CN211828315U - Thick film surface-mounted chip resistor - Google Patents
Thick film surface-mounted chip resistor Download PDFInfo
- Publication number
- CN211828315U CN211828315U CN202020751331.XU CN202020751331U CN211828315U CN 211828315 U CN211828315 U CN 211828315U CN 202020751331 U CN202020751331 U CN 202020751331U CN 211828315 U CN211828315 U CN 211828315U
- Authority
- CN
- China
- Prior art keywords
- fastener
- main body
- layer
- resistor
- chip resistor
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Images
Landscapes
- Apparatuses And Processes For Manufacturing Resistors (AREA)
Abstract
The utility model discloses a thick film surface-mounted chip resistor, which comprises a chip resistor main body, a fixed rod and a fastener; the fixed rod is fixed on the upper surface of the resistor main body through a fastener; the fixed rods are distributed on two sides of the upper surface of the wafer resistor main body in an equidistant and symmetrical mode; the bottom of dead lever and the laminating setting of circuit board just pass through welded fastening on the circuit board. The fixing rods are arranged, so that the firmness of the wafer resistor main body fixed on the circuit board is ensured; the thermal insulation layer is arranged, so that the wafer resistor main body cannot change along with the change of the external temperature, and the working stability of the wafer resistor main body is ensured; through setting up a plurality of bases protrudingly, make wafer resistance main part and circuit board not direct contact, further guaranteed the stability of wafer resistance main part work.
Description
Technical Field
The utility model relates to an electrical element field specifically is a thick film surface mounting wafer resistor.
Background
With the development of electronic technology, more and more circuit boards use chip resistors, which are classified into thick film chip resistors and thin film chip resistors. The thick film chip resistor is also called a conventional thick film chip fixed resistor, has the advantages of small volume, light weight, stable electrical performance, high-frequency characteristic and the like, and is widely applied to the aspects of medical equipment, precision measuring instruments, electronic communication, converters and the like.
The thick film chip resistor is generally fixed on the circuit board by welding, because the thick film chip resistor pin is small, the situation that welding is not firm can occur during welding, and when the circuit board vibrates, the thick film chip resistor pin can be caused to fall off, so that the thick film chip resistor falls off from the circuit board.
SUMMERY OF THE UTILITY MODEL
An object of the utility model is to provide a thick film surface mounting wafer resistor to solve the problem that proposes among the above-mentioned background art.
In order to achieve the above object, the utility model provides a following technical scheme:
a thick film surface-mounted chip resistor comprises a chip resistor main body, a fixed rod and a fastener; the fixed rod is fixed on the upper surface of the resistor main body through a fastener; the fixed rods are distributed on two sides of the upper surface of the wafer resistor main body in an equidistant and symmetrical mode; the bottom of dead lever and the laminating of circuit board set up and welded fastening on the circuit board.
As a further aspect of the present invention: the wafer resistor main body comprises a side electrode, a nickel plating layer, a tin plating layer, a positive electrode, a resistance layer, a negative electrode and a white substrate; the left side and the right side of the upper surface of the white substrate are symmetrically provided with two positive electrodes; two negative electrodes are symmetrically arranged on the left side and the right side of the lower surface of the white substrate; two side electrodes are symmetrically arranged on the left and right of the outer sides of the two positive electrodes and the negative electrodes; an arc-shaped resistance layer is arranged between the two positive electrodes; a first protective layer and a second protective layer are sequentially arranged on the outer side of the resistance layer, the first protective layer wraps the resistance layer, and the second protective layer wraps the first protective layer; and the outer sides of the two side electrodes are sequentially provided with a nickel plating layer and a tin plating layer, the nickel plating layer wraps the side electrodes, and the tin plating layer wraps the nickel plating layer.
As a further aspect of the present invention: the outer side of the wafer resistor main body is uniformly provided with a heat insulation layer; the heat insulating layer is made of porous materials.
As a further aspect of the present invention: the equidistant distribution of heat insulation layer bottom is provided with a plurality of base archs.
As a further aspect of the present invention: the fastener comprises a fastener male part and a fastener female part; the male fastener is fixed at the bottom of the upper end of the fixed rod, and the female fastener is fixed on the upper surface of the wafer resistor main body; a plurality of fastener male part protruding parts are distributed on the circumference of the bottom of the fastener male part; the fastener female part is cylindrical and has an annular bulge inwards at the top end; the vertical height of the triangular prism at the bottom of the convex part of the male fastener is smaller than the height from the annular bulge of the female fastener to the bottom of the female fastener.
Compared with the prior art, the beneficial effects of the utility model are that: the fixing rods are arranged, so that the firmness of the wafer resistor main body fixed on the circuit board is ensured; the thermal insulation layer is arranged, so that the wafer resistor main body cannot change along with the change of the external temperature, and the working stability of the wafer resistor main body is ensured; through setting up a plurality of bases protrudingly, make wafer resistance main part and circuit board not direct contact, further guaranteed the stability of wafer resistance main part work.
Drawings
FIG. 1 is a schematic diagram of a thick film surface mount chip resistor.
FIG. 2 is a schematic diagram of a fastener assembly of a thick film surface mount chip resistor.
