CN211838855U

CN211838855U - Wafer gluing jig

Info

Publication number: CN211838855U
Application number: CN201821551414.3U
Authority: CN
Inventors: 杨光宇
Original assignee: Ruijie Xinsheng Tianjin Electronic Technology Co ltd
Current assignee: Ruijie Xinsheng Tianjin Electronic Technology Co ltd
Priority date: 2018-09-21
Filing date: 2018-09-21
Publication date: 2020-11-03
Anticipated expiration: 2028-09-21

Abstract

The utility model discloses a wafer rubber coating tool, including servo motor, aspiration pump, base and support body, the support body is installed on the top of base, and the internally mounted of base top intermediate position department support body has the base, the both ends of support body bottom all are provided with the stand, the intermediate position department of the inside bottom of base installs servo motor, and the intermediate position department on base top installs the rotary disk, servo motor's output is connected with the rotary disk through the pivot, and the intermediate position department of the inside bottom of rotary disk installs the aspiration pump, the both ends of rotary disk bottom all are provided with first slider, and the top of base be provided with first slider complex first spout. The utility model discloses an install support body, base, fixture block, draw-in groove and anti-skidding silica gel pad for the device is convenient for carry out holistic concatenation and dismantlement according to user's demand, thereby has optimized the structure of self, has strengthened the functionality of device.

Description

Wafer gluing jig

Technical Field

The utility model relates to a wafer rubber coating equipment technical field specifically is a wafer rubber coating tool.

Background

The wafer refers to a silicon wafer used for manufacturing a silicon semiconductor integrated circuit, and is called a wafer because the shape of the wafer is circular, various circuit element structures can be manufactured on the silicon wafer, so that an IC product with a specific electrical function is formed, the original material of the wafer is silicon, the inexhaustible silicon dioxide is used on the surface of a crust, silicon dioxide ore is refined by an electric arc furnace, chlorinated by hydrochloric acid, and distilled to manufacture high-purity polysilicon, the wafer is subjected to single-side gluing operation in the most important step in the manufacturing process, in order to improve the efficiency of the operation, workers often need to glue a wafer jig, and the jig has the advantage that if the wafer is the same product, the workers can quickly produce a large number of good products with few defects and low variability by the jig even if the workers do not have very pure technology.

However, current wafer rubber coating tool still generally has some more or defect more or less on the market, can not satisfy people's demand that increases well, be similar to, traditional wafer rubber coating tool often simple structure, be difficult for splicing and dismantlement, this practicality that leads to the device is low, and simultaneously, current wafer rubber coating tool often the function singleness, this result in the result of use of device not good, in addition, current wafer rubber coating tool still generally has the defect that the suitability is low, this is unfavorable for the long-term popularization of device, to these problems, we have proposed a neotype wafer rubber coating tool, come to cater to the demand in market better, provide better use for people and experience.

SUMMERY OF THE UTILITY MODEL

An object of the utility model is to provide a wafer rubber coating tool to solve the simple structure that proposes in the above-mentioned background art, be difficult for splicing and dismantle, the problem that function singleness and suitability are low.

In order to achieve the above object, the utility model provides a following technical scheme: a wafer gluing jig comprises a servo motor, an air suction pump, a base and a frame body, wherein the frame body is installed at the top end of the base, a base is installed inside the frame body at the middle position of the top end of the base, stand columns are arranged at two ends of the bottom of the frame body, the servo motor is installed at the middle position of the bottom end inside the base, a rotating disc is installed at the middle position of the top end of the base, the output end of the servo motor is connected with the rotating disc through a rotating shaft, the air suction pump is installed at the middle position of the bottom end inside the rotating disc, a first sliding block is arranged at two ends of the bottom of the rotating disc, a first sliding groove matched with the first sliding block is formed in the top end of the base, vacuum suction cups are installed at two ends of the top of the rotating disc, air holes are formed in the ends, close, and the internally mounted of air pump top support body has the mounting disc, the bottom at mounting disc both ends all is provided with the spring of being connected with the base top, and the intermediate position department on mounting disc top installs the electric telescopic handle of being connected with the inside top of support body, control panel is installed through the connecting rod to the one end at base top, and control panel's internally mounted has the singlechip, the output of singlechip is respectively through wire and servo motor, air pump and electric telescopic handle's input electric connection.

