CN211831714U - SMT chip mounter paster material feeding unit - Google Patents
SMT chip mounter paster material feeding unit Download PDFInfo
- Publication number
- CN211831714U CN211831714U CN202020249906.8U CN202020249906U CN211831714U CN 211831714 U CN211831714 U CN 211831714U CN 202020249906 U CN202020249906 U CN 202020249906U CN 211831714 U CN211831714 U CN 211831714U
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- China
- Prior art keywords
- adsorption
- feeding unit
- material feeding
- responsible
- chip mounter
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- 239000000463 material Substances 0.000 title claims abstract description 20
- 238000001179 sorption measurement Methods 0.000 claims abstract description 41
- 230000008878 coupling Effects 0.000 claims abstract description 4
- 238000010168 coupling process Methods 0.000 claims abstract description 4
- 238000005859 coupling reaction Methods 0.000 claims abstract description 4
- 238000010521 absorption reaction Methods 0.000 claims description 4
- 238000000034 method Methods 0.000 description 5
- 239000000428 dust Substances 0.000 description 1
- 238000001125 extrusion Methods 0.000 description 1
- 238000010030 laminating Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 230000000149 penetrating effect Effects 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
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Abstract
The utility model discloses a SMT chip mounter paster material feeding unit, including the chip mounter host computer to and install the material feeding unit on the chip mounter host computer, adsorption equipment is installed to material feeding unit's bottom, and this adsorption equipment is including installing the device board in material feeding unit feed rod bottom, and more than one adsorption part has been laid to device board bottom equidistance, has laid one on the bottom surface of device board and has breathed in and be responsible for and one aerify and be responsible for, and a negative pressure pipe of connecting the negative pressure air supply usefulness is installed at the top of device board, and a gas-supply pipe of connecting the output air supply usefulness, the negative pressure union coupling is breathed in and is responsible for, aerifys and is responsible for and connect the gas-supply pipe, and the paster is placed. The utility model discloses can adsorb the transport to the paster of difference, can effectively solve because current paster size, shape are different and lead to the sucking disc to adsorb insecure problem.
Description
Technical Field
The utility model relates to a SMT paster field, concretely relates to SMT chip mounter paster material feeding unit.
Background
Chip mounter: also known as a mounter or a Surface Mount System (Surface Mount System), which is disposed behind a dispenser or a screen printer in a production line, is an apparatus for accurately placing Surface Mount components on PCB pads by moving a mounting head.
At present, because the size models of patches are different, a common suction nozzle is difficult to adsorb, particularly, the surface is convex, the surface is uneven, and the suction nozzle is difficult to adsorb, so that the problem of falling can always occur in the process of adsorbing the patches.
Disclosure of Invention
The utility model aims to solve the technical problem that an SMT chip mounter paster material feeding unit, it has very good absorption stationary force, is particularly suitable for the paster of unidimensional, shape, can greatly increased application range.
The utility model discloses a realize through following technical scheme: the utility model provides a SMT chip mounter paster material feeding unit, includes the chip mounter host computer to and install the material feeding unit on the chip mounter host computer, adsorption equipment is installed to material feeding unit's bottom, and this adsorption equipment is including installing the device board in material feeding unit feed rod bottom, and more than one adsorption part has been laid to device board bottom equidistance, has laid one on the bottom surface of device board and has breathed in and be responsible for and one aerify and be responsible for, and a negative pressure pipe of connecting the negative pressure air supply usefulness is installed at the top of device board to and a gas-supply pipe of connecting the output air supply usefulness, the negative pressure union coupling is breathed in and is responsible for, aerifys to be responsible for and connect the gas-supply pipe.
According to a preferable technical scheme, the adsorption parts respectively comprise two connecting rods, one ends of the connecting rods are fixedly connected with the lower end face of the device plate, an adsorption rod is installed between the two connecting rods, the adsorption rod is hollow, one side of the adsorption rod is connected with a main air suction pipe through an air suction branch pipe, and more than one small air suction hole is formed in the bottom of the adsorption rod.
According to a preferable technical scheme, a protruding portion is arranged at the top of the adsorption rod, through grooves are formed in two sides of the protruding portion respectively, elastic airbags are filled in the protruding portion, each elastic airbag is connected with an inflation main pipe through an inflation branch pipe, and the elastic airbags are ejected out of the through grooves in the two sides of the protruding portion by inflating the elastic airbags with air.
As a preferable technical scheme, a small air leakage hole is further formed in the position, right opposite to the through groove, of the elastic air bag.
