CN211854162U

CN211854162U - Semiconductor water heating air heater

Info

Publication number: CN211854162U
Application number: CN202020170659.2U
Authority: CN
Inventors: 陆建华; 孙康康
Original assignee: Shandong Guoqi New Energy Technology Co ltd
Current assignee: Shandong Guoqi New Energy Technology Co ltd
Priority date: 2020-02-14
Filing date: 2020-02-14
Publication date: 2020-11-03
Anticipated expiration: 2030-02-14

Abstract

The utility model relates to a semiconductor hot-water heating air heater. The technical scheme is as follows: the positive upside of hot-air blower case is equipped with the air-out grid, and the top of hot-air blower case is equipped with the control display screen, and the inner chamber of stainless steel water tank is equipped with the semiconductor heating strip of aluminum pipe encapsulation, and the semiconductor heating strip is connected to the control computer board, and the control computer board is connected with the control display screen, the stainless steel water tank is connected to heat dissipation coil through the hot-water line, and heat dissipation coil fixes the next door at the air-out grid to be equipped with the fan on one side of the heat dissipation coil. The beneficial effects are that: the semiconductor heating strips heat cold water in the stainless steel water tank, so that the speed is high, the efficiency is high, the heating mode is not dry and hot, the air circulation is fast, and the heat in a room is uniform; in addition, the semiconductor heating strip is made of upper and lower quartz glass strips or upper and lower ceramic panels and graphene coatings, so that the energy consumption efficiency of the semiconductor heating strip reaches 99.99%, and the energy consumption can be greatly reduced.

Description

Semiconductor water heating air heater

Technical Field

The utility model relates to a hot-water heating hot-blast device, in particular to semiconductor hot-water heating air heater.

Background

At present, the heating in winter of the urban user in northern area is through central heating, consequently, the heating effect is more comfortable, and the user who does not incorporate central heating generally can adopt coal-fired or electricity power supply, under the weight of environmental protection, a lot of family users can adopt electric warm air heater, and electric warm air heater's advantage is that the heating is fast, and the shortcoming is: since the air is directly heated, the indoor is dry and the human body is uncomfortable. For example, the Chinese patent document with the publication number of CN208606392U has a patent name of 'electric water heater', and comprises an upper water tank and a lower water tank, wherein the upper water tank, a heat dissipation pipeline and the lower water tank are communicated in sequence; the heat dissipation pipeline is provided with heat dissipation fins, one sides of the heat dissipation fins are provided with fan blades and a driving motor, and the driving motor drives the fan blades to rotate so as to generate wind speed to blow the heat dissipation fins; an electric heating rod is arranged at the bottom end of the lower water tank; and an atmosphere communicating opening is formed in the top end of the upper water tank. The utility model can increase the temperature by heating water, because the high-temperature water can flow from bottom to top, the hot air is blown out by the fan blade after the convection process passes through the radiating fin, thereby increasing the indoor temperature; possess the comfort level of hot-water heating fan, the dry heat that distinguishes traditional electric heating makes the drawback that the human body gets on fire easily. But it has problems that: the electric heating rod is adopted for heating, the heating efficiency is low, the energy consumption is high, and the electricity is consumed.

Chinese patent document publication No. CN208750825U, patent name "intelligent electric water heating fan", including the casing, the front side upper end of casing is provided with the air outlet, and the casing is internal to be corresponded the position of air outlet is provided with hot water storage tank, hot water storage tank is provided with the fan in the one side of keeping away from the air outlet, the fan links firmly with hot water storage tank through the mounting bracket, and hot water storage tank's below is provided with heating water tank, be provided with the electrical heating stick in the heating water tank, heating water tank's top is provided with the inlet tube with hot water storage tank upper end intercommunication, and heating water tank's lower extreme is provided with the wet return with hot water storage tank bottom intercommunication. The utility model discloses regard the hot water storage tank who sets up in the casing as the heat source to borrow the heat that will hot water storage tank by the fan and blow off, thereby replaced the direct mode that heats to the air of traditional heating member, when guaranteeing the heating demand, avoid appearing the dry condition of room air, improved the comfort level. It has the problems that: the electric heating rod is also adopted for heating, so that the heating efficiency is low, the energy consumption is high, and the electricity is consumed.

