CN211803457U - Cooling mechanism of mould for producing Bluetooth headset - Google Patents

Cooling mechanism of mould for producing Bluetooth headset Download PDF

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Publication number
CN211803457U
CN211803457U CN201922050335.5U CN201922050335U CN211803457U CN 211803457 U CN211803457 U CN 211803457U CN 201922050335 U CN201922050335 U CN 201922050335U CN 211803457 U CN211803457 U CN 211803457U
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CN
China
Prior art keywords
mold
plate
fixing plate
bluetooth headset
mould
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Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CN201922050335.5U
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Chinese (zh)
Inventor
方惠芬
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Shenzhen Qilan Industry Co ltd
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Shenzhen Qilan Industry Co ltd
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Filing date
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Application filed by Shenzhen Qilan Industry Co ltd filed Critical Shenzhen Qilan Industry Co ltd
Priority to CN201922050335.5U priority Critical patent/CN211803457U/en
Application granted granted Critical
Publication of CN211803457U publication Critical patent/CN211803457U/en
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

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Abstract

The utility model discloses a bluetooth headset production is with cooling mechanism of mould, upper die fixing plate, mould core, refrigerant chamber, fastening block and heating panel on lower mould fixed plate, punching press lower mould, punching press, the lower mould fixed plate is located the bottom of whole device, lower mould fixed plate one side is equipped with the punching press lower mould, be equipped with in the middle of the lower mould fixed plate mould core, mould core both sides all are equipped with first recess, upper die fixing plate one side is equipped with the mould on the punching press. The utility model discloses an all be equipped with the refrigerant mouth in lower mould fixed plate and last fixed plate, solved only the lower mould of cooling among the prior art, the not thorough problem of cooling does not need the water to cool off, can greatly avoid the waste of water resource like this, has alleviateed the cost in business, adds the refrigerant from the entry and gets into the refrigerant chamber, can accelerate bluetooth headset rapid prototyping on the one hand, and on the other hand refrigerant belongs to harmless and does not have the effect of corruption to the metal.

