CN211789832U - Socket connector - Google Patents

Socket connector Download PDF

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Publication number
CN211789832U
CN211789832U CN202020101796.0U CN202020101796U CN211789832U CN 211789832 U CN211789832 U CN 211789832U CN 202020101796 U CN202020101796 U CN 202020101796U CN 211789832 U CN211789832 U CN 211789832U
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China
Prior art keywords
insertion groove
middle plate
insulating layer
assembly
terminal
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CN202020101796.0U
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Chinese (zh)
Inventor
金亨俊
市川和记
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Hirose Electric Co Ltd
Hirose Korea Co Ltd
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Hirose Electric Co Ltd
Hirose Korea Co Ltd
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    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01RELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/62Means for facilitating engagement or disengagement of coupling parts or for holding them in engagement

Abstract

The utility model relates to a socket connector, include: a first assembly body having a middle plate, a lower terminal arranged to a lower portion thereof, a lower grounding portion arranged to a lower portion thereof and coupled to the middle plate, and a lower insulating layer insert-molded to portions of the lower terminal and the lower grounding portion; and a second assembly having an upper terminal arranged on the upper portion of the middle plate, an upper grounding portion arranged on the upper portion of the middle plate and combined with the middle plate, and an upper insulating layer insert-molded to portions of the upper terminal and the upper grounding portion; and a first insertion groove and a second insertion groove which is separated from the first insertion groove along the longitudinal direction are respectively formed at two ends of the transverse side of the middle plate, a first insertion end and a second insertion end which are bent towards the upper part and the lower part and are inserted into the first insertion groove and the second insertion groove are respectively formed at two ends of the transverse side of the lower part and the upper grounding part, a first spacing part is formed between the first insertion groove and the insertion end to fill the lower insulating layer, and a second spacing part is formed between the second insertion groove and the insertion end to fill the upper insulating layer.

Description

Socket connector
Technical Field
The present invention relates to a socket connector, and more particularly, to a socket connector which can increase a coupling sectional area with an insulating layer by forming a resin filling space portion between an insertion end of an upper ground portion and a lower ground portion and an insertion groove of a middle plate, thereby improving a coupling strength between the middle plate and the upper ground portion and the lower ground portion even without applying an additional fastening structure.
Background
In general, the receptacle connector is electrically connected to the plug connector corresponding to the coupling portion of the front end in a state of being mounted on a board (PCB).
Such a conventional receptacle connector includes a plurality of upper terminals arranged on an upper portion of the intermediate plate, a plurality of lower terminals arranged on a lower portion of the intermediate plate, and a housing (resin) insert-molded so as to cover a part of the intermediate plate, the upper terminals, and the lower terminals from outside.
In addition, the conventional receptacle connector can couple an upper ground portion and a lower ground portion to an upper portion and a lower portion of an insulating housing, respectively, the upper ground portion can be coupled to the upper portion of the insulating housing in a male-female mating manner, and the lower ground portion can be coupled to the lower portion of the insulating housing in a male-female mating manner.
The insertion end can be bent and extended downward at the side of the upper grounding part to be combined with the insertion groove of the middle plate, and the insertion end can be bent and extended downward at the side of the lower grounding part to be combined with the insertion groove of the middle plate.
The insertion ends of the upper and lower ground portions are shaped to correspond to the insertion groove of the middle plate, and are fitted into the insertion groove by press-fitting or the like.
However, the conventional receptacle connector has the following structure: since the insertion ends of the upper and lower grounding portions and the insertion groove of the middle plate are coupled in close contact with each other, a portion not filled with resin exists between the insertion end and the insertion groove, and thus the coupling state between the insertion end and the insertion groove may be changed or separated by an external force.
As a conventional document relating to the present invention, there is japanese laid-open patent publication No. 2013-303024 (2 months and 7 days 2013), in which a receptacle connector is disclosed.
SUMMERY OF THE UTILITY MODEL
[ problems to be solved by the utility model ]
An object of the present invention is to provide a method for manufacturing a socket connector and a socket connector using the same, in which a resin filling space is formed between an insertion end of an upper ground portion and a lower ground portion and an insertion groove of a middle plate to increase a coupling sectional area with an insulating layer, thereby improving a coupling strength between the middle plate and the upper ground portion and the lower ground portion even without using a separate fastening structure.
[ means for solving problems ]
The utility model discloses a socket connector manufacturing approach's characterized in that includes: an assembly forming step of forming a first assembly in which a lower terminal and a lower ground portion are sequentially disposed at a lower portion of a middle plate, a lower insulating layer is insert-molded in a part of the middle plate, the lower terminal, and the lower ground portion, and a second assembly in which an upper ground portion is disposed at an upper portion of an upper terminal, and an upper insulating layer is insert-molded in a part of the upper terminal and the upper ground portion; an assembly bonding step of bonding the second assembly to an upper portion of the first assembly; and a housing forming step of insert-molding a housing in a part of the first assembly body and the second assembly body; and in the assembly body coupling step, first insertion grooves concavely formed to both left and right ends of the middle plate, second insertion grooves concavely formed to both left and right ends of the middle plate in a manner of being positioned at a distance from the first insertion grooves, a first insertion end bent and extended upward from both left and right ends of the lower ground portion to be inserted into the first insertion groove, and a second insertion end bent and extended downward from both left and right ends of the upper ground portion to be inserted into the second insertion groove are formed, respectively, with a first spacing portion formed between the first insertion groove and the first insertion end to fill the lower insulating layer, and a second spacing portion formed between the second insertion groove and the second insertion end to fill the upper insulating layer.