Disclosure of Invention

The utility model aims at providing a semiconductor hot-water heating air heater to the above-mentioned defect that prior art exists, adopt the semiconductor heating, its heating efficiency is high, and the energy consumption can descend by a wide margin, saves the electric energy.

The utility model provides a semiconductor hot-water heating air heater, its technical scheme is: comprises a hot air blower box (1), an air outlet grille (2), a control display screen (3), a control computer board (6), a semiconductor heating bar (7), a stainless steel water tank (8), a heat dissipation coil (9), a fan (10), a hot water pipe (11) and a lead (12), wherein the air outlet grille (2) is arranged on the upper side of the front surface of the hot air blower box (1), the control display screen (3) is arranged at the top of the hot air blower box (1), the stainless steel water tank (8), the control computer board (6), the semiconductor heating bar (7), the heat dissipation coil (9), the fan (10) and the hot water pipe (11) are arranged in the inner cavity of the hot air blower box (1), the semiconductor heating bar (7) packaged by an aluminum pipe is arranged in the inner cavity of the stainless steel water tank (8), the semiconductor heating bar (7) is connected to the control computer board (6), and the control computer board (6) is, the stainless steel water tank (8) is connected to the heat dissipation coil (9) through the hot water pipe (11), the heat dissipation coil (9) is fixed beside the air outlet grille (2), and one side of the heat dissipation coil (9) is provided with one group or more than one group of fans (10).

Preferably, above-mentioned semiconductor heating strip (7) include quartz glass strip (7.1), lower quartz glass strip (7.2), graphite alkene coating (7.3) and copper electrode (7.4), last quartz glass strip (7.1) and be equipped with graphite alkene coating (7.3) down between quartz glass strip (7.2), copper electrode (7.4) are connected to the outer end of graphite alkene coating (7.3), and copper electrode department is fixed with the electrically conductive silver glue, goes up quartz glass strip (7.1) and seals fixedly through high temperature resistant structure glue down around quartz glass strip (7.2).

Preferably, the inner sides of the upper quartz glass strip (7.1) and the lower quartz glass strip (7.2) are provided with electrode grooves (7.5).

Preferably, when the semiconductor heating strip (7) is 1000 watts, the width of the upper quartz glass strip and the width of the lower quartz glass strip are 25mm, the length of the upper quartz glass strip and the length of the lower quartz glass strip are 350mm, the thickness of the graphene coating is 2 micrometers, the width of the graphene coating is 15mm, the length of the graphene coating is 340mm, and a two-layer structure is adopted.

In addition, above-mentioned semiconductor heating strip (7) include ceramic panel (a 7.1), ceramic panel (a 7.2), graphite alkene coating (7.3) and copper electrode (7.4) down, last ceramic panel (a 7.1) and be equipped with graphite alkene coating (7.3) down between ceramic panel (a 7.2), copper electrode (7.4) are connected to the outer end of graphite alkene coating (7.3), and copper electrode department is fixed with electrically conductive silver glue, goes up ceramic panel (a 7.1) and seals fixedly through high temperature resistant structure glue down around ceramic panel (a 7.2).

Preferably, the inner sides of the upper ceramic panel (a 7.1) and the lower ceramic panel (a 7.2) are provided with electrode grooves (7.5).

Preferably, when the semiconductor heating strip (7) is 2000 watts, the length of the upper ceramic panel and the lower ceramic panel is 400mm, the width of the upper ceramic panel and the lower ceramic panel is 40mm, the thickness of the graphene coating is 2 microns, the width of the graphene coating is 20mm, the length of the graphene coating is 39mm, and a two-layer structure is adopted.

