CN211743133U - SIM card and communication system - Google Patents
SIM card and communication system Download PDFInfo
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- CN211743133U CN211743133U CN202020712536.7U CN202020712536U CN211743133U CN 211743133 U CN211743133 U CN 211743133U CN 202020712536 U CN202020712536 U CN 202020712536U CN 211743133 U CN211743133 U CN 211743133U
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- sim card
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Abstract
The utility model discloses a SIM card and communication system, the SIM card includes the IC circuit, the SIM card still includes the heating unit, the heating unit is used for the heating the IC circuit just the heating unit with the IC circuit all encapsulates in the SIM card. In the utility model, the heating unit and the IC circuit to be heated are packaged in the SIM card, on one hand, the IC circuit can be rapidly heated when the temperature is too low, and the heat can be prevented from being dissipated, thereby further improving the heating efficiency; on the other hand, because the heating unit is packaged in the SIM card, the heating unit does not occupy the surface area of the mainboard in which the SIM card is inserted any more, and the performance of the mainboard is further improved.
Description
Technical Field
The utility model relates to the field of communication technology, in particular to SIM card and communication system.
Background
With popularization of application of the internet of things, application scenes of internet of things equipment are diversified, products often face low-temperature use scenes in practical use and are limited by current IC (integrated circuit) process technical factors, the working temperature of an SIM (subscriber identity identification) card built in the internet of things equipment can only reach-35 ℃ at the lowest, the outdoor temperature in winter in northeast is easily lower than the working temperature, and when the equipment needs networking in outdoor work and needs to initialize the SIM card, the problem that loading of the SIM card fails is commonly encountered.
The existing solution is that usually on the internet of things equipment mainboard, arrange powerful resistance array, make it generate heat to its power supply, and this kind of heating mode heating needs longer time, because heat energy need see through PCB (circuit board) board just can reach the SIM card, in addition the heat still can be past outwards dispelling through the air, and the time that heating needs is longer usually. In addition, in order to achieve a better heating effect, the area occupied by the resistor array which is usually placed is equivalent to the area of the SIM card chip, so that the heating resistor array occupies a large area of the mainboard.
SUMMERY OF THE UTILITY MODEL
The to-be-solved technical problem of the utility model is to need heating with the help of the external equipment in order to overcome among the prior art SIM card for to the not high defect of SIM card heating efficiency, provide a SIM card and communication system.
The utility model discloses an above-mentioned technical problem is solved through following technical scheme:
the utility model provides a SIM card, the SIM card includes the IC circuit, the SIM card still includes the heating unit, the heating unit is used for the heating the IC circuit just the heating unit with the IC circuit all encapsulates in the SIM card.
Preferably, the SIM card further includes a SIM card bus, the SIM card bus is configured to transmit a heating instruction, and the heating unit is specifically configured to heat the IC circuit according to the heating instruction.
Preferably, the heating unit is disposed below the IC circuit.
In this embodiment, the heat generated by the heating unit can be quickly transferred to the IC circuit by disposing the heating unit below the IC circuit.
Preferably, the heating unit is disposed directly below the IC circuit.
In the present embodiment, the conduction of thermal energy is further accelerated by disposing the heating unit directly below the IC circuit.
Preferably, the SIM card further comprises a temperature detection unit, the temperature detection unit is configured to detect a temperature of the IC circuit and the temperature detection unit is packaged in the SIM card.
In this embodiment, can in time detect out the condition that SIM card temperature is crossed lowly through setting up temperature detecting element, further be favorable to heating element in time to heating the IC circuit when the temperature crosses lowly.
Preferably, the SIM card further comprises a temperature acquisition interface, and the temperature acquisition interface is used for transmitting the temperature;
and/or the presence of a gas in the gas,
the temperature detection unit and the IC circuit are arranged on the same plane.
In this embodiment, the temperature detection unit and the IC circuit are disposed on the same plane, which is beneficial for the temperature detection unit to detect the real current temperature of the IC circuit.
Preferably, the heating unit comprises a plurality of resistors connected in parallel.
Preferably, the resistor is made of a high-impedance metal material.
In this embodiment, the heating speed of the heating unit can be further increased by setting the resistance of the high-resistance metal material.
The embodiment also provides a communication system, which includes the SIM card as described above, and a main control module;
the main control module is used for sending a temperature acquisition instruction to a temperature detection unit in the SIM card through a temperature acquisition interface of the SIM card when receiving an SIM card initialization failure instruction, wherein the temperature acquisition instruction is used for triggering the temperature detection unit to acquire the temperature of an IC circuit in the SIM card;
the main control module is further used for sending a heating instruction to a heating unit in the SIM card through an SIM card bus of the SIM card when receiving the low-temperature signal, the heating instruction is used for triggering the heating unit to heat the IC circuit, and the low-temperature signal is used for representing that the temperature of the IC circuit is lower than a temperature threshold value.
