CN211760654U

CN211760654U - Double-sided polishing machine for sapphire processing

Info

Publication number: CN211760654U
Application number: CN201921990282.9U
Authority: CN
Inventors: 孙韬
Original assignee: Ningbo Risheng New Material Co ltd
Current assignee: Ningbo Risheng New Material Co ltd
Priority date: 2019-11-18
Filing date: 2019-11-18
Publication date: 2020-10-27
Anticipated expiration: 2029-11-18

Abstract

The utility model discloses a double-sided polishing machine for sapphire processing, when in use, firstly, a telescopic cylinder is started to drive a contraction block to move upwards, so that the contraction rod drives an embedding block to move inwards, a clamping rod and a clamping end can move along with the movement of the embedding block when the embedding block moves so as to clamp a sapphire wafer, a driving gear is driven by a driving motor to rotate so as to further drive an engaging gear and an upper rotating rod to rotate, a lower rotating rod is driven by a connecting belt to rotate, and a polishing wheel and a polishing tooth can simultaneously polish and polish two end faces of the sapphire wafer along with the rotation when the lower rotating rod rotates, the double-sided polishing has higher polishing efficiency compared with the traditional single-sided polishing, the production efficiency of enterprises is greatly improved, two sides of the sapphire wafer can be polished simultaneously by one-time processing, greatly improving the polishing efficiency and reducing the production cost.

Description

Double-sided polishing machine for sapphire processing

Technical Field

The utility model relates to a sapphire processing technology field specifically is a double-sided polishing machine for sapphire processing.

Background

Sapphire wafer is from the boule along the axial of boule after the flakiness is cut off, and the tangent plane is more crude, needs to polish and polish the tangent plane, then carries out the processing in later stage and uses, because the hardness of crystal is great, and the process of polishing needs certain time, therefore usually can polish the polishing with the help of some grinding tool and handle to improve the rate of processing of wafer.

In the prior art, the sapphire wafer is usually polished by means of a grinding disc and a fixed disc, and the following problems exist: in the grinding and polishing process, the grinding disc is simply rotated to grind, so that the grinding process is slow and the efficiency is low; and the production cost is high.

Accordingly, those skilled in the art have provided a double-side polishing machine for sapphire processing to solve the problems set forth in the background art described above.

Disclosure of Invention

An object of the utility model is to provide a two-sided burnishing machine for sapphire processing to solve the problem that proposes among the above-mentioned background art.

In order to achieve the above object, the utility model provides a following technical scheme:

a double-sided polishing machine for sapphire processing comprises a base, an installation box and a clamping seat; the upper end part of the base is provided with an installation box, the middle position in the installation box is provided with a polishing cavity, the middle position at the upper end in the installation cavity is provided with a driving motor, a driving rod is arranged at the lower side end part of the driving motor, a driving gear is sleeved on the driving rod, upper rotating seats are arranged on the two side walls of the upper end side in the installation cavity, and one end of the upper rotating seat far away from the inner wall of the mounting cavity is rotatably connected with an upper rotating rod, and the end part of one side of the upper rotating rod far away from the upper rotating seat is provided with a meshing gear correspondingly arranged with the driving gear, the outer sides of the two ends of the upper rotating rod are respectively provided with an upper rotating wheel, the two side walls of the lower end of the mounting cavity are respectively provided with a lower rotating seat, one end of the lower rotating seat, which is far away from the inner wall of the mounting cavity, is provided with a lower rotating rod, and the end part of one side of the lower rotating rod, which is far away from the lower rotating seat, penetrates through the mounting box and extends to the inside of the polishing cavity;

