CN211782126U - Heat pump circuit board fault self-diagnosis system - Google Patents
Heat pump circuit board fault self-diagnosis system Download PDFInfo
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- CN211782126U CN211782126U CN202020021507.6U CN202020021507U CN211782126U CN 211782126 U CN211782126 U CN 211782126U CN 202020021507 U CN202020021507 U CN 202020021507U CN 211782126 U CN211782126 U CN 211782126U
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Abstract
The utility model relates to a heat pump circuit board fault self-diagnosis system, its characteristics are including diagnosing the chip, resetting chip, first resistance, second resistance, first electric capacity, second electric capacity, third electric capacity, syntonizer, triode, relay switch, alarm, battery, first fan current signal acquisition circuit, second fan current signal acquisition circuit, valve current signal acquisition circuit, water pump current signal acquisition circuit and compressor current signal acquisition circuit. The method has the advantages that the self-diagnosis of the heat pump fault is rapidly realized by adopting the chip, and a user and equipment maintenance personnel can know the fault at the first time and then process the fault in time.
Description
Technical Field
The utility model relates to a heat pump circuit board fault self diagnosis system.
Background
The executing devices of the existing heat pump comprise a compressor, a four-way valve, a fan, a water pump, a valve and the like. When the heat pump operates, if the executing device is damaged, the heat pump can be in operation failure, and the single chip microcomputer control circuit board can also be in electric control failure due to the damage of a power supply circuit or a relay circuit and the like. The existing fault self-diagnosis is realized by using a complex mathematical algorithm, such as big data or an expert system, and the detection method needs a computer with high operation speed, large data processing capacity and strong floating point operation and matrix operation, and cannot be really applied to small and medium-sized heat pump products.
Disclosure of Invention
The utility model aims at overcoming prior art not enough and providing a heat pump circuit board trouble self diagnosis system, adopt the chip to realize the self diagnosis of heat pump trouble fast, convenience of customers and equipment maintenance personnel can know trouble back in time very much.
In order to achieve the above object, the present invention provides a fault self-diagnosis system for a heat pump circuit board, which comprises a diagnosis chip, a reset chip, a first resistor, a second resistor, a first capacitor, a second capacitor, a third capacitor, a resonator, a triode, a relay, an alarm, a storage battery, a first fan current signal acquisition circuit, a second fan current signal acquisition circuit, a valve current signal acquisition circuit, a water pump current signal acquisition circuit and a compressor current signal acquisition circuit; pin 1 of the diagnosis chip is electrically connected with the cathode of the storage battery, the anode of the storage battery is electrically connected with pin 15 of the diagnosis chip, pin 2 of the diagnosis chip is respectively electrically connected with one end of the resonator and one end of the first capacitor, the other end of the first capacitor is respectively electrically connected with an external 5V power supply and one end of the second capacitor, and the other end of the second capacitor and the other end of the resonator are electrically connected with pin 3 of the diagnosis chip; the 4 pins of the diagnosis chip are respectively and electrically connected with one end of a first resistor, the 1 pin of a reset chip and one end of a third capacitor, the 2 pins of the reset chip are respectively and electrically connected with the other end of the first resistor and an external 5V power supply, and the 3 pins of the reset chip and the other end of the third capacitor are grounded; the 7 pin of the diagnosis chip is electrically connected with the VSS pin of the single chip microcomputer in the heat pump, the 8 pin of the diagnosis chip is electrically connected with the VCC pin of the single chip microcomputer in the heat pump, the 9 pin of the diagnosis chip is electrically connected with the P83 pin of the single chip microcomputer in the heat pump, the 10 pin of the diagnosis chip is electrically connected with the P90 pin of the single chip microcomputer in the heat pump, the 11 pin of the diagnosis chip is electrically connected with the P91 pin of the single chip microcomputer in the heat pump, the 12 pin of the diagnosis chip is electrically connected with the P92 pin of the single chip microcomputer in the heat pump, the 13 pin of the diagnosis chip is electrically connected with the P93 pin of the single chip microcomputer in the heat pump, the 14 pin of the diagnosis chip is electrically connected with one end of a second resistor, the other end of the second resistor is electrically connected with the base electrode of a triode, the emitting electrode of the triode is grounded, the other end of the alarm is grounded; thereby the 17 feet of diagnosis chip carry out mutual inductance through the electric current of first fan in first fan current signal acquisition circuit and the heat pump and gather the signal, thereby 18 feet of diagnosis chip carry out mutual inductance through the electric current of second fan in second fan current signal acquisition circuit and the heat pump and gather the signal, thereby 19 feet of diagnosis chip carry out mutual inductance through the electric current of valve current signal acquisition circuit and the valve in the heat pump and gather the signal, thereby 20 feet of diagnosis chip carry out mutual inductance through the electric current of water pump current signal acquisition circuit and the heat pump in the water pump and gather the signal, thereby 21 feet of diagnosis chip carry out mutual inductance through the electric current of compressor current signal acquisition circuit and the heat pump in compressor and gather the signal.
