CN211802034U - Substrate gumming device - Google Patents

Abstract

The utility model discloses a substrate gumming device, which is characterized in that at least one group of secondary gumming components and at least one group of gumming components are additionally arranged between a gum tank and a metering roller; each group of secondary impregnation assemblies is provided with a channel for the base material to pass through and a temporary glue solution storage area, the width of the channel is larger than the width of a gap between the two metering rollers, and the secondary impregnation assemblies can be in contact with two side surfaces of the base material; each group of glue inlet assemblies comprises a main pipeline, a glue inlet pipe communicated with the main pipeline and a pump arranged on the main pipeline, wherein the glue inlet pipe is arranged above each secondary glue dipping assembly and is provided with a plurality of glue inlet openings. When the base material passes through the channel and the temporary glue solution storage area in sequence, the secondary glue dipping assembly scrapes the glue solutions on the two side surfaces of the base material, so that the glue solutions can be diffused and infiltrated into the base material, the glue solutions collected in the temporary glue solution storage area can infiltrate the base material for the second time, the glue dipping time is prolonged while the advancing speed of the base material is not changed, and the purpose of enhancing the infiltration effect of the bonding sheet is achieved.

Description

Substrate gumming device

Technical Field

The utility model relates to a bonding sheet production facility field especially relates to a can increase substrate gumming device of glue solution to the infiltration nature of bonding sheet.

Background

The adhesive sheet is also called prepreg, etc. and is the main raw material of composite material such as laminated board, etc. its production process is generally to dip the strip base material (such as fiber fabric, non-woven fabric, paper, etc.) in the resin glue solution, then to heat, etc. to remove the solvent and make it have a certain degree of solidification and crosslinking, and whether the strip base material can be dipped in the glue solution sufficiently is the prerequisite for producing high quality adhesive sheet.

In the existing substrate dipping device, as shown in fig. 1, a strip-shaped substrate E enters a glue tank C under the traction of a rotating device, is dipped in a glue solution D, then turns to move upwards through a dipping roller G, and is scraped off excessive glue solution through a metering roller H to form a glue-containing substrate F with a proper glue content, and then moves upwards continuously for heating and other treatments, wherein a glue scraping sheet B is arranged on the metering roller H and is used for cleaning residual glue on the metering roller H. In the existing base material dipping device, the base material is subjected to one-time dipping and two-time extrusion (from a dipping roller G and a metering roller H respectively), and the problem of insufficient wetting of the bonding sheet is easy to occur in the wetting process, which is specifically shown in that the glue-containing base material F contains defects such as air bubbles and cavities, and the defects have great negative effects on the quality of composite materials such as laminated plates and the like made of the bonding sheet.

At present, the impregnation effect of the base material is improved by a base material impregnation device mainly by the following methods:

firstly, the residence time of the base material in the glue solution is prolonged, for example, the running speed of the base material is reduced, but the mode correspondingly reduces the production efficiency;

secondly, improving the free diffusion speed of the glue solution, for example, heating the glue solution or stirring the glue solution by adopting ultrasonic waves to increase the free diffusion speed of the glue solution; however, increasing the temperature of the glue solution increases the volatilization of the solvent in the glue solution, increases the concentration of the toxic solvent in the air, has potential safety hazards of explosion and even can cause adverse effects on the performance of the glue solution, the structure of the base material and the like;

increasing the acting force of the outside on the glue-containing base material, such as increasing the number of glue dipping rollers, or increasing a clamping shaft in glue solution to extrude the base material and the like; however, increasing the number of the dipping rollers and the clamping shafts increases the extrusion force on the substrate, easily causes the structure of the substrate to be damaged, reduces the strength of the substrate, and has a great loss in the performance of the composite material prepared by the dipping rollers.

Therefore, there is a need to provide a substrate dipping apparatus that can improve the dipping effect and the production efficiency without damaging the glue solution and the substrate, so as to solve the above problems.

SUMMERY OF THE UTILITY MODEL

An object of the utility model is to provide a can not lead to the fact destruction to glue solution and substrate to can improve the substrate gumming device of infiltration effect and production efficiency.