Preferably, constitute integrated welded structure between base and the base, and the inside wall of base evenly is provided with the bloop that is cellular arrangement, the inside of bloop is stuffed with and is inhaled the sound sponge.

Preferably, both ends of the bottom end of the mounting disc are provided with fixing support legs, the fixing support legs are uniformly provided with first fixing bolts, and the adjacent fixing support legs form bilateral symmetry about the vertical center line of the mounting disc.

Preferably, the both ends of mounting disc all are provided with the guide block of being connected with the stand, and the guide block is hollow structure, the internal diameter of guide block is greater than the external diameter of stand.

Preferably, both ends of support body bottom all are provided with the mount pad, and the bottom of mount pad evenly is provided with the fixture block, the inside of base be provided with fixture block complex draw-in groove, and the lateral wall of fixture block is provided with anti-skidding silica gel pad, constitute through fixture block and draw-in groove between support body and the base and dismantle mounting structure.

Preferably, a second sliding block is arranged in the middle of the bottom end of the vacuum chuck, a second sliding groove matched with the second sliding block is formed in the top end of the inner portion of the rotating disk, the second sliding block is fixed with the rotating disk through a second fixing bolt, and a sliding structure is formed between the vacuum chuck and the rotating disk through the second sliding block and the second sliding groove.

Compared with the prior art, the beneficial effects of the utility model are that: the wafer gluing jig is provided with the frame body, the base, the fixture block, the clamping groove and the anti-slip silica gel pad, so that the device is convenient to integrally splice and disassemble according to the requirements of users, the structure of the device is optimized, the functionality of the device is enhanced, the device is provided with the air pump, the connecting pipe and the vacuum chuck, the device not only improves the mode of fixing wafers and enhances the fixing firmness, but also avoids the loss of the wafers caused by the traditional fixing mode, the use effect of the device is improved, the device is convenient to fix the wafers with different sizes by being provided with the second slide block, the second slide groove and the second fixing bolt, the applicability of the device is enhanced, the long-term popularization of the device is facilitated, meanwhile, the device is convenient to fixedly install corresponding gluing equipment by being provided with the first fixing bolt and the fixing support legs, thereby the functionality of device has been strengthened, and the device is through installing servo motor and rotary disk for the device has realized better rotatory rubber coating function, thereby has promoted the work efficiency of device, and the device is through being provided with the bloop and inhaling the sound sponge, makes the device realize the performance of making an uproar that falls of better amortization, thereby has realized the function of environmental protection, accords with the theme of times.

Drawings

Fig. 1 is a schematic view of the front cross-sectional structure of the present invention;

FIG. 2 is an enlarged schematic view of the structure at A of FIG. 1 according to the present invention;

FIG. 3 is an enlarged schematic view of the structure of FIG. 1 at B according to the present invention;

fig. 4 is a system block diagram of the present invention.

In the figure: 1. a guide block; 2. a column; 3. a mounting seat; 4. a servo motor; 5. an air pump; 6. rotating the disc; 7. a base; 8. a base; 9. a connecting rod; 10. a control panel; 11. a single chip microcomputer; 12. a first fixing bolt; 13. a fixed leg; 14. mounting a disc; 15. an electric telescopic rod; 16. a frame body; 17. a vacuum chuck; 18. a connecting pipe; 19. air holes; 20. a first slider; 21. a first chute; 22. a second fixing bolt; 23. a second slider; 24. a second chute; 25. a spring; 26. a card slot; 27. an anti-slip silica gel pad; 28. and (7) clamping blocks.

Detailed Description

The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.