In the technical scheme, the first fan current signal acquisition circuit comprises a fourth capacitor, a third resistor and a four-pin rectifier bridge; the 17 pins of the diagnosis chip are respectively and electrically connected with one end of a fourth capacitor, one end of a third resistor and the B3 end of a four-pin rectifier bridge, the other end of the fourth capacitor, the other end of the third resistor and the D4 end of the four-pin rectifier bridge are grounded, and the A1 end of the four-pin rectifier bridge is electrically connected with the A2 end of the four-pin rectifier bridge after being mutually inducted by first fan current of the heat pump.
In the technical scheme, the circuit structures of the second fan current signal acquisition circuit, the valve current signal acquisition circuit, the water pump current signal acquisition circuit and the compressor current signal acquisition circuit are the same as the circuit structure of the first fan current signal acquisition circuit.
In the technical scheme, the alarm is an audible and visual alarm.
In the technical scheme, the type of the diagnosis chip is Saiyuan SC91F 73.
In the present embodiment, the model number of the reset chip IC2 is 34064.
In the technical scheme, the type of the single chip microcomputer in the heat pump is UPD 75028.
Compared with the prior art, the utility model the advantage do: the self-diagnosis of the heat pump fault is quickly realized by adopting the chip, so that a user and equipment maintenance personnel can know the fault at the first time and then process the fault in time.
Drawings
Fig. 1 is a schematic diagram of the circuit of the present invention;
fig. 2 is a schematic circuit diagram of a single chip in the heat pump of the present invention.
Detailed Description
The following describes the present invention with reference to the accompanying drawings. It should be noted that the description of the embodiments is provided to help understanding of the present invention, but the present invention is not limited thereto. Furthermore, the technical features mentioned in the embodiments of the present invention described below may be combined with each other as long as they do not conflict with each other.
As shown in fig. 1 to 2, the self-diagnosis system for the fault of the heat pump circuit board comprises a diagnosis chip IC1, a reset chip IC2, a first resistor R1, a second resistor R2, a first capacitor C1, a second capacitor C2, a third capacitor C3, a resonator X, a triode Q, a relay J, an alarm 1, a storage battery E, a first fan current signal acquisition circuit 3, a second fan current signal acquisition circuit 4, a valve current signal acquisition circuit 5, a water pump current signal acquisition circuit 6 and a compressor current signal acquisition circuit 7; a pin 1 of the diagnostic chip IC1 is electrically connected with a negative electrode of a storage battery E, a positive electrode of the storage battery E is electrically connected with a pin 15 of the diagnostic chip IC1, a pin 2 of the diagnostic chip IC1 is electrically connected with one end of a resonator X and one end of a first capacitor C1 respectively, the other end of the first capacitor C1 is electrically connected with an external 5V power supply and one end of a second capacitor C2 respectively, and the other end of the second capacitor C2 and the other end of the resonator X are electrically connected with a pin 3 of the diagnostic chip IC 1; the 4 pins of the diagnosis chip IC1 are respectively and electrically connected with one end of a first resistor R1, the 1 pin of a reset chip IC2 and one end of a third capacitor C3, the 2 pins of the reset chip IC2 are respectively and electrically connected with the other end of the first resistor R1 and an external 5V power supply, and the 3 pins of the reset chip IC2 and the other end of the third capacitor C3 are grounded; the pin 7 of the diagnosis chip IC1 is electrically connected with the VSS pin of the MCU in the heat pump, the pin 8 of the diagnosis chip IC1 is electrically connected with the VCC pin of the MCU in the heat pump, the pin 9 of the diagnosis chip IC1 is electrically connected with the pin P83 of the MCU in the heat pump, the pin 10 of the diagnosis chip IC1 is electrically connected with the pin P90 of the MCU in the heat pump, the pin 11 of the diagnosis chip IC1 is electrically connected with the pin P91 of the MCU in the heat pump, the pin 12 of the diagnosis chip IC1 is electrically connected with the pin P92 of the MCU in the heat pump, the pin 13 of the diagnosis chip IC1 is electrically connected with the pin P93 of the MCU in the heat pump, the pin 14 of the diagnosis chip IC1 is electrically connected with one end of a second resistor R2, the other end of the second resistor R2 is electrically connected with the base of a triode Q, the emitter of the triode Q is grounded, the collector of the triode Q is electrically connected with one end, one end of the alarm 1 is electrically connected with the positive electrode of the storage battery through a relay switch J-1, and the other end of the alarm 1 is grounded; the relay J drives the relay switch J-1 to be closed so as to be communicated, and the relay switch J-1 is a normally open breakpoint; the 17 feet of the diagnosis chip IC1 carry out