Here, in the case forming step, a lower insertion groove may be formed in a lower surface of the case so that the lower ground portion is inserted in correspondence thereto, and an upper insertion groove may be formed in an upper surface of the case so that the upper ground portion is inserted in correspondence thereto.
In the housing forming step, the front ends of the lower terminals, the upper terminals, and the middle plate may be exposed through a front coupling member of the housing, and the rear ends of the lower terminals, the upper terminals, and the middle plate may be exposed through a rear lower surface of the housing.
In the case forming step, a connection end bent downward from a rear end of the middle plate may be formed to protrude toward a lower portion of the case.
On the other hand, the utility model discloses a socket connector includes: a first assembly including a middle plate, a lower terminal arranged to a lower portion of the middle plate, a lower ground portion arranged to a lower portion of the lower terminal and coupled to the middle plate, and a lower insulating layer insert-molded to a portion of the lower terminal and the lower ground portion; and a second assembly body having an upper terminal arranged on an upper portion of the middle plate, an upper ground portion arranged on an upper portion of the upper terminal and coupled to the middle plate, and an upper insulating layer insert-molded to a portion of the upper terminal and the upper ground portion; the receptacle connector is characterized in that: a first insertion groove and a second insertion groove spaced apart from the first insertion groove in a front-rear direction are formed at both ends of the middle plate in a left-right direction, a first insertion end bent and extended upward to be inserted into the first insertion groove is formed at both ends of the lower grounding part in the left-right direction, a second insertion end bent and extended downward to be inserted into the second insertion groove is formed at both ends of the upper grounding part in the left-right direction, a first spacing part is formed between the first insertion groove and the first insertion end to fill the lower insulating layer, and a second spacing part is formed between the second insertion groove and the second insertion end to fill the upper insulating layer.
Here, at least one or more auxiliary insertion grooves may be concavely formed on inner circumferential surfaces of the first and second insertion grooves to fill the insulating layer.
In addition, the first and second insertion slots can be divided into: a left wall portion and a right wall portion which are formed into a straight line along the front-back direction of the middle plate and concavely form the auxiliary insertion groove; and front and rear wall portions formed as straight lines in the left-right direction from both ends of the left and right wall portions in the front-rear direction; the left and right wall portions are positioned apart from the first and second insertion ends by the spacing portion.
Further, a support protrusion may be formed to protrude from the front and rear wall portions, a first guide surface inclined downward in a center direction of the first insertion groove may be formed at an upper end of the support protrusion, and a second guide surface inclined upward in a center direction of the second insertion groove may be formed at a lower end of the support protrusion.
In addition, a housing may be insert-molded at a portion of the first assembly and the second assembly, and the housing may further include a lower coupling groove formed at a lower surface thereof for the lower ground portion to be correspondingly inserted therein and an upper coupling groove formed at an upper surface thereof for the upper ground portion to be correspondingly inserted therein.
[ effects of utility model ]
The utility model discloses has following effect: the resin-filled space portion can be formed between the insertion ends of the upper and lower ground portions and the insertion groove of the middle plate, thereby increasing the bonding cross-sectional area with the insulating layer, and thus improving the bonding strength between the middle plate and the upper and lower ground portions without applying a separate fastening structure.
Drawings
Fig. 1 is a block diagram illustrating a method for manufacturing a receptacle connector according to a first embodiment of the present invention.
Fig. 2 is a perspective view of a first assembly of a receptacle connector according to a second embodiment of the present invention.
Fig. 3 is a bottom view of a first assembly of a receptacle connector according to a second embodiment of the present invention.
Fig. 4 is a perspective view showing a second assembly of a receptacle connector according to a second embodiment of the present invention.
Fig. 5 is a bottom view of a second assembly of a receptacle connector according to a second embodiment of the present invention.
Fig. 6 is a perspective view showing a state in which a first assembly and a second assembly of a receptacle connector according to a second embodiment of the present invention are coupled to each other.
Fig. 7 is a bottom perspective view showing a state in which the first assembly and the second assembly of the receptacle connector according to the second embodiment of the present invention are coupled.
Fig. 8 is a plan view showing a state in which the first assembly and the second assembly of the receptacle connector according to the second embodiment of the present invention are coupled to each other.
Fig. 9 is a bottom view showing a state in which the first assembly and the second assembly of the receptacle connector according to the second embodiment of the present invention are coupled to each other.
Fig. 10 is a perspective view showing a state where a lower insulating layer, an upper insulating layer, a lower ground portion, and an upper ground portion of a receptacle connector according to a second embodiment of the present invention are removed.
Fig. 11 is a plan view showing a state where the lower insulating layer, the upper insulating layer, the lower ground portion, and the upper ground portion of the receptacle connector according to the second embodiment of the present invention are removed.
Fig. 12 is a perspective view showing a state in which a first assembly and a second assembly of a receptacle connector according to a second embodiment of the present invention form a housing.
Description of reference numerals:
100: a first assembly body;
110: a middle plate;
111: a first insertion slot;
111a, 112 a: auxiliary insertion grooves;
112: a second insertion slot;
113: a fastening protrusion;
115: a support protrusion;
115 a: a first guide surface;
115 b: a second guide surface;
117: a connecting end;
120: a lower terminal;
130: a lower ground part;
131: a first insertion end;
140: a lower insulating layer;
200: a second assembly;
210: an upper terminal;
220: an upper ground part;
221: a second insertion end;
230: an upper insulating layer;
300: a housing;
c: a center;
g: a spacer section;
s100: an assembly forming step;
s200: an assembly bonding step;
s300: and a shell forming step.
Detailed Description
Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the accompanying drawings.
The advantages, features, and methods of achieving the same of the present invention will become apparent with reference to the embodiments described in detail below in conjunction with the accompanying drawings.
