CN211716477U

CN211716477U - Vehicle LED headlight structure

Info

Publication number: CN211716477U
Application number: CN202020471299.XU
Authority: CN
Inventors: 陈东桥
Original assignee: Changshu Jiyi Lighting Electrical Factory
Current assignee: Changshu Jiyi Lighting Electrical Factory
Priority date: 2020-04-03
Filing date: 2020-04-03
Publication date: 2020-10-20
Anticipated expiration: 2030-04-03

Abstract

A vehicle LED headlamp structure belongs to the technical field of vehicle components. Including a radiating seat, a heat conductor, a radiator fan, lamp bowl and LED chip, the radiating seat one side down constitutes has a heat dissipation chamber and set up the radiating seat louvre that link up to the heat dissipation chamber from the upper portion of radiating seat at the interval around the radiating seat, offer one and the communicating vehicle mounted power in heat dissipation chamber lead wire hole at the lateral part of radiating seat, radiator fan establishes at the heat dissipation intracavity, and the LED chip establishes the upper portion on the heat conductor, characteristics: and the middle area of the surface of one side of the heat radiating seat facing upwards is also provided with a heat conductor inserting and fixing mechanism, the lower part of the heat conductor is inserted and fixed with the heat conductor inserting and fixing mechanism, the lamp bowl is fixed with the heat conductor inserting and fixing mechanism and shields the upper part of the heat conductor, and the heat conductor is a flat copper plate with a rectangular cross section. The heat dissipation effect is good, and the service life of the LED chip is prolonged; the reflection efficiency of the light source in the lamp bowl is improved, and the gathering effect is improved; and the cost is saved.

Description

Vehicle LED headlight structure

Technical Field

The invention belongs to the technical field of vehicle components, and particularly relates to a vehicle LED headlamp structure.

Background

As is known in the art, since LEDs are semiconductor electrical components, if the temperature is high and no effective forced physical cooling is obtained, the light efficiency is significantly reduced, so that the search for effective technical measures for cooling the heat of the vehicle LED headlamp is of positive significance.

At present, the heat dissipation forms of the LED headlamp structure mainly comprise two types: firstly, heat dissipation is realized by utilizing water circulation; and secondly, heat dissipation is performed by adopting a fan. Typical examples of the former include "a headlamp heat sink based on micro-pump cycle principle" recommended by CN109780505A and "a chimney heat sink LED headlamp" provided by CN 108916809A; typical examples of the latter include CN202938202U (Led car headlight with spiral heat radiation), CN207471434U (an H-type intelligent Led car headlight lighting system), CN207407269U (an H1-type intelligent Led car headlight lighting system), CN207438466U (a new car headlight), CN207438464U (a car headlight with closed heat radiation structure), CN207438477U (a car headlight with surrounding heat radiation structure), and CN207935972U (a car headlight assembly and its Led headlight bulb). The latter has a simpler structure than the former and does not need to worry about leakage of the cooling medium, so that the application range of the latter is significantly larger than that of the former, namely, the LED headlamp structure of the vehicle is generally cooled by wind, namely, the temperature is reduced by a fan. However, the following general disadvantages exist: firstly, because the heat conductor and the heat dissipation seat (also called as a 'radiator') are formed into an integral structure, from the perspective of saving resources, manufacturing convenience factors and cost reduction factors, the materials of the heat conductor and the heat dissipation seat are the same, and the heat conduction effect of the same material is indistinguishable, so that in the actual use process, the heat conductor is exactly expected to have excellent heat conduction efficiency so as to quickly transfer the heat generated by the LED chip (also called as an 'LED lamp bead') which is arranged by taking the heat conductor as a carrier to the heat dissipation seat, which is very beneficial to prolonging the service life of the vehicle LED headlamp; secondly, due to the constraint of the structural design concept for a long time, the heat conductor is usually designed to be a cylindrical structure or a structure with a D-shaped cross section, so that the reflection efficiency of the LED chip as a light source in a reflector (also called "lampshade") is affected to a certain extent, typically, the focusing effect is affected. In view of the foregoing, there is a need for reasonable improvements, and the solutions described below are made in this context.

