CN211720850U - FOF technology supporting and positioning mechanism and FOF technology positioning device - Google Patents
FOF technology supporting and positioning mechanism and FOF technology positioning device Download PDFInfo
- Publication number
- CN211720850U CN211720850U CN201922030758.0U CN201922030758U CN211720850U CN 211720850 U CN211720850 U CN 211720850U CN 201922030758 U CN201922030758 U CN 201922030758U CN 211720850 U CN211720850 U CN 211720850U
- Authority
- CN
- China
- Prior art keywords
- fof
- positioning
- supporting
- component
- groove
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Images
Landscapes
- Supply And Installment Of Electrical Components (AREA)
Abstract
The utility model discloses a FOF technology supports positioning mechanism and FOF technology positioner. The FOF process supporting and positioning mechanism comprises a supporting component and an adsorption component connected with the supporting component, wherein one side of the supporting component is provided with a groove, the adsorption component is connected to the bottom of the groove, and spaces are respectively arranged between the two opposite sides of the adsorption component and the side wall of the groove; the FOF process positioning device comprises the FOF process supporting and positioning mechanism. The utility model discloses a FOF technology supports positioning mechanism, more conveniently shoots.
Description
Technical Field
The utility model relates to a FPC101 equipment technical field, concretely relates to FOF technology supports positioning mechanism and FOF technology positioner.
Background
The FOF is a bonding process for bonding together an FPC101 (flexible wiring board) and a COF102 (chip on film). The ACF conductive adhesive is firstly attached to the COF102 binding area, then prepressing alignment is carried out, and finally local pressing is carried out. The prepressing automatic alignment and press-fitting is the most important link of the process equipment, and in the alignment process, the prepressing Backup structure is very important for adsorbing and fixing the flexible COF102 product to prevent the flexible COF102 product from warping and deforming, so that the yield of the whole binding process is influenced.
At present, a supporting structure for equipment pre-pressing, namely Backup, adopts a quartz strip material, and a vacuum hole is formed in a quartz strip product to adsorb COF 102. The conventional Backup structure seriously influences the photographing identification of a camera grabbing Mark when a product is aligned, so that the productivity is influenced due to frequent alarm of equipment.
SUMMERY OF THE UTILITY MODEL
Based on this, the utility model discloses it is necessary to provide a FOF technology that conveniently shoots supports positioning mechanism.
In order to realize the utility model discloses a purpose, the utility model discloses a following technical scheme:
the FOF process supporting and positioning mechanism comprises a supporting component and an adsorption component connected with the supporting component, wherein a groove is formed in one side of the supporting component, the adsorption component is connected to the bottom of the groove, and spaces are formed between the two opposite sides of the adsorption component and the side walls of the groove respectively.
According to the FOF process supporting and positioning mechanism, one side of the supporting component is provided with the groove, the adsorption component is arranged at the groove bottom of the groove of the supporting component, spaces are arranged on two sides of the groove, and light rays of the camera can be emitted into marks on the FPC101 and the COF102 through the spaces to perform photographing identification, so that the photographing identification is not influenced by the supporting and positioning mechanism, and the productivity of equipment is improved.
In some embodiments, the top surface of the adsorption part is provided with an adsorption hole, and the side surface of the support part is provided with a first air suction hole communicated with the adsorption hole.
In some embodiments, one side of the adsorption part, which is far away from the groove bottom of the groove, protrudes out of one side of the support part, which is provided with the groove.
In some embodiments, the suction member is connected to a middle portion of the groove.
In some embodiments, the FOF process supporting and positioning mechanism further comprises a positioning template, a vacuum hole is formed in the top surface of the positioning template, a second air suction hole communicated with the vacuum hole is formed in the side surface of the positioning template, and one side of the positioning template is connected with one side of the adsorption component.
In some embodiments, the support member is spaced apart from the locating form.
The utility model also provides a FOF technology positioner, include FOF technology support positioning mechanism.
In some embodiments, the FOF processing device further comprises a supporting seat and a shooting component, the supporting component is mounted on the supporting seat, the supporting seat is provided with a shooting groove, a shooting channel is formed among the adsorption component, the shooting groove and the groove, and the shooting component is mounted below the shooting channel.
In some embodiments, the FOF process positioning device further comprises a positioning template, a vacuum hole is formed in the top surface of the positioning template, a second air suction hole communicated with the vacuum hole is formed in the side surface of the positioning template, and one side of the positioning template is connected with one side of the adsorption component.
In some embodiments, the support member is spaced apart from the locating form.
Drawings
FIG. 1 is a schematic structural view of a FOF process supporting and positioning mechanism according to an embodiment of the present invention;
FIG. 2 is a schematic view of the FOF process support positioning mechanism of FIG. 1 from another perspective;
FIG. 3 is a schematic structural view of a FOF process supporting and positioning mechanism according to another embodiment of the present invention;
FIG. 4 is a schematic view of the FOF process supporting and positioning mechanism of FIG. 3 for positioning a product;
FIG. 5 is a schematic structural view of a FOF process positioning device according to an embodiment of the present invention;
FIG. 6 is a schematic view of a partial structure of the FOF process positioning device of FIG. 5;
FIG. 7 is a schematic view of the FOF process positioning device shown in FIG. 5 for positioning a product.
