CN211788958U - Semiconductor wafer sucking disc - Google Patents
Semiconductor wafer sucking disc Download PDFInfo
- Publication number
- CN211788958U CN211788958U CN202020990709.1U CN202020990709U CN211788958U CN 211788958 U CN211788958 U CN 211788958U CN 202020990709 U CN202020990709 U CN 202020990709U CN 211788958 U CN211788958 U CN 211788958U
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- China
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- connecting sleeve
- suction cup
- semiconductor wafer
- sucking disc
- cup body
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Abstract
The utility model relates to a semiconductor material technical field, it discloses a semiconductor wafer sucking disc has solved present sucking disc and can only be the technical problem of single size wafer, including the suction cup body, have the internal screw thread connecting sleeve and have the connecting piece of external screw thread, the connecting sleeve with can dismantle the connection between the suction cup body, the connecting piece passes the connecting sleeve with suction cup body threaded connection will the suction cup body with fixed connection can be dismantled to the connecting sleeve is in the same place. According to the technical scheme, the wafer sucker structure with the sucker bodies of different sizes can be replaced, so that the purpose of manufacturing wafers of different sizes can be achieved by detaching the sucker bodies after the sucker equipment is completed.
Description
Technical Field
The utility model relates to a semiconductor material technical field, more specifically say, it relates to a semiconductor wafer sucking disc.
Background
A wafer refers to a substrate (also called a substrate) for manufacturing a semiconductor transistor or an integrated circuit, and is called a wafer because it is a crystalline material and its shape is circular. The substrate material is silicon, germanium, GaAs, InP, GaN, etc. Since silicon is most commonly used, if the crystalline material is not specified, it is often referred to as a silicon wafer. In actual products, wafers have different sizes, such as 2 inch, 3 inch, 4 inch, 5 inch, 6 inch, 8 inch and 12 inch wafer substrates in the manufacturing process of the traditional spin coater.
When absorbing the wafer substrate, need use the wafer sucking disc in the technology, among the conventional art, the sucking disc is that high accuracy part and sucking disc are mostly the integral type to the required precision is high, and the disability rate is high in the preparation, and easy damage damages in the use, integral type sucking disc equipment back can not dismantle the change, can only do single size wafer.
SUMMERY OF THE UTILITY MODEL
The technical problem of single size wafer can only be done to the sucking disc that proposes in the background art, the utility model aims at providing a wafer sucker structure of removable not unidimensional suction cup body to after the sucking disc is equipped to accomplish, through dismantling the suction cup body, can reach the purpose of doing the many sizes wafer.
In order to achieve the above purpose, the utility model provides a following technical scheme:
the utility model provides a semiconductor wafer sucking disc, includes the suction cup body, has internal screw thread connecting sleeve and has the connecting piece of external screw thread, the connecting sleeve with can dismantle the connection between the suction cup body, the connecting piece passes the connecting sleeve with suction cup body threaded connection will the suction cup body with fixed connection together can be dismantled to the connecting sleeve.
Through the technical scheme, the connecting piece is together fixed with sucker and connecting sleeve, and the sucker is used for absorbing the installation process operation that the wafer carries out spin coating developing machine, and what absorb this moment is specific size's wafer, when the wafer that need change not unidimensional in the installation process was installed, changed the sucker, changed the not unidimensional sucker on the connecting sleeve to can absorb the wafer of other sizes, made things convenient for spin coating developing machine's installation process operation greatly. Wherein, the connection of connecting piece external screw thread adopts american system awl screw thread, its benefit: 1. the connection is tight, and 2, the extruded and expanded connection part is better sealed.
The utility model discloses further set up to: the sucking disc body includes sucking disc and connecting cylinder, sucking disc and connecting cylinder integrated into one piece, the connecting cylinder have with connecting piece complex internal thread, the connecting cylinder can be dismantled insert extremely in the connecting sleeve.
The utility model discloses further set up to: the suction cup is made of a material POM.
Through above-mentioned technical scheme, select for expensive PEEK material for use for traditional sucker material, the sucker can select for use material POM to make in this scheme, material cost is practiced thrift.
The utility model discloses further set up to: the sucking disc deviates from be equipped with the arch of increase frictional force on the one side of connecting cylinder.
The utility model discloses further set up to: one end of the connecting sleeve, which deviates from the sucker, is provided with a guide surface.
Through above-mentioned technical scheme, the connecting sleeve is connected on the pole of motor, inserts the pole of motor and installs in the connecting sleeve, and at this moment, set up the guide face, conveniently insert the pole of motor to the connecting sleeve in.
The utility model discloses further set up to: the connecting sleeve is made of stainless steel materials.
The utility model discloses further set up to: the connecting piece includes integrated into one piece's threaded rod and revolves wrong portion, the external screw thread of threaded rod with the interior screw-thread fit of connecting cylinder, revolve wrong portion week side with connecting sleeve's inner wall laminates mutually.
Through above-mentioned technical scheme, the connection of connecting piece external screw thread and connecting cylinder internal thread adopts american system awl screw thread, its benefit: 1. the connection is tight, and 2, the extruded and expanded connection part is better sealed.
To sum up, the utility model discloses following beneficial effect has:
(1) the sucker bodies with different sizes can be disassembled and replaced, so that wafers with different sizes can be sucked for installation;
(2) the sucker rejection rate in the traditional manufacturing is high, and the scrapping cost is reduced by only replacing the sucker body in the product.