mutual inductance with the current of the first fan in the heat pump through the first fan current signal acquisition circuit 3 so as to acquire signals, the 18 feet of the diagnosis chip IC1 carry out mutual inductance with the current of the second fan in the heat pump through the second fan current signal acquisition circuit 4 so as to acquire signals, the 19 feet of the diagnosis chip IC1 carry out mutual inductance with the current of the valve in the heat pump through the valve current signal acquisition circuit 5 so as to acquire signals, the 20 feet of the diagnosis chip IC1 carry out mutual inductance with the current of the water pump in the heat pump through the water pump current signal acquisition circuit 6 so as to acquire signals, and the 21 feet of the diagnosis chip IC1 carry out mutual inductance with the current of the compressor in the heat pump through the compressor current signal acquisition circuit 7 so as to acquire. The system adopts two ways for judging the faults of the product circuit board: firstly, acquiring a control output signal of a single chip microcomputer MCU in a heat pump, simultaneously acquiring loop current of a first fan or a second fan or a valve or a water pump or a compressor, and comparing whether the current value is normal or not so as to judge whether the operation and the on-off of the first fan or the second fan or the valve or the water pump or the compressor are according to the logic of the single chip microcomputer MCU; secondly, collecting the power supply voltage of the MCU of the singlechip, and judging whether the power supply of the heat pump circuit board is normal or not, thereby judging whether the product is accidentally powered off or not; when the diagnosis chip IC1 judges that the heat pump has a fault, an alarm is given out through the alarm 1. The capacitance of the first capacitor C1 and the second capacitor C2 is 20pF, the resonator is 4.19MHZ, the capacitance of the fourth capacitor is 100nF, and the resistance of the third resistor is 100 Ω.
In this embodiment, the first fan current signal collecting circuit 3 includes a fourth capacitor C4, a third resistor R3, and a four-pin rectifier bridge; the 17 feet of the diagnosis chip IC1 are respectively electrically connected with one end of a fourth capacitor C4, one end of a third resistor R3 and the B3 end of a four-foot rectifier bridge, the other end of the fourth capacitor C4, the other end of the third resistor R3 and the D4 end of the four-foot rectifier bridge are grounded, and the A1 end of the four-foot rectifier bridge is electrically connected with the A2 end of the four-foot rectifier bridge after being mutually inducted with the first fan current of the heat pump.
In this embodiment, the circuit structures of the second fan current signal collecting circuit 4, the valve current signal collecting circuit 5, the water pump current signal collecting circuit 6 and the compressor current signal collecting circuit 7 are the same as the circuit structure of the first fan current signal collecting circuit 3.
In the present embodiment, the alarm 1 is an audible and visual alarm.
In this embodiment, the model of the diagnostic chip IC1 is seiyuan SC91F 73.
In this embodiment, the model number of the reset chip IC2 is 34064.
In this embodiment, the model of the MCU in the heat pump is UPD 75028.
The embodiments of the present invention are described in detail with reference to the drawings, but the present invention is not limited to the described embodiments. It will be apparent to those skilled in the art that various changes, modifications, substitutions and alterations can be made in the embodiments without departing from the principles and spirit of the invention.
Claims (7)
1. A heat pump circuit board fault self-diagnosis system is characterized by comprising a diagnosis chip (IC 1), a reset chip (IC 2), a first resistor (R1), a second resistor (R2), a first capacitor (C1), a second capacitor (C2), a third capacitor (C3), a resonator (X), a triode (Q), a relay (J), an alarm (1), a storage battery (E), a first fan current signal acquisition circuit (3), a second fan current signal acquisition circuit (4), a valve current signal acquisition circuit (5), a water pump current signal acquisition circuit (6) and a compressor current signal acquisition circuit (7); the device comprises a diagnostic chip (IC 1), a pin 1 of the diagnostic chip (IC 1) and a pin 15 of a storage battery (E), wherein the positive electrode of the storage battery (E) is electrically connected with the pin 15 of the diagnostic chip (IC 1), a pin 2 of the diagnostic chip (IC 1) is electrically connected with one end of a resonator (X) and one end of a first capacitor (C1), the other end of the first capacitor (C1) is electrically connected with an external 5V power supply and one end of a second capacitor (C2), and the other end of the second capacitor (C2) and the other end of the resonator (X) are electrically connected with a pin 3 of the diagnostic chip (IC 1); the 4 pins of the diagnosis chip (IC 1) are respectively and electrically connected with one end of a first resistor (R1), the 1 pin of a reset chip (IC 2) and one end of a third capacitor (C3), the 2 pins of the reset chip (IC 2) are respectively and electrically connected with the other end of