In order to achieve the above purpose, the technical scheme of the utility model is that: providing a substrate impregnation device, which comprises a glue tank, an impregnation roller arranged in the glue tank, a pair of metering rollers arranged above the impregnation roller, at least one group of secondary impregnation components arranged between the impregnation roller and the metering rollers, and at least one group of glue inlet components arranged between the glue tank and the secondary impregnation components; each group of secondary impregnation components is provided with a channel for a substrate to pass through and a temporary glue solution storage area, the temporary glue solution storage area is positioned above the channel, the width of the channel is greater than the width of a gap between two metering rollers, and each group of secondary impregnation components can be in contact with two side surfaces of the substrate passing through the channel; every group advance gluey subassembly all include the trunk line, with advance the rubber tube that the trunk line is linked together and locate pump on the trunk line, advance the rubber tube and locate each the top of secondary gumming subassembly and its axial with the axial of metering roll is unanimous, it is equipped with a plurality of glue inlets on the rubber tube to advance.

Preferably, each set of secondary impregnation assembly includes two clamping members arranged at intervals, a gap between bottoms of the two clamping members forms the channel, and a space between upper portions of the two clamping members forms the temporary glue solution storage area.

Preferably, the substrate impregnation device further comprises at least one pair of stop blocks, each pair of stop blocks is correspondingly installed at two ends of one group of secondary impregnation assemblies, each stop block is clamped between the two clamping members, and the shape of the side surface of each stop block is matched with the shape of the outer surface of each clamping member, so that the gap between each stop block and each clamping member is reduced.

Preferably, the centre line of the channel in the width direction is in the same vertical plane as the centre line of the gap between the metering rolls.

Preferably, the gripping members are cylindrical nip rollers, and each of the nip rollers has a diameter greater than the diameter of the metering roller.

Preferably, each of the nip rollers is rotatably disposed, the rotation direction of the nip roller is the same as or opposite to the advancing direction of the substrate, and the rotation speeds of the two nip rollers of each group of the secondary gumming assemblies are the same.

Preferably, each of the nip rollers is fixedly arranged.

Preferably, the two nip rollers of each set of secondary gumming assemblies rotate at the same speed.

Preferably, the substrate dipping device further comprises at least one pair of scraping sheets, each scraping sheet is arranged corresponding to one of the nip rollers and is in contact with the nip roller, and the scraping sheets are used for scraping residual glue on the nip rollers.

Preferably, the contact point between each of the rubber strips and the corresponding nip roller is the highest point of the nip roller or the position of one side of the nip roller close to the channel.

Preferably, the clamping piece is a clamping plate, the two clamping plates are both obliquely arranged, a gap between the bottoms of the two clamping plates forms the channel, and a space between the two clamping plates forms the temporary glue solution storage area.

Compared with the prior art, because the utility model discloses a substrate gumming device, add at least a set of secondary gumming subassembly between gum groove and metering roll and set up at least a set of subassembly that advances glue between gum groove and secondary gumming subassembly, wherein, all be equipped with the passageway and the glue solution temporary storage area that supply the substrate to pass through on every group secondary gumming subassembly, and the width of passageway is greater than the clearance width between two metering rolls, every group secondary gumming subassembly homoenergetic contacts with the both sides face of substrate simultaneously, advance the gluey subassembly and include the trunk line, advance the rubber tube and locate the pump on the trunk line that are linked together with the trunk line, it locates each secondary gumming subassembly top and is equipped with a plurality of glue inlets on it to advance the rubber tube; therefore, when the base material passes through the channel, the secondary impregnation component scrapes the glue solution on the two side surfaces of the base material, the glue solution is favorably diffused and infiltrated into the base material, meanwhile, the secondary impregnation component hardly extrudes the base material, the damage to the base material is avoided, meanwhile, the glue solution scraped by the metering roller is collected in the glue solution temporary storage area, the glue solution in a glue tank or other glue solution containing devices is pumped into the glue solution temporary storage area through a pump, the secondary infiltration is carried out when the base material passes through the glue solution temporary storage area, the impregnation time of the base material is prolonged while the advancing speed of the base material is not changed, the purpose of enhancing the infiltration effect of the bonding sheet is achieved, and the production efficiency is kept.