However, the present invention is not limited to the embodiments disclosed below, and can be realized in various forms, and the embodiments are provided only for fully disclosing the present invention and sufficiently informing the scope of the present invention to those skilled in the art to which the present invention belongs, and the scope of the present invention is defined only by the claims.
In addition, when it is determined that the gist of the present invention will be obscured by related known techniques or the like in the description of the present invention, detailed description thereof will be omitted.
Fig. 1 is a block diagram illustrating a method of manufacturing a receptacle connector according to a first embodiment of the present invention, fig. 2 is a perspective view illustrating a first assembly of a receptacle connector according to a second embodiment of the present invention, and fig. 3 is a bottom view illustrating the first assembly of the receptacle connector according to the second embodiment of the present invention.
Fig. 4 is a perspective view showing a second assembly of a receptacle connector according to a second embodiment of the present invention, fig. 5 is a bottom view showing the second assembly of the receptacle connector according to the second embodiment of the present invention, and fig. 6 is a perspective view showing a state in which the first assembly and the second assembly of the receptacle connector according to the second embodiment of the present invention are coupled to each other.
Fig. 7 is a bottom perspective view showing a state in which the first assembly and the second assembly of the receptacle connector according to the second embodiment of the present invention are coupled, fig. 8 is a plan view showing a state in which the first assembly and the second assembly of the receptacle connector according to the second embodiment of the present invention are coupled, and fig. 9 is a bottom view showing a state in which the first assembly and the second assembly of the receptacle connector according to the second embodiment of the present invention are coupled.
Fig. 10 is a perspective view showing a state where a lower insulating layer, an upper insulating layer, a lower ground portion, and an upper ground portion of a receptacle connector according to a second embodiment of the present invention are removed, fig. 11 is a plan view showing a state where the lower insulating layer, the upper insulating layer, the lower ground portion, and the upper ground portion of the receptacle connector according to the second embodiment of the present invention are removed, and fig. 12 is a perspective view showing a state where a first assembly and a second assembly of the receptacle connector according to the second embodiment of the present invention form a housing.
As shown in fig. 1, a method for manufacturing a receptacle connector according to a second embodiment of the present invention includes: an assembly forming step S100, an assembly joining step S200, and a housing forming step S300.
First, the assembly forming step S100 is a process for forming the first assembly 100 and the second assembly 200 of the receptacle connector respectively as shown in fig. 2 to 5.
More specifically, the first assembly 100 formed in the assembly forming step S100 includes the middle plate 110, the lower terminal 120, the lower ground portion 130, and the lower insulating layer 140, as shown in fig. 2 and 3.
If a description is given of a process of forming the first assembly 100, the following is made: the lower terminal 120 and the lower ground 130 are sequentially disposed at a lower portion of the middle plate 110, and the lower insulating layer 140 is insert-molded at a portion of the middle plate 110, the lower terminal 120, and the lower ground 130.
The middle plate 110 may be manufactured in a fixed size using a conductive material, and a rear end of the middle plate 110 may be fixedly coupled to an upper surface of a Printed Circuit Board (PCB) (not shown).
Here, the middle plate 110 may be divided into a rear region coupled to a printed circuit board (not shown) and a front region located inside a coupling member described below.
At least one first insertion groove 111 and at least one second insertion groove 112 may be concavely formed at different positions at both left and right ends of the middle plate 110.
The first insertion groove 111 and the second insertion groove 112 may be formed to be recessed toward the center C of the middle plate 110 as portions to which the first insertion end 131 and the second insertion end 221 described below are coupled (press-fitted), respectively.
Here, the first insertion grooves 111 may be disposed in a staggered manner in the left-right direction of the middle plate 110 as coupling portions into which the first insertion ends 131 of the lower ground portions 130 described below are inserted (press-fitted).
The second insertion grooves 112 are disposed in the left-right direction of the middle plate 110 so as to be staggered as coupling portions into which the second insertion ends 221 of the upper grounding portions 220 described below are inserted.
The first insertion groove 111 and the second insertion groove 112 may be divided into left and right wall portions formed in the left-right direction and front and rear wall portions formed in the front-rear direction.
The left and right wall portions of the first insertion groove 111 and the second insertion groove 112 may be formed as straight lines in the front-rear direction of the intermediate plate 110, and the front and rear wall portions may be formed as straight lines in the left-right direction from both ends of the left and right wall portions in the front-rear direction.
That is, the first insertion groove 111 and the second insertion groove 112 may be laterally opened
Figure BDA0002369551380000071
The shape of the first and second insertion grooves 111 and 112 may be various shapes as necessary.
At least one auxiliary insertion groove 111a, 112a may be formed in the left and right wall portions of the first insertion groove 111 and the second insertion groove 112 so as to be recessed toward the center C of the middle plate 110.
The auxiliary insertion grooves 111a and 112a are formed to separately form a space for filling resin, and when the lower insulating layer 140 and the upper insulating layer 230, which will be described later, are insert-molded, the resin flowing in through the gap G is separately filled.
That is, the auxiliary insertion grooves 111a and 112a increase the coupling cross-sectional area with the lower insulating layer 140 and the upper insulating layer 230 described below, so that the coupling strength between the middle plate 110 and the lower ground portion 130 and the upper ground portion 220 described below can be improved.
Further, support protrusions 115 may be formed to protrude from front and rear wall portions of the first insertion groove 111 and the second insertion groove 112, respectively.
The support protrusions 115 protrude into the first insertion groove 111 and the second insertion groove 112, and the protruding ends are respectively in close contact with the front and rear ends of the first insertion end 131 and the second insertion end 221, which will be described later.