one end of the lower rotating rod, which is close to the lower rotating seat, is provided with a lower rotating wheel, the outer sides of the upper rotating wheel and the lower rotating wheel are sleeved with a connecting belt, the penetrating end mountain of the lower rotating rod is provided with a polishing wheel, the end part, which is far away from the lower rotating rod, of the polishing wheel is provided with a polishing tooth, the lower end of the middle part in the polishing cavity is provided with a clamping seat, the two sides of the upper end of the clamping seat are provided with connecting ends between the two sides of the upper end of the clamping seat and the inner wall of the polishing cavity, a telescopic cylinder is arranged between the middle part of the upper end of the clamping seat and the connection of the polishing cavity, the lower side end part of the telescopic cylinder is provided with a telescopic rod, the middle part in the inner side of the clamping seat is provided with a contraction groove, the contraction block is arranged in the contraction groove, the upper side end part of the contraction block, the terminal surface of the embedded block is connected with a contraction rod in a rotating mode, one side end portion, far away from the embedded block, of the contraction rod is connected with the contraction block in a rotating mode, a contraction rotating shaft is arranged between the contraction block and the contraction rod in a rotating mode, the upper side of the terminal surface of the embedded block and the upper side of the terminal surface of the contraction rod are provided with clamping rods, and the end portion of the lower side of each clamping rod is provided with an inner-side arc-shaped clamping end.

As a further aspect of the present invention: the lower extreme inboard of installation cavity and install bin all is equipped with the through hole that corresponds the setting with lower pivot pole.

As a further aspect of the present invention: and a driving seat is arranged between the lower side end part of the driving rod and the bottom wall of the mounting cavity.

As a further aspect of the present invention: driving motor and telescopic cylinder all with external power source and outside singlechip electric connection, and the model of outside singlechip is: STM 32.

As a further aspect of the present invention: and an installation rotating shaft is arranged between the clamping rod and the rotary connection of the embedded block and the contraction rod.

Compared with the prior art, the beneficial effects of the utility model are that: the device is suitable for multiple sapphire double-sided polishing occasions, when in use, firstly, the telescopic cylinder is started to drive the contraction block to move towards the upper end so as to drive the embedding block to move towards the inner side, the clamping rod and the clamping end can move along with the movement of the embedding block when the embedding block moves so as to clamp a sapphire wafer, the driving gear is driven by the driving motor to rotate so as to further drive the meshing gear and the upper rotating rod to rotate, the lower rotating rod is driven by the connecting belt to rotate, and the polishing wheel and the polishing teeth can rotate along with the rotation so as to simultaneously polish and polish two end faces of the sapphire wafer, compared with the traditional single-sided polishing, the double-sided polishing has higher polishing efficiency, the production efficiency of enterprises is greatly improved, two sides of the sapphire wafer can be simultaneously polished by one-time processing, the polishing efficiency is greatly improved, the production cost is reduced.

Drawings

Fig. 1 is a schematic structural diagram of a double-side polishing machine for sapphire processing.

Fig. 2 is a schematic structural diagram of a clamp seat detail of a double-sided polishing machine for sapphire processing.

In the figure: 1-a base, 2-an installation box, 3-an installation cavity, 4-a lower rotating base, 5-a lower rotating wheel, 6-a lower rotating rod, 7-a connecting belt, 8-a polishing cavity, 9-an upper rotating base, 10-an upper rotating wheel, 11-an upper rotating rod, 12-an engaging gear, 13-a connecting end, 14-a telescopic rod, 15-a telescopic cylinder and 16-a driving motor, 17-driving gear, 18-driving rod, 19-driving seat, 20-clamping seat, 21-polishing wheel, 22-polishing tooth, 23-clamping rod, 24-embedded groove, 25-embedded block, 26-installation rotating shaft, 27-shrinkage rod, 28-shrinkage rotating shaft, 29-shrinkage block, 30-shrinkage groove and 31-clamping end.

Detailed Description

The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.

Referring to fig. 1-2, in an embodiment of the present invention, a double-sided polishing machine for sapphire processing includes a base 1, an installation box 2, and a clamping seat 20; the polishing device comprises a base 1, a mounting box 2, a polishing cavity 8, a driving motor 16, a driving rod 18, a driving gear 17, an upper rotating seat 9, an upper rotating wheel 10, an upper rotating seat 11, a lower rotating seat 4, a lower rotating seat 6, a lower rotating wheel 6 and a lower rotating seat 6, wherein the mounting box 2 is arranged at the upper end of the base 1, the polishing cavity 8 is arranged at the middle position of the inner part of the mounting box 2, the middle position of the upper end of the inner part of the mounting cavity 3 is provided with the driving rod 16, the driving rod 18 is sleeved with the driving gear 17, the two side walls of the upper end side of the inner wall of the mounting cavity 3 are respectively provided with the upper rotating seat 9, the end part, far away from the inner wall of the mounting cavity 3, of the upper rotating seat 11 is provided with a meshing gear 12 corresponding to the driving gear 17, the outer sides of the two ends of the upper rotating seat 11 are respectively provided with the upper rotating wheel 10, the two side walls of the lower end of;

