CN211831719U - Adsorption device of SMT chip mounter - Google Patents
Adsorption device of SMT chip mounter Download PDFInfo
- Publication number
- CN211831719U CN211831719U CN202020249900.0U CN202020249900U CN211831719U CN 211831719 U CN211831719 U CN 211831719U CN 202020249900 U CN202020249900 U CN 202020249900U CN 211831719 U CN211831719 U CN 211831719U
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- chip mounter
- smt chip
- plate
- negative pressure
- sealing
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Abstract
The utility model discloses a SMT chip mounter adsorption equipment, including the SMT chip mounter host computer to and install the adsorption equipment on the SMT chip mounter host computer, adsorption equipment installs in SMT chip mounter host computer actuating mechanism output, adsorption equipment includes a device board, and a contact site is installed in the bottom embedding of device board, and department sets up a sucking disc in the middle of the bottom of contact site, terminal surface and contact site terminal surface parallel and level under the sucking disc, sucking disc part stretch into in the contact site, the contact site includes flexible outer protective layer and fills at the intraformational memory sponge layer of flexible outer protection. The utility model discloses an adsorption equipment can adsorb to arbitrary shape, the paster of size, can effectively deal with various occasions, uses more in a flexible way.
Description
Technical Field
The utility model relates to a SMT field, concretely relates to SMT chip mounter adsorption equipment.
Background
In the existing field of electronic product production and manufacturing, the SMT (surface mount technology) patch technology is widely applied to the production and manufacturing process of electronic products because of its advantages of high efficiency, high yield and low cost, but electronic devices are various in types and various in overall dimensions. The device that present paster was adsorbed generally adopts the sucking disc, but with the structure of sucking disc, hardly satisfies above-mentioned requirement, drops at the paster in-process very easily.
Disclosure of Invention
The utility model aims to solve the technical problem that an SMT chip mounter adsorption equipment can satisfy and use under the multiple occasion, all can adsorb to the paster of different appearance, size, and application range is wider, more practicality.
The utility model discloses a realize through following technical scheme: an adsorption device of an SMT chip mounter comprises a SMT chip mounter main machine and an adsorption device arranged on the SMT chip mounter main machine, the adsorption device is arranged at the output end of the driving mechanism of the SMT chip mounter and comprises a device plate, the bottom of the device plate is embedded with a contact part, the middle of the bottom of the contact part is provided with a sucker, the lower end surface of the sucker is flush with the lower end surface of the contact part, the sucker partially extends into the contact part, the contact part comprises a flexible outer protection layer and a memory sponge layer filled in the flexible outer protection layer, air inlet and outlet holes are formed in the tops of the device plate and the flexible outer protection layer, the outside of the air inlet and outlet holes is sealed through a sealing device, a negative pressure pipe is inserted into the top of the device plate, movably penetrates through the device plate and the flexible outer protection layer and extends into the memory sponge layer to be connected with the sucker, and the negative pressure pipe is connected with a negative pressure air source.
As the preferred technical scheme, the negative pressure pipe is a hard pipe, the hard pipe movably penetrates through the through holes in the device plate and the flexible outer protective layer, and the inner wall of each through hole is provided with a silica gel sealing ring for being in contact sealing with the outer wall surface of the negative pressure pipe.
According to the preferable technical scheme, the sealing device comprises a sealing plate, a silica gel sealing layer is arranged at the bottom of the sealing plate, a pulling line is connected to the bottom of the silica gel sealing layer, the other end of the pulling line is connected with a flexible rubber sheet, and the flexible rubber sheet seals an opening in the negative pressure pipe.
As the preferred technical scheme, a groove for accommodating the spring is formed in the device plate opposite to the sealing plate, a plastic spring is arranged in the groove, the sealing plate and the silica gel sealing layer are jacked up by the top of the plastic spring, the pulling wire penetrates through the small air inlet and outlet holes, and the outer diameter of the pulling wire is smaller than the inner diameter of the small air inlet and outlet holes.
As a preferred technical scheme, when the adsorption device is not used, the air inlet and outlet small holes are in a conduction state.
As a preferred technical scheme, the top of the device plate is provided with a connecting bracket which is used for connecting a driving mechanism to perform a pressing action.
The utility model has the advantages that: the utility model discloses utilize the structure of memory sponge, can carry out a preliminary fixed to the paster side, reunion negative pressure suction can the various shapes of effectual absorption and the paster of size, application range is wider.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the following description are only some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to these drawings without creative efforts.
Fig. 1 is a schematic view of the overall structure of the present invention;
FIG. 2 is a schematic view of the internal structure of the present invention;
fig. 3 is a partially enlarged view of a portion a in fig. 2 according to the present invention.
Detailed Description
All of the features disclosed in this specification, or all of the steps in any method or process so disclosed, may be combined in any combination, except combinations of features and/or steps that are mutually exclusive.