Referring to fig. 1-4, the present invention provides an embodiment: a wafer gluing jig comprises a servo motor 4, an air suction pump 5, a base 8 and a frame body 16, wherein the frame body 16 is installed at the top end of the base 8, a base 7 is installed in the frame body 16 at the middle position of the top end of the base 8, stand columns 2 are arranged at two ends of the bottom of the frame body 16, installation seats 3 are arranged at two ends of the bottom of the frame body 16, clamping blocks 28 are uniformly arranged at the bottom end of the installation seats 3, clamping grooves 26 matched with the clamping blocks 28 are formed in the base 8, anti-skid silica gel pads 27 are arranged on the outer side walls of the clamping blocks 28, a dismounting and mounting structure is formed between the frame body 16 and the base 8 through the clamping blocks 28 and the clamping grooves 26, so that the whole device can be conveniently dismounted and spliced according to the requirements of a user, the practicability of the device is enhanced, the servo motor 4 is installed at the middle position of the bottom, an integrated welding structure is formed between the base 7 and the base 8, the inner side wall of the base 7 is uniformly provided with silencing holes which are arranged in a honeycomb manner, sound-absorbing sponge is filled in the silencing holes, so that noise pollution generated in the operation process of the device is reduced, and the environment is protected, the output end of the servo motor 4 is connected with the rotating disk 6 through a rotating shaft, the middle position of the bottom end in the rotating disk 6 is provided with the air suction pump 5, the two ends of the bottom of the rotating disk 6 are both provided with first sliding blocks 20, the top end of the base 7 is provided with first sliding chutes 21 matched with the first sliding blocks 20, the two ends of the top of the rotating disk 6 are both provided with vacuum suction cups 17, one ends of the vacuum suction cups 17, which are close to the air suction pump 5, are provided with air holes 19, the middle position of the bottom ends of the vacuum suction cups 17 is provided with second sliding chutes 23, the top end, the second sliding block 23 is fixed with the rotating disk 6 through a second fixing bolt 22, and the vacuum chuck 17 and the rotating disk 6 form a sliding structure through the second sliding block 23 and a second sliding groove 24, so that the smoothness and the stability of the rotating disk 6 during rotation are improved, and the use effect of the device is improved, the output end of the air pump 5 is communicated with the inside of the air hole 19 through a connecting pipe 18, the mounting disk 14 is installed inside the frame body 16 above the air pump 5, the bottom parts of the two ends of the mounting disk 14 are both provided with springs 25 connected with the top end of the base 8, the middle position of the top end of the mounting disk 14 is provided with an electric telescopic rod 15 connected with the top end inside the frame body 16, the two ends of the mounting disk 14 are both provided with guide blocks 1 connected with the upright posts 2, the guide blocks 1 are of a hollow structure, the inner diameter of the guide blocks 1 is larger than the outer diameter of the upright posts 2, the stability of the device during operation is ensured, the two ends of the bottom end of the mounting plate 14 are provided with the fixed support legs 13, and the fixing support legs 13 are uniformly provided with first fixing bolts 12, the adjacent fixing support legs 13 form bilateral symmetry with the vertical center line of the mounting plate 14, so that the device is convenient to mount corresponding gluing equipment, thereby enhancing the functionality of the device and being beneficial to the long-term popularization of the device, one end of the top of the base 8 is provided with a control panel 10 through a connecting rod 9, and a singlechip 11 is arranged in the control panel 10, the output end of the singlechip 11 is respectively and electrically connected with the servo motor 4, the air pump 5 and the input end of the electric telescopic rod 15 through leads, the model of the air pump 5 can be KCD1-02, the model of the electric telescopic rod 15 can be KM01, the type of the single chip microcomputer 11 can be HT66F017, and the type of the servo motor 4 can be MR-J2S-10A.

The working principle is as follows: when the device is used, the device is externally connected with a power supply, a worker firstly adjusts the distance between the vacuum suckers 17 according to the size of a wafer to be processed by utilizing the matching action of the second sliding block 23 and the second sliding groove 24, then places the wafer to be processed on the top end of the vacuum sucker 17, starts the air pump 5 to ensure that the vacuum sucker 17 is vacuumized by utilizing the matching action of the connecting pipe 18 and the air hole 19 to generate negative pressure, so that the wafer to be processed is firmly adsorbed, and then firmly installs corresponding gluing equipment on the frame body 16 by utilizing the action of the first fixing bolt 12 and the fixing support leg 13, at the moment, the device can be put into use, and in the using process of the device, the servo motor 4 and the rotating disk 6 are installed on the device, so that the device realizes a better rotary gluing function, the working efficiency of the device is improved, and finally, the device is provided with the clamping groove 26, The anti-slip silica gel pad 27 and the fixture block 28 enable the device to be conveniently spliced and disassembled integrally according to the requirements of users, so that the structure of the device is optimized, and the functionality of the device is enhanced.