one end of the lower rotating rod 6 close to the lower rotating seat 4 is provided with a lower rotating wheel 5, the outer sides of the upper rotating wheel 10 and the lower rotating wheel 5 are both sleeved with a connecting belt 7, the penetrating end mountain of the lower rotating rod 6 is provided with a polishing wheel 21, one side end part of the polishing wheel 21 far away from the lower rotating rod 6 is provided with a polishing tooth 22, the lower end of the middle position inside the polishing cavity 8 is provided with a clamping seat 20, the connecting ends 13 are arranged between the two sides of the upper end of the clamping seat 20 and the inner wall of the polishing cavity 8, a telescopic cylinder 15 is arranged between the middle position of the upper end of the clamping seat 20 and the connection of the polishing cavity 8, the lower side end part of the telescopic cylinder 15 is provided with a telescopic rod 14, the middle position inside the clamping seat 20 is provided with a contracting groove 30, the contracting block 29 is arranged inside the contracting groove 30, the upper side end part of the contracting block 29 is fixedly connected with the telescopic rod 14, and the, and inlay the inside of establishing groove 24 and inlay and establish and be connected with and inlay and establish piece 25, it is connected with shrink rod 27 to rotate on the terminal surface of inlaying piece 25, and shrink rod 27 keeps away from one side tip that inlays and establishes piece 25 and all rotates with shrink block 29 and be connected, and all be equipped with shrink pivot 28 between shrink block 29 and shrink rod 27's the rotation connection, and the terminal surface upside that inlays and establishes piece 25 and shrink rod 27 all is equipped with supporting rod 23, and the downside tip of supporting rod 23 all is equipped with interior lateral arc mouth exposed core 31.

The lower extreme inboard of installation cavity 3 and install bin 2 all is equipped with the through hole that corresponds the setting with lower rotating rod 6.

A driving seat 19 is arranged between the lower end part of the driving rod 18 and the bottom wall of the mounting cavity 3.

Driving motor 16 and telescopic cylinder 15 all with external power source and outside singlechip electric connection, and the model of outside singlechip is: STM 32.

And an installation rotating shaft 26 is arranged between the clamping rod 23 and the rotary connection of the embedded block 25 and the contraction rod 27.

The utility model discloses a theory of operation is:

the utility model relates to a double-sided polishing machine for sapphire processing, the device is suitable for multiple sapphire double-sided polishing occasions, during the use, at first start telescopic cylinder 15 and drive shrink block 29 and move to the upper end, and then make shrink pole 27 drive and inlay the piece 25 and move to the inboard, when inlaying the piece 25 and moving, holding rod 23 and clamping end 31 can move along with the removal of inlaying the piece 25 and then carry out the centre gripping with the sapphire wafer, start driving motor 16 and drive gear 17 and rotate further drive meshing gear 12 and upper rotating rod 11 and rotate, drive lower rotating rod 6 through connecting belt 7 and rotate, when lower rotating rod 6 rotates, polishing wheel 21 and polishing tooth 22 can be along with rotating and then polish the both ends face of sapphire wafer simultaneously, this kind of double-sided polishing has higher polishing efficiency than traditional polishing single face, the production efficiency of enterprises is greatly improved, two sides of the sapphire wafer can be polished simultaneously by one-time processing, the polishing efficiency is greatly improved, and the production cost is reduced.

It is obvious to a person skilled in the art that the invention is not restricted to details of the above-described exemplary embodiments, but that it can be implemented in other specific forms without departing from the spirit or essential characteristics of the invention. The present embodiments are therefore to be considered in all respects as illustrative and not restrictive, the scope of the invention being indicated by the appended claims rather than by the foregoing description, and all changes which come within the meaning and range of equivalency of the claims are therefore intended to be embraced therein. Any reference sign in a claim should not be construed as limiting the claim concerned.