Drawings
FIG. 1 is an exploded view of a semiconductor wafer chuck;
FIG. 2 is a schematic view of the overall structure of the semiconductor wafer chuck after mounting;
FIG. 3 is a schematic view of a semiconductor wafer chuck showing a bump structure;
FIG. 4 is a front view of a semiconductor wafer chuck;
fig. 5 is a full cross-sectional view of the semiconductor wafer chuck taken along the line a-a in fig. 4.
Reference numerals: 1. a suction cup body; 11. a suction cup; 111. a protrusion; 12. a connecting cylinder; 2. a connecting sleeve; 21. a guide surface; 3. a connecting member; 31. a threaded rod; 32. and a screwing part.
Detailed Description
The present invention will be described in further detail with reference to the following examples and drawings, but the embodiments of the present invention are not limited thereto.
A semiconductor wafer chuck, as can be seen from FIGS. 1 and 2, comprises a chuck body 1, a connecting sleeve 2 and a connecting member 3. Wherein, suction cup body 1 includes sucking disc 11 and connecting cylinder 12, sucking disc 11 and connecting cylinder 12 integrated into one piece, and connecting cylinder 12 has the internal thread, and connecting cylinder 12's size design can insert in connecting sleeve 2. And the suction cup 11 is made of a material POM, referring to fig. 3, a protrusion 111 for increasing friction force is arranged on one surface of the suction cup 11 departing from the connecting cylinder 12.
As can be known by combining the drawing 4 and the drawing 5, the connection can be disassembled between the connecting sleeve 2 and the sucker body 1, specifically, the connecting sleeve 2 is of a central hollow structure, the connecting sleeve 2 is sleeved on the connecting cylinder 12, the connecting cylinder and the connecting sleeve are in clearance fit, the plugging and the pulling are convenient, and the sucker body 1 is convenient to disassemble integrally.
The connecting piece 3 is used for fixedly connecting the suction cup body 1 and the connecting sleeve 2 together. Specifically, the connecting member 3 includes an integrally formed threaded rod 31 and a screwing portion 32, an external thread of the threaded rod 31 is matched with an internal thread of the connecting cylinder 12, during installation, the threaded rod 31 is connected to the connecting cylinder 12, a circumferential side surface of the screwing portion 32 is attached to an inner wall of the connecting sleeve 2, and the screwing portion 32 abuts against the connecting sleeve 2 on the connecting cylinder 12.
After the installation is accomplished, integral erection is on the pole of motor, and utilizes the hollow structure cover of connecting sleeve 2 to accomplish the installation on the pole of motor, simultaneously, is equipped with guide face 21 in the one end that connecting sleeve 2 deviates from suction cup 1, makes things convenient for the pole of motor to insert to inside connecting sleeve 2. And the connecting sleeve 2 is made of stainless steel materials, is low in price and sufficient in rigidity, and is not easy to damage.
It is above only the utility model discloses a preferred embodiment, the utility model discloses a scope of protection does not only confine above-mentioned embodiment, the all belongs to the utility model discloses a technical scheme under the thinking all belongs to the utility model discloses a scope of protection. It should be noted that, for those skilled in the art, various modifications and decorations can be made without departing from the principle of the present invention, and these modifications and decorations should also be regarded as the protection scope of the present invention.
Claims (7)
1. The utility model provides a semiconductor wafer sucking disc which characterized in that, includes suction cup body (1), has internal screw thread connecting sleeve (2) and has connecting piece (3) of external screw thread, connecting sleeve (2) with can dismantle the connection between suction cup body (1), connecting piece (3) are passed connecting sleeve (2) with suction cup body (1) threaded connection will suction cup body (1) with fixed connection together can be dismantled in connecting sleeve (2).
2. The semiconductor wafer chuck of claim 1, wherein: the sucking disc body (1) includes sucking disc (11) and connecting cylinder (12), sucking disc (11) and connecting cylinder (12) integrated into one piece, connecting cylinder (12) have with connecting piece (3) complex internal thread, connecting cylinder (12) can be dismantled insert extremely in connecting sleeve (2).
3. A semiconductor wafer chuck as claimed in claim 2, wherein: the suction cup (11) is made of a material POM.
4. A semiconductor wafer chuck as claimed in claim 3 wherein: and a bulge (111) for increasing friction force is arranged on one surface of the sucker (11) deviating from the connecting cylinder (12).
5. The semiconductor wafer chuck of claim 1, wherein: one end of the connecting sleeve (2) departing from the sucker body (1) is provided with a guide surface (21).
6. The semiconductor wafer chuck of claim 1, wherein: the connecting sleeve (2) is made of stainless steel materials.
7. A semiconductor wafer chuck as claimed in claim 2, wherein: connecting piece (3) include integrated into one piece's threaded rod (31) and revolve wrong portion (32), the external screw thread of threaded rod (31) with the interior screw-thread fit of connecting cylinder (12), revolve wrong portion (32) week side with the inner wall of connecting sleeve (2) is laminated mutually.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202020990709.1U CN211788958U (en) | 2020-06-01 | 2020-06-01 | Semiconductor wafer sucking disc |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202020990709.1U CN211788958U (en) | 2020-06-01 | 2020-06-01 | Semiconductor wafer sucking disc |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN211788958U true CN211788958U (en) | 2020-10-27 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202020990709.1U Active CN211788958U (en) | 2020-06-01 | 2020-06-01 | Semiconductor wafer sucking disc |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN211788958U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN115030463A (en) * | 2021-03-03 | 2022-09-09 | 广东博智林机器人有限公司 | Grabbing device and floor tile paving equipment |
-
2020
- 2020-06-01 CN CN202020990709.1U patent/CN211788958U/en active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN115030463A (en) * | 2021-03-03 | 2022-09-09 | 广东博智林机器人有限公司 | Grabbing device and floor tile paving equipment |
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