Preferably, the main control module is further configured to send a fault notification when receiving a high temperature signal, where the high temperature signal is used to represent that the temperature of the IC circuit is higher than or equal to the temperature threshold.
The positive progress effect of the utility model lies in: the utility model provides a SIM card and communication system, through in encapsulating the heating unit with the IC circuit that needs the heating SIM card, on the one hand, can be lower than the temperature threshold value when the SIM card temperature is heated to the IC circuit fast, can also prevent the heat from dispelling outward, further improve heating efficiency; on the other hand, because the heating unit is packaged in the SIM card, the heating unit does not occupy the surface area of the mainboard in which the SIM card is inserted any more, and the performance of the mainboard is further improved.
Drawings
Fig. 1 is a schematic block diagram of a SIM card according to embodiment 1 of the present invention.
Fig. 2 is a schematic block diagram of a SIM card according to embodiment 2 of the present invention.
Fig. 3 is a schematic block diagram of a communication system according to embodiment 3 of the present invention.
Detailed Description
The present invention is further illustrated by way of the following examples, which are not intended to limit the scope of the invention.
Example 1
The present embodiment provides a SIM card, as shown in fig. 1, a SIM card 101 in the present embodiment includes a built-in IC circuit 103 and a built-in heating unit 102, that is, the IC circuit 103 and the heating unit 102 are integrated in the same SIM card, where the heating unit 102 is used for heating the IC circuit 103.
The SIM card 101 can be disposed in a communication device, and when the communication device needs to be networked in an out-of-service work in cold weather, the heating unit 102 can heat the IC circuit 103 in the SIM card 101 to avoid a situation that the SIM card loading fails due to an excessively low temperature.
In the embodiment, the heating unit and the IC circuit to be heated are packaged in the SIM card, so that on one hand, the IC circuit can be rapidly heated when the temperature is too low, heat is prevented from being dissipated outwards, and the heating efficiency is improved; on the other hand, because the heating unit is packaged in the SIM card, the heating unit does not occupy the surface area of the mainboard in which the SIM card is inserted any more, and the performance of the mainboard is further improved.
Example 2
This embodiment provides a SIM card, which is a further improvement of embodiment 1, and the SIM card in this embodiment further includes a SIM card bus, where the SIM card bus is used to transmit a heating instruction, and the heating unit 102 heats the IC circuit according to the heating instruction.
Specifically, the SIM card bus includes a SIM _ VDD (power supply line), a SIM _ CLK (clock line), a SIM _ DATA (DATA in/out line), and a SIM _ RST (reset line), wherein the SIM _ VDD is electrically connected to the heating unit 102 for supplying power to the heating unit 102.
Preferably, the heating unit 102 in the present embodiment is disposed below the IC circuit 103 in order to facilitate rapid propagation of thermal energy to the IC circuit.
Preferably, in order to further accelerate the diffusion of the thermal energy, the heating unit 102 may be disposed directly below the IC circuit 103.
The heating unit may include a load resistor or a metal wire, the SIM _ VDD of the SIM card bus is electrically connected to the load resistor or the metal wire of the heating unit, and when the SIM _ VDD signal is detected, the heating unit generates heat through the load resistor or the metal wire and heats the IC circuit through heat energy generated by the load resistor or the metal wire.
Preferably, in this embodiment, in order to heat the IC circuit 103 quickly, the load resistor in the heating unit 102 may be a plurality of resistors connected in parallel, and the material of the load resistor may be a high-impedance metal.
Preferably, in order to heat the IC circuit 103 when the temperature is too low, as shown in fig. 2, the SIM card in this embodiment further includes a temperature detection unit 104, and the temperature detection unit 104 is packaged in the SIM card. Specifically, the temperature detection unit 104 may include a temperature sensor, for example, when the temperature sensor includes a thermistor, the temperature of the IC circuit may be detected by using a characteristic that a resistance value of the thermistor varies with temperature, specifically, when the temperature of the IC circuit varies, the resistance value of the thermistor also varies, the variation in the resistance value of the thermistor causes a voltage variation, and the resistance value of the thermistor is calculated by sampling the voltage value obtained by the voltage sampling, so that the temperature value of the IC circuit is monitored.
Preferably, in order to acquire the real temperature of the IC circuit 103, the temperature detection unit 104 and the IC circuit 103 in the present embodiment may be disposed on the same plane in the SIM card 101. Preferably, the SIM card 101 in this embodiment further includes a temperature acquisition interface, and the temperature acquisition interface is configured to transmit the temperature instruction detected by the temperature detection unit 104.
Through the position and the material that set up heating element in this embodiment, can make the heat propagate to the IC circuit fast in order in time to heat for the IC circuit, through setting up temperature detecting element, can be when outdoor temperature is low, in time detect outdoor temperature to in time heat for the IC circuit, through the position that sets up temperature detecting element, also make the temperature that detects more be close with the true temperature of IC circuit.