Detailed Description
In order to facilitate understanding of the present invention, the present invention will be described more fully below. The invention may, however, be embodied in many different forms and should not be construed as limited to the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete.
Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention belongs. The terminology used in the description of the invention herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention.
Example one
Referring to fig. 1, 2 and 4, the present invention provides a supporting and positioning mechanism 100 for a FOF process, which is used for positioning a Chip On Film (COF) 102 when an FPC101 (flexible circuit board) is bonded to the COF102, the supporting and positioning mechanism 100 includes a supporting member 10 and an adsorbing member 20 connected to the supporting member 10, a groove 11 is formed on one side of the supporting member 10, the adsorbing member 20 is connected to the bottom of the groove 11, and spaces are formed between two opposite sides of the adsorbing member 20 and the side walls of the groove 11.
According to the FOF process supporting and positioning mechanism, light rays of a camera can be emitted into the marks on the FPC101 and the COF102 from the space, so that photographing identification is carried out, the supporting and positioning mechanism does not influence the photographing identification, and the productivity of equipment is improved.
The support member 10 and the adsorption member 20 may be made of a metal material, which is lower in cost than a quartz material. For example, the support member 10 and the adsorption member 20 are made of SUS440C or tungsten steel.
Referring to fig. 1 and 2, in an embodiment, the groove 11 is formed in a middle portion of one side of the supporting member 10. Of course, the recess 11 may be opened at a non-central position of the support member 10 without affecting its use.
The depth of the groove 11 is based on the light of the camera passing through. The depth of the groove 11 is, for example, 1mm to 20 mm.
In one embodiment, the suction member 20 is connected to the middle of the recess 11. In this way, the spaces on both sides of the suction member 20 are the same in size, so that the cameras provided on both sides can photograph from the spaces of the same size. Of course, the suction member 20 may be connected to a non-central position opened in the recess 11 without affecting the use thereof.
Referring to fig. 2, the top surface of the adsorption part 20 is opened with an adsorption hole 21, and the side surface of the support part 10 is opened with a first air extraction hole 12 communicating with the adsorption hole 21. After the first air-extracting hole 12 is air-extracted, the suction hole 21 can be vacuumized, thereby sucking the FPC 101.
In one embodiment, the support member 10 has a vent hole 13 therein, the first pumping hole 12 communicates with the vent hole 13, one side of the absorption member 20 has a middle hole 22, the absorption hole 21 communicates with the middle hole 22, and the middle hole 22 communicates with the vent hole 13, thereby communicating the first pumping hole 12 with the absorption hole 21. Both ends of the vent hole 13 are sealed by jackscrews, and the middle hole 22 is sealed by sealing pieces or other sealing modes, so that the vent hole can be in a negative pressure state after air exhaust.
In one embodiment, the side of the adsorption part 20 away from the bottom of the groove 11 protrudes from the side of the support part 10 where the groove 11 is formed. So that the protruding side of the suction member 20 facilitates the connection of a stage for sucking the FPC101 so that the FPC101 and the COF102 can be contacted with each other to be bound as one body.
Referring to fig. 3, the FOF process supporting and positioning mechanism 100 further includes a positioning template 30, a top surface of the positioning template 30 is provided with a vacuum hole 31, a side surface of the positioning template 30 is provided with a second pumping hole 32 communicated with the vacuum hole 31, and one side of the positioning template 30 is connected to one side of the adsorption component 20. Referring to fig. 4, the positioning template 30 is used for adsorbing and positioning the glass panel 103 connected to the COF102 so as to more stably position the COF 102.
In one embodiment, there is a gap between the support member 10 and the positioning template 30. The gap is provided to facilitate the attachment of the suction member 20 to the positioning jig 30.
Example two
Referring to fig. 5, the present embodiment provides a FOF process positioning apparatus 200, which includes the above-mentioned FOF process supporting and positioning mechanism 100.
Referring to fig. 7, specifically, the side of the adsorption part 20 away from the groove bottom of the groove 11 is connected to one side of the positioning template 30, so that the glass panel 103, the COF102 and the FPC101 can be adsorbed and positioned, and the COF102 and the FPC101 are bound together.
Referring to fig. 5, the FOF process apparatus 200 further includes a supporting base 40 and a photographing component 50, the supporting component 10 is mounted on the supporting base 40, referring to fig. 6, the supporting base 40 is provided with a photographing groove 41, a photographing channel is formed between the absorption component 20, the photographing groove 41 and the groove 11 of the supporting component 10, and the photographing component 50 is mounted below the photographing channel. Referring to fig. 5 and 7, light emitted from the image capturing component 50 is incident on the FPC101 and the COF102 through the image capturing channels to identify marks of the two.
