CN211810868U - Semiconductor chip storage box - Google Patents

Semiconductor chip storage box Download PDF

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Publication number
CN211810868U
CN211810868U CN202020274652.5U CN202020274652U CN211810868U CN 211810868 U CN211810868 U CN 211810868U CN 202020274652 U CN202020274652 U CN 202020274652U CN 211810868 U CN211810868 U CN 211810868U
Authority
CN
China
Prior art keywords
semiconductor chip
sealed storage
block
sealing
storage box
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CN202020274652.5U
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Chinese (zh)
Inventor
梁尚红
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Wuxi Tongmao Electronic Technology Co ltd
Original Assignee
Wuxi Tongmao Electronic Technology Co ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Wuxi Tongmao Electronic Technology Co ltd filed Critical Wuxi Tongmao Electronic Technology Co ltd
Priority to CN202020274652.5U priority Critical patent/CN211810868U/en
Application granted granted Critical
Publication of CN211810868U publication Critical patent/CN211810868U/en
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

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Abstract

The utility model discloses a semiconductor chip stores box relates to and stores box technical field, and it is more complicated to store box operation for solving current semiconductor chip, and the rate of utilization is not very high problem. Including sealed storage box, U type fixture block is installed to one side of sealed storage box, and sealed storage box is provided with two, sealed storage lid is installed to the opposite side of U type fixture block, the connecting block is installed to the opposite side of sealed storage lid, and the connecting block is provided with two, the sponge that takes precautions against earthquakes is all installed to the inside of sealed storage box and sealed storage lid, the internally mounted of sealed storage lid has the sealing silica gel strip, two the inside one side of sponge that takes precautions against earthquakes all is provided with the spacing groove, the inside of spacing groove is provided with card strip groove, two the inside opposite side of sponge that takes precautions against earthquakes all is provided with the fixed slot, the inside below of sponge that takes precautions against earthquakes is provided with the steel.