The utility model has the advantages that: control through control display screen and control computer board and add the gentle regulation fan speed of hot water, the cold water in the stainless steel water tank of semiconductor heating strip heating utilizes water pump and hot-water line to the heat dissipation coil pipe provides hot water, and the fan blows off hot-blastly, and such heating mode is not dry and hot, and the circulation of air is fast, and the heat is even in the room, because the utility model discloses a quartz glass strip and graphite alkene coating make about the semiconductor heating strip adopts, or ceramic panel and graphite alkene coating make about adopting, and like this, the energy consumption efficiency of this semiconductor heating strip reaches 99.99%, can be abundant utilize heat energy, and the energy consumption can descend by a wide margin, saves the electric energy, can wide application in the area of non-central heating, has protected the environment.

Drawings

FIG. 1 is a schematic diagram of the present invention;

FIG. 2 is a schematic view of the internal structure of the present invention;

FIG. 3 is a schematic diagram of a first embodiment of a semiconductor heating strip;

FIG. 4 is a schematic transverse cross-sectional view of FIG. 3;

FIG. 5 is a schematic view of a partial structure of an upper quartz glass strip;

FIG. 6 is a schematic structural view of a second embodiment of a semiconductor heating strip;

FIG. 7 is a schematic transverse cross-sectional view of FIG. 6;

FIG. 8 is a schematic view of a partial structure of the upper ceramic panel;

in the upper diagram: the air conditioner comprises a hot air blower box 1, an air outlet grid 2, a control display screen 3, a roller 4, a water filling port 5, a control computer board 6, a semiconductor heating strip 7, a stainless steel water tank 8, a heat dissipation coil 9, a fan 10, a hot water pipe 11, a lead 12, an upper quartz glass strip 7.1, a lower quartz glass strip 7.2, a graphene coating 7.3, a copper electrode 7.4, an upper ceramic panel a7.1 and a lower ceramic panel a 7.2.

Detailed Description

The preferred embodiments of the present invention will be described in conjunction with the accompanying drawings, and it will be understood that they are presented herein only to illustrate and explain the present invention, and not to limit the present invention.

Embodiment 1, referring to fig. 1-5, the semiconductor water heating air heater of the present invention comprises a hot air blower case 1, an air outlet grille 2, a control display screen 3, a control computer board 6, a semiconductor heating strip 7, a stainless steel water tank 8, a heat dissipation coil 9, a fan 10, a hot water pipe 11 and a wire 12, wherein the air outlet grille 2 is disposed on the upper side of the front surface of the hot air blower case 1, the control display screen 3 is disposed on the top of the hot air blower case 1, a stainless steel water tank 8, the control computer board 6, the semiconductor heating strip 7, the heat dissipation coil 9, the fan 10 and the hot water pipe 11 are disposed in the inner cavity of the hot air blower case 1, the semiconductor heating strip 7 packaged by an aluminum pipe is disposed in the inner cavity of the stainless steel water tank 8, the semiconductor heating strip 7 is connected to the control computer board 6, the control computer board 6 is connected to the control display screen 3, the stainless steel water tank 8, the heat dissipation coil 9 is fixed beside the air outlet grille 2, and one side of the heat dissipation coil 9 is provided with one group or more than one group of fans 10; the semiconductor water-heating air heater adopts the semiconductor heating strips to heat cold water in the water tank, hot water is supplied to the radiating coil pipe through the water pump and the hot water pipe, and the fan blows hot air.

This heater adopts 1mm thick 304 stainless steel to make the heating water tank, and the water tank size height 350mm is wide 250mm deep 120mm, carries out hydrologic cycle with 12 volt low pressure water pumps, adopts control computer board and control display screen to control and adds the temperature of hot water and adjust fan speed. In addition, the semiconductor heating strip is packaged in the aluminum tube, and ternary alloy plating treatment is carried out on the outer surface of the aluminum tube.

Referring to the attached

drawings

3 and 4, the semiconductor heating strip 7 comprises an upper quartz glass strip 7.1, a lower quartz glass strip 7.2, a graphene coating 7.3 and a copper electrode 7.4, the graphene coating 7.3 is arranged between the upper quartz glass strip 7.1 and the lower quartz glass strip 7.2, the outer end of the graphene coating 7.3 is connected with the copper electrode 7.4, the copper electrode is fixed by conductive silver adhesive, the peripheries of the upper quartz glass strip 7.1 and the lower quartz glass strip 7.2 are sealed and fixed by high-temperature resistant structural adhesive, and the sealed semiconductor heating strip can be suitable for heating liquid.