That is, when the first insertion end 131 and the second insertion end 221 described below are inserted (press-fitted) into the first insertion groove 111 and the second insertion groove 112, respectively, the protruding ends of the support protrusions 115 support the front ends and the rear ends of the first insertion end 131 and the second insertion end 221 in a close contact state.
Further, first guide surfaces 115a inclined downward in the center direction of the first insertion groove 111 may be formed at the upper ends of the support protrusions 115, respectively.
Meanwhile, second guide surfaces 115b inclined upward in the central direction of the second insertion groove 112 may be formed at the lower ends of the support protrusions 115, respectively.
When the first insertion end 131 and the second insertion end 221, which will be described later, are inserted into the first insertion groove 111 and the second insertion groove 112, respectively, the first guide surface 115a and the second guide surface 115b can guide the insertion ends of the first insertion end 131 and the second insertion end 221 to the insertion positions of the first insertion groove 111 and the second insertion groove 112.
In addition, an inclined space may be formed at an upper portion of the first guide surface 115a and a lower portion of the second guide surface 115b so that a resin may be filled when the lower insulating layer 140 and the upper insulating layer 230, which will be described later, are molded.
A pair of fastening protrusions 113 may be formed to protrude in the left-right direction on the front region side of the middle plate 110, and a pair of connection ends 117 may be bent downward in the left-right direction on the rear region side of the middle plate 110.
The connection terminal 117 may be fixedly coupled in a state of being inserted on an upper surface of the printed circuit board, and an extended end of the connection terminal 117 may be coupled to the printed circuit board by protruding a lower surface of the housing 300 described below toward a lower portion.
The lower terminals 120 are arranged to the lower portion of the middle plate 110, and the lower terminals 120 are combined in a state of being Insert-molded (Insert molding) in the middle plate 110 through a lower insulating layer 140 described later.
Here, the lower terminal 120 may be coupled to the lower portion of the middle plate 110 in a state of having a length in the front and rear directions, and a plurality of the lower terminals may be arranged in a state of being spaced apart in the left and right directions.
The front ends of the lower terminals 120 as described above may be exposed downward by a front coupler of the housing 300 described below, and the rear ends may be electrically connected to the printed circuit board through the lower portion of the housing 300.
The lower ground portion 130 is coupled to an upper portion of the lower terminal 120, and the lower ground portion 130 may be disposed between a front end and a rear end of the lower terminal 120.
Here, the lower ground portion 130 may be formed to have a fixed size using a conductive material, and an upper surface of the lower ground portion 130 may be fixedly coupled to a lower surface of the housing 300, which will be described later.
For this, a pair of first insertion ends 131 for being coupled to the left and right ends of the middle plate 110 in a male-female mating manner may be bent and extended upward at the left and right ends of the lower ground connection portion 130.
The first insertion end 131 is bent and extended upward from both left and right ends of the lower ground portion 130 and inserted through a lower portion of the first insertion groove 111.
For example, in the case of coupling the first insertion end 131 to the first insertion groove 111, a resin-fillable spacer G is formed between the first insertion end 131 and the first insertion groove 111.
In this state, in the case of Insert molding (Insert molding) of the lower insulating layer 140 described later, the resin is filled into the spacer G, and thus the bonding cross-sectional area with the lower insulating layer 140 can be increased.
The lower insulating layer 140 is bonded to the middle plate 110, the lower terminal 120, and a portion of the lower ground portion 130 by Insert molding (Insert molding), and the lower insulating layer 140 is formed of a non-conductive material (resin, etc.).
In this case, the rear end (connection portion) of the lower terminal 120 may be bent downward after protruding rearward of the lower insulating layer 140, and then mounted on the upper surface of the printed circuit board.
The second assembly 200 formed in the assembly forming step S100 may include an upper terminal 210, an upper ground 220, and an upper insulating layer 230.
If the formation process of the second assembly 200 is explained, the following is: an upper ground 220 is disposed above the upper terminal 210, and an upper insulating layer 230 is Insert-molded (Insert molding) to integrate the upper terminal 210 and a part of the upper ground 220.
The upper terminals 210 are arranged to the lower portion of the middle plate 110, and the upper terminals 210 are combined in a state of being Insert-molded (Insert molding) in the middle plate 110 through an upper insulating layer 230 described later.
Here, the upper terminal 210 may be coupled to a lower portion of the middle plate 110 in a state of having a length in the front and rear directions, and a plurality of the upper terminals may be arranged in a state of being spaced apart in the left and right directions.
The front end of the upper terminal 210 as described above may be exposed to the upper portion through a front coupling member of the housing 300 described below, and the rear end may be electrically connected to the printed circuit board through the lower portion of the housing 300.
The upper ground portion 220 is coupled to an upper portion of the upper terminal 210, and the upper ground portion 220 may be disposed between a front end and a rear end of the upper terminal 210.
Here, the upper ground portion 220 may be formed of a conductive material to have a fixed size, and an upper surface of the upper ground portion 220 may be fixedly coupled to a lower surface of the housing 300 to be described later.
For this, a pair of second insertion ends 221, which are bent and extended downward at both left and right ends of the upper ground connection portion 220 to be correspondingly coupled to both left and right ends of the middle plate 110 in a male-female mating manner, may be provided.
The second insertion end 221 may be bent and extended upward from both left and right ends of the upper ground portion 220 to be inserted through an upper portion of the second insertion groove 112.
For example, in the case of coupling the second insertion end 221 to the second insertion groove 112, a resin-fillable spacer G is formed between the second insertion end 221 and the second insertion groove 112.
