platforms of the side walls form an accommodating space for accommodating the chip; the opening of the pressing table is provided with a compression joint plane, and the compression joint plane is coated with heat-conducting silicone grease; when the chip is positioned in the accommodating space, the heat-conducting silicone grease on the compression joint plane of each pressing platform is respectively contacted with the corresponding edge of the top surface of the chip; a conduction strip is welded outside one side wall of the outer cover, and a surface-mounted type lead connecting seat is welded on the end head of the conduction strip. The utility model discloses can carry out effectual electromagnetic shield protection to the welded chip on the PCB circuit board.
Description
Technical Field
The utility model relates to an electromagnetic shield structure indicates especially a device that carries out electromagnetic shield to the chip of operation on the PCB circuit board.
Background
Electronic equipment is composed of various electronic components, and the electronic components are soldered on a PCB circuit board. In the working process of the electronic equipment, each electronic component generally emits certain electromagnetic waves, so that adjacent electronic components mutually generate electromagnetic interference, and particularly when chips on a PCB (printed circuit board), especially key chips (such as a singlechip, a microprocessor and the like) are subjected to the electromagnetic interference of surrounding adjacent electronic components, the normal and stable operation of the electronic equipment can be influenced to a great extent. Therefore, the design of a technical scheme capable of effectively protecting the chip, particularly the key chip, by electromagnetic shielding is a problem which needs to be solved urgently at present.
SUMMERY OF THE UTILITY MODEL
An object of the utility model is to provide a chip electromagnetic shield device, it can carry out effectual electromagnetic shield protection to the welded chip on the PCB circuit board.
In order to achieve the above purpose, the utility model adopts the following technical scheme:
a chip electromagnetic shielding device is characterized in that: it includes uncovered cuboid dustcoat down, wherein: the inner surface of each side wall of the outer cover is welded with a pressing platform with an inverted L-shaped section, and the pressing platforms of the side walls form an accommodating space for accommodating the chip; the opening of the pressing table is provided with a compression joint plane, and the compression joint plane is coated with heat-conducting silicone grease; when the chip is positioned in the accommodating space, the heat-conducting silicone grease on the compression joint plane of each pressing platform is respectively contacted with the corresponding edge of the top surface of the chip; a conduction strip is welded outside one side wall of the outer cover, and a surface-mounted type lead connecting seat is welded on the end head of the conduction strip.
The utility model has the advantages that:
the utility model discloses can carry out effectual electromagnetic shield to welded chip on the PCB circuit board, especially key chip (like singlechip, microprocessor etc.), and heat dispersion is good, can effectively ensure the long-time normal steady operation of chip.
Drawings
Fig. 1 is a front view of the electromagnetic shielding device for chip of the present invention.
Fig. 2 is a top view of fig. 1.
Fig. 3 is a sectional view taken along line a-a of fig. 2.
Fig. 4 is a sectional view taken along line B-B of fig. 2.
Detailed Description
As shown in fig. 1 to 4, the chip electromagnetic shielding device of the present invention includes a rectangular casing 10 with an opening facing downward, wherein: the inner surface of each side wall 12 of the outer cover 10 is welded with a pressing platform 13 with an inverted L-shaped cross section, and the pressing platforms 13 of the side walls 12 together form an accommodating space 50 (shown by a dotted line in fig. 3) for accommodating a chip (not shown); the opening 130 of the pressing platform 13 is provided with a pressing plane 1301, and the pressing plane 1301 is coated with heat-conducting silicone grease 40; when the chip is in the accommodating space 50, the heat-conducting silicone grease 40 on the pressure-welding plane 1301 of each pressure table 13 is in contact with the corresponding edge of the top surface of the chip respectively to realize good heat conduction; a conducting strip 20 is welded outside one side wall 12 of the outer cover 10, and a patch type lead connecting seat 30 is welded on the end of the conducting strip 20.
In the present invention, the opening 130 of the pressing table 13 is opened inward, and is composed of a horizontal pressing plane 1301 and a vertical standing plane 1302.
In practical design, the pressing platform 13 is disposed at the lower part of the sidewall 12 and has an elongated shape.
In a practical design, the side walls 12 of the housing 10 may be welded to form a ring of platens 13.
In practical applications, the patch type wire connecting base 30 is used for connecting with a ground wire.