Drawings

Fig. 1 is a schematic structural diagram of a conventional impregnation apparatus.

FIG. 2 is a schematic structural diagram of an embodiment of the substrate dipping apparatus of the present invention.

Fig. 3 is a schematic structural view of the hose inlet pipe in fig. 2.

Fig. 4 is a top view of the hose feeding pipe of fig. 2 engaged with the pinch rollers.

Fig. 5A-5B are side views of the nip roller in cooperation with a stop.

FIG. 6 is a schematic structural view of another embodiment of the substrate dipping apparatus of the present invention.

FIG. 7 is a schematic structural view of another embodiment of the substrate dipping apparatus of the present invention.

Detailed Description

Embodiments of the present invention will now be described with reference to the drawings, wherein like element numerals represent like elements throughout.

Referring to fig. 2-7, the substrate dipping device 100 of the present invention includes a glue tank 110, a dipping roller 120 disposed in the glue tank 110, a pair of metering rollers 130 disposed above the glue tank 110, at least one set of secondary dipping modules 140 disposed between the dipping roller 120 and the metering rollers 130, and at least one set of glue feeding modules 150 disposed between the glue tank 110 and the secondary dipping modules 140. Each secondary impregnation component 140 is arranged above the glue tank 110, each group of secondary impregnation components 140 is provided with a channel 141 for the substrate E to pass through and a temporary glue storage area 142, and the channel 141 and the temporary glue storage area 142 are sequentially arranged along the advancing direction of the substrate E, in a preferred mode, the temporary glue storage area 142 is arranged above the channel 141, the width of the channel 141 is greater than the width of the gap between the two metering rollers 130, the central line in the width direction of the channel 141 and the central line of the gap between the two metering rollers 130 are positioned in the same vertical plane, and meanwhile, each group of secondary impregnation components 140 can be in contact with two sides of the substrate E passing through the channel 141; the glue inlet assembly 150 is used for replenishing the glue solution in the glue tank 110 or other glue solution containing devices to the temporary glue solution storage area 142. Therefore, when the substrate E after gum dipping passes through the channel 141 of the secondary gum dipping assembly 140, the secondary gum dipping assembly 140 contacts with the gum solutions on the two side surfaces of the substrate E, and scrapes the substrate E, so as to facilitate the gum solutions to further diffuse into the substrate E, meanwhile, the secondary gum dipping assembly 140 can block the gum solutions scraped by the metering roller 130, and pump the gum solutions in the gum tank 110 or other gum solution containing devices into the gum solution temporary storage area 142 through the pump 153, so that the gum solutions are gathered in the gum solution temporary storage area 142 and maintain the proper gum solution amount, and the substrate E undergoes secondary gum dipping when passing through the glue solution temporary storage area 142, thereby prolonging the gum dipping time.

More specifically, the glue inlet assembly 150 includes a main pipe 151 with one end extending into the glue tank 110 or other glue solution containing devices, glue inlet pipes 152 communicated with the main pipe 151, and pumps 153 disposed on the main pipe 151, the number of the glue inlet pipes 152 corresponds to the number of the secondary glue dipping assemblies 140, each glue inlet pipe 152 is disposed above one group of the secondary glue dipping assemblies 140, the axial direction of the glue inlet pipe 152 is consistent with the axial direction of the metering roller 130, and each glue inlet pipe 152 is provided with a plurality of glue inlet ports 1521.

Preferably, the second glue dipping module 140 of the present invention comprises two holding members disposed at an interval, wherein the gap between the bottoms of the two holding members forms the channel 141, and the space between the upper portions of the two holding members forms the temporary glue solution storage area 142. The clamping members may be rollers 143, clamping plates 144 or other members, and different embodiments of the substrate dipping apparatus 100 of the present invention will be described with reference to fig. 2-7.