In this state, in the case of Insert molding (Insert molding) of the upper insulating layer 230 described later, the resin is filled into the spacer G, and thus the bonding cross-sectional area with the upper insulating layer 230 can be increased.
The upper insulating layer 230 is bonded to the upper terminal 210 and a portion of the upper ground portion 220 by Insert molding (Insert molding), and the upper insulating layer 230 is formed of a non-conductive material (resin, etc.).
At this time, the rear end (connection portion) of the upper terminal 210 may be bent downward after protruding rearward of the upper insulating layer 230 and then mounted on the upper surface of the printed circuit board.
Next, the assembly body joining step S200 is a process of joining the second assembly body 200 at the upper portion of the first assembly body 100 like fig. 6 to 9, and the first assembly body 100 and the second assembly body 200 formed in the assembly body forming step S100 are integrated by Insert molding (Insert molding) in the case forming step S300 described later.
More specifically, when the lower surface of the second assembly 200 is closely attached to the upper surface of the first assembly 100, a pair of first insertion ends 131 bent and extended toward the upper portion of the lower grounding portion 130 are inserted into the first insertion grooves 111 formed at both left and right ends of the middle plate 110, respectively, and are electrically connected thereto.
At the same time, a pair of second insertion ends 221 bent and extended to the lower portion of the upper ground portion 220 are inserted into the second insertion grooves 112 formed at both left and right ends of the middle plate 110, respectively, and electrically connected thereto.
At this time, the first insertion end 131 of the lower grounding part 130 is coupled to the first insertion groove 111, and the second insertion end 221 of the upper grounding part 220 is coupled to the second insertion groove 112, whereby the assembly of the first assembly 100 and the second assembly 200 is completed.
In particular, when the second assembly 200 is coupled to the upper portion of the first assembly 100 in the assembly coupling step S200, the left and right wall portions and the front and rear wall portions of the first insertion groove 111 and the second insertion groove 112 are positioned at a distance from the first insertion end 131 and the second insertion end 221, which will be described later, by the distance G.
The spacers G are formed between the inner circumferential surface of the first insertion groove 111 and a first insertion end 131 described below and between the inner circumferential surface of the second insertion groove 112 and a second insertion end 221 described below at regular intervals to fill the lower insulating layer 140 and the upper insulating layer 230.
The spacer G as described above can increase the coupling cross-sectional area with the lower insulating layer 140 and the upper insulating layer 230, and thus can improve the coupling strength between the middle plate 110 and the lower and upper ground portions 130 and 220, which will be described later, without applying a separate fastening structure.
Finally, the housing forming step S300 is a process of: the housing 300 (insulating raw material, etc.) is coupled by Insert molding (Insert molding) in such a manner as to externally wrap a portion of the first assembly body 100 and the second assembly body 200 like fig. 12.
At this time, the contact surfaces of the lower terminals 120 and the upper terminals 210 and the front region of the middle plate 110 are exposed through the front-side engaging members of the housing 300, and the rear ends of the lower terminals 120 and the upper terminals 210 and the rear region of the middle plate 110 are exposed through the rear-side lower surface of the housing 300.
The coupling member is a portion for coupling to a plug connector (not shown) for connection with an electronic device, and covers the front portion of the middle plate 110 from above and below.
At this time, the front region (side surface) of the middle plate 110 is exposed in the left-right direction of the coupling member, and the fastening protrusions 113 formed at both left and right ends of the middle plate 110 protrude in the left-right direction, respectively.
The contact surface formed in front of the lower terminal 120 is exposed downward through the lower surface of the bonding material, and the contact surface formed in front of the upper terminal 210 is exposed upward through the upper surface of the bonding material.
A lower coupling groove for coupling the lower ground portion 130 and a lower through hole which vertically penetrates through the housing 300 so that the first insertion end 131 is inserted into the first insertion groove 111 may be formed on the lower surface of the housing 300.
At the same time, an upper coupling groove for coupling the upper ground connection part 220 and an upper through hole which vertically penetrates therethrough and through which the second insertion end 221 is inserted into the second insertion groove 112 may be formed on the upper surface of the housing 300.
Also, a front-side vertical hole for protruding the rear end of the lower terminal 120 to the lower portion may be formed along the upper and lower sides of the lower portion of the housing 300.
Meanwhile, a rear vertical hole for protruding the rear end of the upper terminal 210 to the lower portion may be formed vertically at the rear of the front vertical through hole.
That is, the rear ends of the lower and upper terminals 120 and 210 protruding through the front and rear vertical through-holes may be mounted to the printed circuit board through the lower side of the housing 300.
As described above, the present invention can form the resin-filled gap G between the first and second insertion ends 131 and 221 of the upper and lower ground portions 220 and 130 and the first and second insertion grooves 111 and 112 of the middle plate 110.
Accordingly, the coupling cross-sectional areas between the first and second insertion ends 131 and 221, the first and second insertion grooves 111 and 112, and the insulating layers 140 and 230 can be increased, and thus the coupling strength between the middle plate 110 and the upper and lower ground portions 220 and 130 can be increased without applying a separate fastening structure.
Hereinafter, the socket connector according to the present invention will be described with reference to fig. 2 to 12, and as described below, the socket connector according to the present invention includes a first assembly 100, a second assembly 200, and a housing 300.
First, the first assembly 100 includes a middle plate 110, a plurality of lower terminals 120, a lower ground 130, and a lower insulating layer 140.
The middle plate 110 may be manufactured in a fixed size using a conductive material, and a rear end of the middle plate 110 may be fixedly coupled to an upper surface of a Printed Circuit Board (PCB) (not shown).
Here, the middle plate 110 may be divided into a rear region coupled to a printed circuit board (not shown) and a front region located inside a coupling member described below.