Disclosure of Invention

The invention aims to provide a vehicle LED headlamp structure which is beneficial to obviously improving the heat conduction efficiency of a heat conductor and the reflectivity of an LED chip in a reflector.

The invention aims to solve the problem that the LED headlamp structure of the vehicle comprises a heat radiating seat, a heat conductor, a heat radiating fan, a lamp bowl and an LED chip, wherein a heat radiating cavity is formed on one downward side of the heat radiating seat, heat radiating seat heat radiating holes penetrating from the upper part of the heat radiating seat to the heat radiating cavity are formed in the periphery of the heat radiating seat at intervals, a vehicle-mounted power supply lead wire hole communicated with the heat radiating cavity is formed in the side part of the heat radiating seat, the heat radiating fan is arranged in the heat radiating cavity, the LED chip is arranged on the upper part of the heat conductor, the LED headlamp structure is characterized in that a heat conductor inserting and fixing mechanism is further formed in the middle area of the surface of one upward side of the heat radiating seat, the lower part of the heat conductor is inserted and fixed with the heat conductor inserting and fixing mechanism, the lamp bowl is fixed with the heat conductor inserting and fixing mechanism and shields the upper part of the heat conductor, and.

In a specific embodiment of the present invention, the heat conductor insertion mechanism includes an additional heat dissipating stud formed in a middle region of an upward facing side surface of the heat dissipating stud, additional heat dissipating stud heat dissipating holes formed in the additional heat dissipating stud at intervals around the additional heat dissipating stud, the lower part of the heat conductor is sequentially inserted into the lower insertion cavity of the heat conductor and the lower supporting and limiting cavity of the heat conductor, the upper part of the heat conductor together with the LED chip extends out of the lower insertion cavity of the heat conductor, and the lamp bowl is fixed with the additional heat dissipation column.

In another specific embodiment of the present invention, a conductor hole of the left conductor defining seat is formed on the left conductor defining seat, and a conductor hole of the right conductor defining seat is formed on the right conductor defining seat, the conductor hole of the left conductor defining seat extends downward from the upper portion of the left conductor defining seat and communicates with the heat dissipation chamber after sequentially passing through the additional heat dissipation pillar and the heat dissipation seat, and the conductor hole of the right conductor defining seat extends downward from the upper portion of the right conductor defining seat and communicates with the heat dissipation chamber after sequentially passing through the additional heat dissipation pillar and the heat dissipation seat.

In yet another specific embodiment of the present invention, the widths of the heat conductor lower insert cavity and the heat conductor lower support limit cavity are adapted to the thickness of the heat conductor.

In a further particular embodiment of the invention, the cross-sectional shape of the left and right seats of the heat conductor is semicircular.

In still another embodiment of the present invention, a heat conductor fixing screw hole is formed at a side portion of the additional heat dissipating stud, the heat conductor fixing screw hole communicates with the heat conductor lower support limit chamber, and a heat conductor fixing screw for fixing a lower portion of the heat conductor is provided at the heat conductor fixing screw hole.

In a more specific embodiment of the present invention, a lamp bowl fixing sleeve is fixedly sleeved on the outer wall of the additional heat dissipation column, and the lower part of the lamp bowl is fixed with the lamp bowl fixing sleeve.

In a further embodiment of the invention, a mounting sleeve flange is formed on the upper part of the lamp bowl mounting sleeve, a lamp bowl fixing flange ring is formed on the lower part of the lamp bowl, the lamp bowl fixing flange ring is fixed with the mounting sleeve flange through flange ring screws, and a lamp bowl panel is arranged on the upper part of the lamp bowl and is transparent.

In yet another specific embodiment of the present invention, a pair of the LED chips are disposed on the upper left and right sides of the heat conductor respectively through a chip substrate, and the chip substrates are fixed to the heat conductor by chip substrate fixing screws.