The utility model discloses in, SMD wire connecting seat 30 can be selected for IPEX/IPX connects, and other joint components and parts can also be adopted certainly, do not receive the limitation.
In the present invention, the housing 10 is composed of four side walls 12 and a top cover 11, and the shape of the flat housing 10 is adapted to the shape of the chip.
In the present invention, the housing 10, the pressing table 13, and the conducting strip 20 are made of metal.
The outer cover 10 should have good heat conduction and electrical conductivity, the platen 13 should have good heat conduction, and the conductive strip 20 should have good electrical conductivity.
In practice, the housing 10 may be provided with heat dissipation holes (not shown).
During the use, will the utility model discloses on chip electromagnetic shield device detained welded chip (like key chip) on the PCB circuit board, the chip was arranged in accommodation space 50 to each edge of chip top surface contacts with the heat conduction silicone grease 40 that coats on the crimping plane 1301 of corresponding pressure platform 13 respectively. The side walls 12 of the housing 10 are then securely soldered to the PCB board and the ground wire is connected to the patch type wire connection base 30.
When the chip works, the metal outer cover 10 plays a good role in electromagnetic shielding and protecting the chip, and prevents surrounding adjacent components from causing electromagnetic interference to the chip. In addition, the chip can realize good heat dissipation effect through heat conduction among the heat-conducting silicone grease 40, the pressing table 13 and the outer cover 10. In addition, the outer cover 10 is connected with the grounding wire through the conducting strip 20 and the patch type lead connecting seat 30, so that the safe operation of the chip is effectively guaranteed.
The utility model has the advantages that:
the utility model discloses can carry out effectual electromagnetic shield to welded chip on the PCB circuit board, especially key chip (like singlechip, microprocessor etc.), and heat dispersion is good, can effectively ensure the long-time normal steady operation of chip.
The above description is the preferred embodiment of the present invention and the technical principle applied by the preferred embodiment, and for those skilled in the art, without departing from the spirit and scope of the present invention, any obvious changes based on the equivalent transformation, simple replacement, etc. of the technical solution of the present invention all belong to the protection scope of the present invention.
Claims (7)
1. A chip electromagnetic shielding device is characterized in that: it includes uncovered cuboid dustcoat down, wherein: the inner surface of each side wall of the outer cover is welded with a pressing platform with an inverted L-shaped section, and the pressing platforms of the side walls form an accommodating space for accommodating the chip; the opening of the pressing table is provided with a compression joint plane, and the compression joint plane is coated with heat-conducting silicone grease; when the chip is positioned in the accommodating space, the heat-conducting silicone grease on the compression joint plane of each pressing platform is respectively contacted with the corresponding edge of the top surface of the chip; a conduction strip is welded outside one side wall of the outer cover, and a surface-mounted type lead connecting seat is welded on the end head of the conduction strip.
2. The chip electromagnetic shield apparatus of claim 1, wherein:
the pressing platform is arranged on the lower portion of the side wall and is in a long strip shape.
3. The chip electromagnetic shield apparatus of claim 2, wherein:
and each side wall of the outer cover is welded to form a circle of pressing platform.
4. The chip electromagnetic shield apparatus of claim 1, wherein:
the patch type lead connecting seat is connected with a grounding wire.
5. The chip electromagnetic shield apparatus of claim 4, wherein:
the patch type lead connecting seat is an IPEX/IPX connector.
6. The chip electromagnetic shield apparatus of any one of claims 1 to 5, wherein:
the outer cover, the pressing table and the conducting strip are made of metal materials.
7. The chip electromagnetic shield apparatus of any one of claims 1 to 5, wherein:
the outer cover is provided with heat dissipation holes.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202020782297.2U CN211860968U (en) | 2020-05-12 | 2020-05-12 | Chip electromagnetic shielding device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202020782297.2U CN211860968U (en) | 2020-05-12 | 2020-05-12 | Chip electromagnetic shielding device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN211860968U true CN211860968U (en) | 2020-11-03 |
Family
ID=73177644
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202020782297.2U Active CN211860968U (en) | 2020-05-12 | 2020-05-12 | Chip electromagnetic shielding device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN211860968U (en) |
-
2020
- 2020-05-12 CN CN202020782297.2U patent/CN211860968U/en active Active
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