Referring to the attached drawing 5, electrode grooves 7.5 are formed in the inner sides of the upper quartz glass strip 7.1 and the lower quartz glass strip 7.2, rectangular notches are ground at the end portions of the quartz glass strips to serve as the electrode grooves, the depth of each notch is equal to that of the surface of each quartz glass strip, the copper electrodes are mounted, the graphene coating is attached to the quartz glass strips with the copper electrodes mounted, and the copper electrodes are fixed through conductive silver adhesive.

In addition, when the semiconductor heating strip 7 is 1000 watts, the width of the upper quartz glass strip and the lower quartz glass strip is 25mm, the length of the upper quartz glass strip and the lower quartz glass strip is 350mm, the thickness of the graphene coating is 2 microns, the width of the graphene coating is 15mm, the length of the graphene coating is 340mm, and the graphene coating adopts a two-layer structure. The energy consumption efficiency of the semiconductor heating strip reaches 99.99%.

The utility model discloses a filler pours into cold water into to stainless steel water tank in, controls to add gentle regulation fan speed of hot water through control display screen and control computer board, and the cold water in the stainless steel water tank is heated to the semiconductor heating strip, utilizes water pump and hot-water line to provide hot water to the heat dissipation coil pipe, and the fan blows off hot-blastly, and such heating mode is not dry and hot, and the circulation of air is fast, and the heat is even in the room, because the utility model discloses a quartz glass strip and graphite alkene coating make about the semiconductor heating strip adoption, like this, the energy consumption efficiency of this semiconductor heating strip reaches 99.99%, can be abundant utilize heat energy, and the energy consumption can descend by a wide margin, saves the electric energy, can wide application in the area of non-centralized heating, has.

Embodiment 2, referring to fig. 6 and 7, the difference between the present invention and embodiment 1 is:

the utility model discloses a semiconductor heating strip 7 includes ceramic panel a7.1, lower ceramic panel a7.2, graphite alkene coating 7.3 and copper electrode 7.4, last ceramic panel a7.1 and be equipped with graphite alkene coating 7.3 down between ceramic panel a7.2, copper electrode 7.4 is connected to graphite alkene coating 7.3's outer end, copper electrode department is fixed with electrically conductive silver glue, go up ceramic panel a7.1 and down ceramic panel a7.2 glue all around through high temperature resistant structure and seal fixedly, the sealed semiconductor heating strip can be fit for the heating liquid body.

The inner sides of the upper ceramic panel a7.1 and the lower ceramic panel a7.2 are provided with electrode grooves 7.5, in addition, when the semiconductor heating strip 7 is 2000 watts, the length of the upper ceramic panel and the lower ceramic panel is 400mm, the width of the upper ceramic panel and the lower ceramic panel is 40mm, the thickness of the graphene coating is 2 microns, the width of the graphene coating is 20mm, the length of the graphene coating is 39mm, and a two-layer structure is adopted. The energy consumption efficiency of the semiconductor heating strip can also reach 99.99%.

The utility model discloses a filler pours into cold water into to the stainless steel water tank in, controls to add gentle regulation fan speed of hot water through control display screen and control computer board, and the cold water in the stainless steel water tank is heated to the semiconductor heating strip, utilizes water pump and hot-water line to provide hot water to the heat dissipation coil pipe, and the fan blows off hot-blastly, and such heating mode is not dry and hot, and the circulation of air is fast, and the heat is even in the room, because the utility model discloses a ceramic panel and graphite alkene coating make about the semiconductor heating strip adoption, like this, the energy consumption efficiency of this semiconductor heating strip also can reach 99.99%, can be abundant utilization heat energy, and the energy consumption can descend by a wide margin, saves the electric energy, can wide application in the area of non-centralized heating.