In yet another specific embodiment of the present invention, a heat conductor fixing screw penetrating hole is formed in a lower portion of the heat conductor at a position corresponding to the heat conductor fixing screw hole, the heat conductor fixing screw penetrating hole into which the heat conductor fixing screw penetrates, and the heat conductor fixing screw penetrating hole is a blind hole.

One of the technical effects of the technical scheme provided by the invention is that the heat conductor and the heat radiating seat are creatively formed into a split structure, so that the heat conductor can be made of a copper plate with higher heat conduction efficiency, the heat radiating effect can be brought into full play, and the service life of the LED chip can be obviously prolonged; secondly, because the heat conductor is formed into a flat structure with a rectangular cross section, compared with the cylinder in the prior art, the heat conductor is beneficial to improving the reflection efficiency of the light source in the lamp bowl and enhancing the gathering effect; thirdly, because the heat conductor is made of copper with relatively high price, and the heat dissipation seat still uses traditional cheap materials, a reasonable balance point is found between resource conservation and product cost.

Drawings

FIG. 1 is a schematic diagram of an embodiment of the present invention.

Fig. 2 is a detailed structure diagram of the heat sink, the heat conductor and the heat dissipation fan shown in fig. 1.

Fig. 3 is a schematic diagram of another embodiment of the present invention.

Fig. 4 is a detailed structure diagram of the heat sink, the heat conductor and the heat dissipation fan shown in fig. 3.

Fig. 5 is a schematic view of the heat sink shown in fig. 3.

Detailed Description

In order to clearly understand the technical spirit and the advantages of the present invention, the applicant below describes in detail by way of example, but the description of the example is not intended to limit the technical scope of the present invention, and any equivalent changes made according to the present inventive concept, which are merely in form and not in material, should be considered as the technical scope of the present invention.

In the following description, all the concepts related to the directions or orientations of up, down, left, right, front and rear are in the position state shown in fig. 1, and thus, it should not be understood as a particular limitation to the technical solution provided by the present invention.

Example 1:

referring to fig. 1 and 2, a heat sink 1, a heat conductor 2, a heat dissipation fan 3, a lamp bowl 4 and LED chips 5 are shown, wherein a heat dissipation cavity 11 with an unsealed bottom is formed on a downward side of the heat sink 1, heat dissipation holes 12 penetrating from the upper portion of the heat sink 1 to the heat dissipation cavity 11 are arranged around the heat sink 1 at intervals, a vehicle-mounted power supply lead wire hole 13 communicated with the heat dissipation cavity 11 is arranged on a side portion of the heat sink 1, as a preferred scheme, heat sink grooves 15 are arranged around the outer wall of the heat sink 1 at intervals in a longitudinal state, the heat dissipation fan 3 is arranged in the heat dissipation cavity 11, and the LED chips 5 are arranged on the upper portion of the heat conductor 2.

The technical key points of the technical scheme provided by the invention are as follows: a heat conductor insertion mechanism 14 is further formed in a central region of an upward facing side surface of the heat sink 1, a lower portion of the heat conductor 2 is inserted into the heat conductor insertion mechanism 14, the lamp bowl 4 is fixed to the heat conductor insertion mechanism 14 and shields an upper portion of the heat conductor 2, and the heat conductor 2 is a flat copper plate (i.e., "flat copper plate strip") having a rectangular cross-sectional shape. In this example, the copper plate is pure copper having a copper content of 99.7% by mass or more.

As shown in fig. 1 and 2, a stepped cavity 111 is formed at a lower portion of the heat dissipation chamber 11, and the heat dissipation fan 3 is preferably inserted and positioned in the stepped cavity 111. The material of the heat sink 1 is preferably aluminum alloy or other equivalent materials.

