CN211766866U

CN211766866U - Wafer tears gluey waste film recovery unit

Info

Publication number: CN211766866U
Application number: CN202020136736.2U
Authority: CN
Inventors: 陈志远; 聂伟; 孟强; 徐学飞; 王坤; 苏杨生
Original assignee: Jiangsu Union Semiconductor Co Ltd
Current assignee: Jiangsu Union Semiconductor Co Ltd
Priority date: 2020-01-21
Filing date: 2020-01-21
Publication date: 2020-10-27
Anticipated expiration: 2030-01-21

Abstract

The utility model discloses a wafer tears gluey waste film recovery unit in the semiconductor manufacturing field, including the mounting substrate of vertical setting, the last blowing axle that rotationally sets up of mounting substrate, the last sticky tape charging tray that installs of blowing axle, the corresponding actuating mechanism who is provided with drive wafer workstation and removes below the guide roller set, the sticky tape that the sticky tape charging tray was emitted contacts with the wafer after the guide of guide roller set, the sticky tape that contacts with the wafer is last to be convoluteed on the charging tray, the mounting substrate back corresponds the charging tray and is vertically provided with the actuating cylinder, the piston rod extension end of actuating cylinder articulates there is the swinging arms, the swinging arms end connection has the pressure bar axle, the pressure bar axle passes mounting substrate forward, the cover is equipped with the depression bar on the pressure bar axle that is located the mounting substrate front, the depression bar sets up with the charging tray is corresponding, is; and the front surface of the mounting substrate is provided with a control switch for controlling the driving cylinder. The utility model discloses can clear up the waste glue membrane of tearing off and retrieve.

Description

Wafer tears gluey waste film recovery unit

Technical Field

The utility model belongs to semiconductor manufacturing field, in particular to wafer tears gluey plastic waste film recovery unit.

Background

In the prior art, a wafer is a silicon wafer used for manufacturing a silicon semiconductor integrated circuit, and is called a wafer because the wafer has a circular shape. During the processing of the wafer, several processes such as coating, exposure, development, etching, ion implantation, metal sputtering and cutting are required to be performed on the wafer. Wafer processing usually adopts and attaches the wafer on the basement membrane to cover one deck protection glued membrane on the wafer surface, fix a holding ring around the basement membrane surface, the holding ring is as the supporter of wafer, is convenient for process the wafer, and the location is convenient, prevents to destroy the wafer. The field of semiconductor processing and manufacturing is provided with a wafer frame-combining device which can automatically tear off a protective adhesive film on the upper surface of a wafer, but has the following defects: lacks the device that clears up the waste adhesive film that tears off and retrieve.

SUMMERY OF THE UTILITY MODEL

The utility model aims at providing a wafer tears gluey plastic waste film recovery unit can clear up the plastic waste film that tears and retrieve to can detect the warning when the plastic waste film needs to be cleared up.

The purpose of the utility model is realized like this: a wafer adhesive tearing waste film recovery device comprises a vertically arranged mounting substrate, wherein a discharging shaft is rotatably arranged on the mounting substrate and is perpendicular to the mounting substrate, an adhesive tape tray is arranged on the discharging shaft and is wound with a plurality of circles of adhesive tapes, a guide roller set is arranged on the mounting substrate corresponding to the adhesive tape tray, a driving mechanism for driving a wafer workbench to move is correspondingly arranged below the guide roller set, the adhesive tapes discharged from the adhesive tape tray are guided by the guide roller set and then are contacted with wafers on the wafer workbench, a material collecting barrel is rotatably arranged on the mounting substrate corresponding to the adhesive tapes, the axis of the material collecting barrel is perpendicular to the mounting substrate, the adhesive tapes contacted with the wafers are finally wound on the material collecting barrel, a driving cylinder is vertically arranged on the back surface of the mounting substrate corresponding to the material collecting barrel, the extending end of a piston rod of the driving cylinder is hinged with a swing rod, a support is arranged on the, the middle part of the swing rod is hinged with the support, the end part of the swing rod is connected with a pressure rod shaft, the pressure rod shaft forwards penetrates through the mounting substrate, a pressure rod is sleeved on the pressure rod shaft positioned in front of the mounting substrate and is vertical to the mounting substrate, the pressure rod is arranged corresponding to the material receiving barrel, and a position sensor is arranged on the pressure rod; and the front surface of the mounting substrate is provided with a control switch for controlling the driving cylinder.