The above-mentioned embodiments only represent some embodiments of the present invention, and the description thereof is specific and detailed, but not to be construed as limiting the scope of the present invention. It should be noted that, for those skilled in the art, without departing from the spirit of the present invention, several variations and modifications can be made, which are within the scope of the present invention. Therefore, the protection scope of the present invention should be subject to the appended claims.
Claims (10)
1. The FOF process supporting and positioning mechanism is characterized by comprising a supporting component and an adsorption component connected with the supporting component, wherein a groove is formed in one side of the supporting component, the adsorption component is connected to the bottom of the groove, and spaces are formed between the two opposite sides of the adsorption component and the side walls of the groove respectively.
2. The FOF process supporting and positioning mechanism of claim 1, wherein the top surface of the adsorption component is provided with an adsorption hole, and the side surface of the support component is provided with a first air suction hole communicated with the adsorption hole.
3. The FOF process supporting and positioning mechanism of claim 1, wherein a side of the adsorption part away from the bottom of the groove protrudes from a side of the supporting part where the groove is formed.
4. The FOF process support positioning mechanism of claim 1, wherein the adsorption component is connected to a middle portion of the groove.
5. The FOF process supporting and positioning mechanism of claim 1, further comprising a positioning template, wherein a vacuum hole is formed in the top surface of the positioning template, a second air suction hole communicated with the vacuum hole is formed in the side surface of the positioning template, and one side of the positioning template is connected with one side of the adsorption component.
6. The FOF process support positioning mechanism of claim 5, wherein a gap is provided between the support member and the positioning template.
7. A FOF process positioning device, characterized by comprising the FOF process supporting and positioning mechanism of any one of claims 1-4.
8. The FOF process positioning device of claim 7, further comprising a support seat and a shooting component, wherein the support component is mounted on the support seat, the support seat is provided with a shooting groove, a shooting channel is formed among the adsorption component, the shooting groove and the groove, and the shooting component is mounted below the shooting channel.
9. The FOF process positioning device of claim 7, further comprising a positioning template, wherein a vacuum hole is formed in the top surface of the positioning template, a second air extraction hole communicated with the vacuum hole is formed in the side surface of the positioning template, and one side of the positioning template is connected with one side of the adsorption component.
10. The FOF process positioning device of claim 9, wherein a gap is provided between the support member and the positioning template.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201922030758.0U CN211720850U (en) | 2019-11-21 | 2019-11-21 | FOF technology supporting and positioning mechanism and FOF technology positioning device |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201922030758.0U CN211720850U (en) | 2019-11-21 | 2019-11-21 | FOF technology supporting and positioning mechanism and FOF technology positioning device |
Publications (1)
Publication Number | Publication Date |
---|---|
CN211720850U true CN211720850U (en) | 2020-10-20 |
Family
ID=72815179
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201922030758.0U Active CN211720850U (en) | 2019-11-21 | 2019-11-21 | FOF technology supporting and positioning mechanism and FOF technology positioning device |
Country Status (1)
Country | Link |
---|---|
CN (1) | CN211720850U (en) |
-
2019
- 2019-11-21 CN CN201922030758.0U patent/CN211720850U/en active Active
Similar Documents
Publication | Publication Date | Title |
---|---|---|
US9126393B2 (en) | Bonding apparatus and method of bonding component on substrate using the same | |
US7980284B2 (en) | Vacuum laminator | |
CN212229376U (en) | Flexible screen bending and attaching machine | |
KR101687022B1 (en) | Die suction device | |
CN211720850U (en) | FOF technology supporting and positioning mechanism and FOF technology positioning device | |
JP3990694B2 (en) | Apparatus and method for removing fine foreign matter from portable camera module | |
JPH10177183A (en) | Device and method for sticking flexible substrate to another substrate | |
CN106501276B (en) | Apply the device and method of pressure in optical detection to FPD screen back light source | |
CN211075017U (en) | COF automatic alignment crimping lighting structure | |
JP2003283185A (en) | Method and device for assembling board | |
CN110126423B (en) | COF automatic alignment crimping lighting structure | |
CN114483740A (en) | Full-automatic laminating device and method for frame lamination and display device | |
KR100715725B1 (en) | Chip Mounter | |
CN110709246A (en) | Vacuum laminating machine and laminating method | |
JP4555008B2 (en) | Component mounting equipment | |
CN108527832B (en) | Bonding method and bonding machine | |
CN213586025U (en) | Assembly structure of TV lamp strip | |
CN216449853U (en) | A FPC attaches tool for attaching ACF | |
CN213340327U (en) | COG pre-alignment device | |
JPH11204579A (en) | Apparatus and method of mounting electronic component | |
CN110244480B (en) | Full-automatic pre-attaching device of conductive adhesive film for mobile phone screen | |
CN218998727U (en) | Assembly head mechanism and electronic product assembly equipment | |
CN216710923U (en) | Glass apron and display module assembly equipment | |
CN216053833U (en) | Automatic electricity comprehensive detection device | |
CN213529453U (en) | Positioning jig of blind hole gluing equipment |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
GR01 | Patent grant | ||
GR01 | Patent grant |