Referring to fig. 2, in an embodiment of the substrate dipping device 100 of the present invention, only one set of secondary dipping module 140 is provided, the secondary dipping module 140 includes two nip rollers 143 parallel to the metering roller 130 and disposed at intervals, a gap between tangent lines of the two nip rollers 143 in a vertical plane forms a channel 141, and meanwhile, a width of the channel 141 between the two nip rollers 143 is greater than a width of the gap between the two metering rollers 130, so as to ensure that the nip rollers 143 do not extrude the substrate E, and at the same time, the gap between the two nip rollers 143 cannot be too large, so as to ensure that the two nip rollers 143 can both contact with the glue solution on both sides of the substrate E passing through the channel 141, so as to scrape the substrate E. In addition, the two nip rollers 143 are both cylindrical and have the same diameter, and the diameter of each nip roller 143 is larger than the diameter of the metering roller 130, so that the temporary glue storage area 142, which is located above the two nip rollers 143 and is enclosed by the outer walls of the two nip rollers, is larger, that is, in the horizontal direction perpendicular to the axial direction of the two nip rollers 143, the width of the temporary glue storage area 142 is far larger than the width of the channel 141, and the larger the diameter of the nip rollers 143 is, the more glue that can be stored in the temporary glue storage area 142 formed between the two nip rollers 143 is, which is more beneficial to the secondary infiltration of the substrate E, but the diameter of the nip rollers 143 needs to meet the space limitation of the substrate impregnation device 100.

With reference to fig. 2, in this embodiment, the two nip rollers 143 of the secondary gumming assembly 140 may be fixedly or rotatably disposed, and when rotatably disposed, the two nip rollers 143 may be rotated reversely or clockwise, wherein the reverse rotation means that the rotation directions of the two nip rollers 143 are both opposite to the traveling direction of the substrate E, and the clockwise rotation means that the rotation directions of the two nip rollers 143 are both the same as the traveling direction of the substrate E; the rotational speeds of the two nip rollers 143 may be the same or different. The preferred embodiment of this embodiment is that both nip rollers 143 are arranged clockwise, i.e., the left nip roller 143 shown in fig. 2 rotates counterclockwise, the right nip roller 143 rotates clockwise, and the rotational speeds of both nip rollers 143 are the same.

Referring to fig. 2 again, the substrate dipping device 100 further includes a pair of rubber sheets 160 cooperating with the two nip rollers 143, each rubber sheet 160 is disposed corresponding to one nip roller 143 and contacts with the nip roller 143, a contact point between the rubber sheet 160 and the nip roller 143 is a highest point of the nip roller 143 or a position of one side of the nip roller 143 near the channel 141, and the rubber sheet 160 is used for scraping residual rubber on the nip roller 143.

In addition, the substrate dipping apparatus 100 further includes a pair of doctor blades 160 coupled to the pair of metering rollers 130 for scraping the residual glue from the metering rollers 130.

As shown in fig. 3-4, in this embodiment, only one set of glue inlet assembly 150 is provided, the glue inlet assembly 150 has a main pipe 151 and a glue inlet pipe 152 communicated with the main pipe, the glue inlet pipe 152 is provided above one of the clamping rollers 143, an axial direction of the glue inlet pipe 152 is consistent with an axial direction of the clamping roller 143, one side of the glue inlet pipe 152 located in the temporary glue storage area 142 is uniformly provided with a plurality of glue inlet ports 1521, a lower end of the main pipe 151 extends into the glue tank 110, under the action of the pump 153, the glue in the glue tank 110 enters the glue inlet pipe 152 through the main pipe 151 and uniformly flows to the upper side of the clamping roller 143 through the plurality of glue inlet ports 1521 of the glue inlet pipe 152, so as to supplement the glue amount in the temporary glue storage area 142, and ensure that the glue in the temporary glue storage area 142 is maintained at a proper amount. Of course, the main pipe 151 is not limited to extend into the glue tank 110, and the lower end thereof may extend into a glue mixing barrel or other glue solution providing device as long as the glue solution can be replenished.

Understandably, a plurality of main pipelines 151 communicated with the rubber inlet pipe 152 can be arranged, each main pipeline 151 is provided with a pump 153, and the rubber liquid is supplemented to the rubber inlet pipe 152 through the main pipelines 151 together, so that the efficiency is improved.