It is obvious to a person skilled in the art that the invention is not restricted to details of the above-described exemplary embodiments, but that it can be implemented in other specific forms without departing from the spirit or essential characteristics of the invention. The present embodiments are therefore to be considered in all respects as illustrative and not restrictive, the scope of the invention being indicated by the appended claims rather than by the foregoing description, and all changes which come within the meaning and range of equivalency of the claims are therefore intended to be embraced therein. Any reference sign in a claim should not be construed as limiting the claim concerned.

Claims

1. The utility model provides a wafer rubber coating tool, includes servo motor (4), aspiration pump (5), base (8) and support body (16), its characterized in that: the frame body (16) is installed on the top end of the base (8), the base (8) is installed inside the frame body (16) at the middle position of the top end of the base (8), the stand columns (2) are arranged at the two ends of the bottom of the frame body (16), the servo motor (4) is installed at the middle position of the bottom end of the inside of the base (7), the rotary disk (6) is installed at the middle position of the top end of the base (7), the output end of the servo motor (4) is connected with the rotary disk (6) through a rotating shaft, the air suction pump (5) is installed at the middle position of the bottom end of the inside of the rotary disk (6), the first sliding blocks (20) are arranged at the two ends of the bottom of the rotary disk (6), the first sliding grooves (21) matched with the first sliding blocks (20) are arranged at the top end of the base (7), and the, and one end of the vacuum sucker (17) close to the air pump (5) is provided with an air hole (19), the output end of the air pump (5) is communicated with the inside of the air hole (19) through a connecting pipe (18), and a mounting disc (14) is arranged in the frame body (16) above the air pump (5), the bottoms of the two ends of the mounting disc (14) are both provided with springs (25) connected with the top end of the base (8), an electric telescopic rod (15) connected with the top end inside the frame body (16) is arranged in the middle of the top end of the mounting disc (14), one end of the top of the base (8) is provided with a control panel (10) through a connecting rod (9), and the control panel (10) is internally provided with a singlechip (11), and the output end of the singlechip (11) is electrically connected with the input ends of the servo motor (4), the air pump (5) and the electric telescopic rod (15) through wires respectively.

2. The wafer gluing jig of claim 1, wherein: constitute integrated welded structure between base (7) and base (8), and the inside wall of base (7) evenly is provided with the bloop that is cellular range, the inside packing of bloop has the sound absorbing sponge.

3. The wafer gluing jig of claim 1, wherein: both ends of mounting disc (14) bottom all are provided with fixed stabilizer blade (13), and evenly be provided with first fixing bolt (12) on fixed stabilizer blade (13), constitute bilateral symmetry about the perpendicular center line of mounting disc (14) between adjacent fixed stabilizer blade (13).

4. The wafer gluing jig of claim 1, wherein: the both ends of mounting disc (14) all are provided with guide block (1) of being connected with stand (2), and guide block (1) are hollow structure, the internal diameter of guide block (1) is greater than the external diameter of stand (2).

5. The wafer gluing jig of claim 1, wherein: the utility model discloses a support body, including support body (16), base (8), clamping block (28), clamping groove (26) and the lateral wall of clamping block (28) are provided with anti-skidding silica gel pad (27), the both ends of support body (16) bottom all are provided with mount pad (3), and the bottom of mount pad (3) evenly is provided with clamping block (28), the inside of base (8) be provided with clamping block (28) complex clamping groove (26), constitute through clamping block (28) and clamping groove (26) between support body (16) and base (8) and dismantle.

6. The wafer gluing jig of claim 1, wherein: the middle position department of vacuum chuck (17) bottom is provided with second slider (23), and the inside top of rotary disk (6) be provided with second slider (23) complex second spout (24), second slider (23) are fixed with rotary disk (6) through second fixing bolt (22), and constitute sliding structure through second slider (23) and second spout (24) between vacuum chuck (17) and rotary disk (6).