Description

Cooling mechanism of mould for producing Bluetooth headset
Technical Field
The utility model relates to a mould cooling equipment technical field particularly, relates to a bluetooth headset production is with cooling mechanism of mould.
Background
The invention of the Bluetooth earphone enables people to get rid of the limitation of wired earphones, thereby more conveniently and flexibly using the earphones for communication and listening. The Bluetooth headset is divided into an ear-hanging type and an ear-free type, is convenient to wear and small in size, is popular with users, is manufactured through a mold, is inconvenient to position and disassemble and is not beneficial to workers to overhaul, and most of traditional molds adopt cooling water for heat dissipation, so that the self-cooling function of a stamping mold is realized, but waste of water resources is easily caused; and present mostly is to lower mould cooling, however at the punching press in-process, the drift also can produce high temperature with the part of lower mould contact, can influence the life-span to the drift. Therefore, a cooling medium cooling mode is provided, which can cool the upper die and the lower die simultaneously, and reduce the high temperature generated when the die is used.
An effective solution to the problems in the related art has not been proposed yet.
SUMMERY OF THE UTILITY MODEL
An object of the utility model is to provide a bluetooth headset production is with cooling mechanism of mould to solve the problem that proposes in the above-mentioned background art.
In order to achieve the above object, the utility model provides a following technical scheme: a cooling mechanism of a mold for producing a Bluetooth headset comprises a lower mold fixing plate, a stamping lower mold, a stamping upper mold, an upper mold fixing plate, a mold core plate, a refrigerant cavity, a fastening block and a heat dissipation plate, the lower die fixing plate is positioned at the bottom end of the whole device, one side of the lower die fixing plate is provided with the stamping lower die, the middle of the lower die fixing plate is provided with the die core plate, both sides of the die core plate are provided with first grooves, the first grooves are all internally provided with first connecting columns, the middle of the die core plate is provided with a heat dissipation port, one side of the die core plate is provided with the refrigerant cavity, the upper die fixing plate is arranged at the upper end of the lower die fixing plate, the periphery of the upper die fixing plate is provided with second connecting columns, the middle of the upper die fixing plate is provided with the heat dissipation plate, the two sides of the heat dissipation plate are provided with the fastening blocks, the middle of the fastening block is provided with a second groove, and one side of the upper die fixing plate is provided with an upper die for stamping.
Furthermore, the periphery of the lower die fixing plate is provided with small holes, and the second connecting column is sleeved with the small holes.
Furthermore, a spring is arranged on the second connecting column, and the second connecting column is welded on the upper die fixing plate.
Furthermore, the second connecting column and the first connecting column are made of copper.
Further, a fixing block is arranged at the upper end of the upper die fixing plate and fixedly connected with the upper die fixing plate.
Furthermore, the periphery of the heat dissipation plate is provided with positioning blocks, and the heat dissipation plate is fixedly connected with the positioning blocks.
Furthermore, a plurality of refrigerant ports are arranged in the lower stamping die and the upper stamping die and communicated with the refrigerant cavity.
Compared with the prior art, the utility model discloses following beneficial effect has:
(1) the utility model relates to a bluetooth headset production is with cooling mechanism of mould, this device is through all being equipped with the refrigerant mouth in bed die fixed plate and last fixed die plate, has solved only the lower mould of cooling among the prior art, the not thorough problem of cooling, do not need the water to cool off, the waste of water resource has greatly been avoided like this, the cost of enterprise has been alleviateed, add the refrigerant from the entry and get into the refrigerant chamber, can accelerate bluetooth headset rapid prototyping on the one hand, on the other hand refrigerant belongs to harmless and does not have the effect of corruption to the metal.
(2) The utility model discloses be equipped with the thermovent on the mold core board for refrigerated speed, spliced pole all around adopts copper, makes the heat dissipation more rapidly even.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings required to be used in the embodiments will be briefly described below, and it is obvious that the drawings in the following description are only some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to these drawings without creative efforts.
Fig. 1 is a schematic structural view of a cooling mechanism of a mold for producing a bluetooth headset according to an embodiment of the present invention;
fig. 2 is a schematic structural view of a lower die fixing plate of a cooling mechanism of a mold for producing a bluetooth headset according to an embodiment of the present invention;
fig. 3 is according to the utility model discloses a bluetooth headset production is with last mould fixed plate structure schematic diagram of cooling mechanism of mould.
Reference numerals:
1. a lower die fixing plate; 2. stamping a lower die; 3. a refrigerant port; 4. a spring; 5. stamping an upper die; 6. an upper die fixing plate; 7. a fixed block; 8. a small hole; 9. a first connecting column; 10. a core plate; 11. a refrigerant cavity; 12. a heat dissipation port; 13. a first groove; 14. a second connecting column; 15. a second groove; 16. a fastener; 17. a heat dissipation plate; 18. and (5) positioning the blocks.
Detailed Description
The following, with reference to the drawings and the detailed description, further description of the present invention is made:
referring to fig. 1-3, a mold cooling mechanism for bluetooth headset production according to an embodiment of the present invention includes a lower mold fixing plate 1, a lower stamping mold 2, an upper stamping mold 5, an upper mold fixing plate 6, a mold core plate 10, a coolant cavity 11, a fastening block 16 and a heat sink 17, wherein the lower mold fixing plate 1 is located at the bottom end of the entire device, the lower stamping mold 2 is disposed at one side of the lower mold fixing plate 1, the mold core plate 10 is disposed at the middle of the lower mold fixing plate 1, first grooves 13 are disposed at both sides of the mold core plate 10, first connecting posts 9 are disposed in the first grooves 13, a heat sink 12 is disposed at the middle of the mold core plate 10, the coolant cavity 11 is disposed at one side of the mold core plate 10, the upper mold fixing plate 6 is disposed at the upper end of the lower mold fixing plate 1, second connecting posts 14 are disposed around the upper mold fixing plate 6, the heat sink 17, the heat dissipation plate 17 is provided with fastening blocks 16 on two sides, a second groove 15 is formed in the middle of each fastening block 16, and an upper stamping die 5 is arranged on one side of the upper die fixing plate 6.
Through the above technical scheme of the utility model, lower mould fixed plate 1 all is equipped with aperture 8 all around, second spliced pole 14 cup joints with aperture 8, be equipped with spring 4 on the second spliced pole 14, second spliced pole 14 welds in last fixed plate 6, and second spliced pole 14's effect is the radiating effect of playing on the one hand, and on the other hand plays the supporting role, second spliced pole 14 and first spliced pole 9 all adopt the copper, 6 upper ends of last fixed plate are equipped with fixed block 7, fixed block 7 and 6 fixed connection of last fixed plate, heating panel 17 all is equipped with locating piece 18 all around, and the effect of heating panel 17 is the radiating efficiency of accelerating, heating panel 17 and 18 fixed connection of locating piece, be equipped with a plurality of refrigerant mouths 3 in mould 5 on punching press lower mould 2 and the punching press, refrigerant mouth 3 and 11 intercommunications in refrigerant chamber.
When specifically using, the utility model relates to a bluetooth headset production is with cooling mechanism of mould, this device is through all being equipped with refrigerant mouth 3 in lower mould fixed plate 1 and upper die fixing plate 6, only the lower mould of cooling among the prior art has been solved, the not thorough problem of cooling, do not need the water to cool off, the waste of water resource has greatly been avoided like this, the cost of enterprise has been alleviateed, add into refrigerant chamber 11 with the refrigerant from the entry, bluetooth headset rapid prototyping can be accelerated on the one hand, on the other hand refrigerant belongs to harmless and does not have the effect of corruption to the metal, through be equipped with thermovent 12 on mold core board 10, accelerate refrigerated speed, spliced pole all around adopts the copper, it is more rapid even to make the heat dissipation.
In the description of the present invention, it should be noted that the terms "top", "bottom", "one side", "the other side", "front", "back", "middle part", "inside", "top", "bottom", etc. indicate the orientation or positional relationship based on the orientation or positional relationship shown in the drawings, which is only for the convenience of description and simplification of the description, but does not indicate or imply that the device or element referred to must have a specific orientation, be constructed in a specific orientation, and be operated, and thus, should not be construed as limiting the present invention; the terms "first," "second," and "third" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance; furthermore, unless expressly stated or limited otherwise, the terms "mounted," "connected," and "connected" are to be construed broadly, as they may be fixedly connected, detachably connected, or integrally connected, for example; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meaning of the above terms in the present invention can be understood in specific cases to those skilled in the art.
Finally, it should be noted that: although the present invention has been described in detail with reference to the foregoing embodiments, it will be apparent to those skilled in the art that modifications may be made to the embodiments described in the foregoing embodiments, or equivalents may be substituted for elements thereof. Any modification, equivalent replacement, or improvement made within the spirit and principle of the present invention should be included in the protection scope of the present invention.