Any feature disclosed in this specification (including any accompanying claims, abstract and drawings), may be replaced by alternative features serving equivalent or similar purposes, unless expressly stated otherwise. That is, unless expressly stated otherwise, each feature is only an example of a generic series of equivalent or similar features.
In the description of the present invention, it is to be understood that the terms "one end", "the other end", "the outside", "upper", "inside", "horizontal", "coaxial", "central", "end", "length", "outer end", etc. indicate orientations or positional relationships based on those shown in the drawings, and are only for convenience of description and simplicity of description, and do not indicate or imply that the device or element referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore, should not be construed as limiting the present invention.
Furthermore, in the description of the present invention, "a plurality" means at least two, e.g., two, three, etc., unless specifically limited otherwise.
The use of terms herein such as "upper," "above," "lower," "below," and the like in describing relative spatial positions is for the purpose of facilitating description to describe one element or feature's relationship to another element or feature as illustrated in the figures. The spatially relative positional terms may be intended to encompass different orientations of the device in use or operation in addition to the orientation depicted in the figures. For example, if the device in the figures is turned over, elements described as "below" or "beneath" other elements or features would then be oriented "above" the other elements or features. Thus, the exemplary term "below" can encompass both an orientation of above and below. The device may be otherwise oriented (rotated 90 degrees or at other orientations) and the spatially relative descriptors used herein interpreted accordingly
In the present invention, unless otherwise explicitly specified or limited, the terms "set", "coupled", "connected", "penetrating", "plugging", and the like are to be understood in a broad sense, and may be, for example, fixedly connected, detachably connected, or integrated; can be mechanically or electrically connected; they may be directly connected or indirectly connected through intervening media, or they may be connected internally or in any other suitable relationship, unless expressly stated otherwise. The specific meaning of the above terms in the present invention can be understood according to specific situations by those skilled in the art.
As shown in fig. 1 and fig. 2, the utility model discloses a SMT chip mounter adsorption equipment, including SMT chip mounter host computer to and install the adsorption equipment on SMT chip mounter host computer, adsorption equipment installs in SMT chip mounter host computer actuating mechanism output.
The adsorption device comprises a device plate 2, the bottom of the device plate 2 is embedded with a contact part 3, a sucker 7 is arranged in the middle of the bottom of the contact part 3, the lower end face of the sucker 7 is flush with the lower end face of the contact part 3, and the sucker 7 partially extends into the contact part 3;
the contact part 3 comprises a flexible outer protective layer 32 and a memory sponge layer 31 filled in the flexible outer protective layer, the top parts of the device plate 2 and the flexible outer protective layer 32 are provided with air inlet and outlet small holes 22, the outside of the air inlet and outlet small holes 22 is sealed by a sealing device, the top part of the device plate 2 is inserted and provided with a negative pressure pipe 6, the negative pressure pipe 6 movably penetrates through the device plate 2 and the flexible outer protective layer 32 and extends into the memory sponge layer 31 to be connected with the sucker 7, and the negative pressure pipe 6 is connected with a negative pressure air source.
In this embodiment, the negative pressure tube 6 is a hard tube, and the negative pressure tube movably passes through the through holes on the device board and the flexible outer protective layer, and the inner wall of the through hole is provided with a silica gel sealing ring (not shown) for contacting and sealing with the outer wall surface of the negative pressure tube 6.
As shown in fig. 3, the sealing device 5 includes a sealing plate 51, a silicone sealing layer 52 is disposed at the bottom of the sealing plate 51, a pulling wire 11 is connected to the bottom of the silicone sealing layer 52, a flexible rubber sheet 8 is connected to the other end of the pulling wire 11, the flexible rubber sheet 8 seals an opening on the negative pressure tube 6, a groove 21 for accommodating a spring is disposed on the device plate facing the sealing plate 51, a plastic spring 9 is disposed in the groove 21, the top of the plastic spring 9 jacks up the sealing plate 51 and the silicone sealing layer 52, the pulling wire penetrates through the small air inlet and outlet hole 22, and the outer diameter of the pulling wire is smaller than the inner diameter of the small air.
In this embodiment, adsorption equipment is when not using, and the business turn over gas aperture is the form that switches on, this moment with contact site and paster compressive contact for the paster is detained in the contact site, utilizes contact site parcel paster, and sucking disc and paster up end contact this moment, opens the negative pressure source this moment, can utilize negative pressure and parcel power to wrap up the paster, reaches absorbent purpose.
After the negative pressure is opened, the negative pressure makes the flexible rubber piece part sunken, because flexible rubber piece is connected to the one end of pulling wire, consequently, the pulling wire of indent can drive outside closing plate and silica gel sealing layer and move towards business turn over gas aperture, and then utilize the silica gel sealing layer to seal business turn over gas aperture, whole business turn over gas aperture is sealed this moment, the memory sponge can not be through business turn over gas aperture suction outside air, just also can not make the memory sponge resume deformation, wrap up the paster all the time, can adsorb the transport to the paster during this period, can switch on business turn over gas aperture after closing the negative pressure source, loosen the paster.
