CN211831599U - Novel heat dissipation shell structure - Google Patents

Novel heat dissipation shell structure Download PDF

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Publication number
CN211831599U
CN211831599U CN201921933760.2U CN201921933760U CN211831599U CN 211831599 U CN211831599 U CN 211831599U CN 201921933760 U CN201921933760 U CN 201921933760U CN 211831599 U CN211831599 U CN 211831599U
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China
Prior art keywords
shell
end cover
heat dissipation
heat conduction
high heat
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CN201921933760.2U
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Chinese (zh)
Inventor
冯唐高
宋文龙
邓青
徐天猛
陈继良
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Huiyi New Material Technology Foshan Co ltd
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Dongguan Flett Electronic Technology Co ltd
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Priority to CN201921933760.2U priority Critical patent/CN211831599U/en
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Abstract

The utility model discloses a novel heat dissipation shell structure relates to the electron product heat dissipation field. This novel heat dissipation shell structure, including shell and heating element, the inside cover of shell is equipped with heating element, the opening has all been seted up with the back to the front of shell, the front and the back of shell just are equipped with first end cover and second end cover respectively in the position that the opening is relative, first end cover sets up with the second end cover is relative, the back of shell is inlayed and is equipped with high heat conduction structure spare. This novel heat dissipation shell structure through setting up high heat conduction structure, inlay entry and louvre, from the heat dissipation angle of shell, with the material cladding of low coefficient of thermal conductivity at high coefficient of thermal conductivity material periphery, this makes high heat conduction material can carry out direct heat transfer with outside environment air for high heat conduction structure directly exposes in external environment, and high heat conduction structure can not directly touched, and overall effect radiating effect is good, and the surface temperature sense of touch is excellent.

