CN211859040U

CN211859040U - Card holds in palm subassembly and electronic equipment

Info

Publication number: CN211859040U
Application number: CN202020823976.XU
Authority: CN
Inventors: 刘军; 徐小峰
Original assignee: Vivo Mobile Communication Co Ltd
Current assignee: Vivo Mobile Communication Co Ltd
Priority date: 2020-05-15
Filing date: 2020-05-15
Publication date: 2020-11-03
Anticipated expiration: 2030-05-15

Abstract

The application discloses card holds in palm subassembly and electronic equipment belongs to communication technology field. The card holds in palm the subassembly and includes: the device comprises a card holder, memory alloy, a buffering elastic piece and a transmission rod; one end of the transmission rod is connected with the clamping support, and the other end of the transmission rod is connected with the memory alloy through the buffering elastic piece; the memory alloy is switched between a first state and a second state under the influence of temperature so as to drive the card holder to move. The card support component drives the card support to move out through the memory alloy state switching influenced by the temperature, so that the inconvenience of inserting pins to take cards is avoided, and the card taking operation of a user is greatly facilitated.

Description

Card holds in palm subassembly and electronic equipment

Technical Field

The embodiment of the application relates to the technical field of consumer electronics, in particular to a card holder assembly and electronic equipment.

Background

At present, electronic equipment on the market adopts a pluggable card holder which is directly designed on the outer side of a shell to realize card placing or card taking. This kind of electronic equipment, its card hold in the palm overhead through-hole of having seted up, set up the push rod hole corresponding to the through-hole on the casing, when the card is got to needs, will get the card needle and stretch into the push rod hole through the through-hole to exert certain pressure and make the card hold in the palm and pop out the casing surface, thereby realize getting the card. The card taking needle needs to be carried with a person, which brings great inconvenience to users. Meanwhile, the arrangement of the through hole and the push rod hole seriously influences the attractiveness and the waterproof sealing performance of the terminal product.

Therefore, it is necessary to improve the card holder ejecting structure to solve the problem of inconvenient card taking by the pin in the prior art.

SUMMERY OF THE UTILITY MODEL

The embodiment of the application provides a card support component and electronic equipment, and aims to solve the problem that a memory alloy in an existing card support ejecting structure is prone to damage.

In order to solve the technical problem, the present application is implemented as follows:

one aspect of the present application provides a card holder assembly, including:

the device comprises a card holder, memory alloy, a buffering elastic piece and a transmission rod; one end of the transmission rod is connected with the clamping support, and the other end of the transmission rod is connected with the memory alloy through the buffering elastic piece; the memory alloy is switched between a first state and a second state under the influence of temperature so as to drive the card holder to move.

The application also provides electronic equipment with the card support assembly, and the electronic equipment further comprises a shell;

the shell is provided with an accommodating space and an opening, the opening is communicated with the accommodating space, the card support assembly is at least partially arranged in the accommodating space, and the memory alloy is switched between the first state and the second state to drive the card support to move between an extending position and a retracting position;

when the card support is in the extending position, at least part of the card support extends out of the shell from the opening, and when the card support is in the retracting position, the card support is positioned in the accommodating space.

The card support component drives the card support to move out through state switching of the temperature control memory alloy, inconvenience of card taking of a contact pin of the existing electronic equipment is avoided, and card taking operation of a user is greatly facilitated.

Drawings

The accompanying drawings, which are included to provide a further understanding of the application and are incorporated in and constitute a part of this application, illustrate embodiment(s) of the application and together with the description serve to explain the application and not to limit the application. In the drawings:

FIG. 1 is a schematic diagram of a card holder assembly according to an embodiment of the present disclosure;

FIG. 2 is a first state of a memory alloy according to an embodiment of the present application;

FIG. 3 illustrates a second state of a memory alloy according to an embodiment of the present application.

Description of reference numerals:

10-a housing; 101-a guide; 20-a memory alloy; 201-first state; 202-a second state; 301-a cushioning elastic member; 302-a first push block; 303-a second push block; 40-card holder; 50-a transmission rod; 501-a rotating shaft area; 60-flexible circuit board.