Continuing with fig. 1 and 2, a preferred, but not absolutely limited, configuration of the aforementioned thermal conductor insertion mechanism 14 is as follows: includes an additional heat dissipating stud 141, a left heat conductor limiting seat 142 and a right heat conductor limiting seat 143, the additional heat dissipating stud 141 is formed in the middle region of one upward facing surface of the heat dissipating stud 1, additional heat dissipating stud heat dissipating holes 1411 are formed in the additional heat dissipating stud 141 at intervals around the additional heat dissipating stud 141, the additional heat dissipating stud heat dissipating holes 1411 penetrate from the upper portion to the lower portion of the additional heat dissipating stud 141 and communicate with the heat dissipating chamber 11, a heat conductor lower supporting limiting chamber 1412 is formed at the center of the additional heat dissipating stud 141, the left heat conductor limiting seat 142 and the right heat conductor limiting seat 143 are formed by extending upward in a left-right corresponding state to each other on the upper surface of the additional heat dissipating stud 141, that is, the left heat conductor limiting seat 142 and the right heat conductor limiting seat 143 are directly formed on the upper surface of the additional heat dissipating stud 141, the space between the left heat conductor limiting seat 142 and the right heat conductor limiting seat 143 is formed as a heat conductor lower insertion chamber 144, the heat conductor lower insertion cavity 144 corresponds to and communicates with the heat conductor lower support/limit cavity 1412, the lower portion of the heat conductor 2 is inserted into the heat conductor lower insertion cavity 144 and the heat conductor lower support/limit cavity 1412 in this order, the upper portion thereof protrudes out of the heat conductor lower insertion cavity 144 together with the LED chip 5, and the lamp bowl 4 is fixed to the additional heat radiation column 141.

A conductor hole 1421 of the left conductor defining seat 142 is formed therein, a conductor hole 1431 of the right conductor defining seat 143 is formed therein, the conductor hole 1421 of the left conductor defining seat extends downward from the upper portion of the left conductor defining seat 142 and communicates with the heat dissipating cavity 11 after passing through the additional heat dissipating stud 141 and the heat dissipating seat 1 in turn, and the conductor hole 1431 of the right conductor defining seat extends downward from the upper portion of the right conductor defining seat 143 and communicates with the heat dissipating cavity 11 after passing through the additional heat dissipating stud 141 and the heat dissipating seat 1 in turn.

In this embodiment, the widths of the thermal conductor lower insert cavity 144 and the thermal conductor lower support limit cavity 1412 are adapted to the thickness of the thermal conductor 2, so as to meet the requirement of inserting and matching the thermal conductor 2.

In the present embodiment, the cross-sectional shapes of the left thermal conductor limiting seat 142 and the right thermal conductor limiting seat 143 are semicircular.

A heat conductor fixing screw hole 1413 is formed in a side portion of the additional heat dissipating stud 141, the heat conductor fixing screw hole 1413 communicates with the heat conductor lower support stopper chamber 1412, and a heat conductor fixing screw 14131 for fixing the lower portion of the heat conductor 2 is provided in the heat conductor fixing screw hole 1413.

As shown in fig. 1, a lamp bowl fixing sleeve 1414 is fixedly sleeved on the outer wall of the additional heat dissipating column 141, and the lower portion of the lamp bowl 4 is fixed to the lamp bowl fixing sleeve 1414.

Continuing with fig. 1, a mounting sleeve flange 14141 is formed on the upper portion of the lamp bowl mounting sleeve 1414, a lamp bowl mounting flange 41 is formed on the lower portion of the lamp bowl 4, the lamp bowl mounting flange 41 is fixed to the mounting sleeve flange 14141 by flange ring screws 411, and a lamp bowl panel 42 is disposed on the upper portion of the lamp bowl 4, the lamp bowl panel 42 is transparent, for example, made of transparent plastic or transparent plexiglass or transparent glass, etc.

In the present embodiment, the LED chips 5 are provided in a pair and are respectively disposed on the upper left and right sides of the heat conductor 2 via chip substrates 51, and the chip substrates 51 are fixed to the heat conductor 2 by chip substrate fixing screws 511.

A heat conductor fixing screw insertion hole 21 is formed in a lower portion of the heat conductor 2 at a position corresponding to the heat conductor fixing screw hole 1413, the heat conductor fixing screw 14131 is inserted into the heat conductor fixing screw insertion hole 21, and the heat conductor fixing screw insertion hole 21 is a blind hole.