the first resistor (R1) and an external 5V power supply, and the 3 pins of the reset chip (IC 2) and the other end of the third capacitor (C3) are grounded; the pin 7 of the diagnosis chip (IC 1) is electrically connected with the VSS pin of the singlechip (MCU) in the heat pump, the pin 8 of the diagnosis chip (IC 1) is electrically connected with the VCC pin of the singlechip (MCU) in the heat pump, the pin 9 of the diagnosis chip (IC 1) is electrically connected with the pin P83 of the singlechip (MCU) in the heat pump, the pin 10 of the diagnosis chip (IC 1) is electrically connected with the pin P90 of the singlechip (MCU) in the heat pump, the pin 11 of the diagnosis chip (IC 1) is electrically connected with the pin P91 of the singlechip (MCU) in the heat pump, the pin 12 of the diagnosis chip (IC 1) is electrically connected with the pin P92 of the singlechip (MCU) in the heat pump, the pin 13 of the diagnosis chip (IC 1) is electrically connected with the pin P93 of the singlechip (MCU) in the heat pump, the pin 14 of the diagnosis chip (IC 1) is electrically connected with one end of a second resistor (R2), the other end of the second resistor (R2) is electrically connected with the base of the, the collector electrode of the triode (Q) is electrically connected with one end of a relay (J), the other end of the relay (J) is electrically connected with the anode of a storage battery, one end of the alarm (1) is electrically connected with the anode of the storage battery through a relay switch (J-1), and the other end of the alarm (1) is grounded; a pin 17 of the diagnosis chip (IC 1) is mutually inducted with the current of a first fan in the heat pump through a first fan current signal acquisition circuit (3) to acquire signals, a pin 18 of the diagnosis chip (IC 1) is mutually inducted with the current of a second fan in the heat pump through a second fan current signal acquisition circuit (4) to acquire signals, a pin 19 of the diagnosis chip (IC 1) is mutually inducted with the current of a valve in the heat pump through a valve current signal acquisition circuit (5) to acquire signals, a pin 20 of the diagnosis chip (IC 1) is mutually inducted with the current of a water pump in the heat pump through a water pump current signal acquisition circuit (6) to acquire signals, and a pin 21 of the diagnosis chip (IC 1) is mutually inducted with the current of a compressor in the heat pump through a compressor current signal acquisition circuit (7) to acquire signals.
2. The heat pump circuit board fault self-diagnosis system according to claim 1, wherein the first fan current signal acquisition circuit (3) comprises a fourth capacitor (C4), a third resistor (R3) and a four-pin rectifier bridge; the 17 feet of the diagnosis chip (IC 1) are respectively and electrically connected with one end of a fourth capacitor (C4), one end of a third resistor (R3) and the B3 end of a four-foot rectifier bridge, the other end of the fourth capacitor (C4), the other end of the third resistor (R3) and the D4 end of the four-foot rectifier bridge are grounded, and the A1 end of the four-foot rectifier bridge is electrically connected with the A2 end of the four-foot rectifier bridge after being mutually induced with the first fan current of the heat pump.
3. The heat pump circuit board fault self-diagnosis system according to claim 2, wherein the second fan current signal acquisition circuit (4), the valve current signal acquisition circuit (5), the water pump current signal acquisition circuit (6) and the compressor current signal acquisition circuit (7) have the same circuit structure as the first fan current signal acquisition circuit (3).
4. The heat pump circuit board fault self-diagnosis system according to claim 1, characterized in that the alarm (1) is an audible and visual alarm.
5. The heat pump circuit board fault self-diagnosis system according to claim 1, wherein the model of the diagnosis chip (IC 1) is seiyuan SC91F 73.
6. The heat pump circuit board fault self-diagnosis system according to claim 1, characterized in that the model number of the reset chip (IC 2) is 34064.
7. The heat pump circuit board fault self-diagnosis system according to claim 1, wherein the type of the single chip Microcomputer (MCU) in the heat pump is UPD 75028.
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| Application Number | Priority Date | Filing Date | Title |
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| CN202020021507.6U CN211782126U (en) | 2020-01-07 | 2020-01-07 | Heat pump circuit board fault self-diagnosis system |
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| Application Number | Priority Date | Filing Date | Title |
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| CN202020021507.6U CN211782126U (en) | 2020-01-07 | 2020-01-07 | Heat pump circuit board fault self-diagnosis system |
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| CN211782126U true CN211782126U (en) | 2020-10-27 |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110926075A (en) * | 2020-01-07 | 2020-03-27 | 顺德职业技术学院 | Heat pump fault self-diagnosis system |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110926075A (en) * | 2020-01-07 | 2020-03-27 | 顺德职业技术学院 | Heat pump fault self-diagnosis system |
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