CN211791523U

CN211791523U - SFP28 industrial application module

Info

Publication number: CN211791523U
Application number: CN202020707449.2U
Authority: CN
Inventors: 方生金; 殷瑞麟; 王远
Original assignee: Shenzhen Oulingke Communication Technology Co ltd
Current assignee: Shenzhen Oulingke Communication Technology Co ltd
Priority date: 2020-04-30
Filing date: 2020-04-30
Publication date: 2020-10-27
Anticipated expiration: 2030-04-30

Abstract

The utility model provides an SFP28 industrial application module, which comprises an optical communication signal transmission unit, an MCU control unit and a temperature adjusting unit; the optical communication signal transmission unit is arranged in the SFP28 packaging structure and comprises an optical transmission unit, an optical receiving unit, a first CDR clock unit and a second CDR clock unit; the temperature adjusting unit comprises a heating driving module, a temperature sensor and a heating resistor, wherein the temperature sensor and the heating resistor are arranged in the transmitting unit, the temperature sensor is connected with the MCU control unit, and the heating driving module is connected with the MCU control unit and the heating resistor. The utility model discloses a built-in temperature sensor and heating resistor in SFP28 packaging structure's application module's the light emission unit, through the electric current that MCU processing unit control heating resistor flows through, and then the operating temperature of control light emission unit, make the utility model discloses an SFP28 packaging structure's the adaptable wideer scope's of application module operating temperature, and packing density is high.

Description

SFP28 industrial application module

Technical Field

The utility model relates to a photovoltaic module technical field particularly, relates to SFP28 industrial grade application module.

Background

An optical module of an SFP28 (Small form factor pluggable (SFP) package structure is a high transmission rate application product supporting only a single channel and having a channel transmission speed of 25Gbit/s, and compared with an early GBIC (gigabit interface converter) optical module, the optical module has the advantages of a volume of only 1/2 that of the GBIC module, a much smaller external dimension, and miniaturization and high density, and thus becomes a preferred module for miniaturization development of the optical module. Because the environment adaptability of miniaturized optical module is strong, so the SFP packaging structure is widely applied to industrial equipment, but in an industrial application scene, the ambient temperature can both produce certain influence to the optical transmitting module and the optical receiving module in the optical module, especially the transmitting module needs to be maintained in a constant temperature range, otherwise the light emitted by the laser can drift or vibrate to influence the communication. Due to the fact that laser wavelength of an optical module is prone to drift, an existing optical module can only work in a narrow temperature environment generally, and if the working temperature is in a wider range, a laser with a TEC (thermal point cooler) needs to be adopted, so that cost is high. In addition, the size of the SFP28 package structure is limited, and the internal space thereof is very limited, so that a temperature adjusting device with low cost and simple structure is arranged in the limited package space of the SFP28, which is a problem to be solved urgently.

Accordingly, the prior art is yet to be improved and developed.

SUMMERY OF THE UTILITY MODEL

An object of the embodiment of the utility model is to provide SFP28 industrial grade application module, aim at solving the narrow problem of current SFP28 packaging structure's optical module operating temperature scope.

In order to solve the above problem, the technical scheme of the utility model is as follows:

the SFP28 industrial application module comprises an optical communication signal transmission unit, an MCU control unit and a temperature regulation unit; the optical communication signal transmission unit is arranged in an SFP28 packaging structure and comprises an optical emission unit, an optical receiving unit, a first CDR clock unit and a second CDR clock unit, wherein the optical emission unit is connected with the first CDR clock unit, and the optical receiving unit is connected with the second CDR clock unit; the temperature adjusting unit comprises a heating driving module, a temperature sensor and a heating resistor, wherein the temperature sensor and the heating resistor are arranged in the transmitting unit, the temperature sensor is connected with the MCU control unit, and the heating driving module is connected with the MCU control unit and the heating resistor.

The SFP28 industrial application module, wherein the temperature sensor is a thermistor type temperature sensor.

The SFP28 industrial application module, wherein the SFP28 industrial application module, wherein the light emitting unit includes an LD laser chip and a driving chip, and the LD laser chip, the driving chip and the first CDR clock unit are connected in sequence.

The SFP28 industrial application module, wherein the light receiving unit includes a PIN receiving chip, a transimpedance amplifier and a limiting amplifier connected in sequence, and the limiting amplifier is connected to the second CDR clock unit.

The SFP28 industrial application module, wherein the optical communication signal transmission unit further includes an optical interface structure and an electrical interface structure; the LD laser chip and the PIN receiving chip are both coupled with the optical port structure, and the first CDR clock unit and the second CDR clock unit are respectively connected with the electrical port structure.