At least one first insertion groove 111 and at least one second insertion groove 112 may be concavely formed at different positions at both left and right ends of the middle plate 110.
The first insertion groove 111 and the second insertion groove 112 may be formed to be recessed toward the center C of the middle plate 110 as portions to which the first insertion end 131 and the second insertion end 221 described below are coupled (press-fitted), respectively.
Here, the first insertion grooves 111 may be disposed in a staggered manner in the left-right direction of the middle plate 110 as coupling portions into which the first insertion ends 131 of the lower ground portions 130 described below are inserted (press-fitted).
The second insertion grooves 112 are disposed in the left-right direction of the middle plate 110 so as to be staggered as coupling portions into which the second insertion ends 221 of the upper grounding portions 220 described below are inserted.
The first insertion groove 111 and the second insertion groove 112 may be divided into left and right wall portions formed in the left-right direction and front and rear wall portions formed in the front-rear direction.
The left and right wall portions of the first insertion groove 111 and the second insertion groove 112 may be formed as straight lines in the front-rear direction of the intermediate plate 110, and the front and rear wall portions may be formed as straight lines in the left-right direction from both ends of the left and right wall portions in the front-rear direction.
That is, the first insertion groove 111 and the second insertion groove 112 may be laterally opened
Figure BDA0002369551380000121
The shape of the first and second insertion grooves 111 and 112 may be various shapes as necessary.
At least one auxiliary insertion groove 111a, 112a may be formed in the left and right wall portions of the first insertion groove 111 and the second insertion groove 112 so as to be recessed toward the center C of the middle plate 110.
The auxiliary insertion grooves 111a and 112a are formed to separately form a space for filling resin, and when the lower insulating layer 140 and the upper insulating layer 230, which will be described later, are insert-molded, the resin flowing in through the gap G is separately filled.
That is, the auxiliary insertion grooves 111a and 112a increase the coupling cross-sectional area with the lower insulating layer 140 and the upper insulating layer 230 described below, so that the coupling strength between the middle plate 110 and the lower ground portion 130 and the upper ground portion 220 described below can be improved.
Further, support protrusions 115 may be formed to protrude from front and rear wall portions of the first insertion groove 111 and the second insertion groove 112, respectively.
The support protrusions 115 protrude into the first insertion groove 111 and the second insertion groove 112, and the protruding ends are respectively in close contact with the front and rear ends of the first insertion end 131 and the second insertion end 221, which will be described later.
That is, when the first insertion end 131 and the second insertion end 221 described below are inserted (press-fitted) into the first insertion groove 111 and the second insertion groove 112, respectively, the protruding ends of the support protrusions 115 support the front ends and the rear ends of the first insertion end 131 and the second insertion end 221 in a close contact state.
Further, first guide surfaces 115a inclined downward in the center direction of the first insertion groove 111 may be formed at the upper ends of the support protrusions 115, respectively.
Meanwhile, second guide surfaces 115b inclined upward in the central direction of the second insertion groove 112 may be formed at the lower ends of the support protrusions 115, respectively.
When the first insertion end 131 and the second insertion end 221, which will be described later, are inserted into the first insertion groove 111 and the second insertion groove 112, respectively, vertically, the first guide surface 115a and the second guide surface 115b can guide the insertion ends of the first insertion end 131 and the second insertion end 221 to the insertion positions of the first insertion groove 111 and the second insertion groove 112.
In addition, an inclined space may be formed at an upper portion of the first guide surface 115a and a lower portion of the second guide surface 115b so that a resin may be filled when the lower insulating layer 140 and the upper insulating layer 230, which will be described later, are molded.
A pair of fastening protrusions 113 may be formed to protrude in the left-right direction on the front region side of the middle plate 110, and a pair of connection ends 117 may be bent downward in the left-right direction on the rear region side of the middle plate 110.
The connection terminal 117 may be fixedly coupled in a state of being inserted on an upper surface of the printed circuit board, and an extended end of the connection terminal 117 may be coupled to the printed circuit board by protruding a lower surface of the housing 300 described below toward a lower portion.
The lower terminals 120 are arranged to the lower portion of the middle plate 110, and the lower terminals 120 are combined in a state of being Insert-molded (Insert molding) in the middle plate 110 through a lower insulating layer 140 described later.
Here, the lower terminal 120 may be coupled to the lower portion of the middle plate 110 in a state of having a length in the front and rear directions, and a plurality of the lower terminals may be arranged in a state of being spaced apart in the left and right directions.
The front ends of the lower terminals 120 as described above may be exposed downward by a front coupler of the housing 300 described below, and the rear ends may be electrically connected to the printed circuit board through the lower portion of the housing 300.
The lower ground portion 130 is coupled to an upper portion of the lower terminal 120, and the lower ground portion 130 may be disposed between a front end and a rear end of the lower terminal 120.
Here, the lower ground portion 130 may be formed to have a fixed size using a conductive material, and an upper surface of the lower ground portion 130 may be fixedly coupled to a lower surface of the housing 300, which will be described later.
For this, a pair of first insertion ends 131 for being coupled to the left and right ends of the middle plate 110 in a male-female mating manner may be bent and extended upward at the left and right ends of the lower ground connection portion 130.
The first insertion end 131 is bent and extended upward from both left and right ends of the lower ground portion 130 and inserted through a lower portion of the first insertion groove 111.
For example, in the case of coupling the first insertion end 131 to the first insertion groove 111, a resin-fillable spacer G is formed between the first insertion end 131 and the first insertion groove 111.
A gap portion G is formed between the inner circumferential surface of the first insertion groove 111 and the first insertion end 131 at a fixed interval to fill the lower insulating layer 140.