Of course, in this embodiment, it is not limited to only one set of glue inlet assemblies 150, and one set of glue inlet assemblies 150 may be provided corresponding to the other nip roller 143 as required, that is, there are two sets of glue inlet assemblies 150 oppositely disposed in total, and the two sets of glue inlet assemblies 150 have the same structure.

As shown in fig. 4-5B, the substrate dipping device 100 in this embodiment further includes a pair of blocking blocks 170, the pair of blocking blocks 170 are respectively disposed at two ends of the secondary dipping module 140, and each blocking block 170 is clamped between two clamping rollers 143, and the shape of the side surface of the blocking block 170 is preferably an arc shape (see fig. 5B) corresponding to the outer circumferential shape of the clamping roller 143, so as to reduce the gap between the blocking block 170 and the clamping roller 143, and facilitate increasing the glue storage amount of the glue solution temporary storage area 142 above the clamping shaft 143. Alternatively, the side surface of the stopper 170 may be a plane, and the cross section of the stopper 170 may be triangular (see fig. 5A), which can also achieve the above-mentioned effects.

Understandably, when the clamping member is in other shapes, the shape of the side surface of the blocking block 170 is correspondingly set to be matched with the shape of the outer surface of the clamping member.

Referring to fig. 6, in another embodiment of the substrate dipping device 100 of the present invention, the difference from the above embodiment is: two groups of secondary impregnation assemblies 140 and two pairs of rubber scraping sheets 160 are provided, the two groups of secondary impregnation assemblies 140 are arranged between the metering roller 130 and the impregnation roller 120 at intervals, the two groups of secondary impregnation assemblies 140 are both positioned above the glue tank 110, each pair of rubber scraping sheets 160 is arranged corresponding to one group of secondary impregnation assemblies 140, wherein the arrangement mode of each group of secondary impregnation assemblies 140 and the corresponding rubber scraping sheets 160 is the same as that in the above embodiment, and therefore, the description is omitted.

In this embodiment, the nip rollers 143 of each set of secondary impregnation modules 140 may be both fixedly disposed or rotatably disposed, and the rotation direction and the rotation speed of the nip rollers 143 of each set of secondary impregnation modules 140 may be the same or different, and it is preferable that the nip rollers 143 of each set of secondary impregnation modules 140 are both clockwise rotated and have the same rotation speed.

Referring to fig. 6 again, only one set of glue inlet assembly 150 is provided in the present embodiment, but the difference from the glue inlet assembly 150 in the above embodiment is that: the glue feeding assembly 150 comprises a main pipe 151 and two glue feeding pipes 152 communicated with the main pipe 151, wherein the two glue feeding pipes 152 are respectively arranged above the clamping rollers 143 of the two groups of secondary glue dipping assemblies 140, and the axial directions of the two glue feeding pipes 152 are consistent with the axial directions of the clamping rollers 143, so that glue in the glue tank 110 enters the two glue feeding pipes 152 through the main pipe 151 under the action of the pump 153 and uniformly flows into the two temporary glue storage areas 142 through glue feeding ports 1521 on the two glue feeding pipes 152, and the glue amount in the two temporary glue storage areas 142 is supplemented.

Of course, in this embodiment, a plurality of main pipes 151 may be provided to replenish the two glue inlet pipes 152 with glue, and two sets of opposite glue inlet assemblies 150 may be provided to replenish the two temporary glue storage areas 142 with glue from two sides, respectively.

As shown in fig. 6, in this embodiment, by setting two sets of secondary impregnation assemblies 140, the glue solutions on the two side surfaces of the substrate E are scraped twice and treated by two glue solution temporary storage areas 142 for impregnation again, which is more favorable for promoting the glue solution to further diffuse into the substrate E, and meanwhile, the substrate E is twice impregnated by two glue solution temporary storage areas 142, so that the glue solution impregnation time is longer, and the impregnation effect is further improved.