Description

Novel heat dissipation shell structure
Technical Field
The utility model relates to an electronic product heat dissipation technical field specifically is a novel heat dissipation shell structure.
Background
Along with electronic product is more intelligent, it is small and exquisite, the unit area's consumption density is also continuous increase, this leads to electronic product heat dissipation problem more and more serious, to the product that uses natural heat dissipation mode control temperature, most of heats all must scatter and disappear to the environment through the shell and go, use higher coefficient of heat conductivity's material design shell, though can strengthen the heat transfer, reduce the temperature of the inside device of product, but the higher shell material of coefficient of heat conductivity, the sense of touch of giving people under the same temperature scalds more, to the product that those human bodies easily touched, the temperature is experienced relatively poorly, to the not enough of current device, the utility model discloses a novel heat dissipation shell structure.
SUMMERY OF THE UTILITY MODEL
Technical problem to be solved
Not enough to prior art, the utility model discloses a novel heat dissipation shell structure to solve the problem that proposes among the above-mentioned background art.
(II) technical scheme
In order to achieve the above purpose, the utility model discloses a following technical scheme realizes: a novel heat dissipation shell structure comprises a shell and a heating element, wherein the heating element is sleeved in the shell.
The front and the back of shell have all seted up the opening, the front and the back of shell just are equipped with first end cover and second end cover respectively in the relative position of opening, first end cover sets up with the second end cover is relative, the back of shell is inlayed and is equipped with high heat conduction structure spare, the last edge department of shell has seted up and has inlayed the mouth, inlay the front and back both sides of mouth and be linked together with corresponding first end cover and second end cover respectively, the inside and the high heat conduction structure spare activity of inlaying the mouth cup joint, the louvre has been seted up at the top of shell, the louvre runs through the top of shell.
Preferably, the outer surface of the heating element is attached to the housing, the first end cap and the high thermal conductivity structural member.
Preferably, the opening degree of the embedding opening is matched with the high heat conduction structural part.
Preferably, the radiating holes are arranged at the top of the shell at equal intervals, and the radiating holes are communicated with the embedding openings.
Preferably, the high heat conduction structural member is arranged in an L shape.
Preferably, the first end cap and the second end cap have the same thickness.
The utility model discloses a novel heat dissipation shell structure, its beneficial effect who possesses as follows:
this novel heat dissipation shell structure, through setting up high heat conduction structure, inlay entry and louvre, from the heat dissipation angle of shell, the material cladding with low coefficient of heat conductivity is peripheral at high coefficient of heat conductivity material, this makes high heat conduction material can carry out direct heat transfer with external environment air, and the part that the staff directly touched is then low coefficient of heat conductivity's structure, high heat conduction structure is attached at low heat conduction structure inner wall, the aperture is opened in low heat conduction material outside simultaneously, make high heat conduction structure directly expose in external environment, nevertheless less because of the aperture, high heat conduction structure can not directly touched, the whole effect radiating effect is good, the surface temperature sense of touch is excellent.
Drawings
FIG. 1 is an exploded view of the structure of the present invention;
FIG. 2 is a schematic view of the structure of the housing of the present invention;
FIG. 3 is a sectional view of the structure of the housing of the present invention;
fig. 4 is an enlarged view of a portion a in fig. 3 according to the present invention.
In the figure: the heat dissipation structure comprises a shell 1, an opening 2, a first end cover 3, a second end cover 4, a heating element 5, a high-heat-conductivity structural member 6, an embedded opening 7 and heat dissipation holes 8.
Detailed Description
The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments.
Examples of which are illustrated in the accompanying drawings, wherein like reference numerals refer to the same or similar elements or elements having the same or similar function throughout. The embodiments described below with reference to the drawings are exemplary and intended to be used for explaining the present invention, and should not be construed as limiting the present invention.
The embodiment of the utility model discloses novel heat dissipation shell structure, as shown in fig. 1-4, including shell 1 and heating element 5, the inside cover of shell 1 is equipped with heating element 5, and the heat radiation structure of this patent can be applied to the shell of various human accessible electronic products, if: a vehicle event data recorder, a motion camera, a smart sound box, a smart phone, and the like.
The front side and the back side of the shell 1 are both provided with openings 2, the front side and the back side of the shell 1 are respectively provided with a first end cover 3 and a second end cover 4 at positions opposite to the openings 2, the first end cover 3 and the second end cover 4 are oppositely arranged, the thicknesses of the first end cover 3 and the second end cover 4 are the same, the back side of the shell 1 is embedded with a high-heat-conductivity structural member 6, the outer surface of the heating element 5 is attached to the shell 1, the first end cover 3 and the high-heat-conductivity structural member 6, the high-heat-conductivity structural member 6 is arranged in an L shape, and the high-heat-conductivity structural member 6 can be a copper foil, an aluminum foil, a graphite film, a graphene film, a copper; the low thermal conductivity material structure may be plastic, glass, etc.
Specifically, through setting up high thermal conductivity structure 6, embedding mouth 7 and louvre 8, from the heat dissipation angle of shell 1, the material cladding with low coefficient of thermal conductivity is peripheral at high coefficient of thermal conductivity material, this makes high thermal conductivity material can carry out direct heat transfer with the external environment air, and the part that the staff directly touched is then the structure of low coefficient of thermal conductivity, high thermal conductivity structure 6 is attached at low thermal conductivity material structure inner wall, open the aperture in low thermal conductivity material outside simultaneously, make high thermal conductivity structure 6 directly expose in the external environment, but because of the aperture is less, high thermal conductivity structure 6 can not directly touched, the whole effect radiating effect is good, surface temperature sense of touch is excellent.
The high heat conduction structural member 6 can be embedded in the middle of the low heat conduction material, but a small hole is formed outside the low heat conduction structural member, so that the high heat conduction structural member 6 is directly exposed in the external environment, but the high heat conduction structural member 6 cannot be directly touched due to small aperture, and the high heat conduction structural member 6 can be a copper foil, an aluminum foil, a graphite film, a graphene film, a copper sheet, an aluminum sheet, a ceramic sheet or a mesh structure of the materials and the like; the low thermal conductivity material structure may be plastic, glass, etc.
The department has been seted up along going up of shell 1 and has been inlayed entry 7, both sides are linked together with first end cap 3 and the second end cap 4 that corresponds respectively around embedding mouth 7, the inside and the activity of high heat conduction structure spare of embedding mouth 7 cup joint, louvre 8 has been seted up at the top of shell 1, louvre 8 runs through the top of shell 1, the aperture and the 6 looks adaptations of high heat conduction structure spare of embedding mouth 7, louvre 8 equidistance is seted up at the top of shell 1, and louvre 8 is linked together with embedding mouth 7, louvre 8's trompil shape can be circular, squarely, forms such as hexagon.
The working principle is as follows: the device is when using, the material cladding with low coefficient of heat conductivity is peripheral at high coefficient of heat conductivity material, this makes high heat conduction material can carry out direct heat transfer with external environment air, and the part that the staff directly touched is then low coefficient of heat conductivity's structure, high heat conduction structure is attached at low heat conduction structure inner wall, simultaneously at the outside aperture of opening of low heat conduction material, make high heat conduction structure 6 directly expose in the external environment, nevertheless because of the aperture is less, high heat conduction structure 6 can not directly touched, the heat that heating element 5 produced is dispelled along the inner wall of shell 1, high heat conduction structure 6 absorbs the heat at the top in the shell 1 simultaneously, through the inside of timely effectual discharge shell 1 of louvre 8.
The basic principles and the main features of the invention and the advantages of the invention have been shown and described above. It will be understood by those skilled in the art that the present invention is not limited to the above embodiments, and that the foregoing embodiments and descriptions are provided only to illustrate the principles of the present invention without departing from the spirit and scope of the present invention. The scope of the invention is defined by the appended claims and equivalents thereof.