The spacer G as described above can increase the coupling cross-sectional area with the lower insulating layer 140, and thus can improve the coupling strength between the middle plate 110 and the lower ground connection portion 130 without applying a separate fastening structure.
In this state, in the case of Insert molding (Insert molding) of the lower insulating layer 140 described later, the resin is filled into the spacer G, and thus the bonding cross-sectional area with the lower insulating layer 140 can be increased.
The lower insulating layer 140 is bonded to the middle plate 110, the lower terminal 120, and a portion of the lower ground portion 130 by Insert molding (Insert molding), and the lower insulating layer 140 is formed of a non-conductive material (resin, etc.).
In this case, the rear end (connection portion) of the lower terminal 120 may be bent downward after protruding rearward of the lower insulating layer 140, and then mounted on the upper surface of the printed circuit board.
The second assembly 200 may include a plurality of upper terminals 210, an upper ground 220, and an upper insulating layer 230.
If the formation process of the second assembly 200 is explained, the following is: an upper ground portion 220 is disposed on the upper portion of the upper terminal 210, and an upper insulating layer 230 is Insert molded (Insert molding) to a portion of the upper terminal 210 and the upper ground portion 220 to be integrated.
The upper terminals 210 are arranged to the lower portion of the middle plate 110, and the upper terminals 210 are combined in a state of being Insert-molded (Insert molding) in the middle plate 110 through an upper insulating layer 230 described later.
Here, the upper terminal 210 may be coupled to a lower portion of the middle plate 110 in a state of having a length in the front and rear directions, and a plurality of the upper terminals may be arranged in a state of being spaced apart in the left and right directions.
The front end of the upper terminal 210 as described above may be exposed to the upper portion through a front coupling member of the housing 300 described below, and the rear end may be electrically connected to the printed circuit board through the lower portion of the housing 300.
The upper ground portion 220 is coupled to an upper portion of the upper terminal 210, and the upper ground portion 220 may be disposed between a front end and a rear end of the upper terminal 210.
Here, the upper ground portion 220 may be formed of a conductive material to have a fixed size, and an upper surface of the upper ground portion 220 may be fixedly coupled to a lower surface of the housing 300 to be described later.
For this, a pair of second insertion ends 221, which are bent and extended downward at both left and right ends of the upper ground connection portion 220 to be correspondingly coupled to both left and right ends of the middle plate 110 in a male-female mating manner, may be provided.
The second insertion end 221 may be bent and extended upward from both left and right ends of the upper ground portion 220 to be inserted through an upper portion of the second insertion groove 112.
For example, in the case of coupling the second insertion end 221 to the second insertion groove 112, a resin-fillable spacer G is formed between the second insertion end 221 and the second insertion groove 112.
A gap portion G is formed between the inner circumferential surface of the second insertion groove 112 and the second insertion end 221 at a fixed interval to fill the upper insulating layer 230.
The spacer G as described above can increase the coupling cross-sectional area with the upper insulating layer 230, and thus can improve the coupling strength between the middle plate 110 and the upper ground connection portion 220 without applying a separate fastening structure.
In this state, in the case of Insert molding (Insert molding) of the upper insulating layer 230 described later, the resin is filled into the spacer G, and thus the bonding cross-sectional area with the upper insulating layer 230 can be increased.
The upper insulating layer 230 is bonded to the upper terminal 210 and a portion of the upper ground portion 220 by Insert molding (Insert molding), and the upper insulating layer 230 is formed of a non-conductive material (resin, etc.).
At this time, the rear end (connection portion) of the upper terminal 210 may be bent downward after protruding rearward of the upper insulating layer 230 and then mounted on the upper surface of the printed circuit board.
For example, when the lower surface of the second assembly 200 is coupled to the upper surface of the first assembly 100, the pair of first insertion ends 131 bent and extended toward the upper portion of the lower ground portion 130 are inserted into the first insertion grooves 111 formed at both left and right ends of the middle plate 110, respectively, and are electrically connected thereto.
At the same time, a pair of second insertion ends 221 bent and extended to the lower portion of the upper ground portion 220 are inserted into the second insertion grooves 112 formed at both left and right ends of the middle plate 110, respectively, and electrically connected thereto.
At this time, the first insertion end 131 of the lower grounding part 130 is coupled to the first insertion groove 111, and the second insertion end 221 of the upper grounding part 220 is coupled to the second insertion groove 112, whereby the assembly of the first assembly 100 and the second assembly 200 is completed.
In particular, when the second assembly 200 is coupled to the upper portion of the first assembly 100, the left and right wall portions and the front and rear wall portions of the first insertion groove 111 and the second insertion groove 112 are positioned at a distance from the first insertion end 131 and the second insertion end 221, which will be described later, by the distance G.
The housing forming step S300 is a process of bonding the housing 300 (insulating raw material, etc.) by Insert molding (Insert molding) in a manner of coating the first assembly 100 and a portion of the second assembly 200 from the outside.
At this time, the contact surfaces of the lower terminals 120 and the upper terminals 210 and the front region of the middle plate 110 are exposed through the front-side engaging members of the housing 300, and the rear ends of the lower terminals 120 and the upper terminals 210 and the rear region of the middle plate 110 are exposed through the rear-side lower surface of the housing 300.
The coupling member is a portion for coupling to a plug connector (not shown) for connection with an electronic device, and covers the front portion of the middle plate 110 from above and below.
At this time, the front region (side surface) of the middle plate 110 is exposed in the left-right direction of the coupling member, and the fastening protrusions 113 formed at both left and right ends of the middle plate 110 protrude in the left-right direction, respectively.