Detailed Description

The technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application, and it is obvious that the described embodiments are some, but not all, embodiments of the present application. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present application.

One aspect of the present application discloses a card holder assembly. Optionally, the card holder assembly comprises: the card holder 40, the memory alloy 20, the buffer elastic piece 301 and the transmission rod 50; one end of the transmission rod 50 is connected to the card holder 40, and the other end is connected to the memory alloy 20 through the buffering elastic piece 301; the memory alloy 20 is switched between a first state 201 and a second state 202 under the influence of temperature to move the card holder 40.

According to an embodiment of the present application, as shown in fig. 1, the card holder assembly includes a card holder 40, and the card holder 40 may be used for mounting a SIM card, and may also be used for mounting other types of cards, such as a memory card, and the like, and the present application does not limit the types of cards. The card holder assembly also includes a memory alloy 20. The memory alloy 20 has a shape memory effect and can be deformed under the condition of supplying heat from the outside. In the present application, the memory alloy 20 has a first state 201 and a second state 202, see FIG. 1. The first state 201 is the original state of the memory alloy, and the second state 202 is the deformed state of the memory alloy 20. As an embodiment, the memory alloy 20 according to the present application can be switched between the first state 201 and the second state 202 under the influence of temperature, from the first state 201 to the second state 202 in case of an increase in temperature, and from the second state 202 to the first state 201 in case of a decrease in temperature, see fig. 2 and 3. The card-tray assembly further includes a buffer elastic member 301 and a driving lever 50. The driving rod 50 has one end connected to the holder 40 and the other end connected to the memory alloy 20 through the buffering elastic member 301. Alternatively, the memory alloy 20 may be in contact with or in close proximity to the buffer spring. When the memory alloy 20 is switched between the first state 201 and the second state 202 under the influence of temperature, the memory alloy 20 acts on the buffer elastic member 301 and the transmission rod 50 in sequence to drive the card holder 40 to move. Alternatively, the switching of the state of the memory alloy 20 may be controlled by electrical heating, which is not limited in this application.

The card that this application relates to holds in palm the subassembly, through the influence of temperature to memory alloy 20, makes it switch between first state 201 and second state 202 to drive the removal of card support 40, can conveniently realize stretching out and retracting of card support, thereby get the card for the user and provide convenience, optimize user experience. In addition, by using the buffer elastic member 301 as a motion transmission member between the memory alloy 20 and the transmission lever 50, when the card holder 40 is ejected and receives a resistance force in a direction indicated by an arrow shown in fig. 1, the resistance force is first transmitted to the buffer elastic member 301, and the buffer effect is provided to the memory alloy 20 by the deformation of the buffer elastic member. The structural form can effectively solve the problem that the memory alloy is easy to damage.

The buffering elastic member 301 according to the present application may be a spring made of a metal material or a rubber member made of a rubber material. No matter the metal spring or the rubber piece can realize the motion transmission and the stress buffering action from the memory alloy 20, not only can the card holder 40 move smoothly, but also can prevent the memory alloy damage problem caused by the movement obstruction of the card holder 40. Of course, the buffering elastic member 301 may be made of other materials, which is not limited in this application.