When the utility model works, the adhesive tape discharged from the adhesive tape tray is guided by the guide roller group and then wound on the material collecting barrel, and the driving mechanism controls the wafer workbench to move, so that the adhesive tape tears off the adhesive film on the surface of the wafer; then the adhesive tape tray rotates to release the adhesive tape, the waste adhesive film is collected and wound by the collecting barrel, and the wafer workbench is moved continuously to tear the adhesive after being reset; when the normal during operation, the depression bar is close to the receipts feed cylinder, when position sensor detected the expense glued membrane, drives actuating cylinder through control switch control for the swinging arms drives the depression bar rebound, lets out the position, and the personnel of being convenient for take off the clearance with the waste rubber membrane and fall. Compared with the prior art, the beneficial effects of the utility model reside in that: can clear up the waste glue membrane of tearing off and retrieve to can detect when the waste glue membrane needs to be cleared up and remind.

As a further improvement, the mounting base plate is provided with an arc-shaped groove corresponding to the pressure rod shaft, the pressure rod shaft passes through the arc-shaped groove, and the arc-shaped groove is located above the material collecting barrel.

As a further improvement, the last fixed mounting of receipts feed cylinder has the locating support, and the locating support is including being located the outside lever in the receipts feed cylinder outside and being located the inboard pole of receipts feed cylinder, and outside lever and inboard pole all are mutually perpendicular with the receipts feed cylinder axis, are provided with the connecting rod between outside lever and the inboard pole, leave the clearance between outside lever and the receipts feed cylinder outer wall. The waste rubber film passes through the clearance between the outer side rod and the material receiving barrel, the waste rubber film is clamped, and then the material receiving barrel can be rotated to receive materials, so that the waste rubber film can be prevented from loosening.

As a further improvement of the utility model, the bobbin of the material receiving cylinder passes through the mounting substrate and stretches to the back of the mounting substrate, and the bobbin of the material receiving cylinder is in transmission connection with the belt pulley mechanism behind the mounting substrate. The belt pulley mechanism controls the material receiving cylinder to rotate.

As a further improvement, the back of mounting substrate is provided with relay and buzzer, drives and is provided with magnetic switch on the actuating cylinder, and magnetic switch establishes ties mutually with relay, buzzer, and magnetic switch passes through the break-make of relay control buzzer. When the magnetic switch senses that the driving cylinder enables the pressure rod to rise, a signal is fed back to the relay, the relay works to conduct the

circuits

1 and 2, and the buzzer works; when the magnetic switch senses that the driving cylinder enables the pressure rod to descend, no feedback signal is sent to the relay, the

relay circuits

1 and 2 are normally closed, and the buzzer does not work; when the waste adhesive film is cleaned, an operator dials the control switch downwards to enable the piston rod of the driving cylinder to retract, so that the right side pressure rod is lifted, the relay can be triggered to be switched on to enable the buzzer to buzz, the buzzing can be stopped until the pressure rod is put down, the operator can be effectively reminded to put down the pressure rod in time before the waste adhesive film is replaced, and the situation that the waste adhesive film cannot be detected by the position sensor due to the fact that the pressure rod is not put down is avoided.

In order to prevent the adhesive tape from sticking the guide roller group during transmission, the adhesive tape is a hot melt adhesive tape. The adhesive tape is heated before contacting the wafer, so that the viscosity is just released for tearing.

As the utility model discloses a further improvement, the guide roll group is including the guide roll one, guide roll two, guide roll three and the guide roll four that are located between wafer workstation and the sticky tape charging tray to and be located deflector, the guide roll five and the guide roll six between wafer workstation and the material collecting barrel, the deflector slope sets up.

As a further improvement, the driving mechanism comprises a guide rail, the wafer worktable is connected on the guide rail through a sliding block, and a cylinder for driving the wafer worktable to move is arranged on the guide rail. The cylinder drives the wafer workbench to move, and the wafer workbench and the adhesive tape are relatively displaced, so that the adhesive film is torn off.

Drawings

Fig. 1 is a front view of the present invention.

Fig. 2 is a rear view of the present invention.

FIG. 3 is a cross-sectional view of a receiving cartridge.

Fig. 4 is a cross-sectional view of the strut.

Fig. 5 is an electrical control schematic diagram of the relay, buzzer and magnetic switch.

The device comprises a mounting base plate 1, a discharging shaft 2, a tape tray 3, a wafer workbench 4, a material collecting barrel 5, a driving cylinder 6, a swinging rod 7, a support 8, a pressure rod shaft 9, a pressure rod 9a, a control switch 10, an arc-shaped groove 11, a positioning support 12, an outer side rod 12a, an inner side rod 12b, a connecting rod 12c, a belt pulley mechanism 13, a relay 14, a buzzer 15, a magnetic switch 16, a first guide roller 17, a second guide roller 18, a third guide roller 19, a fourth guide roller 20, a guide plate 21, a fifth guide roller 22, a sixth guide roller 23, a guide rail 24, a cylinder 25 and a tape 26.