Of course, the number of the secondary impregnation modules 140 of the substrate impregnation device 100 of the present invention is not limited to the above two embodiments, and the number thereof can be flexibly set according to the specific required impregnation effect and the installation space of the substrate impregnation device 100; and the number of the glue inlet pipes 152 of the glue inlet assembly 150 is correspondingly set.

Referring to fig. 7, in another embodiment of the substrate dipping device 100 of the present invention, the difference between the two embodiments is: the structure of the secondary impregnation assembly 140, in this embodiment, the secondary impregnation assembly 140 includes two clamp plates 144 symmetrically disposed, each clamp plate 144 is disposed obliquely upward, so that a temporary glue storage area 142 with an upward gradually expanding opening is formed between the two clamp plates 144, and a gap between bottoms of the two clamp plates 144 forms a channel 141, therefore, in the horizontal direction, the width of the temporary glue storage area 142 is much greater than the width of the channel 141, and the longer the upward extending length of the clamp plates 144 is, the more glue can be stored in the temporary glue storage area 142 formed therebetween, the more the secondary impregnation of the substrate E is facilitated, as long as the upward extending length of the clamp plates 144 can satisfy the space limitation of the substrate impregnation device 100.

In this embodiment, only one set of glue inlet assemblies 150 is provided, and the manner of disposing the glue inlet assemblies 150 is the same as that in the embodiment shown in fig. 2, and therefore, the description is not repeated.

The operation principle and process of the substrate dipping apparatus 100 of the present invention will be described with reference to fig. 2-7 again.

After gum dipping is started, the strip-shaped base material E enters the gum tank 110 under the traction action of the rotating equipment, the base material is dipped in the gum solution and then turns to move upwards through the gum dipping roller 120, and then the base material E needs to sequentially pass through the secondary gum dipping assembly 140 and the two metering rollers 130 to obtain the gum-containing base material F with proper gum content.

When the substrate E passes through the channel 141 formed between the two nip rollers 143 or the two nip plates 144, the two nip rollers 143 or the two nip plates 144 contact with the glue solution on the two side surfaces of the substrate E, and have a scraping effect on the substrate E, which is favorable for promoting the glue solution to further diffuse into the substrate E, so as to promote the glue solution to infiltrate; in addition, the two lower nip rollers 143 or the two lower nip plates 144 can block the glue scraped by the metering roller 130, so that the glue is temporarily stored in the temporary glue storage area 142 formed between the two nip rollers 143 or the two lower nip plates 144, meanwhile, the glue in the glue tank 110 or other glue containing devices is pumped into the glue inlet pipe 152 by the pump 153 of the glue inlet assembly 150, and then the glue uniformly flows to the upper sides of the nip rollers 143 or the nip plates 144 through the plurality of glue inlets 1521 on the glue inlet pipe 152, so as to ensure that the proper amount of the glue in the temporary glue storage area 142 is ensured, therefore, when the substrate E passes through the temporary glue storage area 142, the glue in the substrate E is subjected to secondary glue dipping to achieve the purpose of prolonging the glue dipping time, and the purpose of enhancing the glue dipping effect of the bonding sheet is achieved by promoting the diffusion of the glue and prolonging the glue dipping time.

After passing through the metering roller 130, the substrate E is scraped to remove excess glue solution, and becomes a glue-containing substrate F with a proper glue content, and then goes upward to heat and the like.

In summary, because the utility model discloses a substrate impregnation device 100, add at least a set of secondary impregnation subassembly 140 between glue groove 110 and metering roller 130 and set up at least a set of subassembly 150 that advances glue between glue groove and secondary impregnation subassembly, wherein, all be equipped with passageway 141 and the glue solution temporary storage area 142 that supplies substrate E to pass through on every group secondary impregnation subassembly 140, and the width of passageway 141 is greater than the clearance width between two metering roller 130, every group secondary impregnation subassembly 140 all can contact with the both sides face of substrate E simultaneously, advance glue subassembly 150 and include that one end stretches into trunk line 151 in glue groove 110 or other glue solution holding devices, advance rubber pipe 152 and locate the pump 153 on trunk line 151 that is linked together with trunk line 151, advance rubber pipe 152 and locate each secondary impregnation subassembly top and be equipped with a plurality of glue inlets 1521 on it; therefore, when the substrate E passes through the channel 141, the secondary impregnation module 140 scrapes the glue on the two side surfaces of the substrate E, which is helpful for the glue to diffuse and infiltrate into the substrate E, and at the same time, the secondary impregnation module 140 hardly extrudes the substrate E, so as to avoid damaging the substrate E, meanwhile, the temporary glue storage area 142 collects the glue scraped by the metering roller 130, and pumps the glue in the glue tank 110 or other glue holding devices into the temporary glue storage area through the pump 153, and the substrate E undergoes secondary infiltration when passing through the temporary glue storage area 142, so that the impregnation time is prolonged without changing the advancing speed of the substrate E, thereby achieving the purpose of enhancing the impregnation effect of the adhesive sheet and maintaining the production efficiency.