As the preferred technical scheme, both sides of the adsorption rod are respectively provided with a sliding block, the side face of the connecting rod opposite to the sliding block is provided with a corresponding sliding groove, the sliding block is arranged in the sliding groove, and the sliding block slides in the sliding groove by extruding the adsorption rod.
The utility model has the advantages that: the utility model discloses utilize a brand-new structure, can be suitable for in various occasions, can play effective absorption to the paster of difference, prevent the problem that the paster dropped in the transportation process.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the following description are only some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to these drawings without creative efforts.
Fig. 1 is a schematic view of the overall structure of the present invention;
fig. 2 is a schematic structural view of the adsorption device of the present invention;
fig. 3 is a schematic structural view of the adsorption part of the present invention.
Detailed Description
All of the features disclosed in this specification, or all of the steps in any method or process so disclosed, may be combined in any combination, except combinations of features and/or steps that are mutually exclusive.
Any feature disclosed in this specification (including any accompanying claims, abstract and drawings), may be replaced by alternative features serving equivalent or similar purposes, unless expressly stated otherwise. That is, unless expressly stated otherwise, each feature is only an example of a generic series of equivalent or similar features.
In the description of the present invention, it is to be understood that the terms "one end", "the other end", "the outside", "upper", "inside", "horizontal", "coaxial", "central", "end", "length", "outer end", etc. indicate orientations or positional relationships based on those shown in the drawings, and are only for convenience of description and simplicity of description, and do not indicate or imply that the device or element referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore, should not be construed as limiting the present invention.
Furthermore, in the description of the present invention, "a plurality" means at least two, e.g., two, three, etc., unless specifically limited otherwise.
The use of terms herein such as "upper," "above," "lower," "below," and the like in describing relative spatial positions is for the purpose of facilitating description to describe one element or feature's relationship to another element or feature as illustrated in the figures. The spatially relative positional terms may be intended to encompass different orientations of the device in use or operation in addition to the orientation depicted in the figures. For example, if the device in the figures is turned over, elements described as "below" or "beneath" other elements or features would then be oriented "above" the other elements or features. Thus, the exemplary term "below" can encompass both an orientation of above and below. The device may be otherwise oriented (rotated 90 degrees or at other orientations) and the spatially relative descriptors used herein interpreted accordingly
In the present invention, unless otherwise explicitly specified or limited, the terms "set", "coupled", "connected", "penetrating", "plugging", and the like are to be understood in a broad sense, and may be, for example, fixedly connected, detachably connected, or integrated; can be mechanically or electrically connected; they may be directly connected or indirectly connected through intervening media, or they may be connected internally or in any other suitable relationship, unless expressly stated otherwise. The specific meaning of the above terms in the present invention can be understood according to specific situations by those skilled in the art.
As shown in fig. 1 and fig. 2, the utility model discloses a SMT chip mounter paster material feeding unit, including the chip mounter host computer, and install material feeding unit 1 on the chip mounter host computer, adsorption equipment 2 is installed to material feeding unit 1's bottom, this adsorption equipment 2 is including installing the device board 21 in material feeding unit feed rod bottom, more than one adsorption part 5 has been laid to device board 21 bottom equidistance, lay one on the bottom surface of device board 21 and breathe in and be responsible for 232 and one and aerify and be responsible for 231, one is installed at the top of device board 21 and is connected negative pressure pipe 22 that the negative pressure air supply was used, and one is connected the gas-supply pipe 23 that the output air supply was used, negative pressure 22 union coupling breathes in 232, it connects gas-supply pipe 23 to aerify to be responsible for 231, paster 4 is placed in the bottom of each adsorption part 5.
As shown in fig. 3, the adsorption part 5 includes two connecting rods 24, one end of each connecting rod 24 is fixedly connected to the lower end face of the device plate 21, an adsorption rod 27 is installed between the two connecting rods 24, the adsorption rod 27 is hollow, one side of the adsorption rod 27 is connected to the main air suction pipe 231 through an air suction branch pipe, and the bottom of the adsorption rod 27 is provided with more than one small air suction hole 28.
Wherein, the top of the adsorption rod 27 is provided with a convex part 26, two sides of the convex part 26 are respectively provided with a through groove, the convex part is filled with an elastic airbag 25, each elastic airbag 25 is connected with an inflation main pipe 231 through an inflation branch pipe 230, the elastic airbag 25 is ejected out of the through grooves at two sides of the convex part 26 by inflating the elastic airbag 25 with gas, as shown in figure 2, the adsorption rod contacted with the upper end protrusion 3 of the patch 4 is jacked up, the surface plane of the patch 4 is contacted with the lower end surface of the adsorption rod, the adsorption is carried out through the bottom writing air suction small hole, the air suction small hole at the bottom of the jacked adsorption rod is contacted and adsorbed with the protrusion 3, meanwhile, the air pipe inputs air source, the elastic airbag is ejected out through the through grooves, the side surface of the protrusion 3 is clamped and fixed by the ejected elastic airbag, the adsorption at the top surface and the side surface is achieved, and the all-round, the steady conveying of the paster is achieved.