A plurality of, for example, four vehicle-mounted power supply lines 6 (shown in fig. 1) are introduced from the vehicle-mounted power supply lead wire holes 13 and electrically connected to the LED chips 5 and the heat dissipation fan 3, respectively, and a driver 61 connected to the vehicle-mounted power supply lines 6 is also shown in fig. 1. When the vehicle is in a normal working state, for example, in a night driving state, when the vehicle LED headlamp needs to be turned on, the driver operates the corresponding components in the vehicle, at this time, the heat dissipation fan 3 is in a working state, the LED chip 5 is in a lighting state, the heat generated by the LED chip 5 is transferred to the heat conductor left limiting seat-142 and the heat conductor right limiting seat 143 by the heat conductor conduction, the heat is LED into the heat dissipation chamber 11 by the heat dissipation fan 3 through the additional heat dissipation pillar 141 and the additional heat dissipation pillar heat dissipation hole 1411 and is discharged outside, and at the same time, the heat is LED into the heat dissipation chamber 11 by the heat dissipation seat 1 and the heat dissipation seat heat dissipation hole 12 and is discharged outside by the heat dissipation fan 3.

Example 2:

referring to fig. 3 to 5, the heat sink 1 and the heat conductor fixing mechanism 14 are divided into two halves with the same size from the middle along the longitudinal axis direction, and two symmetrical heat sink petals with the same size are connected into a whole by the heat sink fixing and connecting screws 16, so as to form the heat sink 1. In order to facilitate the connection of the two fins, a fixing screw hole 17 is formed in each of the two fins at a corresponding position, and the fixing screw hole 17 is located above the stepped cavity 111, so as to prevent the heat sink fixing screw 16 from being interfered by the heat dissipation fan 3 when being screwed into the fixing screw hole 17. When the two half-valve structures are folded, i.e. combined, a gap matched with the thickness of the heat conductor 2 is still kept between the heat conductor left limiting seat 142 and the heat conductor right limiting seat 143. Since the final result of the structure of this embodiment, i.e. the expression form in the use state, is the same as the structure of embodiment 1, and is only convenient in processing, if the structure of embodiment 2 is adopted, it should be regarded as not departing from the scope of the technical solution provided by the present invention. The rest is the same as described in example 1.

In conclusion, the technical scheme provided by the invention overcomes the defects in the prior art, successfully completes the invention task and truly realizes the technical effects of the applicant in the technical effect column.

Claims

1. A vehicle LED headlight structure comprises a heat dissipation seat (1), a heat conductor (2), a heat dissipation fan (3), a lamp bowl (4) and LED chips (5), wherein one side of the heat dissipation seat (1) facing downwards is provided with a heat dissipation cavity (11), heat dissipation seat heat dissipation holes (12) which are communicated with the heat dissipation cavity (11) from the upper part of the heat dissipation seat (1) are arranged at intervals around the heat dissipation seat (1), the side part of the heat dissipation seat (1) is provided with a vehicle-mounted power supply lead wire hole (13) communicated with the heat dissipation cavity (11), the heat dissipation fan (3) is arranged in the heat dissipation cavity (11), the LED chips (5) are arranged at the upper part of the heat conductor (2), the vehicle LED headlight structure is characterized in that the middle area of the surface of one side of the heat dissipation seat (1) facing upwards is also provided with a heat conductor inserting and fixing mechanism (14), and the lower part of the heat conductor (2) is inserted and fixed with the heat conductor inserting and fixing mechanism, the lamp bowl (4) is fixed with the heat conductor inserting and fixing mechanism (14) and shields the upper part of the heat conductor (2), and the heat conductor (2) is a flat copper plate with a rectangular cross section.

2. The vehicle LED headlight structure according to claim 1, wherein the heat conductor insertion mechanism (14) includes an additional heat radiation post (141), a heat conductor left restriction seat (142), and a heat conductor right restriction seat (143), the additional heat radiation post (141) is formed in a central region of an upward facing side surface of the heat radiation seat (1), additional heat radiation post heat radiation holes (1411) are formed in the additional heat radiation post (141) at intervals around the additional heat radiation post (141), the additional heat radiation post heat radiation holes (1411) penetrate from an upper portion to a lower portion of the additional heat radiation post (141) and communicate with the heat radiation chamber (11), a heat conductor lower support restriction chamber (1412) is formed at a central position of the additional heat radiation post (141), the heat conductor left restriction seat (142) and the heat conductor right restriction seat (143) extend upward and are formed on an upper surface of the additional heat radiation post (141) in left-right correspondence with each other, the space between the left heat conductor limiting seat (142) and the right heat conductor limiting seat (143) is formed into a heat conductor lower portion inserting cavity (144), the heat conductor lower portion inserting cavity (144) corresponds to and is communicated with the heat conductor lower portion supporting limiting cavity (1412), the lower portion of the heat conductor (2) is sequentially inserted into the heat conductor lower portion inserting cavity (144) and the heat conductor lower portion supporting limiting cavity (1412), the upper portion of the heat conductor lower portion inserting cavity together with the LED chip (5) extends out of the heat conductor lower portion inserting cavity (144), and the lamp bowl (4) is fixed with the additional radiating column (141).

3. The vehicle LED headlight structure of claim 2, wherein a heat conductor left delimiting seat wire guide (1421) is formed in the heat conductor left delimiting seat (142), a heat conductor right delimiting seat wire guide (1431) is formed in the heat conductor right delimiting seat (143), the heat conductor left delimiting seat wire guide (1421) extends downward from an upper portion of the heat conductor left delimiting seat (142) and communicates with the heat dissipating chamber (11) after passing through the additional heat dissipating pillar (141) and the heat dissipating seat (1) in order, and the heat conductor right delimiting seat wire guide (1431) extends downward from an upper portion of the heat conductor right delimiting seat (143) and communicates with the heat dissipating chamber (11) after passing through the additional heat dissipating pillar (141) and the heat dissipating seat (1) in order.

4. The vehicle LED headlight structure according to claim 2, characterized in that a width of the heat conductor lower insert cavity (144) and the heat conductor lower support limit cavity (1412) is adapted to a thickness of the heat conductor (2).

5. The vehicle LED headlight structure according to claim 2 or 3, characterized in that the cross-sectional shapes of the heat conductor left defining seat (142) and the heat conductor right defining seat (143) are semicircular.

6. The vehicle LED headlight structure according to claim 2, wherein a heat conductor fixing screw hole (1413) is formed at a side portion of the additional heat dissipating pillar (141), the heat conductor fixing screw hole (1413) communicates with the heat conductor lower support limit chamber (1412), and a heat conductor fixing screw (14131) for fixing a lower portion of the heat conductor (2) is provided at the heat conductor fixing screw hole (1413).

7. The vehicle LED headlight structure according to claim 2, wherein a lamp bowl fixing sleeve (1414) is fixedly fitted to an outer wall of the additional heat dissipating post (141), and a lower portion of the lamp bowl (4) is fixed to the lamp bowl fixing sleeve (1414).

8. The vehicle LED headlight structure according to claim 7, wherein a cover flange (14141) is formed on an upper portion of the cover (1414), a bowl fixing flange (41) is formed on a lower portion of the bowl (4), the bowl fixing flange (41) is fixed to the cover flange (14141) by a flange screw (411), and a bowl panel (42) is provided on an upper portion of the bowl (4), the bowl panel (42) being transparent.

9. The vehicle LED headlight structure according to claim 1, wherein the LED chips (5) are paired and are respectively provided on the upper left and right sides of the heat conductor (2) through a chip substrate (51), and the chip substrates (51) are fixed to the heat conductor (2) by chip substrate fixing screws (511).

10. The vehicle LED headlight structure according to claim 6, wherein a heat conductor fixing screw penetration hole (21) into which the heat conductor fixing screw (14131) penetrates is formed at a lower portion of the heat conductor (2) at a position corresponding to the heat conductor fixing screw hole (1413), and the heat conductor fixing screw penetration hole (21) is a blind hole.