Furthermore, it should be understood that although the present description refers to embodiments, not every embodiment may contain only a single embodiment, and such description is for clarity only, and those skilled in the art should integrate the description, and the embodiments may be combined as appropriate to form other embodiments understood by those skilled in the art.

Claims

1. A double-sided polishing machine for sapphire processing comprises a base (1), an installation box (2) and a clamping seat (20); the polishing device is characterized in that an installation box (2) is arranged at the end part of the upper side of a base (1), a polishing cavity (8) is formed in the middle position of the inner part of the installation box (2), a driving motor (16) is arranged at the middle position of the upper end of the inner part of the installation cavity (3), a driving rod (18) is arranged at the end part of the lower side of the driving motor (16), a driving gear (17) is sleeved on the driving rod (18), upper rotating seats (9) are respectively arranged on the side walls of the upper end side of the inner part of the installation cavity (3) at the upper end side of the installation cavity (3), an upper rotating rod (11) is rotatably connected to one end of the upper rotating seat (9) far away from the inner wall of the installation cavity (3), meshing gears (12) corresponding to the driving gear (17) are respectively arranged at the end part of the upper rotating rod (11), upper rotating wheels (10) are respectively arranged on the outer sides of, and one end of the lower rotating seat (4) far away from the inner wall of the installation cavity (3) is provided with a lower rotating rod (6), and the end part of one side of the lower rotating rod (6) far away from the lower rotating seat (4) penetrates through the installation cavity (3) and the installation box (2) and extends to the inside of the polishing cavity (8).

2. The double-sided polishing machine for sapphire processing as claimed in claim 1, wherein the lower rotating rod (6) is provided with a lower rotating wheel (5) at one end close to the lower rotating seat (4), the outer sides of the upper rotating wheel (10) and the lower rotating wheel (5) are sleeved with a connecting belt (7), the penetrating end of the lower rotating rod (6) is provided with a polishing wheel (21), the end part of one side of the polishing wheel (21) far away from the lower rotating rod (6) is provided with a polishing tooth (22), the lower end of the middle position inside the polishing cavity (8) is provided with a clamping seat (20), the two sides of the upper end of the clamping seat (20) are provided with a connecting end (13) connected with the inner wall of the polishing cavity (8), a telescopic cylinder (15) is arranged between the middle position of the upper end of the clamping seat (20) and the connection of the polishing cavity (8), and the lower end part of the telescopic cylinder (15) is provided with a telescopic rod (14), a contraction groove (30) is arranged in the middle of the inner side of the clamping seat (20), a contraction block (29) is arranged in the contraction groove (30), the upper end part of the contraction block (29) is fixedly connected with the telescopic rod (14), and the upper and lower sides of the clamping seats (20) at the two ends of the contraction groove (30) are provided with embedded grooves (24), an embedding block (25) is embedded and connected in the embedding groove (24), a contraction rod (27) is rotatably connected on the end surface of the embedding block (25), and the end part of one side of the contraction rod (27) far away from the embedded block (25) is rotationally connected with the contraction block (29), and a contraction rotating shaft (28) is arranged between the rotary connection of the contraction block (29) and the contraction rod (27), and the upper sides of the end surfaces of the embedding block (25) and the contraction rod (27) are both provided with a clamping rod (23), and the lower side end parts of the clamping rods (23) are provided with inward arc mouth clamping ends (31).

3. The double-sided polishing machine for sapphire processing as claimed in claim 1, wherein the mounting cavity (3) and the mounting box (2) are provided with through holes corresponding to the lower rotating rod (6) on the inner sides of the lower ends.

4. The double-sided polishing machine for sapphire processing as claimed in claim 1, characterized in that a driving seat (19) is provided between the lower end of the driving rod (18) and the bottom wall connection of the mounting cavity (3).

5. The double-sided polishing machine for sapphire processing as claimed in claim 1, wherein the drive motor (16) and the telescopic cylinder (15) are both electrically connected with an external power supply and an external single chip microcomputer, and the external single chip microcomputer is of the type: STM 32.

6. The double-sided polishing machine for sapphire processing as set forth in claim 2, characterized in that a mounting rotation shaft (26) is provided between the clamping rod (23) and the rotational connection of the insert block (25) and the contraction rod (27).