In this embodiment, the top of the mounting plate 2 is provided with a connecting bracket 1 for connecting a driving mechanism to perform a pressing action.
The utility model has the advantages that: the utility model discloses utilize the structure of memory sponge, can carry out a preliminary fixed to the paster side, reunion negative pressure suction can the various shapes of effectual absorption and the paster of size, application range is wider.
The above description is only for the specific embodiments of the present invention, but the scope of the present invention is not limited thereto, and any changes or substitutions that are not thought of through the creative work should be covered within the scope of the present invention. Therefore, the protection scope of the present invention should be subject to the protection scope defined by the claims.
Claims (6)
1. The utility model provides a SMT chip mounter adsorption equipment, includes SMT chip mounter host computer to and install the adsorption equipment on SMT chip mounter host computer, adsorption equipment installs in SMT chip mounter host computer actuating mechanism output, its characterized in that: the adsorption device comprises a device plate, a contact part is embedded into the bottom of the device plate, a sucker is arranged in the middle of the bottom of the contact part, the lower end face of the sucker is flush with the lower end face of the contact part, the sucker partially extends into the contact part, the contact part comprises a flexible outer protective layer and a memory sponge layer filled in the flexible outer protective layer, air inlet and outlet holes are formed in the tops of the device plate and the flexible outer protective layer, the outside of the air inlet and outlet holes is sealed through a sealing device, a negative pressure pipe is inserted into the top of the device plate, penetrates through the device plate and the flexible outer protective layer and extends into the memory sponge layer to be connected with the sucker, and the negative pressure pipe is connected with a negative pressure air source.
2. An adsorption device of an SMT chip mounter according to claim 1, wherein: the negative pressure pipe is a hard pipe and movably penetrates through the through hole in the device plate and the flexible outer protective layer, and a silica gel sealing ring is arranged on the inner wall of the through hole and used for being in contact sealing with the outer wall surface of the negative pressure pipe.
3. An adsorption device of an SMT chip mounter according to claim 1, wherein: the sealing device comprises a sealing plate, a silica gel sealing layer is arranged at the bottom of the sealing plate, a pulling line is connected to the bottom of the silica gel sealing layer, a flexible rubber sheet is connected to the other end of the pulling line, and the flexible rubber sheet seals an opening on the negative pressure pipe.
4. An adsorption device of an SMT chip mounter according to claim 3, wherein: a groove for accommodating the spring is formed in the device plate opposite to the sealing plate, the plastic spring is arranged in the groove, the sealing plate and the silica gel sealing layer are jacked up by the top of the plastic spring, the pulling wire penetrates through the small air inlet and outlet holes, and the outer diameter of the pulling wire is smaller than the inner diameter of the small air inlet and outlet holes.
5. An adsorption device of an SMT chip mounter according to claim 1, wherein: when the adsorption device is not used, the air inlet and outlet small holes are in a conducting state.
6. An adsorption device of an SMT chip mounter according to claim 1, wherein: the top of the device plate is provided with a connecting bracket for connecting a driving mechanism to perform a pressing action.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202020249900.0U CN211831719U (en) | 2020-03-04 | 2020-03-04 | Adsorption device of SMT chip mounter |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202020249900.0U CN211831719U (en) | 2020-03-04 | 2020-03-04 | Adsorption device of SMT chip mounter |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN211831719U true CN211831719U (en) | 2020-10-30 |
Family
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202020249900.0U Expired - Fee Related CN211831719U (en) | 2020-03-04 | 2020-03-04 | Adsorption device of SMT chip mounter |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN211831719U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112367827A (en) * | 2020-12-03 | 2021-02-12 | 韩里平 | Adsorption device of SMT chip mounter |
| CN116331833A (en) * | 2023-03-17 | 2023-06-27 | 常州涵洋高分子材料科技有限公司 | Transfer tool and conveying device for flame-retardant sponge for automobile |
-
2020
- 2020-03-04 CN CN202020249900.0U patent/CN211831719U/en not_active Expired - Fee Related
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112367827A (en) * | 2020-12-03 | 2021-02-12 | 韩里平 | Adsorption device of SMT chip mounter |
| CN112367827B (en) * | 2020-12-03 | 2021-10-22 | 赣州深奥电子有限公司 | Adsorption device of SMT chip mounter |
| CN116331833A (en) * | 2023-03-17 | 2023-06-27 | 常州涵洋高分子材料科技有限公司 | Transfer tool and conveying device for flame-retardant sponge for automobile |
| CN116331833B (en) * | 2023-03-17 | 2023-08-22 | 常州涵洋高分子材料科技有限公司 | Transfer tool and conveying device for flame-retardant sponge for automobile |
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| Date | Code | Title | Description |
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| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20201030 |
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| CF01 | Termination of patent right due to non-payment of annual fee |