Description

Semiconductor chip storage box
Technical Field
The utility model relates to a store box technical field, specifically be a semiconductor chip stores box.
Background
The semiconductor chip storage box is a box for storing a semiconductor chip, the semiconductor chip is a semiconductor device which is manufactured by etching, wiring and realizing a certain function on a semiconductor sheet, not only a silicon chip, but also common semiconductor materials such as gallium arsenide, germanium and the like, the semiconductor also has a trend like an automobile, in the twentieth and seventies, the U.S. enterprises such as intel occupy the wind in the dynamic random access memory market, in order to meet the requirement on mass production, the electrical property of the semiconductor must be predictable and stable, therefore, the purity of dopants and the quality of a semiconductor crystal lattice structure must be strictly required, common quality problems including dislocation, crystal faces or stacking faults of the crystal lattice can influence the characteristics of the semiconductor material, the most common method for growing high-purity single crystal semiconductor material is called a chaila-based method at present, the process includes setting seed crystal of single crystal into dissolved liquid of the same material, and rotating to raise the seed crystal slowly for the solute to solidify along the interface between the solid and the liquid and to homogenize the temperature of the solute.
However, the existing semiconductor chip storage box is relatively complex in operation and not very high in utilization rate; thus, the existing requirements are not satisfied, and a semiconductor chip storage box is provided for the requirement.
SUMMERY OF THE UTILITY MODEL
An object of the utility model is to provide a semiconductor chip stores box to it is more complicated to propose current semiconductor chip to store box operation in solving above-mentioned background art, and the rate of utilization is not very high problem.
In order to achieve the above object, the utility model provides a following technical scheme: a semiconductor chip storage box comprises a sealed storage box, wherein one side of the sealed storage box is provided with two U-shaped clamping blocks, the other side of each U-shaped clamping block is provided with a sealed storage cover, the other side of each sealed storage cover is provided with a connecting block, the number of the connecting blocks is two, shockproof sponges are arranged inside the sealed storage box and the sealed storage cover, sealing silica gel strips are arranged inside the sealed storage cover, one side of the inner part of each shockproof sponge is provided with a limiting groove, a clamping strip groove is arranged inside the limiting groove, the other side of the inner part of each shockproof sponge is provided with a fixing groove, a steel wire mesh groove is arranged below the inner part of each shockproof sponge, the number of the steel wire mesh grooves is two, a semiconductor chip carrier is arranged in the middle position inside the sealed storage box, and the two sides of the semiconductor chip carrier are provided with fixing clamping strips, the semiconductor chip carrier is internally provided with a plurality of connecting sheets, supporting columns are arranged between every two adjacent connecting sheets, and a plurality of supporting columns are arranged, supporting blocks are arranged on one side of each supporting column, and a plurality of supporting blocks are arranged on each supporting block, shockproof silica gel is arranged on one side of the supporting column and the front end of the supporting block, a handle is arranged above the semiconductor chip carrier, three handles are arranged, two fixing blocks are arranged below the semiconductor chip carrier, a magnet adsorption block is arranged inside one side of the sealed storage cover, a magnet clamping groove is arranged inside one side of the sealed storage box, a magnet strip is arranged in the magnet clamping groove, a steel wire mesh is arranged below the semiconductor chip carrier, activated carbon is installed below the steel wire mesh, and an ultraviolet sterilization heat preservation lamp is installed in the middle of the front end of the sealed storage cover.
Preferably, the U-shaped fixture block is rotatably connected with the connecting block through a rotating shaft inserting strip.
Preferably, the connecting piece and the supporting column are connected with the connecting piece and the supporting block in a welding mode.
Preferably, the shockproof silica gel and the support column and the shockproof silica gel and the support block are both adhered and connected.
Preferably, the semiconductor chip carrier and the handle are connected by screws.
Preferably, the sealed storage cover and the sealed silica gel strip and the sealed storage box and the shockproof sponge are both adhered and connected.
Compared with the prior art, the beneficial effects of the utility model are that:
1. the utility model discloses a carrier that will deposit semiconductor chip designs alone, is for making things convenient for better deposit and take out of semiconductor chip, separates semiconductor chip with the connection piece simultaneously, can guarantee to take place to contact between chip and the chip, plays unnecessary friction, and the installation of the shockproof silica gel on support column and the supporting shoe and sealed storage box and the inside shockproof sponge of sealed storage lid can play certain spacing effect on the one hand to semiconductor chip, and the other hand plays fine guard action to the chip;
2. the utility model discloses an at installation active carbon and ultraviolet sterilization heat preservation lamp, play on the one hand for storing box inside dehumidification, make the box inside keep dry, on the other hand can be for storing box inside and semiconductor chip heat preservation of disinfecting, for semiconductor chip provides a fine environment, avoids taking place the chip and damages, and the design of device has promoted the availability factor greatly.
Drawings
Fig. 1 is an expanded view of a semiconductor chip storage case according to the present invention;
fig. 2 is a front view of the semiconductor chip carrier of the present invention;
fig. 3 is a cross-sectional view of the sealed storage case and the sealed storage lid of the present invention.