Claims (7)

1. A cooling mechanism of a mold for producing a Bluetooth headset is characterized by comprising a lower mold fixing plate (1), a lower stamping mold (2), an upper stamping mold (5), an upper mold fixing plate (6), a mold core plate (10), a refrigerant cavity (11), a fastening block (16) and a heat dissipation plate (17), wherein the lower mold fixing plate (1) is positioned at the bottom end of the whole device, the lower stamping mold (2) is arranged on one side of the lower mold fixing plate (1), the mold core plate (10) is arranged in the middle of the lower mold fixing plate (1), first grooves (13) are formed in two sides of the mold core plate (10), first connecting columns (9) are arranged in the first grooves (13), a heat dissipation port (12) is formed in the middle of the mold core plate (10), the refrigerant cavity (11) is arranged on one side of the mold core plate (10), the upper mold fixing plate (6) is arranged at the upper end, go up fixed die plate (6) and all be equipped with second spliced pole (14) all around, be equipped with in the middle of last fixed die plate (6) heating panel (17), heating panel (17) both sides all are equipped with fastening block (16), be equipped with second recess (15) in the middle of fastening block (16), it goes up mould (5) to be equipped with the punching press in fixed die plate (6) one side.
2. The cooling mechanism of the mold for producing the Bluetooth headset as claimed in claim 1, wherein the periphery of the lower mold fixing plate (1) is provided with small holes (8), and the second connecting column (14) is sleeved with the small holes (8).
3. The cooling mechanism of the mold for producing the Bluetooth headset as claimed in claim 1, wherein the second connecting column (14) is provided with a spring (4), and the second connecting column (14) is welded to the upper mold fixing plate (6).
4. The cooling mechanism of the mold for producing the Bluetooth headset as claimed in claim 1, wherein the second connecting column (14) and the first connecting column (9) are made of copper.
5. The cooling mechanism of the mold for producing the Bluetooth headset as claimed in claim 1, wherein a fixing block (7) is disposed at an upper end of the upper mold fixing plate (6), and the fixing block (7) is fixedly connected with the upper mold fixing plate (6).
6. The cooling mechanism of the mold for producing the bluetooth headset as claimed in claim 1, wherein the heat dissipation plate (17) is provided with positioning blocks (18) around, and the heat dissipation plate (17) is fixedly connected with the positioning blocks (18).
7. The temperature reduction mechanism of the mold for producing the Bluetooth headset as claimed in claim 1, wherein a plurality of refrigerant ports (3) are formed in the lower stamping mold (2) and the upper stamping mold (5), and the refrigerant ports (3) are communicated with the refrigerant cavity (11).
CN201922050335.5U 2019-11-25 2019-11-25 Cooling mechanism of mould for producing Bluetooth headset Expired - Fee Related CN211803457U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201922050335.5U CN211803457U (en) 2019-11-25 2019-11-25 Cooling mechanism of mould for producing Bluetooth headset

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201922050335.5U CN211803457U (en) 2019-11-25 2019-11-25 Cooling mechanism of mould for producing Bluetooth headset

Publications (1)

Publication Number Publication Date
CN211803457U true CN211803457U (en) 2020-10-30

Family

ID=73028244

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201922050335.5U Expired - Fee Related CN211803457U (en) 2019-11-25 2019-11-25 Cooling mechanism of mould for producing Bluetooth headset

Country Status (1)

Country Link
CN (1) CN211803457U (en)

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GR01 Patent grant
GR01 Patent grant
CF01 Termination of patent right due to non-payment of annual fee
CF01 Termination of patent right due to non-payment of annual fee

Granted publication date: 20201030

Termination date: 20211125