In the embodiment of the present application, as shown in fig. 1, the card holder assembly further includes a first pushing block 302 and a second pushing block 303, where the first pushing block 302 and the second pushing block 303 are respectively connected to two ends of the buffer elastic member 301. Also, the first push block 302 is in engagement with the drive link 50. Specifically, the first push block 302 may be fixedly connected, abutted, or otherwise proximate to the drive link 50. The mutual approaching means that a space exists between the first pushing block 302 and the transmission rod 50, and the first pushing block 302 is only required to be driven by the buffering elastic member 301 to move, so that the transmission rod 50 can be driven to move, and the card holder 40 is pushed to move. The distance between the first push block 302 and the transmission lever 50 is not particularly limited. The second push block 303 is engaged with the memory alloy 20. Specifically, the second push block 303 may be in contact with or close to the memory alloy 20. Similarly, the fact that the second pushing block 303 is close to the memory alloy 20 means that the second pushing block 303 is not in direct contact with the memory alloy 20, and the second pushing block 303 is located within the action range of the memory alloy 20, that is, the memory alloy 20 is switched from the first state 201 to the second state 202, and the second pushing block 303 can be driven to move. The application is not limited to the matching manner of the first pushing block 302 and the transmission rod 50 and the second pushing block 303 and the memory alloy 20. When the buffering elastic member 301 is a spring, since the spring is spiral, the two ends of the spring are directly used as the stress points, and the stress direction may deviate from the axis of the spring. The first pushing block 302 and the second pushing block 303 are arranged to properly correct the stress direction of the spring so that the stress direction is along the axial direction of the spring. In addition, the first push block 302 and the second push block 303 respectively act on the transmission rod 50 and the memory alloy 20, so that the acting areas of the transmission rod 50, the memory alloy 20 and the buffer elastic piece 301 can be increased, and the reliability of the structure is enhanced. In addition, when the elastic buffer piece 301 has another structure, the arrangement of the first pushing block 302 and the second pushing block 303 can also be used to increase the acting area of the transmission rod 50 and the memory alloy 20 with the elastic buffer piece 301.

In this application, the first push block 302 may be connected to the transmission rod 50 by a hinge or a rivet. After the first pushing block 302 is hinged or riveted with the transmission rod 50, the first pushing block 302 and the transmission rod 50 can rotate relatively, and when the buffering elastic piece 301 moves towards the direction indicated by the arrow shown in fig. 1, the transmission rod 50 is driven by the first pushing block 302 to rotate, so that the card holder 40 is pushed to move out. The hinged or riveted connection is advantageous to ensure the reliability of the action and the structural stability between the first push block 302 and the transmission rod 50. Of course, the first pushing block 302 and the driving rod 50 may be connected by abutting, so as to simplify the assembly process of the card holder assembly and save the cost. Other connection methods can be selected by those skilled in the art, and the application is not limited to the method.

Another aspect of the present application also discloses an electronic device. Alternatively, the electronic device may be a mobile phone, a tablet computer, a game machine, etc., but is not limited thereto in practical applications. The electronic equipment comprises the card support assembly. The card holder assembly may be used for movement of the card holder 40. The electronic device further comprises a housing 10 as shown in fig. 1. Optionally, the housing 10 is provided with an accommodating space and an opening communicating with the accommodating space. The card holder assembly is at least partially disposed in the accommodating space of the housing 10. The memory alloy 20 is switched between a first state 201 and a second state 202 as shown in fig. 1 to move the card holder 40 between the extended position and the retracted position; when the card holder 40 is in the extended position, at least a part of the card holder 40 extends out of the housing 10 of the electronic device from the opening, and the user can take out the card carried on the card holder; when the card holder 40 is in the retracted position, the card holder 40 is located in the accommodating space, and the user can use the card carried on the card holder.

The electronic equipment with the card support assembly has the advantages that a user does not need to use a card taking needle in the prior art to take a card, great convenience is brought to the user, and meanwhile, the intelligent degree of the electronic equipment is improved. In addition, the elastic buffer member is arranged to transmit the impact force to the elastic buffer member 301 when the card holder 40 is ejected and is subjected to the resistance in the direction indicated by the arrow in fig. 1, and the elastic buffer member absorbs the impact force through the elastic buffer member itself, so as to prevent the memory alloy 20 from being damaged due to the impact action of the resistance, that is, the elastic buffer member 301 can reduce the damage probability of the memory alloy 20 and improve the durability of the card holder assembly.

According to one embodiment of the present application, the electronic device further includes a power supply module. Optionally, the power supply module is disposed in the accommodating space of the casing 10, and the power supply module is electrically connected to the memory alloy 20 to heat the memory alloy. Specifically, the power supply module may supply a current to the memory alloy 20, the memory alloy has a temperature increased under the action of the current, and then undergoes a phase change, and then switches from the first state 201 to the second state 202 to drive the card holder 40 to move from the retracted position to the extended position, at which time the user may take the card from the card holder 40. The power supply module can provide energy for the memory alloy 20, and conveniently control the state switching of the memory alloy.

