CN211855768U - Chip manufacturing is with vibrations testing arrangement - Google Patents
Chip manufacturing is with vibrations testing arrangement Download PDFInfo
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- CN211855768U CN211855768U CN202020667647.0U CN202020667647U CN211855768U CN 211855768 U CN211855768 U CN 211855768U CN 202020667647 U CN202020667647 U CN 202020667647U CN 211855768 U CN211855768 U CN 211855768U
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- fixed plate
- fixed mounting
- connecting block
- spring
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Abstract
The utility model belongs to the technical field of the chip manufacturing technique and specifically relates to a chip is vibrations testing arrangement for manufacturing, comprises a workbench, workstation middle part both sides are connected with the connecting block through the bolster, the connecting block is kept away from the equal fixed mounting in surface of bolster has the connecting pin axle, the connecting pin axle is kept away from the equal fixed mounting in surface of connecting block has the fixed plate, the inside equal fixed mounting of fixed plate has shock dynamo, two the equal fixed mounting in surface that the fixed plate upper end is close to each other has the backup pad, the equal threaded mounting in both sides has the centre gripping bolt, one about the backup pad fixed plate lower extreme fixed mounting has the spring, spring tip fixedly connected with couple, another fixed plate lower extreme fixed mounting has solid fixed ring, gu fixed ring with the couple is mutually supported, and the.
Description
Technical Field
The utility model relates to a chip manufacturing technical field especially relates to a chip manufacturing is with vibrations testing arrangement.
Background
The chip refers to a silicon chip containing an integrated circuit, has small volume, is an essential part in a computer or other electronic equipment, and when the chip is manufactured, the quality of the chip needs to be sampled and detected, wherein the anti-seismic performance is one of factors influencing the quality of the chip.
SUMMERY OF THE UTILITY MODEL
The utility model aims at solving the shortcoming that the structure is complicated and is not convenient for use among the prior art, and the vibration testing device for chip manufacturing that proposes.
In order to achieve the above purpose, the utility model adopts the following technical scheme:
the utility model provides a chip manufacturing is with vibrations testing arrangement, comprises a workbench, workstation middle part both sides are connected with the connecting block through the bolster, the connecting block is kept away from the equal fixed mounting in surface of bolster has connecting pin axle, connecting pin axle is kept away from the equal fixed mounting in surface of connecting block has the fixed plate, the inside equal fixed mounting of fixed plate has shock dynamo, two the equal fixed mounting in surface that the fixed plate upper end is close to each other has the backup pad, the equal threaded mounting in both sides has the centre gripping bolt, one about the backup pad fixed plate lower extreme fixed mounting has the spring, spring tip fixedly connected with couple, another fixed plate lower extreme fixed mounting has solid fixed ring, gu fixed ring with the couple is mutually supported.
Preferably, the bolster includes movable block and second spring, the mounting groove has been seted up to workstation middle part inboard, mounting groove internal surface with second spring one end is fixed to be linked to each other, the second spring other end with the movable block is fixed to be linked to each other.
Preferably, a rubber pad is fixedly adhered to the surface of the workbench, which is close to the connecting block.
Preferably, the connecting block is rotatably connected with the fixing plate through the connecting pin shaft.
The utility model provides a pair of chip manufacturing is with vibrations testing arrangement, beneficial effect lies in: the inside rubber pad of the device makes and can not influence the collision between connecting block and the workstation, make to have better elastic buffer's effect between connecting block and the workstation, gu fixed ring mutually supports with the couple, make the lower extreme that the spring can stimulate the both sides fixed plate be close to each other, make the fixed plate upper end can have the effort of keeping away from each other, make the chip have the effort of being dragged, shock dynamo work produces vibrations simultaneously, make the vibrations of chip impression stronger, with this can be better the anti-seismic performance to the chip detect.
Drawings
Fig. 1 is a schematic structural diagram of a vibration testing apparatus for manufacturing a chip according to the present invention;
fig. 2 is an enlarged schematic structural diagram of a portion a in fig. 1 of a vibration testing apparatus for manufacturing a chip according to the present invention;
fig. 3 is an enlarged schematic structural diagram of a portion B in fig. 1 of a vibration testing apparatus for manufacturing a chip according to the present invention.
In the figure: the device comprises a workbench 1, a buffer part 2, a movable block 21, a mounting groove 22, a second spring 23, a connecting block 3, a connecting pin shaft 4, a fixing plate 5, a vibration motor 6, a supporting plate 7, a clamping bolt 8, a spring 9, a hook 10, a fixing ring 11 and a rubber pad 12.
Detailed Description
The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments.
Example 1
Referring to fig. 1-3, a chip is vibrations testing arrangement for manufacturing, including workstation 1, workstation 1 middle part both sides are connected with connecting block 3 through bolster 2, bolster 2 includes movable block 21 and second spring 23, mounting groove 22 has been seted up to workstation 1 middle part inboard, the inside surface of mounting groove 22 is fixed continuous with second spring 23 one end, the second spring 23 other end is fixed continuous with movable block 21, be connected through second spring 23 elasticity between movable block 21 and the workstation 1, make to have the effect of buffering isolation between movable block 21 and the workstation 1.