The SFP28 industrial application module, wherein the temperature sensor and the heating resistor are both built in the LD laser chip.

The SFP28 industrial application module, wherein the optical port structure is a single bidirectional optical fiber.

The beneficial effects of the utility model include: the utility model discloses a built-in temperature sensor and heating resistor in SFP28 packaging structure's application module's the light emission unit, through MCU processing unit control heating drive module to the electric current that control heating resistor flows through, and then control the utility model discloses a light emission unit's operating temperature makes the utility model discloses a miniaturized SFP28 packaging structure's the adaptable wideer's of application module operating temperature, and packing density is high, simple structure, and is with low costs.

Drawings

In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings needed to be used in the embodiments of the present invention will be briefly described below, it should be understood that the following drawings only illustrate some embodiments of the present invention, and therefore should not be considered as limiting the scope, and for those skilled in the art, other related drawings can be obtained according to these drawings without inventive efforts.

Fig. 1 is a schematic structural diagram of an SFP28 industrial application module according to an embodiment of the present invention.

Detailed Description

The technical solution in the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present invention.

In the description of the present invention, it should be noted that the terms "inside" and "outside" are used for indicating the position or positional relationship based on the position or positional relationship shown in the drawings, or the position or positional relationship that the utility model is usually placed when using, and are only for convenience of describing the present invention and simplifying the description, but not for indicating or implying that the device or element to be referred must have a specific position, be constructed and operated in a specific position, and thus should not be construed as limiting the present invention. Furthermore, the terms "first," "second," and the like are used merely to distinguish one description from another, and are not to be construed as indicating or implying relative importance.

It should also be noted that, unless expressly stated or limited otherwise, the terms "disposed" and "connected" are to be construed broadly, e.g., as meaning fixedly connected, detachably connected, or integrally connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meaning of the above terms in the present invention can be understood in specific cases to those skilled in the art.

As shown in fig. 1, an SFP28 industrial application module provided for the embodiment of the present invention includes an optical communication signal transmission unit 10, an MCU control unit 20, and a temperature adjustment unit 30. The optical communication signal transmission unit 10 is disposed in an SFP28 package structure, and includes a light emitting unit 11, a light receiving unit 12, a first CDR (Clock and data recovery, CDR) Clock unit 13, and a second CDR Clock unit 14. In practical application, the light emitting unit 11 includes an LD laser chip 111 and a driving chip 112, and the first CDR clock unit 13LD, the driving chip 112, and the laser chip 111 are connected in sequence, the first CDR clock unit 13 is configured to preprocess an electrical signal, the electrical signal is input to the driving chip 112 after clock data recovery, and then the driving chip 112 drives the LD laser chip 111 to convert the electrical signal into an optical signal to be emitted; the light receiving unit 12 includes a PIN receiving chip 121, a transimpedance amplifier 122, and a limiting amplifier 123, wherein, the transimpedance amplifier 122 is built in the PIN receiving chip 121, the limiting amplifier 123 is connected with the second CDR clock unit 14, the PIN receiving chip 121 is configured to receive the optical signal transmitted through the optical fiber and convert the optical signal into a current signal, the transimpedance amplifier 122 converts the current signal into a voltage signal that is convenient for processing by an application device, the limiting amplifier 123 further limits and amplifies the voltage signal converted by the transimpedance amplifier 122 to increase the amplitude of the voltage signal, for stable transmission of the signal, and finally, the second CDR clock unit 14 is used for clock data recovery of the voltage signal, the distortion signal is recovered, the signal quality is improved, the sensitivity of signal identification is improved, the link margin is increased, and the robustness of the application module is improved.