As still another embodiment of the present application, a guide 101 is formed on the housing 10, and refer to fig. 1. Optionally, the guide portion 101 is disposed in the accommodating space of the housing 10 to provide a guiding function for the buffering elastic member 301. Specifically, the elastic buffer member 301 is disposed in the guide portion 101, and during the process of deforming the memory alloy 20 from the first state 201 to the second state 202, the memory alloy pushes the elastic buffer member 301 to move along the extending direction of the guide portion 101. In fig. 1, the extending direction of the guide 101 is parallel to the direction indicated by the arrow. The guide portion 101 is configured to provide a good motion guiding effect for the elastic buffer member 301, and the guide portion 301 can prevent the elastic buffer member 301 from being unnecessarily deformed, thereby ensuring the elastic buffer member to be deformed along the axial direction.

Alternatively, the aforementioned first and second pushing

blocks

302 and 303 are also provided in the guide 101 to move along the guide 101 together with the buffer elastic member 301.

Alternatively, the guide 101 is provided in a barrel-shaped structure open at both ends. The cushion elastic member 301 is fitted into the barrel structure from the opening of the barrel structure and moves in the axial direction of the barrel structure. The guide part 101 is designed into a barrel-shaped structure with two open ends, so that foreign matters can be prevented from entering the guide part 101 to block the movement or deformation of the buffering elastic part 301, and the normal work of the buffering elastic part is ensured. As an example, the guide 101 may be configured as a semi-annular barrel structure, which facilitates installation of the elastic buffer member 301 and observation of the movement of the elastic buffer member 301. However, the structure of the guide 101 is not limited to this.

As an embodiment of the present application, the transmission rod 50 is provided with a pivot area 501 as shown in fig. 1, and the transmission rod 50 forms a pivot connection with the housing 10 through the pivot area, in which case the transmission rod is in a lever structure. The pivot area 501 serves as a fixed end of the transmission rod 50, and when one end of the transmission rod is acted by the buffering elastic member 301, the transmission rod 50 rotates along the pivot area, and the other end of the transmission rod pushes the card holder 40 out of the accommodating space of the housing 10. In specific connection, the rotating shaft region 501 may be a circular through hole as shown in fig. 1, a cylindrical rotating shaft is formed by protruding on the housing 10, and the transmission rod 50 is sleeved on the rotating shaft through the circular through hole. This design not only meets the functional requirements of the transmission rod, but also improves the ease of installation of the transmission rod 50.

The memory alloy 20 of the present application may be configured in a symmetrical zig-zag configuration as shown in fig. 1. The horizontal edge area of the n-shaped structure is fixedly connected to the housing 10, and the vertical edge area of the n-shaped structure pushes the buffer elastic member 301 to move through deformation. The memory alloy 20 is arranged in a symmetrical zigzag structure, which can improve the connection reliability of the memory alloy 20 and the shell 10 and can also help to enhance the structural strength of the memory alloy 20. As an alternative embodiment, the memory alloy 20 may also be an L-shaped structure, and two regions of the L-shaped structure perpendicular to each other are used for fixing and deforming, respectively. Of course, the structure of the memory alloy 20 of the present application is not limited to the above-described zigzag structure or L-shaped structure.

The memory alloy 20 is provided in a symmetrical zigzag structure with its axis of symmetry perpendicular to the moving direction of the buffer elastic member 301, as shown in fig. 1. In this design, the displacement generated by the memory alloy 20 deforming from the first state 201 to the second state 202 can be effectively transferred to the buffering elastic member 301, so as to push the buffering elastic member 301 to move along the guide portion 101. It can be said that, when the symmetry axis of the memory alloy 20 in the shape of a Chinese character 'ji' is perpendicular to the moving direction of the elastic buffer member 301, the memory alloy 20 can make the elastic buffer member 301 generate the maximum displacement when it is deformed by electricity, which is beneficial to avoiding the problem that the card holder 40 cannot be ejected because the displacement is too small and the elastic deformation of the elastic buffer member 301 is offset.