Connecting block 3 keeps away from the equal fixed mounting in surface of bolster 2 has connecting pin 4, the equal fixed mounting in surface that connecting pin 4 kept away from connecting block 3 has fixed plate 5, connecting block 3 is through connecting pin 4 and fixed plate 5 rotatable coupling, can adjust the angle of fixed plate 5 through connecting pin 4, workstation 1 is close to the fixed surface of connecting block 3 and pastes and is equipped with rubber pad 12, rubber pad 12 makes and can not take place to influence the collision between connecting block 3 and the workstation 1, make to have better elastic buffering's effect between connecting block 3 and the workstation 1.
Inside equal fixed mounting of fixed plate 5 has shock dynamo 6, can realize the function of vibrations through shock dynamo 6, the equal fixed mounting in surface that two fixed plates 5 upper ends are close to each other has backup pad 7, the equal threaded mounting in both sides has holding bolt 8 about backup pad 7, place the chip in backup pad 7, can carry out stable centre gripping with the chip through holding bolt 8, 5 lower extreme fixed mounting of a fixed plate has spring 9, spring 9 tip fixedly connected with couple 10, 5 lower extreme fixed mounting of another fixed plate has solid fixed ring 11.
Fixed ring 11 mutually supports with couple 10, make the lower extreme that spring 9 can stimulate both sides fixed plate 5 be close to each other, make fixed plate 5 upper end can have the effort of keeping away from each other, make the chip have the effort of being dragged, vibrating motor 6 work produces vibrations simultaneously, make the vibrations of chip impression more intense, with this can be better the anti-seismic performance to the chip detect, in addition, the elastic buffer's that has between connecting block 3 and the workstation 1 effect can reduce vibrating motor 6 and bring the vibration effect for workstation 1 self, thereby can avoid near staff to feel strong vibrations, lead to comfortablely.
The above, only be the concrete implementation of the preferred embodiment of the present invention, but the protection scope of the present invention is not limited thereto, and any person skilled in the art is in the technical scope of the present invention, according to the technical solution of the present invention and the utility model, the concept of which is equivalent to replace or change, should be covered within the protection scope of the present invention.
Claims (4)
1. The utility model provides a chip manufacturing is with vibrations testing arrangement, includes workstation (1), its characterized in that, workstation (1) middle part both sides are connected with connecting block (3) through bolster (2), the equal fixed mounting in surface of bolster (2) is kept away from to connecting block (3) has connecting pin axle (4), the equal fixed mounting in surface that connecting pin axle (4) kept away from connecting block (3) has fixed plate (5), equal fixed mounting has shock dynamo (6) inside fixed plate (5), two the equal fixed mounting in surface that the upper end of fixed plate (5) is close to each other has backup pad (7), the equal threaded mounting in both sides has clamping bolt (8) about backup pad (7), one fixed plate (5) lower extreme fixed mounting has spring (9), spring (9) tip fixed connection has couple (10), another fixed ring (11) is installed to fixed plate (5) lower extreme, the fixing ring (11) is matched with the hook (10).
2. The vibration testing device for chip manufacturing according to claim 1, wherein the buffer member (2) comprises a movable block (21) and a second spring (23), an installation groove (22) is formed in the inner side of the middle of the workbench (1), the inner surface of the installation groove (22) is fixedly connected with one end of the second spring (23), and the other end of the second spring (23) is fixedly connected with the movable block (21).
3. The vibration testing device for chip manufacturing according to claim 1, wherein a rubber pad (12) is fixedly adhered to the surface of the workbench (1) close to the connecting block (3).
4. The vibration testing device for chip manufacturing according to claim 1, wherein the connecting block (3) is rotatably connected to the fixing plate (5) by the connecting pin (4).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202020667647.0U CN211855768U (en) | 2020-04-27 | 2020-04-27 | Chip manufacturing is with vibrations testing arrangement |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202020667647.0U CN211855768U (en) | 2020-04-27 | 2020-04-27 | Chip manufacturing is with vibrations testing arrangement |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN211855768U true CN211855768U (en) | 2020-11-03 |
Family
ID=73178564
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202020667647.0U Expired - Fee Related CN211855768U (en) | 2020-04-27 | 2020-04-27 | Chip manufacturing is with vibrations testing arrangement |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN211855768U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112985725A (en) * | 2021-02-24 | 2021-06-18 | 盐城工学院 | Electronic component vibrations test bench |
| CN116659789A (en) * | 2023-08-02 | 2023-08-29 | 江苏晖恒芯片科技有限责任公司 | Chip vibration testing machine |
-
2020
- 2020-04-27 CN CN202020667647.0U patent/CN211855768U/en not_active Expired - Fee Related
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112985725A (en) * | 2021-02-24 | 2021-06-18 | 盐城工学院 | Electronic component vibrations test bench |
| CN112985725B (en) * | 2021-02-24 | 2022-12-30 | 盐城工学院 | Electronic component vibrations test bench |
| CN116659789A (en) * | 2023-08-02 | 2023-08-29 | 江苏晖恒芯片科技有限责任公司 | Chip vibration testing machine |
| CN116659789B (en) * | 2023-08-02 | 2023-09-22 | 江苏晖恒芯片科技有限责任公司 | Chip vibration testing machine |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20201103 |
|
| CF01 | Termination of patent right due to non-payment of annual fee |