Further, the temperature adjusting unit 30 includes a heating driving module 31, a temperature sensor 32 and a heating resistor 33 built in the emitting unit, in practical application, the temperature sensor 32 and the heating resistor 33 are both built in the LD laser chip 111, and the temperature sensor 32 is a thermistor type temperature sensor. Since the temperature sensor 32 is built in the LD laser chip 111, the temperature of the LD laser chip 111 can be directly detected, and the detection accuracy is high. Meanwhile, the temperature sensor 32 is connected to the MCU control unit 20, and the heating driving module 31 is also connected to the MCU control unit 20. The temperature sensor 32 is configured to detect a temperature in the LD laser chip 111, and send a sensor signal indicating a current temperature to the MCU control unit 20, after the MCU control unit obtains a temperature value detected by the temperature sensor 32, a voltage value corresponding to the obtained temperature value is determined according to a correspondence between a pre-stored temperature value and a voltage output value, and a corresponding compensation voltage is output to the control terminal of the heating driving module 31 according to the determined voltage value, where in actual application, the pre-stored temperature value may be set according to actual needs. The MCU control unit 20 is provided therein with a digital-to-analog converter connected to the heating driving module 31 for converting a digital signal into an analog signal to output a corresponding compensation voltage. Further, the heating driving module 31 is connected to the heating resistor 33, and after the heating driving module 31 receives the compensation voltage, the current value passing through the heating driving module 31 is increased, and the heating resistor 32 generates heat under the action of the current output by the heating driving module 31 and transfers the heat to the LD laser chip 111 in the light emitting unit 11, so as to increase the ambient temperature of the LD laser chip 111, and prevent the optical signal emitted by the LD laser chip 111 from drifting or oscillating and affecting signal transmission. In practical applications, the heating driving module 31 may be a triode switching circuit with a resistor connected to a base, and one end of the resistor is connected to the digital-to-analog converter.

The utility model discloses a SFP28 industrial-grade application module, optical communication signal transmission unit 10 still include light mouthful structure 40 and electric mouthful structure 50, wherein LD laser chip 111 and PIN receiving chip 121 all with light mouthful structure coupling connection for receiving and dispatching light signal. The first CDR clock unit 13 and the second CDR clock unit 14 are shown to be connected to an electrical interface structure 50, respectively, where the electrical interface structure 50 may be a gold finger interface for electrical connection with an applied device. The optical port structure 40 is a single bidirectional optical fiber, and the single bidirectional optical fiber is used for leading in or leading out optical signals, can support the speed up to 25G, can transmit up to 10km at most, and is convenient for high-speed networking.

The utility model discloses a built-in temperature sensor and heating resistor in the light emission unit of SFP28 packaging structure's application module, through MCU processing unit control heating drive module, and then control the operating temperature of the light emission unit of the utility model, make the utility model's miniaturized SFP28 packaging structure's application module adaptable operating temperature of wider scope, and temperature sensor is integrated on laser chip, can improve the precision of temperature detection; and adopt LD laser chip and PIN receiving chip to receive and dispatch optical signal, packaging density is high, simple structure, and is with low costs.

The above description is only an example of the present invention and is not intended to limit the scope of the present invention, and various modifications and changes may be made by those skilled in the art. Unless expressly stated or limited otherwise, the terms "disposed" and "connected" are to be construed broadly, e.g., as meaning a fixed connection, a removable connection, or an integral connection; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meaning of the above terms in the present invention can be understood in specific cases to those skilled in the art. Any modification, equivalent replacement, or improvement made within the spirit and principle of the present invention should be included in the protection scope of the present invention.

Claims

The SFP28 industrial application module is characterized by comprising an optical communication signal transmission unit, an MCU control unit and a temperature regulation unit; the optical communication signal transmission unit is arranged in an SFP28 packaging structure and comprises an optical emission unit, an optical receiving unit, a first CDR clock unit and a second CDR clock unit, wherein the optical emission unit is connected with the first CDR clock unit, and the optical receiving unit is connected with the second CDR clock unit; the temperature adjusting unit comprises a heating driving module, a temperature sensor and a heating resistor, wherein the temperature sensor and the heating resistor are arranged in the light emitting unit, the temperature sensor is connected with the MCU control unit, and the heating driving module is connected with the MCU control unit and the heating resistor.
2. The SFP28 industrial-scale application module of claim 1, wherein the temperature sensor is a thermistor-type temperature sensor.
3. The SFP28 industrial-grade application module according to claim 2, wherein the light emitting unit comprises an LD laser chip and a driving chip, and the first CDR clock unit, the driving chip and the LD laser chip are connected in sequence.
4. The SFP28 industrial-grade application module according to claim 3, wherein the light receiving unit comprises a PIN receiving chip, a trans-impedance amplifier and a limiting amplifier which are connected in sequence, and the limiting amplifier is connected with the second CDR clock unit.
5. The SFP28 industrial application module of claim 4, wherein the optical communication signal transmission unit further comprises an optical port structure and an electrical port structure; the LD laser chip and the PIN receiving chip are respectively coupled with the optical port structure, and the first CDR clock unit and the second CDR clock unit are respectively connected with the electrical port structure.
6. The SFP28 industrial-grade application module according to claim 3, wherein the temperature sensor and the heating resistor are both built in the LD laser chip.
7. The SFP28 industrial application module of claim 5, wherein the optical port structure is a single bidirectional optical fiber.