Detailed Description

As shown in fig. 1-5, a device for recycling waste film of torn wafer adhesive comprises a vertically arranged mounting substrate 1, a discharging shaft 2 is rotatably arranged on the mounting substrate 1, the discharging shaft 2 is perpendicular to the mounting substrate 1, a tape tray 3 is arranged on the discharging shaft 2, a plurality of circles of tapes 26 are wound on the tape tray 3, a guide roller set is arranged on the mounting substrate 1 corresponding to the tape tray 3, a driving mechanism for driving the wafer worktable 4 to move is correspondingly arranged below the guide roller set, the tapes 26 discharged from the tape tray 3 are guided by the guide roller set to contact with the wafer on the wafer worktable 4, a material receiving barrel 5 is rotatably arranged on the mounting substrate 1 corresponding to the tapes 26, the axis of the material receiving barrel 5 is perpendicular to the mounting substrate 1, the tapes 26 contacting with the wafer are finally wound on the material receiving barrel 5, a driving cylinder 6 is vertically arranged on the back of the mounting substrate 1 corresponding to the material receiving barrel 5, the extension end of a piston rod of the driving cylinder 6 is hinged with a swing rod 7, the back of the mounting base plate 1 is provided with a support 8, the middle of the swing rod 7 is hinged with the support 8, the end part of the swing rod 7 is connected with a pressure rod shaft 9, the pressure rod shaft 9 forwards penetrates through the mounting base plate 1, a pressure rod 9a is sleeved on the pressure rod shaft 9 in front of the mounting base plate 1, the pressure rod 9a is perpendicular to the mounting base plate 1, the pressure rod 9a is arranged corresponding to the material receiving barrel 5, and a position sensor is arranged on the pressure rod; the front surface of the mounting substrate 1 is provided with a control switch 10 for controlling the driving cylinder 6. An arc-shaped groove 11 is formed in the mounting base plate 1 corresponding to the pressure rod shaft 9, the pressure rod shaft 9 penetrates through the arc-shaped groove 11, and the arc-shaped groove 11 is located above the material collecting barrel 5. The material receiving barrel 5 is fixedly provided with a positioning support 12, the positioning support 12 comprises an outer side rod 12a located on the outer side of the material receiving barrel 5 and an inner side rod 12b located on the inner side of the material receiving barrel 5, the outer side rod 12a and the inner side rod 12b are perpendicular to the axis of the material receiving barrel 5, a connecting rod 12c is arranged between the outer side rod 12a and the inner side rod 12b, and a gap is reserved between the outer side rod 12a and the outer wall of the material receiving barrel 5. The cylinder shaft of the material receiving cylinder 5 penetrates through the mounting substrate 1 and extends to the back of the mounting substrate 1, and the cylinder shaft of the material receiving cylinder 5 is in transmission connection with a belt pulley mechanism 13 on the back of the mounting substrate 1. A relay 14 and a buzzer 15 are arranged on the back of the mounting substrate 1, a magnetic switch 16 is arranged on the driving cylinder 6, the magnetic switch 16 is connected with the relay 14 and the buzzer 15 in series, and the magnetic switch 16 controls the on-off of the buzzer 15 through the relay 14. The adhesive tape 26 is a hot melt adhesive tape. The guide roller group comprises a first guide roller 17, a second guide roller 18, a third guide roller 19 and a fourth guide roller 20 which are positioned between the wafer workbench 4 and the adhesive tape tray 3, and a guide plate 21, a fifth guide roller 22 and a sixth guide roller 23 which are positioned between the wafer workbench 4 and the material receiving barrel 5, wherein the guide plate is obliquely arranged. The driving mechanism comprises a guide rail 24, the wafer worktable 4 is connected on the guide rail 24 through a sliding block in a sliding way, and a cylinder 25 for driving the wafer worktable 4 to move is arranged on the guide rail 24.

When the utility model works, the adhesive tape 26 discharged from the adhesive tape tray 3 is guided by the guide roller group and then wound on the material collecting barrel 5, and the driving mechanism controls the wafer worktable 4 to move, so that the adhesive tape 26 tears off the adhesive film on the surface of the wafer; then the adhesive tape tray 3 rotates to release the adhesive tape 26, the material receiving cylinder 5 collects and winds the waste adhesive film, and the wafer workbench 4 moves continuously to tear the adhesive after being reset; during normal work, depression bar 9a is close to receiving feed cylinder 5, when position sensor detected the expense glued membrane, drives actuating cylinder 6 through control switch 10 control for swinging arms 7 drive depression bar 9a rebound, lets out the position, and the personnel of being convenient for take off the clearance with the waste glue membrane and fall. As shown in fig. 5, when the magnetic switch 16 senses that the air cylinder 6 is driven to lift the pressure rod 9a, a signal is fed back to the relay 14, the relay 14 works to conduct the

circuits

1 and 2, and the buzzer 15 works; when the magnetic switch 16 senses that the driving cylinder 6 enables the pressure lever 9a to descend, no feedback signal is sent to the relay 14, the