The structure and arrangement of other parts of the substrate dipping device 100 according to the present invention are conventional arrangements known to those skilled in the art, and will not be described in detail herein.

The above disclosure is only for the purpose of illustrating the preferred embodiments of the present invention and is not to be construed as limiting the scope of the invention, therefore, the invention is not limited thereto.

Claims (10)

1. The utility model provides a substrate gumming device, includes the glue groove, locates gumming roller in the glue groove and locate a pair of metering roll of gumming roller top, its characterized in that still includes:

each secondary impregnation component is arranged between the impregnation roller and the metering roller, each secondary impregnation component is provided with a channel for a substrate to pass through and a temporary glue solution storage area, the temporary glue solution storage area is positioned above the channel, the width of the channel is greater than the width of a gap between the two metering rollers, and each secondary impregnation component can be in contact with two side faces of the substrate passing through the channel;

at least a set of subassembly of advancing, every group advance gluey subassembly all include the trunk line, with advance the rubber tube that the trunk line is linked together and locate pump on the trunk line, advance the rubber tube and locate each the top of secondary gumming subassembly and its axial with the axial of metering roll is unanimous, it is equipped with a plurality of glue inlets on the rubber tube to advance.

2. The substrate dipping device according to claim 1, wherein each set of secondary dipping assemblies comprises two clamping members arranged at intervals, a gap between bottoms of the two clamping members forms the channel, and a space between upper portions of the two clamping members forms the temporary glue solution storage area.

3. The apparatus for dipping substrate according to claim 2, further comprising at least a pair of stop blocks, wherein each pair of stop blocks is correspondingly installed at two ends of a group of the secondary dipping assemblies, each stop block is clamped between two of the clamping members, and the shape of the side surface of each stop block matches with the shape of the outer surface of the clamping member.

4. The apparatus for dipping a substrate in a solution of claim 1 wherein a centerline of the passageway in the width direction is in the same vertical plane as a centerline of the gap between the metering rolls.

5. The apparatus for dipping substrate of claim 2 wherein the grippers are cylindrical grippers, and each of the grippers has a diameter greater than a diameter of the metering roll.

6. The apparatus for dipping substrates in a glue solution according to claim 5, wherein each of the nip rollers is rotatably disposed, the direction of rotation of the nip rollers is the same as or opposite to the direction of travel of the substrate, and the rotational speed of the two nip rollers of each set of the secondary dipping assemblies is the same.

7. The apparatus for dipping a substrate in a solution of claim 5 wherein each of the nip rollers is fixedly disposed.

8. The apparatus for dipping substrate according to claim 5, further comprising at least one pair of doctor blades, each of the doctor blades being disposed corresponding to and contacting a corresponding one of the nip rollers, the doctor blades being configured to scrape off residual glue from the nip rollers.

9. The apparatus for dipping a substrate in a glue as claimed in claim 8, wherein the contact point between each of the doctor blades and the corresponding nip roller is the highest point of the nip roller or the side of the nip roller adjacent to the passageway.

10. The substrate dipping device according to claim 2, wherein the holding member is a clamping plate, the clamping plate and the clamping plate are arranged in an inclined manner, a gap between bottoms of the clamping plate and the clamping plate forms the channel, and a space between the clamping plate and the clamping plate forms the glue solution temporary storage area.

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