The contact surface formed in front of the lower terminal 120 is exposed downward through the lower surface of the bonding material, and the contact surface formed in front of the upper terminal 210 is exposed upward through the upper surface of the bonding material.
A lower coupling groove for coupling the lower ground portion 130 and a lower through hole which vertically penetrates through the housing 300 so that the first insertion end 131 is inserted into the first insertion groove 111 may be formed on the lower surface of the housing 300.
At the same time, an upper coupling groove for coupling the upper ground connection part 220 and an upper through hole which penetrates up and down to allow the second insertion end 221 to be inserted into the second insertion groove 112 may be formed on the upper surface of the housing 300.
Also, a front-side vertical hole for protruding the rear end of the lower terminal 120 to the lower portion may be formed along the upper and lower sides of the lower portion of the housing 300.
Meanwhile, a rear vertical hole for protruding the rear end of the upper terminal 210 to the lower portion may be formed vertically at the rear of the front vertical through hole.
That is, the rear ends of the lower and upper terminals 120 and 210 protruding through the front and rear vertical through-holes may be mounted to the printed circuit board through the lower side of the housing 300.
As described above, the present invention can form the resin-fillable spacer G between the first and second insertion ends 131 and 221 of the upper and lower ground portions 220 and 130 and the first and second insertion grooves 111 and 112 of the middle plate 110.
Accordingly, the coupling cross-sectional areas between the first and second insertion ends 131 and 221, the first and second insertion grooves 111 and 112, and the insulating layers 140 and 230 can be increased, and thus the coupling strength between the middle plate 110 and the upper and lower ground portions 220 and 130 can be increased without applying a separate fastening structure.
As a result, the present invention can increase the coupling sectional area with the lower insulating layer 140 and the upper insulating layer 230 by forming the resin-filled spacer G at the first insertion end 131 and the second insertion end 221 and the first insertion groove 111 and the second insertion groove 112, and thus can increase the coupling strength of the middle plate 110 with the upper ground contact portion 220 and the lower ground contact portion 130 without applying a separate fastening structure.
While the present invention has been described with reference to the specific embodiments thereof, it will be understood that various modifications may be made without departing from the scope of the present invention.
It is intended, therefore, that the present invention not be limited to the particular embodiments disclosed, but that the present invention be limited only by the terms of the appended claims, along with the full scope of equivalents to which such claims are entitled.
That is, the above embodiments are to be understood as examples in all aspects and not restrictive, the scope of the present invention is indicated by the appended claims rather than by the detailed description, and all changes and modifications derived from the meaning and scope of the claims and their equivalents are intended to be embraced therein.

Claims (5)

1. A receptacle connector, comprising:
a first assembly including a middle plate, a lower terminal arranged to a lower portion of the middle plate, a lower ground portion arranged to a lower portion of the lower terminal and coupled to the middle plate, and a lower insulating layer insert-molded to a portion of the lower terminal and the lower ground portion; and
a second assembly including an upper terminal arranged on an upper portion of the middle plate, an upper ground portion arranged on an upper portion of the upper terminal and coupled to the middle plate, and an upper insulating layer insert-molded to a portion of the upper terminal and the upper ground portion;
the receptacle connector is characterized in that:
a first insertion groove and a second insertion groove spaced apart from the first insertion groove in the front-rear direction are formed at both ends of the middle plate in the left-right direction, a first insertion end bent and extended upward to be inserted into the first insertion groove is formed at both ends of the lower grounding part in the left-right direction, a second insertion end bent and extended downward to be inserted into the second insertion groove is formed at both ends of the upper grounding part in the left-right direction,
a first spacer is formed between the first insertion groove and the first insertion end to fill the lower insulating layer, and a second spacer is formed between the second insertion groove and the second insertion end to fill the upper insulating layer.
2. Socket connector according to claim 1,
at least one auxiliary insertion groove is concavely formed on the inner circumferential surfaces of the first insertion groove and the second insertion groove to fill the insulating layer.
3. Socket connector according to claim 2,
the first insertion groove and the second insertion groove are divided into:
a left wall portion and a right wall portion which are formed into a straight line along the front-back direction of the middle plate and concavely form the auxiliary insertion groove; and
front and rear wall portions formed as straight lines in the left-right direction from both ends of the left and right wall portions in the front-rear direction;
the left and right wall portions are positioned apart from the first insertion end and the second insertion end by the spacing portion.
4. Socket connector according to claim 3,
support protrusions are formed to protrude from the front and rear wall portions,
first guide surfaces inclined downward in a center direction of the first insertion grooves are formed at upper ends of the support protrusions, respectively,
second guide surfaces inclined upward in a center direction of the second insertion groove are formed at lower ends of the support protrusions, respectively.
5. Socket connector according to claim 1,
insert molding a housing in a portion of the first assembly and the second assembly,
the housing further has a lower coupling groove formed on a lower surface thereof for the lower grounding part to be inserted correspondingly, and an upper coupling groove formed on an upper surface thereof for the upper grounding part to be inserted correspondingly.
CN202020101796.0U 2019-01-22 2020-01-16 Socket connector Active CN211789832U (en)

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KR1020190008213A KR102589590B1 (en) 2019-01-22 2019-01-22 Receptacle connector manufacturing method and receptacle connector using the same
KR10-2019-0008213 2019-01-22

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20160101520A (en) * 2015-02-17 2016-08-25 히로세코리아 주식회사 Receptacle connector
JP6418324B2 (en) * 2015-05-01 2018-11-07 株式会社村田製作所 Multi-pole connector
JP6561668B2 (en) * 2015-08-07 2019-08-21 Smk株式会社 Electrical connector

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