In the figure: 1-base bulge, 2-side electrode, 3-nickel plating layer, 4-tin plating layer, 5-heat insulation layer, 6-fixing rod, 7-fastener, 8-positive electrode, 9-second protective layer, 10-first protective layer, 11-resistance layer, 12-negative electrode, 13-white substrate, 14-fastener male part, 15-fastener female part and 16-fastener male part bulge.
Detailed Description
The technical solution of the present patent will be described in further detail with reference to the following embodiments.
Example 1
Referring to fig. 1, the embodiment provides a thick film surface mount chip resistor, which includes a chip resistor main body, a fixing rod 6 and a fastener 7; the fixed rod 6 is fixed on the upper surface of the resistor main body through a fastener 7; the fixed rods 6 are distributed on two sides of the upper surface of the wafer resistor main body in an equidistant and symmetrical mode; the bottom end of the fixed rod 6 is attached to the circuit board and is welded and fixed on the circuit board; one end of the fixing rod 6 is welded on the circuit board, and the other end of the fixing rod is fixed above the wafer resistor main body, so that the wafer resistor main body can be further ensured not to fall off from the circuit board.
The wafer resistor main body comprises a side electrode 2, a nickel-plated layer 3, a tin-plated layer 4, a positive electrode 8, a resistance layer 11, a negative electrode 12 and a white substrate 13; the left side and the right side of the upper surface of the white substrate 13 are symmetrically provided with two positive electrodes 8; two negative electrodes 12 are symmetrically arranged on the left side and the right side of the lower surface of the white substrate 13; two side electrodes 2 are symmetrically arranged at the outer sides of the two positive electrodes 8 and the negative electrodes 12; an arc-shaped resistance layer 11 is arranged between the two positive electrodes 8; a first protective layer 10 and a second protective layer 9 are sequentially arranged on the outer side of the resistor layer 11, the resistor layer 11 is wrapped by the first protective layer 10, and the internal structure of the thick film chip resistor is protected by the second protective layer 9 wrapped by the first protective layer 10; the outer sides of the two side electrodes 2 are sequentially provided with a nickel plating layer 3 and a tin plating layer 4, the nickel plating layer 3 wraps the side electrodes 2, and the tin plating layer 4 wraps the nickel plating layer 3.
The outer side of the wafer resistor main body is uniformly provided with a heat insulation layer 5; porous material is selected for use to heat insulation layer 5, sets up like this, can utilize the hole that porous material itself contains to insulate against heat, sets up like this, can avoid the temperature of wafer resistance main part to rise because of outside ambient temperature, has guaranteed the stability of wafer resistance work.
The 5 bottom equidistance of heat insulation layer distributes and is provided with a plurality of base arch 1, sets up like this, makes 5 bottoms of heat insulation layer not with circuit board direct contact, and the circuit board can give off the heat at the during operation, and heat insulation layer 5 and circuit board contact if, probably transmit the heat part for the wafer resistor main part to influence the work of wafer resistor main part.
The working principle of the embodiment is as follows: the fixed rods 6 are distributed on two sides of the upper surface of the wafer resistor main body in an equidistant and symmetrical mode; the bottom end of the fixed rod 6 is attached to the circuit board and fixed on the circuit board through welding; one end of the fixing rod 6 is welded on the circuit board, and the other end of the fixing rod is fixed above the wafer resistor main body, so that the wafer resistor main body can be further ensured not to fall off from the circuit board. The heat insulation layer 5 uniformly wraps the wafer resistor main body, so that the temperature of the wafer resistor main body cannot rise due to the rise of the external temperature, and the working stability of the wafer resistor main body is ensured; by providing a plurality of pedestal projections 1 on the bottom, direct contact of the heat insulating layer 5 with the circuit board is avoided, and the temperature of the wafer resistor main body is further kept constant.
Example 2
Referring to fig. 2, the embodiment is further improved on the basis of embodiment 1, and the improvement is as follows: the fastener 7 comprises a fastener male part 14 and a fastener female part 15; the male fastener 14 is fixed at the bottom of the upper end of the fixed rod 6, and the female fastener 15 is fixed on the upper surface of the wafer resistor main body; a plurality of fastener male part protruding parts 16 are distributed on the bottom circumference of the fastener male part 14; the fastener female part 15 is cylindrical and has an annular bulge inwards at the top end; the vertical height of the triangular prism at the bottom of the male fastener convex part 16 is less than the height of the annular bulge of the female fastener 15 from the bottom of the female fastener 15; by this arrangement, the stability of the fastening 7 can be ensured.
It should be noted that, as is obvious to a person skilled in the art, the invention is not limited to details of the above-described exemplary embodiments, but can be embodied in other specific forms without departing from the spirit or essential characteristics thereof.
Claims (5)
1. A thick film surface-mounted chip resistor comprises a chip resistor main body, a fixed rod (6) and a fastener (7), and is characterized in that the fixed rod (6) is fixed on the upper surface of the resistor main body through the fastener (7); the number of the fixing rods (6) is multiple, and the fixing rods are equidistantly and symmetrically distributed on two sides of the upper surface of the wafer resistor main body; the bottom of dead lever (6) sets up and welded fastening on the circuit board with the laminating of circuit board.