The above description is only a preferred embodiment of the present invention, and any person skilled in the art may modify the present invention or modify it into an equivalent technical solution by using the technical solutions described above. Therefore, any simple modifications or equivalent replacements made according to the technical solution of the present invention belong to the scope of the claimed invention as far as possible.

Claims

1. A semiconductor water heating air heater is characterized in that: comprises a hot air blower box (1), an air outlet grille (2), a control display screen (3), a control computer board (6), a semiconductor heating bar (7), a stainless steel water tank (8), a heat dissipation coil (9), a fan (10), a hot water pipe (11) and a lead (12), wherein the air outlet grille (2) is arranged on the upper side of the front surface of the hot air blower box (1), the control display screen (3) is arranged at the top of the hot air blower box (1), the stainless steel water tank (8), the control computer board (6), the semiconductor heating bar (7), the heat dissipation coil (9), the fan (10) and the hot water pipe (11) are arranged in the inner cavity of the hot air blower box (1), the semiconductor heating bar (7) packaged by an aluminum pipe is arranged in the inner cavity of the stainless steel water tank (8), the semiconductor heating bar (7) is connected to the control computer board (6), and the control computer board (6) is, the stainless steel water tank (8) is connected to the heat dissipation coil (9) through the hot water pipe (11), the heat dissipation coil (9) is fixed beside the air outlet grille (2), and one side of the heat dissipation coil (9) is provided with one group or more than one group of fans (10).

2. The semiconductor water heating hot air blower as claimed in claim 1, wherein: semiconductor heating strip (7) include quartz glass strip (7.1), lower quartz glass strip (7.2), graphite alkene coating (7.3) and copper electrode (7.4), last quartz glass strip (7.1) and be equipped with graphite alkene coating (7.3) down between quartz glass strip (7.2), copper electrode (7.4) are connected to the outer end of graphite alkene coating (7.3), and copper electrode department is fixed with electrically conductive silver glue, goes up quartz glass strip (7.1) and seals fixedly through high temperature resistant structure glue down around quartz glass strip (7.2).

3. The semiconductor water heating hot air blower as claimed in claim 2, wherein: and electrode grooves (7.5) are arranged on the inner sides of the upper quartz glass strip (7.1) and the lower quartz glass strip (7.2).

4. The semiconductor water heating hot air blower as claimed in claim 2, wherein: the semiconductor heating strip (7) is 1000 watt-hour, the width of the upper quartz glass strip and the width of the lower quartz glass strip are 25mm, the length of the upper quartz glass strip and the lower quartz glass strip is 350mm, the thickness of the graphene coating is 2 micrometers, the width of the graphene coating is 15mm, the length of the graphene coating is 340mm, and a two-layer structure is adopted.

5. The semiconductor water heating hot air blower as claimed in claim 1, wherein: semiconductor heating strip (7) include ceramic panel (a 7.1), lower ceramic panel (a 7.2), graphite alkene coating (7.3) and copper electrode (7.4), last ceramic panel (a 7.1) and be equipped with graphite alkene coating (7.3) down between ceramic panel (a 7.2), copper electrode (7.4) are connected to the outer end of graphite alkene coating (7.3), and copper electrode department is fixed with electrically conductive silver glue, goes up ceramic panel (a 7.1) and seals fixedly through high temperature resistant structure glue down around ceramic panel (a 7.2).

6. The semiconductor water heating hot air blower as claimed in claim 5, wherein: and electrode grooves (7.5) are arranged on the inner sides of the upper ceramic panel (a 7.1) and the lower ceramic panel (a 7.2).

7. The semiconductor water heating hot air blower as claimed in claim 5, wherein: the semiconductor heating strip (7) is 2000 watt-hour, the length of the upper ceramic panel and the lower ceramic panel is 400mm, the width of the upper ceramic panel and the lower ceramic panel is 40mm, the thickness of the graphene coating is 2 micrometers, the width of the graphene coating is 20mm, the length of the graphene coating is 39mm, and a two-layer structure is adopted.