Claims (6)

1. A novel heat dissipation shell structure comprises a shell (1) and a heating element (5), and is characterized in that: a heating element (5) is sleeved in the shell (1);
opening (2) have all been seted up with the back in the front of shell (1), the front and the back of shell (1) just are equipped with first end cover (3) and second end cover (4) respectively in opening (2) relative position, first end cover (3) set up with second end cover (4) relatively, the back of shell (1) is inlayed and is equipped with high heat conduction structure spare (6), the department of going up along of shell (1) has been seted up and has been inlayed entry (7), inlay the front and back both sides of entry (7) and be linked together with first end cover (3) and second end cover (4) that correspond respectively, the inside and the high heat conduction structure spare (6) activity of inlaying entry (7) are cup jointed, louvre (8) have been seted up at the top of shell (1), louvre (8) run through the top of shell (1).
2. The novel heat dissipation housing structure of claim 1, wherein: the outer surface of the heating element (5) is attached to the shell (1), the first end cover (3) and the high-heat-conductivity structural member (6).
3. The novel heat dissipation housing structure of claim 1, wherein: the opening degree of the embedding opening (7) is matched with the high heat conduction structural part (6).
4. The novel heat dissipation housing structure of claim 1, wherein: the radiating holes (8) are arranged at the top of the shell (1) at equal intervals, and the radiating holes (8) are communicated with the embedded opening (7).
5. The novel heat dissipation housing structure of claim 1, wherein: the high heat conduction structural part (6) is arranged in an L shape.
6. The novel heat dissipation housing structure of claim 1, wherein: the thickness of the first end cover (3) is the same as that of the second end cover (4).
CN201921933760.2U 2019-11-11 2019-11-11 Novel heat dissipation shell structure Active CN211831599U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201921933760.2U CN211831599U (en) 2019-11-11 2019-11-11 Novel heat dissipation shell structure

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201921933760.2U CN211831599U (en) 2019-11-11 2019-11-11 Novel heat dissipation shell structure

Publications (1)

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CN211831599U true CN211831599U (en) 2020-10-30

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Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN113597189A (en) * 2021-09-27 2021-11-02 南通市晨邺信息技术有限公司 Electronic product ventilation cooling protecting sheathing
EP4135340A3 (en) * 2021-08-09 2023-03-08 Beijing Xiaomi Mobile Software Co., Ltd. Sound-producing structure and playback device

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP4135340A3 (en) * 2021-08-09 2023-03-08 Beijing Xiaomi Mobile Software Co., Ltd. Sound-producing structure and playback device
US11778381B2 (en) 2021-08-09 2023-10-03 Beijing Xiaomi Mobile Software Co., Ltd Sound-producing structure and playback device
CN113597189A (en) * 2021-09-27 2021-11-02 南通市晨邺信息技术有限公司 Electronic product ventilation cooling protecting sheathing
CN113597189B (en) * 2021-09-27 2021-11-26 南通市晨邺信息技术有限公司 Electronic product ventilation cooling protecting sheathing

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Effective date of registration: 20220525

Address after: 528000 span 6, zone a, floor 3, building B, phase II plant of Xintai high tech Industrial Park, No. 12, haizan Road, hailing village, Xingtan town, Shunde District, Foshan City, Guangdong Province

Patentee after: Huiyi new material technology (Foshan) Co.,Ltd.

Address before: 523000 4th floor, No.51 Hongsheng Road, diaolang village, Huangjiang Town, Dongguan City, Guangdong Province

Patentee before: DONGGUAN FLETT ELECTRONIC TECHNOLOGY CO.,LTD.