In the figure: 1. sealing the storage box; 2. a U-shaped fixture block; 3. sealing the storage lid; 4. connecting blocks; 5. a shockproof sponge; 6. sealing the silica gel strip; 7. a limiting groove; 8. a clamping strip groove; 9. fixing grooves; 10. a steel wire mesh groove; 11. a semiconductor chip carrier; 12. fixing the clamping strip; 13. connecting sheets; 14. a support pillar; 15. a support block; 16. shockproof silica gel; 17. a handle; 18. a fixed block; 19. a magnet adsorption block; 20. a magnet clamping groove; 21. a magnet bar; 22. inserting a rotating shaft; 23. steel wire mesh; 24. activated carbon; 25. ultraviolet ray sterilization heat preservation lamp.
Detailed Description
The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments.
Referring to fig. 1-3, the present invention provides an embodiment: a semiconductor chip storage box comprises a sealed storage box 1, wherein one side of the sealed storage box 1 is provided with two U-shaped clamping blocks 2, the sealed storage box 1 is provided with two U-shaped clamping blocks 3, the other side of each U-shaped clamping block 2 is provided with a sealed storage cover 3, the other side of each sealed storage cover 3 is provided with a connecting block 4, the connecting blocks 4 are provided with two, shockproof sponges 5 are respectively arranged inside the sealed storage box 1 and the sealed storage cover 3, the sealing property is good, the connection is firmer, a sealing silica gel strip 6 is arranged inside the sealed storage cover 3, one side inside each shockproof sponge 5 is provided with a limiting groove 7, a clamping strip groove 8 is arranged inside each limiting groove, the other side inside each shockproof sponge 5 is provided with a fixing groove 9, a steel wire mesh groove 10 is arranged below the shockproof sponge 5, the steel wire mesh grooves 10 are provided with two, and a semiconductor chip carrier 11 is arranged at the middle, the semiconductor chip carrier comprises a semiconductor chip carrier 11, fixing clamping strips 12 are arranged on two sides of the semiconductor chip carrier 11, connecting sheets 13 are arranged inside the semiconductor chip carrier 11, a plurality of connecting sheets 13 are arranged, supporting columns 14 are arranged between every two adjacent connecting sheets 13, the supporting columns 14 are tightly connected and are not easy to deform, supporting blocks 15 are arranged on one sides of the supporting columns 14, the supporting blocks 15 are arranged on the plurality of supporting blocks 15, shockproof silica gel 16 is arranged on one sides of the supporting columns 14 and the front ends of the supporting blocks 15, handles 17 are arranged above the semiconductor chip carrier 11, the operation is simple and convenient to disassemble, three handles 17 are arranged, fixing blocks 18 are arranged below the semiconductor chip carrier 11, two fixing blocks 18 are arranged, magnet adsorption blocks 19 are arranged inside one side of a sealing storage cover 3, magnet clamping grooves 20 are arranged inside one side of a sealing storage box 1, and magnet strips 21 are arranged inside, a steel wire mesh 23 is arranged below the semiconductor chip carrier 11, active carbon 24 is arranged below the steel wire mesh 23, and an ultraviolet sterilization heat preservation lamp 25 is arranged in the middle of the front end of the sealed storage cover 3.
Further, the U-shaped fixture block 2 and the connecting block 4 are rotatably connected through the rotating shaft inserting strip 22, so that the installation is simple and easy, and simple rotation can be performed.
Furthermore, the connecting sheet 13 and the supporting column 14 and the connecting sheet 13 and the supporting block 15 are connected in a welding mode, and are tightly connected and not prone to deformation.
Furthermore, the shockproof silica gel 16 and the support column 14, and the shockproof silica gel 16 and the support block 15 are adhered and connected, so that the sealing performance is strong, and the adhesion is firm.
Further, the semiconductor chip carrier 11 is connected with the handle 17 through screws, so that the operation is simple and the disassembly is convenient.
Further, sealed storage lid 3 and sealing silica gel strip 6 and sealed storage box 1 all paste with shockproof sponge 5 and be connected, and the leakproofness is good, and the connection is more firm.
The working principle is as follows: when in use, the semiconductor chip storage box is firstly opened, the magnet adsorption block 19 on one side of the sealed storage box 1 and the sealed storage cover 3 is separated from the magnet strip 21, the sealed storage box 1 is separated from the sealed storage cover 3, the handle 17 is held by hand, the semiconductor chip carrier 11 is taken out from the shockproof sponge 5 in the sealed storage box 1, the semiconductor chip is sequentially placed between the connecting sheet 13 and the connecting sheet 13, the semiconductor chip moves towards the direction of the supporting block 15, the movement of the semiconductor chip is stopped when the chip touches the shockproof silica gel 16 on the supporting block 15, each semiconductor chip is mounted by the same method, after the mounting is finished, the handle 17 is held by hand, the fixed clamping strip 12 on one side of the semiconductor chip carrier 11 is inserted into the clamping strip groove 8 on the shockproof sponge 5 in the sealed storage box 1, and the rear end of the semiconductor chip carrier 11 is clamped into the fixed groove 9 on the shockproof sponge 5 in the sealed storage box 1, carry out a fine spacing like this to semiconductor chip carrier 11, then open sterilamp 25, sterilamp 25 begins to work, for storing the inside heat preservation that disinfects of box and semiconductor chip, install wire net 23 and active carbon 24 in semiconductor chip carrier 11 below, active carbon 24 provides a dry environment for storing the box, go into sealed storage box 1 inside wire net inslot 10 with the both sides card of wire net 23, cover sealed storage lid 3 after the installation, sealed storage lid 3 inside card strip groove 8 and fixed slot 9, block fixed card strip 12 and the rear end of semiconductor chip carrier 11 opposite side on the card respectively, cover sealed storage lid 3 after, the magnet adsorption piece 19 and the magnet strip 21 of sealed storage box 1 and sealed storage lid 3 one side adsorb can.
It is obvious to a person skilled in the art that the invention is not restricted to details of the above-described exemplary embodiments, but that it can be implemented in other specific forms without departing from the spirit or essential characteristics of the invention. The present embodiments are therefore to be considered in all respects as illustrative and not restrictive, the scope of the invention being indicated by the appended claims rather than by the foregoing description, and all changes which come within the meaning and range of equivalency of the claims are therefore intended to be embraced therein. Any reference sign in a claim should not be construed as limiting the claim concerned.