Example 3
As shown in fig. 3, the communication system in this embodiment includes a SIM card 101 and a main control module 105 in embodiment 2.
When receiving the SIM card initialization failure instruction, the main control module 105 sends a temperature acquisition instruction to the temperature detection unit 104 in the SIM card 101 through the temperature acquisition interface in the SIM card 101, where the temperature acquisition instruction is used to trigger the temperature detection unit 104 to acquire the current temperature of the IC circuit 103 in the SIM card, and send the current temperature to the main control module 105 through the temperature acquisition interface. When receiving the low-temperature signal, the main control module 105 generates a heating instruction, and sends the heating instruction to the heating unit 102 through the SIM card bus, where the heating instruction is used to trigger the heating unit 102 to heat the IC circuit 103, and the heating unit 102 immediately heats the IC circuit 103 after receiving the heating instruction, where the low-temperature signal is used to indicate that the temperature of the IC circuit is lower than a temperature threshold. In addition, if the main control module 105 receives a high temperature signal, it may be that another problem causes the initialization of the SIM card to fail, and then a fault notification is sent to timely notify the relevant personnel to perform fault removal, where the high temperature signal is used to indicate that the current temperature of the IC circuit is higher than or equal to the temperature threshold. In this embodiment, the temperature threshold may be set in a customized manner according to the actual application.
It should be understood that, in the case that the main control module 105 does not receive the SIM card 101 initialization failure instruction, the default SIM card 101 initialization is successful, and therefore, the temperature acquisition instruction is not sent.
In the communication system in this embodiment, the heating unit, the temperature detection unit, and the IC circuit to be heated are packaged in the SIM card together, so that the true temperature of the SIM card can be automatically detected when the initialization of the SIM card fails, and the SIM card is heated quickly when the current true temperature is lower than the temperature threshold, thereby solving the defect that the SIM card is prone to loading failure in cold weather.
Although specific embodiments of the present invention have been described above, it will be understood by those skilled in the art that this is by way of example only and that the scope of the invention is defined by the appended claims. Various changes and modifications to these embodiments may be made by those skilled in the art without departing from the spirit and the principles of the present invention, and these changes and modifications are all within the scope of the present invention.
Claims (10)
1. A SIM card, the SIM card comprising an IC circuit, characterized in that:
the SIM card also comprises a heating unit, wherein the heating unit is used for heating the IC circuit, and the heating unit and the IC circuit are both packaged in the SIM card.
2. The SIM card according to claim 1, further comprising a SIM card bus, the SIM card bus being configured to transmit a heating instruction, the heating unit being configured to heat the IC circuit according to the heating instruction.
3. The SIM card according to claim 1, wherein the heating unit is disposed below the IC circuit.
4. The SIM card according to claim 3, wherein the heating unit is provided directly below the IC circuit.
5. The SIM card according to claim 1, further comprising a temperature detection unit for detecting a temperature of the IC circuit and the temperature detection unit is packaged in the SIM card.
6. The SIM card of claim 5, further comprising a temperature acquisition interface to transmit the temperature;
and/or the presence of a gas in the gas,
the temperature detection unit and the IC circuit are arranged on the same plane.
7. The SIM card of claim 1, wherein the heating element comprises a plurality of resistors connected in parallel.
8. The SIM card according to claim 7, wherein the resistor is made of a high-resistance metal material.
9. A communication system, characterized in that the communication system comprises a SIM card according to any one of claims 1 to 8, the communication system further comprising a master control module;
the main control module is used for sending a temperature acquisition instruction to a temperature detection unit in the SIM card through a temperature acquisition interface of the SIM card when receiving an SIM card initialization failure instruction, wherein the temperature acquisition instruction is used for triggering the temperature detection unit to acquire the temperature of an IC circuit in the SIM card;
the main control module is further used for sending a heating instruction to a heating unit in the SIM card through an SIM card bus of the SIM card when receiving the low-temperature signal, the heating instruction is used for triggering the heating unit to heat the IC circuit, and the low-temperature signal is used for representing that the temperature of the IC circuit is lower than a temperature threshold value.
10. The communication system of claim 9, wherein the master module is further configured to send a fault notification when receiving a high temperature signal, the high temperature signal being used to characterize that the temperature of the IC circuit is greater than or equal to the temperature threshold.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202020712536.7U CN211743133U (en) | 2020-04-30 | 2020-04-30 | SIM card and communication system |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202020712536.7U CN211743133U (en) | 2020-04-30 | 2020-04-30 | SIM card and communication system |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN211743133U true CN211743133U (en) | 2020-10-23 |
Family
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202020712536.7U Active CN211743133U (en) | 2020-04-30 | 2020-04-30 | SIM card and communication system |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN211743133U (en) |
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2020
- 2020-04-30 CN CN202020712536.7U patent/CN211743133U/en active Active
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