CN211741482U - Semiconductor device test apparatus for performing high-speed test in low-speed operating environment - Google Patents
Semiconductor device test apparatus for performing high-speed test in low-speed operating environment Download PDFInfo
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- CN211741482U CN211741482U CN201922361519.3U CN201922361519U CN211741482U CN 211741482 U CN211741482 U CN 211741482U CN 201922361519 U CN201922361519 U CN 201922361519U CN 211741482 U CN211741482 U CN 211741482U
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Abstract
The utility model discloses a semiconductor device test equipment for carrying out high-speed test in low-speed operational environment, the power distribution box comprises a box body, the inside bottom position of box is provided with hydraulic stem A, hydraulic stem A's upper end fixedly connected with brace table, the inside wall of box is provided with perpendicular curb plate, the slip rail has been seted up to the lateral wall of perpendicular curb plate, the both ends sliding connection of brace table is in the inside of slip rail, the top of brace table is provided with places the board, the inside of placing the board is provided with the semiconductor main part, the inside of placing the board has seted up the cavity, the inside fixedly connected with hydraulic stem B of cavity, the one end fixedly connected with limit stop of hydraulic stem B, the lateral wall of hydraulic stem B rotates and is connected with lower branch. The utility model discloses semiconductor structure is convenient for take and place, and work efficiency is high, avoids damaging, and the structure is more stable, avoids whole device vibrations, guarantees the accuracy of semiconductor test.
Description
Technical Field
The utility model relates to a semiconductor test technical field especially relates to a semiconductor device test equipment that is arranged in carrying out high-speed test in low-speed operational environment.
Background
Each electronic device may include a large number of electronic components, and in these electronic devices, a computer system may include a large number of semiconductor devices made of semiconductors, and a semiconductor test apparatus operating at a high speed is an apparatus for testing failures of manufactured semiconductor devices and classifying the semiconductor devices according to test results before being shipped to the market.
The existing semiconductor equipment testing equipment for executing high-speed testing in a low-speed operating environment is not convenient to take and place, is improper in operation and easily damages a semiconductor, is low in working efficiency of manual taking and placing, is unreasonable in design and inconvenient to use, generally places the semiconductor on a workbench directly, a probe can cause semiconductor displacement during working, accuracy of semiconductor testing is influenced, and the structure is not stable enough.
SUMMERY OF THE UTILITY MODEL
The purpose of the utility model is to solve the shortcoming that exists among the prior art, and the semiconductor device test equipment who is used for carrying out high-speed test in low-speed operational environment that proposes.
In order to achieve the above purpose, the utility model adopts the following technical scheme:
a semiconductor device test equipment for carrying out high-speed test in low-speed operational environment, the power distribution box comprises a box body, the inside bottom position of box is provided with hydraulic stem A, hydraulic stem A's upper end fixedly connected with brace table, the inside wall of box is provided with perpendicular curb plate, the slide rail has been seted up to the lateral wall of perpendicular curb plate, the both ends sliding connection of brace table is in the inside of slide rail, the top of brace table is provided with places the board, the inside of placing the board is provided with the semiconductor main part, the inside of placing the board has seted up the cavity, the inside fixedly connected with hydraulic stem B of cavity, the one end fixedly connected with limit stop of hydraulic stem B, the lateral wall of hydraulic stem B rotates and is connected with lower branch, the one end axle of lower branch rotates and is connected with upper strut, the upper end of upper strut rotates and is.
Preferably, erect the equal fixedly connected with elasticity billet to one side of upper end and the lower extreme of curb plate, the one end of elasticity billet to one side and the inside wall fixed connection of box to one side, the lateral wall of erecting the curb plate is close to a plurality of trapezoidal rubber block A of the even fixedly connected with in one side of box, the even fixedly connected with a plurality of trapezoidal rubber block B of inside wall of box, it is a plurality of trapezoidal rubber block A sets up with the crisscross joint of a plurality of trapezoidal rubber block B.
Preferably, the inner side wall of the arc-shaped clamping block is fixedly connected with a rubber non-slip mat, the inner side wall of the placing plate is provided with a movable groove, an I-shaped sliding groove is formed in the movable groove, the I-shaped sliding groove is connected with an I-shaped sliding block in a sliding mode, and one side of the lower supporting rod is movably connected with the upper surface of the I-shaped sliding block.
Preferably, the lower surface of the placing plate is fixedly connected with a T-shaped sliding block, the upper surface of the supporting table is provided with a T-shaped sliding groove, the T-shaped sliding block is connected inside the T-shaped sliding groove in a sliding mode, and one side wall of the placing plate is fixedly connected with a pulling handle.
Preferably, the inside top position fixedly connected with probe main part, surveillance camera head and the sensor of box, the probe main part sets up between surveillance camera head and sensor, the sensor is including photoelectric sensor, infrared ray sensor and temperature sensing inductor, one side lateral wall fixedly connected with controller of box, controller and photoelectric sensor, infrared ray sensor, temperature sensing inductor and surveillance camera head electric connection.
Preferably, the side wall of placing the board has seted up the slot, the inside screw thread of slot rotates and is connected with the reinforcement bolt pole, go up the inside fixedly connected with screw thread section of thick bamboo of branch, the one end of reinforcement bolt pole runs through the inside and the fixedly connected with regulating block of screw thread section of thick bamboo.
Compared with the prior art, the beneficial effects of the utility model are that:
1. the utility model discloses in, place the lateral wall of arc clamp splice with the semiconductor main part, start hydraulic stem B, hydraulic stem B drives down branch, goes up the branch and rotates, and then the arc clamp splice presss from both sides the semiconductor main part, and when taking, the side door has been seted up to one side of box, will place the board through the pulling handle and take out, and it is spacing that T shape slider slides in the inside of T shape spout, and the semiconductor structure is convenient for take and place, and work efficiency is high, avoids damaging.
2. The utility model discloses in, the worker shape slider slides in the inside of worker shape spout, can carry on spacingly to lower branch, guarantee the stable in structure of device, open the probe main part and test, press from both sides the device through the arc clamp splice, worker shape slider slides in the inside of worker shape spout, guarantee the stable in structure of branch down, it rotates to drive the reinforcing bolt pole through the regulating block, cooperation screw thread section of thick bamboo and slot will go up the branch locking, device stable in structure, and cooperation elasticity oblique billet can constitute the device of shock attenuation buffering, when a supporting bench relies on perpendicular curb plate to slide, the structure is more stable, avoid whole device vibrations, guarantee the accuracy of semiconductor test.
Drawings
FIG. 1 is a schematic diagram of a semiconductor device testing apparatus for performing high speed testing in a low speed operating environment in accordance with the present invention;
fig. 2 is a plan view of a mounting plate of a semiconductor device testing apparatus for performing a high-speed test in a low-speed operating environment according to the present invention;
FIG. 3 is an enlarged view of the semiconductor device testing apparatus for performing high speed testing in a low speed operating environment according to the present invention at A;
fig. 4 is an enlarged view of the second embodiment of the semiconductor device testing apparatus for performing high-speed testing in a low-speed operating environment according to the present invention.
In the figure: 1 box, 2 brace tables, 3 hydraulic stem A, 4T shape spout, 5T shape sliders, 6 perpendicular curb plates, 7 sliding rails, 8 place the board, 9 probe main parts, 10 hydraulic stem B, 11 limit stop, 12 cavities, 13 movable grooves, 14 worker's shape spouts, 15 worker's shape sliders, 16 lower branch, 17 upper branch, 18 arc clamp splice, 19 semiconductor main parts, 20 thread section of thick bamboo, 21 regulating block, 22 slots, 23 reinforcing bolt pole, 24 trapezoidal rubber piece A, 25 trapezoidal rubber piece B, 26 oblique billet of elasticity.
Detailed Description
The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments.
The first embodiment is as follows:
the semiconductor equipment testing device for executing high-speed testing in a low-speed operating environment comprises a box body 1, wherein a probe main body 9, a monitoring camera and a sensor are fixedly connected to the top position in the box body 1, the probe main body 9 is arranged between the monitoring camera and the sensor, the sensor comprises a photoelectric sensor, an infrared sensor and a thermosensitive sensor, a controller is fixedly connected to the side wall of one side of the box body 1, and the controller is electrically connected with the photoelectric sensor, the infrared sensor, the thermosensitive sensor and the monitoring camera and is shown in the attached drawing 1; through setting up the condition that can detect and monitor 1 insides of box such as photoelectric sensor, infrared ray sensor, temperature sensing ware and surveillance camera head, through the controller reaction, the test result is more directly perceived.
A hydraulic rod A3 is arranged at the bottom of the inside of the box body 1, a support table 2 is fixedly connected to the upper end of the hydraulic rod A3, a vertical side plate 6 is arranged on the inner side wall of the box body 1, a sliding rail 7 is arranged on the side wall of the vertical side plate 6, two ends of the support table 2 are slidably connected to the inside of the sliding rail 7, a placing plate 8 is arranged above the support table 2, a T-shaped sliding block 5 is fixedly connected to the lower surface of the placing plate 8, a T-shaped sliding groove 4 is arranged on the upper surface of the support table 2, the T-shaped sliding block 5 is slidably connected to the inside of the T-shaped sliding groove 4, and a pulling; by pulling the handle, the placing plate 8 can be pulled out from the supporting table 2, and the semiconductor body can be placed and taken conveniently.
A semiconductor body 19 is arranged inside the placing plate 8, a cavity 12 is formed inside the placing plate 8, a hydraulic rod B10 is fixedly connected inside the cavity 12, a limit stop 11 is fixedly connected to one end of a hydraulic rod B10, a lower support rod 16 is rotatably connected to the side wall of the hydraulic rod B10, an upper support rod 17 is rotatably connected to one end of the lower support rod 16, a slot 22 is formed in the side wall of the placing plate 8, a reinforcing bolt rod 23 is rotatably connected to the internal thread of the slot 22, a thread cylinder 20 is fixedly connected to the inside of the upper support rod 17, and an adjusting block 21 is fixedly connected to one end of the reinforcing bolt rod 23, penetrates through the inside of the thread cylinder 20, as shown in figure 3; the adjusting block 21 drives the reinforcing bolt rod 23 to rotate, the upper support rod 17 is locked by matching the threaded cylinder 20 and the slot 22, and the device is stable in structure.
The upper end of the upper support rod 17 is rotatably connected with an arc-shaped clamping block 18, the inner side wall of the arc-shaped clamping block 18 is fixedly connected with a rubber anti-skid pad, the inner side wall of the placing plate 8 is provided with a movable groove 13, an I-shaped sliding groove 14 is formed in the movable groove 13, an I-shaped sliding block 15 is connected in the I-shaped sliding groove 14 in a sliding manner, one side of the lower support rod 16 is movably connected with the upper surface of the I-shaped sliding block 15, and the attached drawing 2 shows that; the arc-shaped clamping blocks 18 are arranged to facilitate clamping of the semiconductor, and the rubber anti-slip pads increase friction and reduce abrasion.
Example two:
the semiconductor equipment testing device for executing high-speed testing in a low-speed operating environment comprises a box body 1, wherein a probe main body 9, a monitoring camera and a sensor are fixedly connected to the top position in the box body 1, the probe main body 9 is arranged between the monitoring camera and the sensor, the sensor comprises a photoelectric sensor, an infrared sensor and a thermosensitive sensor, a controller is fixedly connected to the side wall of one side of the box body 1, and the controller is electrically connected with the photoelectric sensor, the infrared sensor, the thermosensitive sensor and the monitoring camera and is shown in the attached drawing 1; through setting up the condition that can detect and monitor 1 insides of box such as photoelectric sensor, infrared ray sensor, temperature sensing ware and surveillance camera head, through the controller reaction, the test result is more directly perceived.
A hydraulic rod A3 is arranged at the bottom of the interior of the box body 1, a support table 2 is fixedly connected to the upper end of the hydraulic rod A3, a vertical side plate 6 is arranged on the inner side wall of the box body 1, an elastic inclined steel bar 26 is fixedly connected to the upper end and the lower end of the vertical side plate 6, one end of the elastic inclined steel bar 26 is fixedly connected to the inner side wall of the box body 1, a plurality of trapezoidal rubber blocks A24 are uniformly and fixedly connected to one side, close to the box body 1, of the side wall of the vertical side plate 6, a plurality of trapezoidal rubber blocks B25 are uniformly and fixedly connected to the inner side wall of the box body 1, and the plurality of trapezoidal rubber blocks A24 and the plurality of; through the structure that a plurality of trapezoidal rubber piece A24 and the crisscross joint of a plurality of trapezoidal rubber piece B25 set up, and cooperation elasticity billet 26 to one side can constitute the device of shock attenuation buffering, and when propping up supporting bench 2 and relying on perpendicular curb plate 6 to slide, the structure is more stable, avoids whole device vibrations.
A sliding rail 7 is arranged on the side wall of the vertical side plate 6, two ends of the supporting platform 2 are connected inside the sliding rail 7 in a sliding mode, a placing plate 8 is arranged above the supporting platform 2, a T-shaped sliding block 5 is fixedly connected to the lower surface of the placing plate 8, a T-shaped sliding groove 4 is arranged on the upper surface of the supporting platform 2, the T-shaped sliding block 5 is connected inside the T-shaped sliding groove 4 in a sliding mode, and a pulling handle is fixedly connected to the side wall of one side of the placing plate 8, as shown in the attached; by pulling the handle, the placing plate 8 can be pulled out from the supporting table 2, and the semiconductor body can be placed and taken conveniently.
A semiconductor body 19 is arranged inside the placing plate 8, a cavity 12 is formed inside the placing plate 8, a hydraulic rod B10 is fixedly connected inside the cavity 12, a limit stop 11 is fixedly connected to one end of a hydraulic rod B10, a lower support rod 16 is rotatably connected to the side wall of the hydraulic rod B10, an upper support rod 17 is rotatably connected to one end of the lower support rod 16, a slot 22 is formed in the side wall of the placing plate 8, a reinforcing bolt rod 23 is rotatably connected to the internal thread of the slot 22, a thread cylinder 20 is fixedly connected to the inside of the upper support rod 17, and an adjusting block 21 is fixedly connected to one end of the reinforcing bolt rod 23, penetrates through the inside of the thread cylinder 20, as shown in figure 3; the adjusting block 21 drives the reinforcing bolt rod 23 to rotate, the upper support rod 17 is locked by matching the threaded cylinder 20 and the slot 22, and the device is stable in structure.
The upper end of the upper support rod 17 is rotatably connected with an arc-shaped clamping block 18, the inner side wall of the arc-shaped clamping block 18 is fixedly connected with a rubber anti-skid pad, the inner side wall of the placing plate 8 is provided with a movable groove 13, an I-shaped sliding groove 14 is formed in the movable groove 13, an I-shaped sliding block 15 is connected in the I-shaped sliding groove 14 in a sliding manner, one side of the lower support rod 16 is movably connected with the upper surface of the I-shaped sliding block 15, and the attached drawing 2 shows that; the arc-shaped clamping blocks 18 are arranged to facilitate clamping of the semiconductor, and the rubber anti-slip pads increase friction and reduce abrasion.
The working principle is as follows: when the semiconductor packaging box is used, the semiconductor main body 19 is placed on the side wall of the arc-shaped clamping block 18, the hydraulic rod B10 is started, the hydraulic rod B drives the lower support rod 16 and the upper support rod 17 to rotate, the semiconductor main body 19 is clamped by the arc-shaped clamping block 18, when the semiconductor packaging box is taken, one side of the box body 1 is provided with a side door, the placing plate 8 is taken out by pulling a handle, the T-shaped sliding block 5 is limited in the T-shaped sliding groove 4 in a sliding mode, the semiconductor structure is convenient to take and place, the working efficiency is high, damage is avoided, the I-shaped sliding block 15 slides in the I-shaped sliding groove 14 and can limit the lower support rod 16, the structure stability of the device is guaranteed, the support table 2 is jacked up by the hydraulic rod A3, two ends of the support table 2 slide in the sliding rail 7, the probe main body 9 is tested, the device is clamped by the arc-shaped clamping block 18, the I, drive reinforcing bolt pole 23 through regulating block 21 and rotate, cooperation screw thread section of thick bamboo 20 and slot 22 will go up the locking of branch 17, device stable in structure, and cooperation elasticity billet 26 to one side can constitute the device of shock attenuation buffering, and when brace table 2 relied on perpendicular curb plate 6 to slide, the structure is more stable, avoids whole device vibrations, guarantees the accuracy of semiconductor test.
The above, only be the concrete implementation of the preferred embodiment of the present invention, but the protection scope of the present invention is not limited thereto, and any person skilled in the art is in the technical scope of the present invention, according to the technical solution of the present invention and the utility model, the concept of which is equivalent to replace or change, should be covered within the protection scope of the present invention.
Claims (6)
1. A semiconductor device testing device for performing high-speed testing in a low-speed operating environment comprises a box body (1) and is characterized in that a hydraulic rod A (3) is arranged at the bottom of the interior of the box body (1), a supporting table (2) is fixedly connected to the upper end of the hydraulic rod A (3), a vertical side plate (6) is arranged on the inner side wall of the box body (1), a sliding rail (7) is arranged on the side wall of the vertical side plate (6), two ends of the supporting table (2) are slidably connected to the inside of the sliding rail (7), a placing plate (8) is arranged above the supporting table (2), a semiconductor main body (19) is arranged inside the placing plate (8), a cavity (12) is arranged inside the placing plate (8), a hydraulic rod B (10) is fixedly connected to the interior of the cavity (12), and a limit stop (11) is fixedly connected to one end of the hydraulic rod B (10), the side wall of the hydraulic rod B (10) is rotatably connected with a lower support rod (16), one end shaft of the lower support rod (16) is rotatably connected with an upper support rod (17), and the upper end of the upper support rod (17) is rotatably connected with an arc-shaped clamping block (18).
2. The semiconductor device testing apparatus for performing high speed testing in a low speed operating environment according to claim 1, wherein the upper end and the lower end of the vertical side plate (6) are both fixedly connected with an elastic angle steel bar (26), one end of the elastic angle steel bar (26) is fixedly connected with the inner side wall of the box body (1), one side of the side wall of the vertical side plate (6) close to the box body (1) is uniformly and fixedly connected with a plurality of trapezoidal rubber blocks A (24), the inner side wall of the box body (1) is uniformly and fixedly connected with a plurality of trapezoidal rubber blocks B (25), and the trapezoidal rubber blocks A (24) and the trapezoidal rubber blocks B (25) are in staggered clamping arrangement.
3. The semiconductor device testing apparatus for performing high-speed testing in a low-speed operating environment according to claim 1, wherein a rubber anti-slip pad is fixedly connected to an inner side wall of the arc-shaped clamping block (18), a movable groove (13) is formed in an inner side wall of the placing plate (8), an I-shaped sliding groove (14) is formed in the movable groove (13), an I-shaped sliding block (15) is slidably connected to the inside of the I-shaped sliding groove (14), and one side of the lower support rod (16) is movably connected to an upper surface of the I-shaped sliding block (15).
4. The semiconductor device testing apparatus for performing high-speed testing in a low-speed operating environment according to claim 1, wherein a T-shaped slider (5) is fixedly connected to a lower surface of the placing plate (8), a T-shaped sliding slot (4) is formed in an upper surface of the supporting table (2), the T-shaped slider (5) is slidably connected to an inner portion of the T-shaped sliding slot (4), and a pulling handle is fixedly connected to a side wall of one side of the placing plate (8).
5. The semiconductor device testing apparatus for performing high speed testing in a low speed operation environment according to claim 1, wherein a probe body (9), a monitoring camera and a sensor are fixedly connected to an inner top position of the case (1), the probe body (9) is disposed between the monitoring camera and the sensor, the sensor comprises a photoelectric sensor, an infrared sensor and a heat-sensitive sensor, a controller is fixedly connected to one side wall of the case (1), and the controller is electrically connected to the photoelectric sensor, the infrared sensor, the heat-sensitive sensor and the monitoring camera.
6. The semiconductor device testing apparatus for performing high-speed testing in a low-speed operating environment according to claim 1, wherein a slot (22) is opened in a side wall of the placing plate (8), a reinforcing bolt rod (23) is rotatably connected to an inner thread of the slot (22), a threaded cylinder (20) is fixedly connected to an inner portion of the upper support rod (17), and an adjusting block (21) is fixedly connected to one end of the reinforcing bolt rod (23) penetrating through the inner portion of the threaded cylinder (20).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201922361519.3U CN211741482U (en) | 2019-12-24 | 2019-12-24 | Semiconductor device test apparatus for performing high-speed test in low-speed operating environment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201922361519.3U CN211741482U (en) | 2019-12-24 | 2019-12-24 | Semiconductor device test apparatus for performing high-speed test in low-speed operating environment |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN211741482U true CN211741482U (en) | 2020-10-23 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201922361519.3U Active CN211741482U (en) | 2019-12-24 | 2019-12-24 | Semiconductor device test apparatus for performing high-speed test in low-speed operating environment |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN211741482U (en) |
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2019
- 2019-12-24 CN CN201922361519.3U patent/CN211741482U/en active Active
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