Claims (6)

1. A semiconductor chip storage case comprising a sealed storage case (1), characterized in that: the anti-vibration sealing device is characterized in that a U-shaped clamping block (2) is installed on one side of the sealing storage box (1), two sealing storage boxes (1) are arranged, a sealing storage cover (3) is installed on the other side of the U-shaped clamping block (2), a connecting block (4) is installed on the other side of the sealing storage cover (3), two connecting blocks (4) are arranged, anti-vibration sponges (5) are installed inside the sealing storage box (1) and the sealing storage cover (3), sealing silica gel strips (6) are installed inside the sealing storage cover (3), a limiting groove (7) is arranged on one side inside each of the two anti-vibration sponges (5), a clamping strip groove (8) is arranged inside the limiting groove, a fixing groove (9) is arranged on the other side inside each of the two anti-vibration sponges (5), and a steel wire mesh groove (10) is arranged below the inside each sponge (5), and the steel wire mesh groove (10) is provided with two, the semiconductor chip carrier (11) is installed at the middle position inside the sealed storage box (1), the fixing clamp strips (12) are installed on the two sides of the semiconductor chip carrier (11), the connecting piece (13) is installed inside the semiconductor chip carrier (11), the connecting piece (13) is provided with a plurality of connecting pieces, the supporting columns (14) are installed between the adjacent connecting pieces (13), the supporting columns (14) are provided with a plurality of supporting columns, the supporting block (15) is installed on one side of each supporting column (14), the supporting block (15) is provided with a plurality of supporting blocks, the shockproof silica gel (16) is installed on one side of each supporting column (14) and the front end of each supporting block (15), the handle (17) is installed above the semiconductor chip carrier (11), the handle (17) is provided with three supporting blocks, the fixing block (18) is installed below the semiconductor chip carrier (11, and fixed block (18) are provided with two, the internally mounted of sealed storage lid (3) one side has magnet adsorption piece (19), the inside of sealed storage box (1) one side is provided with magnet draw-in groove (20), the internally mounted of magnet draw-in groove (20) has magnet strip (21), wire net (23) are installed to the below of semiconductor chip carrier (11), active carbon (24) are installed to the below of wire net (23), ultraviolet sterilization heat preservation lamp (25) are installed to the intermediate position of sealed storage lid (3) front end.
2. A semiconductor chip storage case according to claim 1, wherein: the U-shaped fixture block (2) is rotatably connected with the connecting block (4) through a rotating shaft inserting strip (22).
3. A semiconductor chip storage case according to claim 1, wherein: the connecting piece (13) is connected with the supporting column (14) in a welding manner, and the connecting piece (13) is connected with the supporting block (15) in a welding manner.
4. A semiconductor chip storage case according to claim 1, wherein: the shockproof silica gel (16) and the support column (14) are connected with the shockproof silica gel (16) and the support block (15) in a sticking mode.
5. A semiconductor chip storage case according to claim 1, wherein: the semiconductor chip carrier (11) is connected with the handle (17) through screws.
6. A semiconductor chip storage case according to claim 1, wherein: the sealing storage cover (3) is connected with the sealing silica gel strip (6) and the sealing storage box (1) is connected with the shockproof sponge (5) in an adhering mode.
CN202020274652.5U 2020-03-09 2020-03-09 Semiconductor chip storage box Expired - Fee Related CN211810868U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN202020274652.5U CN211810868U (en) 2020-03-09 2020-03-09 Semiconductor chip storage box

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN202020274652.5U CN211810868U (en) 2020-03-09 2020-03-09 Semiconductor chip storage box

Publications (1)

Publication Number Publication Date
CN211810868U true CN211810868U (en) 2020-10-30

Family

ID=73008945

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202020274652.5U Expired - Fee Related CN211810868U (en) 2020-03-09 2020-03-09 Semiconductor chip storage box

Country Status (1)

Country Link
CN (1) CN211810868U (en)

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GR01 Patent grant
GR01 Patent grant
CF01 Termination of patent right due to non-payment of annual fee

Granted publication date: 20201030

CF01 Termination of patent right due to non-payment of annual fee