2. The thick film surface mount chip resistor of claim 1, wherein the chip resistor body comprises a side electrode (2), a nickel plating layer (3), a tin plating layer (4), a positive electrode (8), a resistive layer (11), a negative electrode (12), and a white substrate (13); two positive electrodes (8) are symmetrically arranged on the left side and the right side of the upper surface of the white substrate (13); two negative electrodes (12) are symmetrically arranged on the left side and the right side of the lower surface of the white substrate (13); two side electrodes (2) are symmetrically arranged at the left and right sides of the outer sides of the two positive electrodes (8) and the outer sides of the two negative electrodes (12); an arc-shaped resistance layer (11) is arranged between the two positive electrodes (8); a first protective layer (10) and a second protective layer (9) are sequentially arranged on the outer side of the resistor layer (11), the resistor layer (11) is wrapped by the first protective layer (10), and the first protective layer (10) is wrapped by the second protective layer (9); the outer sides of the two side electrodes (2) are sequentially provided with a nickel plating layer (3) and a tin plating layer (4), the nickel plating layer (3) wraps the side electrodes (2), and the tin plating layer (4) wraps the nickel plating layer (3).
3. The thick film surface mount chip resistor as claimed in claim 2, wherein the chip resistor body is uniformly provided with a heat insulating layer (5) on the outer side; the heat insulating layer (5) is made of a porous material.
4. The thick film surface mount chip resistor as claimed in claim 3, wherein the insulating layer (5) is provided with a plurality of base projections (1) at the bottom thereof in an equidistant distribution.
5. The thick film surface mount chip resistor of claim 2, wherein said clip (7) comprises a clip male (14) and a clip female (15); the male fastener (14) is fixed at the bottom of the upper end of the fixed rod (6), and the female fastener (15) is fixed on the upper surface of the wafer resistor main body; a plurality of fastener male part protruding parts (16) are distributed on the circumference of the bottom of the fastener male part (14); the fastener female part (15) is cylindrical and has an annular bulge inwards at the top end; the vertical height of the triangular prism shape at the bottom of the convex part (16) of the male fastener is smaller than the height of the annular bulge of the female fastener (15) from the bottom of the female fastener (15).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202020751331.XU CN211828315U (en) | 2020-05-09 | 2020-05-09 | Thick film surface-mounted chip resistor |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202020751331.XU CN211828315U (en) | 2020-05-09 | 2020-05-09 | Thick film surface-mounted chip resistor |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN211828315U true CN211828315U (en) | 2020-10-30 |
Family
ID=73020514
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202020751331.XU Active CN211828315U (en) | 2020-05-09 | 2020-05-09 | Thick film surface-mounted chip resistor |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN211828315U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113889308A (en) * | 2021-09-23 | 2022-01-04 | 浙江玖维电子科技有限公司 | Production process of chip resistor loaded on ceramic substrate |
-
2020
- 2020-05-09 CN CN202020751331.XU patent/CN211828315U/en active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113889308A (en) * | 2021-09-23 | 2022-01-04 | 浙江玖维电子科技有限公司 | Production process of chip resistor loaded on ceramic substrate |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JP5924907B2 (en) | PROTECTION CIRCUIT MODULE WITH THERMISTOR AND SECONDARY PACK | |
| KR101084982B1 (en) | Secondary Battery Pack of Novel Structure | |
| US6040755A (en) | Chip thermistors and methods of making same | |
| CN211828315U (en) | Thick film surface-mounted chip resistor | |
| JP2011249615A (en) | Surface mounted electronic component and method for manufacturing the same | |
| JP3736602B2 (en) | Chip type thermistor | |
| JP2002043717A (en) | Electronic parts and its manufacturing method | |
| TW201432754A (en) | Solid electrolytic capacitor package structure for decreasing equivalent series resistance and method of manufacturing the same | |
| CN103021598B (en) | Over-current protecting element | |
| TW201430896A (en) | Over-current protection device and circuit board containing the same | |
| CN209199782U (en) | A kind of lamination type capacitor for using parylene as dielectric substance layer | |
| US9307646B2 (en) | Over-current protection device and protective circuit board containing the same | |
| JP2021527322A (en) | High frequency and high power thin film components | |
| CN111816647B (en) | Plastic package high-voltage silicon stack | |
| CN210575321U (en) | Chip thermistor and electronic device | |
| CN217542021U (en) | Probe of thermal flow sensor | |
| CN218548433U (en) | Diode device | |
| CN219416481U (en) | NTC temperature sensor | |
| JPH0610399Y2 (en) | Piezoelectric buzzer | |
| CN220691791U (en) | Alloy sheet type fixed resistor | |
| CN221352481U (en) | Chip resistor structure | |
| CN209374615U (en) | The signal acquiring board of power battery module | |
| CN217641007U (en) | Explosion-proof paster electrolytic capacitor | |
| JPS5853031Y2 (en) | display panel | |
| CN215069995U (en) | Firm SMD MOS pipe structure |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant |