CN211727000U - Collecting device of solder wire extruder - Google Patents
Collecting device of solder wire extruder Download PDFInfo
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- CN211727000U CN211727000U CN202020243746.6U CN202020243746U CN211727000U CN 211727000 U CN211727000 U CN 211727000U CN 202020243746 U CN202020243746 U CN 202020243746U CN 211727000 U CN211727000 U CN 211727000U
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- wire
- solder wire
- mounting plate
- solder
- shaped mounting
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- 229910000679 solder Inorganic materials 0.000 title claims abstract description 119
- 230000007246 mechanism Effects 0.000 claims abstract description 63
- 238000004804 winding Methods 0.000 claims abstract description 57
- 238000005476 soldering Methods 0.000 claims description 32
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 claims description 24
- 238000005096 rolling process Methods 0.000 abstract description 2
- 238000004140 cleaning Methods 0.000 description 20
- 238000009434 installation Methods 0.000 description 6
- 238000000034 method Methods 0.000 description 5
- 230000008569 process Effects 0.000 description 4
- 230000008859 change Effects 0.000 description 3
- 239000012752 auxiliary agent Substances 0.000 description 2
- 238000003466 welding Methods 0.000 description 2
- 229910001128 Sn alloy Inorganic materials 0.000 description 1
- 230000004075 alteration Effects 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000008901 benefit Effects 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000009826 distribution Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000000945 filler Substances 0.000 description 1
- 239000012535 impurity Substances 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
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Abstract
The utility model discloses a solder wire extruder collecting device, which comprises a U-shaped mounting plate, a wire rolling mechanism and a solder wire position adjusting mechanism; u type mounting panel: a solder wire through hole is formed in the right end of the U-shaped mounting plate, a second solder wire guiding mechanism is mounted on the right side face of the U-shaped mounting plate at a position corresponding to the solder wire through hole, and a first solder wire guiding mechanism is mounted on the left side of the bottom end of the U-shaped mounting plate; a wire winding mechanism: the wire winding mechanism comprises a wire winding motor, a left mounting seat, a round rod and a right mounting seat, the wire winding motor is mounted on the left side face of the U-shaped mounting plate, an output shaft of the wire winding motor is connected with the left mounting seat, the right mounting seat is rotatably connected with the inner wall of the right side of the U-shaped mounting plate, the round rod is connected between the left mounting seat and the right mounting seat, a winding drum is sleeved on the side face of the round rod, and a clamping block is arranged on the side face of the round rod; the collecting device is simple in structure, high in wire winding uniformity and high in collecting efficiency.
Description
Technical Field
The utility model relates to a solder wire collecting device technical field specifically is a solder wire extruder collection device.
Background
The solder wire is composed of tin alloy and auxiliary agent, wherein the auxiliary agent part can improve the auxiliary heat conduction of the solder wire in the welding process, the oxidation is removed, the surface tension of the welded material is reduced, the solder wire is widely used for welding electronic original devices, the solder wire can be used as a filler to be added to the surfaces and gaps of the electronic original devices, the solder wire is extruded by an extruder in the production process, the solder wire is extruded from a die, a collecting device is required to be used for collecting the solder wire after the solder wire is extruded, the traditional solder wire collecting device is simple in structure, the collecting efficiency of the solder wire is low, the collected solder wire is disordered, when the solder wire is wound into a cylinder, the distribution of the solder wire is uneven, and the quality of the solder wire is easily influenced.
SUMMERY OF THE UTILITY MODEL
The to-be-solved technical problem of the utility model is to overcome current defect, provide a solder wire extruder collection device, this collection device simple structure, the degree of consistency of wire winding is high and collection efficiency is fast, can effectively solve the problem in the background art.
In order to achieve the above object, the utility model provides a following technical scheme: a collecting device of a solder wire extruder comprises a U-shaped mounting plate, a wire winding mechanism and a solder wire position adjusting mechanism;
u type mounting panel: a solder wire through hole is formed in the right end of the U-shaped mounting plate, a second solder wire guiding mechanism is mounted on the right side face of the U-shaped mounting plate at a position corresponding to the solder wire through hole, and a first solder wire guiding mechanism is mounted on the left side of the bottom end of the U-shaped mounting plate;
a wire winding mechanism: the wire winding mechanism comprises a wire winding motor, a left mounting seat, a round rod and a right mounting seat, the wire winding motor is mounted on the left side face of the U-shaped mounting plate, an output shaft of the wire winding motor is connected with the left mounting seat, the right mounting seat is rotatably connected with the inner wall of the right side of the U-shaped mounting plate, the round rod is connected between the left mounting seat and the right mounting seat, a winding drum is sleeved on the side face of the round rod, a clamping block is arranged on the side face of the round rod, a clamping groove is formed in the inner wall of the winding drum, and the clamping block is clamped in the clamping groove;
solder wire position adjustment mechanism: the soldering tin wire position adjusting mechanism comprises a servo motor, a lead screw, a guide rod and a movable seat, wherein the lead screw and the guide rod are parallelly installed on the inner wall of a U-shaped installation plate, the lead screw is rotatably connected with the inner wall of the U-shaped installation plate, the movable seat is installed on the lead screw and the guide rod, is in threaded connection with the lead screw, is in sliding connection with the guide rod left and right, is provided with a through hole in the middle, is rotatably connected with a second limiting roller at the bottom end of the movable seat through a support, is rotatably connected with a first limiting roller at the top end of the movable seat through a vertical plate, is installed on the left side surface of the U-shaped installation plate, and is connected with the lead screw through an output;
the automatic soldering tin wire winding device is characterized by further comprising a single chip microcomputer and a soldering tin wire, wherein the soldering tin wire sequentially penetrates through the second soldering tin wire guide mechanism, the soldering tin wire perforation, the first soldering tin wire guide mechanism, the second limiting idler wheel, the movable seat and the first limiting idler wheel and is wound on the side face of the winding drum, the input end of the single chip microcomputer is electrically connected with the output end of an external power supply, and the output end of the single chip microcomputer is electrically connected with the input ends of the wire winding motor and the servo motor.
Furthermore, the first solder wire guiding mechanism comprises two V-shaped frames, two rotating shafts and two rotating rollers, the two V-shaped frames are arranged at the bottom end of the U-shaped mounting plate in parallel, the rotating shafts are connected between the two V-shaped frames, the rotating rollers are mounted on the rotating shafts and are connected with the rotating shafts in a rotating mode, the second solder wire guiding mechanism is identical to the first solder wire guiding mechanism in structure, the two rotating rollers are located on the same horizontal plane, the moving positions of the solder wires can be limited through the rotating rollers, the tightness of the solder wires is guaranteed, and wire winding is facilitated.
Further, still include the spacing ring, the right flank at U type mounting panel is installed to the spacing ring, and is located second solder wire guiding mechanism's top, sets up the spacing ring, can pull the solder wire from the direction of difference, guarantees that the solder wire has certain rate of tension in transportation process.
Further, the left end of round bar is fixed with the fixed plate, and rotates through the round pin axle between fixed plate and the left mount pad to be connected, and the right-hand member and the right mount pad of round bar pass through bolted connection, in the aspect of the installation of reel, make the round bar rotatable, and convenient the dismantlement is convenient for change the reel.
Further, still include the clean frame of solder wire, the clean frame of solder wire includes triangle-shaped mount, semicircle cleaning plate and clamping screw, the triangle-shaped mount is fixed in the bottom of U type mounting panel and is close to solder wire perforation position department, the semicircle cleaning plate is equipped with two, and the inner wall of semicircle cleaning plate is equipped with the brush hair, and the top at the triangle-shaped mount is installed to a semicircle cleaning plate, connects through clamping screw between two semicircle cleaning plates, the solder wire passes the through-hole that two semicircle cleaning plates formed, can carry out surperficial clearance to the solder wire that extrudes through setting up the clean frame of solder wire before the wire winding, guarantees the clean degree on solder wire surface.
Compared with the prior art, the beneficial effects of the utility model are that: this solder wire extruder collection device has following benefit:
this solder wire extruder collection device's simple structure, and the area that occupies is little, conveniently fix and use on the solder wire extruder, through being provided with the spacing ring, can draw the solder wire that extrudes from the direction of difference, under the effect of first solder wire guiding mechanism and second solder wire guiding mechanism, the rate of tension of solder wire has been guaranteed, be equipped with solder wire position adjustment mechanism in the collection device, can change the winding position of solder wire, and then the even side of winding solder wire at the reel, in the design of rolling up wire mechanism, adopt the structure of the reel of being convenient for to change, conveniently wind solder wire, improve the efficiency that solder wire collected.
Drawings
FIG. 1 is a schematic structural view of the present invention;
FIG. 2 is a schematic top view of the present invention;
FIG. 3 is a schematic view of the enlarged structure of the part A of the present invention;
fig. 4 is a schematic view of the cross-sectional structure of the plane B-B of the present invention.
In the figure: 1 single chip microcomputer, 2U-shaped mounting plates, 3 solder wires, 4 wire winding mechanisms, 41 wire winding motors, 42 left mounting seats, 43 round rods, 44 right mounting seats, 5 first solder wire guide mechanisms, 51V-shaped frames, 52 rotating shafts, 53 rotating rollers, 6 solder wire cleaning frames, 61 triangular fixing frames, 62 semicircular cleaning plates, 63 fixing screws, 7 solder wire position adjusting mechanisms, 71 servo motors, 72 lead screws, 73 guide rods, 74 movable seats, 8 first limiting idler wheels, 9 second limiting idler wheels, 10 limiting rings, 11 solder wire through holes, 12 winding drums and 13 second solder wire guide mechanisms.
Detailed Description
The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.
Referring to fig. 1-4, the present invention provides a technical solution: a collecting device of a solder wire extruder comprises a U-shaped mounting plate 2, a wire winding mechanism 4 and a solder wire position adjusting mechanism 7;
u type mounting panel 2: the right end of the U-shaped mounting plate 2 is provided with a solder wire perforation 11, a solder wire 3 passes through the solder wire perforation 11, a second solder wire guide mechanism 13 is arranged at the position of the right side surface of the U-shaped mounting plate 2 corresponding to the solder wire perforation 11, the second solder wire guide mechanism 13 is used for adjusting the position of the solder wire 3, so that the solder wire 3 can accurately pass through the solder wire perforation 11 and is not contacted with the U-shaped mounting plate 2, the left side of the bottom end of the U-shaped mounting plate 2 is provided with a first solder wire guide mechanism 5, the first solder wire guide mechanism 5 comprises two V-shaped frames 51, a rotating shaft 52 and a rotating roller 53, the two V-shaped frames 51 are arranged at the bottom end of the U-shaped mounting plate 2 in parallel, the rotating shaft 52 is connected between the two V-shaped frames 51, the rotating roller 53 is arranged on the rotating shaft 52 and is rotatably connected with the rotating shaft 52, the solder wire 3, the second solder wire guiding mechanism 13 and the first solder wire guiding mechanism 5 are identical in structure, the two rotating rollers 53 are positioned on the same horizontal plane, so that the solder wires 3 are positioned on the same horizontal plane in the conveying process and cannot incline, the soldering tin wire guiding mechanism further comprises a limiting ring 10, the limiting ring 10 is installed on the right side face of the U-shaped mounting plate 2 and is positioned above the second solder wire guiding mechanism 13, the limiting ring 10 can provide a traction position for the solder wires 3, so that the solder wires 3 output by the extruder can penetrate through the limiting ring 10 from all directions and are pulled to the position of the second solder wire guiding mechanism 13, and the solder wires 3 are guaranteed to have certain tension;
and a wire winding mechanism 4: the wire winding mechanism 4 comprises a wire winding motor 41, a left mounting seat 42, a round rod 43 and a right mounting seat 44, the wire winding motor 41 is mounted on the left side surface of the U-shaped mounting plate 2, an output shaft of the wire winding motor 41 is connected with the left mounting seat 42, the output shaft of the wire winding motor 41 can drive the left mounting seat 42 to rotate, the right mounting seat 44 is rotatably connected with the inner wall of the right side of the U-shaped mounting plate 2, the round rod 43 is connected between the left mounting seat 42 and the right mounting seat 44, the side surface of the round rod 43 is sleeved with the winding drum 12, a clamping block is arranged on the side surface of the round rod 43, a clamping groove is arranged on the inner wall of the winding drum 12, the clamping block is clamped in the clamping groove, when the wire winding mechanism works, the output shaft of the wire winding motor 41 can drive the left mounting seat 42 to rotate, the winding drum 43 and the side surface of the round rod 43 are driven to rotate, the solder wire 3 is wound, the right end of the round rod 43 is connected with the right mounting seat 44 through a bolt, and after the bolt between the right mounting seat 44 and the round rod 43 is loosened, the round rod 43 can rotate along the connection part of the round rod 43 and the left mounting seat 42, so that the reel 12 is convenient to replace, and the collection efficiency of the soldering tin wires 3 is improved;
solder wire position adjusting mechanism 7: the solder wire position adjusting mechanism 7 comprises a servo motor 71, a lead screw 72, a guide rod 73 and a movable seat 74, the lead screw 72 and the guide rod 73 are parallelly installed on the inner wall of the U-shaped mounting plate 2, the lead screw 72 is rotatably connected with the inner wall of the U-shaped mounting plate 2, the movable seat 74 is installed on the lead screw 72 and the guide rod 73, the movable seat 74 is in threaded connection with the lead screw 72, the movable seat 74 is in sliding connection with the guide rod 73 from side to side, in operation, an output shaft of the servo motor 71 drives the lead screw 72 to rotate, and further drives the movable seat 74 to move from side to side along the guide rod 73, a through hole is formed in the middle of the movable seat 74, the bottom end of the movable seat 74 is rotatably connected with a second limiting roller 9 through a bracket, the top end of the movable seat 74 is rotatably connected with a first limiting roller 8 through a vertical plate, the solder wire 3 passes through the second limiting roller 9 and then enters, thereby driving the solder wire 3 to move in a reciprocating way, enabling the solder wire 3 to be wound on the side surface of the winding drum 12 uniformly, installing the servo motor 71 on the left side surface of the U-shaped mounting plate 2, and connecting the output shaft of the servo motor 71 with the screw 72;
the cleaning device comprises a solder wire cleaning frame 6, wherein the solder wire cleaning frame 6 comprises a triangular fixing frame 61, two semicircular cleaning plates 62 and a fixing screw 63, the triangular fixing frame 61 is fixed at the bottom end of the U-shaped mounting plate 2 and is close to the position of a solder wire through hole 11, the number of the semicircular cleaning plates 62 is two, bristles are arranged on the inner wall of each semicircular cleaning plate 62, one semicircular cleaning plate 62 is installed at the top end of the triangular fixing frame 61, the two semicircular cleaning plates 62 are connected through the fixing screw 63, a solder wire 3 penetrates through a through hole formed by the two semicircular cleaning plates 62, and by arranging the solder wire cleaning frame 6, the surface of the solder wire 3 extruded from an extruder can be cleaned, so that the surface of the collected solder wire 3 is clean and free of foreign matters;
the automatic soldering tin wire winding device comprises a single chip microcomputer 1 and a soldering tin wire 3, wherein the soldering tin wire 3 sequentially penetrates through a second soldering tin wire guide mechanism 13, a soldering tin wire through hole 11, a first soldering tin wire guide mechanism 5, a second limiting roller 9, a movable seat 74 and a first limiting roller 8 and is wound on the side face of a winding drum 12, the input end of the single chip microcomputer 1 is electrically connected with the output end of an external power supply, and the output end of the single chip microcomputer 1 is electrically connected with the input ends of a wire winding motor 41 and a servo motor 71.
When in use: the reel 12 is installed on the round rod 43, then the round rod 43 is rotated and fixed with the right installation seat 44, the end part of the soldering wire 3 extruded by the extruder sequentially passes through the limit ring 10, the second soldering wire guide mechanism 13, the soldering wire perforation 11, the soldering wire cleaning frame 6, the first soldering wire guide mechanism 5, the second limit roller 9, the movable seat 74 and the first limit roller 8, then is wound on the side surface of the reel 12, the wire winding motor 41 is started, the output shaft of the wire winding motor 41 drives the left installation seat 42 to rotate, further drives the round rod 43 and the reel 12 on the side surface thereof to rotate, winds the soldering wire 3 on the side surface of the reel 12, meanwhile, the servo motor 71 is started to drive the lead screw 72 to rotate, further drives the movable seat 74 to move along the guide rod 73, after the soldering wire moves to the other end, the servo motor 71 rotates reversely, the left and right reciprocating movement of the movable seat 74 is realized, in the moving process of the soldering wire, the semicircular cleaning plate 62 cleans the surface of the solder wire 3 to remove impurities adhered to the side surface.
It should be noted that, the specific model of the single chip microcomputer 1 disclosed in this embodiment is STC11L05E, the preferred model of the wire winding motor 41 is 180B2810, the preferred model of the servo motor 71 is SM130-050-25LFB, and the single chip microcomputer 1 controls the wire winding motor 41 and the servo motor 71 to work by a method commonly used in the prior art.
Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.
Claims (5)
1. The utility model provides a solder wire extruder collection device which characterized in that: comprises a U-shaped mounting plate (2), a wire winding mechanism (4) and a solder wire position adjusting mechanism (7);
u-shaped mounting plate (2): a solder wire through hole (11) is formed in the right end of the U-shaped mounting plate (2), a second solder wire guiding mechanism (13) is mounted on the right side face of the U-shaped mounting plate (2) at a position corresponding to the solder wire through hole (11), and a first solder wire guiding mechanism (5) is mounted on the left side of the bottom end of the U-shaped mounting plate (2);
wire winding mechanism (4): the wire winding mechanism (4) comprises a wire winding motor (41), a left mounting seat (42), a round rod (43) and a right mounting seat (44), the wire winding motor (41) is mounted on the left side face of the U-shaped mounting plate (2), an output shaft of the wire winding motor (41) is connected with the left mounting seat (42), the right mounting seat (44) is rotatably connected with the inner wall of the right side of the U-shaped mounting plate (2), the round rod (43) is connected between the left mounting seat (42) and the right mounting seat (44), a winding drum (12) is sleeved on the side face of the round rod (43), a clamping block is arranged on the side face of the round rod (43), a clamping groove is formed in the inner wall of the winding drum (12), and the clamping block is clamped in the clamping groove;
solder wire position adjusting mechanism (7): the soldering tin wire position adjusting mechanism (7) comprises a servo motor (71), a lead screw (72), a guide rod (73) and a movable seat (74), the lead screw (72) and the guide rod (73) are parallelly installed on the inner wall of the U-shaped mounting plate (2), the lead screw (72) is rotatably connected with the inner wall of the U-shaped mounting plate (2), the movable seat (74) is installed on the lead screw (72) and the guide rod (73), the movable seat (74) is in threaded connection with the lead screw (72), the movable seat (74) is in left-right sliding connection with the guide rod (73), a through hole is formed in the middle of the movable seat (74), the bottom end of the movable seat (74) is rotatably connected with a second limiting roller (9) through a support, the top end of the movable seat (74) is rotatably connected with a first limiting roller (8) through a vertical plate, the servo motor (71) is installed on the left side face of the U-shaped mounting plate (, and the output shaft of the servo motor (71) is connected with the screw rod (72);
the soldering tin wire winding device is characterized by further comprising a single chip microcomputer (1) and soldering tin wires (3), wherein the soldering tin wires (3) sequentially penetrate through a second soldering tin wire guide mechanism (13), a soldering tin wire perforation hole (11), a first soldering tin wire guide mechanism (5), a second limiting roller (9), a movable seat (74) and a first limiting roller (8) and are wound on the side face of the winding drum (12), the input end of the single chip microcomputer (1) is electrically connected with the output end of an external power supply, and the output end of the single chip microcomputer (1) is electrically connected with the input ends of the wire winding motor (41) and the servo motor (71).