The elastic air bag 25 is further provided with a small air release hole (not shown) at a position opposite to the through groove, and the redundant input air source is discharged through the small air release hole, and the discharged air can also assist in removing dust on the surface of the patch.
In this embodiment, each side of adsorbing pole 27 sets up a slider (not shown in the drawing), just is provided with the spout that corresponds on the connecting rod side of slider, and the slider sets up in the spout, adsorbs pole 27 through the extrusion and makes the slider slide in the spout, adsorbs the pole meeting protruding 3 back, can be through the slider jack-up that makes progress in the spout for dodge protruding 3, can the complete paster top of laminating.
The utility model has the advantages that: the utility model discloses utilize a brand-new structure, can be suitable for in various occasions, can play effective absorption to the paster of difference, prevent the problem that the paster dropped in the transportation process.
The above description is only for the specific embodiments of the present invention, but the scope of the present invention is not limited thereto, and any changes or substitutions that are not thought of through the creative work should be covered within the scope of the present invention. Therefore, the protection scope of the present invention should be subject to the protection scope defined by the claims.
Claims (5)
1. The utility model provides a SMT chip mounter paster material feeding unit which characterized in that: including the chip mounter host computer to and install the material feeding unit on the chip mounter host computer, adsorption equipment is installed to material feeding unit's bottom, and this adsorption equipment is including installing the device board in the material feeding unit feed rod bottom, and more than one absorption portion has been laid to device board bottom equidistance, has laid one on the bottom surface of device board and has breathed in and be responsible for and one aerify and be responsible for, and a negative pressure pipe of connecting the negative pressure air supply usefulness is installed at the top of device board to and a gas-supply pipe of connecting the output air supply usefulness, the negative pressure union coupling is breathed in and is responsible for, aerifys to be responsible for and connects the gas-supply pipe, and the paster.
2. A SMT pick and place machine feeding apparatus according to claim 1, wherein: the adsorption part comprises two connecting rods, one end of each connecting rod is fixedly connected with the lower end face of the device plate, an adsorption rod is arranged between the two connecting rods, the adsorption rod is hollow, one side of the adsorption rod is connected with an air suction main pipe through an air suction branch pipe, and more than one air suction small hole is formed in the bottom of the adsorption rod.
3. A SMT pick and place machine feeding apparatus according to claim 2, wherein: the top of the adsorption rod is provided with a protruding portion, through grooves are formed in two sides of the protruding portion respectively, elastic airbags are filled in the protruding portion, each elastic airbag is connected with an inflation main pipe through an inflation branch pipe, and the elastic airbags are ejected out of the through grooves in the two sides of the protruding portion by inflating the elastic airbags.
4. A SMT pick and place machine feeding apparatus according to claim 3, wherein: and the elastic air bag is also provided with an air leakage small hole at the position opposite to the through groove.
5. A SMT pick and place machine feeding apparatus according to claim 2, wherein: the two sides of the adsorption rod are respectively provided with a sliding block, the side face of the connecting rod, which is opposite to the sliding block, is provided with a corresponding sliding groove, the sliding blocks are arranged in the sliding grooves, and the sliding blocks can slide in the sliding grooves by extruding the adsorption rod.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202020249906.8U CN211831714U (en) | 2020-03-04 | 2020-03-04 | SMT chip mounter paster material feeding unit |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202020249906.8U CN211831714U (en) | 2020-03-04 | 2020-03-04 | SMT chip mounter paster material feeding unit |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN211831714U true CN211831714U (en) | 2020-10-30 |
Family
ID=72997664
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202020249906.8U Expired - Fee Related CN211831714U (en) | 2020-03-04 | 2020-03-04 | SMT chip mounter paster material feeding unit |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN211831714U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112367827A (en) * | 2020-12-03 | 2021-02-12 | 韩里平 | Adsorption device of SMT chip mounter |
-
2020
- 2020-03-04 CN CN202020249906.8U patent/CN211831714U/en not_active Expired - Fee Related
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112367827A (en) * | 2020-12-03 | 2021-02-12 | 韩里平 | Adsorption device of SMT chip mounter |
| CN112367827B (en) * | 2020-12-03 | 2021-10-22 | 赣州深奥电子有限公司 | Adsorption device of SMT chip mounter |
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| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20201030 |