As an embodiment of the present application, the electronic device further includes a flexible circuit board 60, and the memory alloy 20 is connected to the power supply module through the flexible circuit board 60. In the present application, the flexible circuit board 60 may be disposed on the housing 10, the memory alloy 20 is electrically connected to the flexible circuit board, and the power supply module may supply power to the flexible circuit board, so as to supply power to the memory alloy 10. The flexible circuit board 60 can be installed by utilizing the gap inside the electronic device, so that the space utilization rate inside the device is improved, and the flexible circuit board 60 can be conveniently used for controlling the on-off of the current of the memory alloy 20.

In the present application, the movement of the card holder 40 from the retracted position to the extended position may be triggered by a combination of keys of the electronic device, such as a combination of volume up and down keys. It can also be controlled by the built-in program of the electronic device, similar to the control of a bluetooth switch. In practice, the triggering of the removal of the card holder is not limited to the above manner.

The application discloses electronic equipment, power module are to memory alloy 20 power supply, and memory alloy takes place deformation after the circular telegram, promotes buffering elastic component 301 and removes, and the displacement of buffering elastic component makes transfer line 50 rotate, promotes then card holds in the palm 40 and shifts out. The electronic equipment with the characteristics has the advantages that a user does not need to use the card taking needle in the prior art to take the card, great convenience is brought to the user, and meanwhile, the intelligent degree of the electronic equipment is improved. In addition, the elastic buffer member 301 is arranged to transmit the impact force to the elastic buffer member when the card holder 40 is ejected and is subjected to the resistance in the direction indicated by the arrow in fig. 1, and the elastic buffer member 301 absorbs the impact force through the elastic self-deformation, so as to prevent the memory alloy 20 from being damaged due to the impact action of the resistance, that is, the elastic buffer member 301 can reduce the damage probability of the memory alloy 20 and improve the durability of the electronic device.

While the present embodiments have been described with reference to the accompanying drawings, it is to be understood that the invention is not limited to the precise embodiments described above, which are meant to be illustrative and not restrictive, and that various changes may be made therein by those skilled in the art without departing from the spirit and scope of the invention as defined by the appended claims.

Claims

1. A card holder assembly, comprising:

the device comprises a card holder, memory alloy, a buffering elastic piece and a transmission rod;

one end of the transmission rod is connected with the clamping support, and the other end of the transmission rod is connected with the memory alloy through the buffering elastic piece;

the memory alloy is switched between a first state and a second state under the influence of temperature so as to drive the card holder to move.

2. The card tray assembly of claim 1, wherein the cushioning resilient member is a spring or a rubber member.

3. The card tray assembly of claim 1, further comprising: the first push block and the second push block are respectively connected to two ends of the buffering elastic piece, the first push block is matched with the transmission rod, and the second push block is matched with the memory alloy.

4. The card holder assembly of claim 3, wherein the first push block is connected with the transmission rod by means of hinging or riveting.

5. An electronic device, comprising: the card holder assembly and housing of any of the preceding claims 1-4;

6. The electronic device of claim 5, further comprising: a power supply module;

the power supply module is arranged in the accommodating space and is electrically connected with the memory alloy so as to heat the memory alloy.

7. The electronic device of claim 5, wherein a guide portion is formed on the housing in the accommodating space, and the buffering elastic member is disposed in the guide portion.

8. The electronic device of claim 5, wherein the memory alloy is a symmetrical n-shaped structure, a lateral edge region of the n-shaped structure is fixedly connected to the housing, and a vertical edge region of the n-shaped structure pushes the buffer elastic member to move by deforming.

9. The electronic device of claim 8, wherein the symmetry axis of the zigzag structure is perpendicular to the moving direction of the buffer elastic member.

10. The electronic device of claim 6, further comprising: and the memory alloy is connected to the power supply module through the flexible circuit board.