2. A solder wire extruder collection device as defined in claim 1, wherein: the first solder wire guiding mechanism (5) comprises two V-shaped frames (51), two rotating shafts (52) and two rotating rollers (53), the two V-shaped frames (51) are arranged at the bottom end of the U-shaped mounting plate (2) in parallel, the rotating shafts (52) are connected between the two V-shaped frames (51), the rotating rollers (53) are mounted on the rotating shafts (52) and are rotatably connected with the rotating shafts (52), the second solder wire guiding mechanism (13) is identical to the first solder wire guiding mechanism (5) in structure, and the two rotating rollers (53) are located on the same horizontal plane.
3. A solder wire extruder collection device as defined in claim 1, wherein: the soldering tin wire guiding mechanism further comprises a limiting ring (10), wherein the limiting ring (10) is installed on the right side face of the U-shaped mounting plate (2) and is located above the second soldering tin wire guiding mechanism (13).
4. A solder wire extruder collection device as defined in claim 1, wherein: the left end of round bar (43) is fixed with the fixed plate, and rotates through the round pin axle between fixed plate and left mount pad (42) and is connected, and the right-hand member and the right mount pad (44) of round bar (43) pass through bolted connection.
5. A solder wire extruder collection device as defined in claim 1, wherein: still include the clean frame of solder wire (6), the clean frame of solder wire (6) includes triangle-shaped mount (61), semicircle clean board (62) and clamping screw (63), the bottom at U type mounting panel (2) is fixed and is close to solder wire perforation (11) position department in triangle-shaped mount (61), semicircle clean board (62) are equipped with two, and the inner wall of semicircle clean board (62) is equipped with the brush hair, and the top at triangle-shaped mount (61) is installed in semicircle clean board (62), connects through clamping screw (63) between two semicircle clean boards (62), solder wire (3) pass the through-hole that two semicircle clean boards (62) formed.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202020243746.6U CN211727000U (en) | 2020-03-03 | 2020-03-03 | Collecting device of solder wire extruder |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202020243746.6U CN211727000U (en) | 2020-03-03 | 2020-03-03 | Collecting device of solder wire extruder |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN211727000U true CN211727000U (en) | 2020-10-23 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202020243746.6U Active CN211727000U (en) | 2020-03-03 | 2020-03-03 | Collecting device of solder wire extruder |
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| Country | Link |
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| CN (1) | CN211727000U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114210887A (en) * | 2021-10-15 | 2022-03-22 | 铜陵精达新技术开发有限公司 | Copper-based conductor wire shearing device |
-
2020
- 2020-03-03 CN CN202020243746.6U patent/CN211727000U/en active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114210887A (en) * | 2021-10-15 | 2022-03-22 | 铜陵精达新技术开发有限公司 | Copper-based conductor wire shearing device |
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| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20240207 Address after: 314000, 1st, 2nd, and 3rd floors of Building 3 on the south side of No. 1758 Jiachuang Road, Gaozhao Street, Xiuzhou District, Jiaxing City, Zhejiang Province, China, and 1st floor of Building 4 Patentee after: Zhejiang Yunheng Green Energy New Materials Co.,Ltd. Country or region after: China Address before: No. 4 Juhua Road, Xianglu Village, Wangting Town, Xiangcheng District, Suzhou City, Jiangsu Province, 215000 Patentee before: Hanerxin solder technology (Suzhou) Co.,Ltd. Country or region before: China |
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| TR01 | Transfer of patent right |