circuits

1 and 2 of the relay 14 are normally closed, and the buzzer 15 does not work; when the waste adhesive film is cleaned, an operator dials down the control switch 10 to enable the piston rod of the driving cylinder 6 to retract, so that the right side pressure rod 9a is lifted, the relay 14 is triggered to conduct to enable the buzzer 15 to buzz, buzzing can be stopped until the pressure rod 9a is put down, the operator can be effectively reminded to put down the pressure rod 9a in time before the waste adhesive film is replaced, and the situation that the waste adhesive film cannot be detected by the position sensor due to the fact that the pressure rod 9a is not put down is avoided. The utility model has the advantages that: can clear up the waste glue membrane of tearing off and retrieve to can detect when the waste glue membrane needs to be cleared up and remind.

The present invention is not limited to the above embodiments, and based on the technical solutions disclosed in the present invention, those skilled in the art can make some replacements and transformations for some technical features without creative labor according to the disclosed technical contents, and these replacements and transformations are all within the protection scope of the present invention.

Claims

1. A wafer adhesive tearing waste film recovery device comprises a vertically arranged mounting substrate, a discharging shaft is rotatably arranged on the mounting substrate and is perpendicular to the mounting substrate, an adhesive tape tray is arranged on the discharging shaft and is wound with a plurality of circles of adhesive tapes, a guide roller set is arranged on the mounting substrate corresponding to the adhesive tape tray, a driving mechanism for driving a wafer workbench to move is correspondingly arranged below the guide roller set, the adhesive tapes discharged from the adhesive tape tray are guided by the guide roller set and then are contacted with wafers on the wafer workbench, the device is characterized in that a material collecting barrel is rotatably arranged on the mounting substrate corresponding to the adhesive tapes, the axis of the material collecting barrel is perpendicular to the mounting substrate, the adhesive tapes contacted with the wafers are finally wound on the material collecting barrel, a driving cylinder is vertically arranged on the back surface of the mounting substrate corresponding to the material collecting barrel, and a swinging rod is hinged to the extending end of a piston rod of the driving, the back of the mounting substrate is provided with a support, the middle part of the oscillating rod is hinged with the support, the end part of the oscillating rod is connected with a pressure rod shaft, the pressure rod shaft forwards penetrates through the mounting substrate, a pressure rod is sleeved on the pressure rod shaft positioned in front of the mounting substrate and is vertical to the mounting substrate, the pressure rod is arranged corresponding to the material receiving barrel, and a position sensor is arranged on the pressure rod; and the front surface of the mounting substrate is provided with a control switch for controlling the driving cylinder.

2. The wafer tearing waste film recycling device according to claim 1, wherein the mounting substrate is provided with an arc-shaped slot corresponding to the pressure rod shaft, the pressure rod shaft passes through the arc-shaped slot, and the arc-shaped slot is located above the material collecting barrel.

3. The wafer tearing glue waste film recycling device according to claim 1 or 2, wherein a positioning support is fixedly mounted on the material receiving cylinder, the positioning support comprises an outer side rod located outside the material receiving cylinder and an inner side rod located inside the material receiving cylinder, the outer side rod and the inner side rod are perpendicular to the axis of the material receiving cylinder, a connecting rod is arranged between the outer side rod and the inner side rod, and a gap is reserved between the outer side rod and the outer wall of the material receiving cylinder.

4. The wafer tearing tape waste film recycling device according to claim 1 or 2, wherein the shaft of the material collecting barrel extends to the rear of the mounting substrate through the mounting substrate, and the shaft of the material collecting barrel is in transmission connection with a belt pulley mechanism at the rear of the mounting substrate.

5. The wafer tearing glue waste film recycling device according to claim 1 or 2, wherein a relay and a buzzer are arranged behind the mounting substrate, a magnetic switch is arranged on the driving cylinder, the magnetic switch is connected with the relay and the buzzer in series, and the magnetic switch controls the buzzer to be turned on or off through the relay.

6. The wafer tearing tape waste film recycling device according to claim 1 or 2, wherein the adhesive tape is a hot melt adhesive tape.

7. The wafer tearing glue waste film recycling device according to claim 1 or 2, wherein the guide roller group comprises a first guide roller, a second guide roller, a third guide roller and a fourth guide roller which are positioned between the wafer workbench and the adhesive tape tray, and a guide plate, a fifth guide roller and a sixth guide roller which are positioned between the wafer workbench and the material receiving barrel, wherein the guide plate is obliquely arranged.

8. The wafer tearing glue waste film recycling device according to claim 1 or 2, wherein the driving mechanism comprises a guide rail, the wafer worktable is connected to the guide rail in a sliding manner through a sliding block, and a cylinder for driving the wafer worktable to move is arranged on the guide rail.