CN211709741U - Quick automatic device that cuts of crystalline silicon - Google Patents
Quick automatic device that cuts of crystalline silicon Download PDFInfo
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- CN211709741U CN211709741U CN202020086795.3U CN202020086795U CN211709741U CN 211709741 U CN211709741 U CN 211709741U CN 202020086795 U CN202020086795 U CN 202020086795U CN 211709741 U CN211709741 U CN 211709741U
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Abstract
The utility model relates to a quick automatic device that cuts of crystal silicon belongs to crystal silicon and cuts the device field, the on-line screen storage device comprises a base, automatic positioning conveying unit, clean unit and detection righting unit have set gradually on the advancing direction along crystal silicon on the base, automatic positioning conveying unit's top is provided with segmentation cutting unit for fix a position, cut, clean and carry crystal silicon, have the location characteristics quick, accurate, that the productivity is high and save space.
Description
Technical Field
The utility model belongs to the technical field of crystal silicon processing equipment, specifically speaking relates to a quick automatic device that cuts of crystal silicon.
Background
At present, band saw cutting machines, single-line cutting machines and multi-cutter cutting machines are mainly used for cutting and back cutting of silicon rods in the photovoltaic industry; the main problems of the above devices are:
the band saw cutting machine has the problems of wide cutting knife gap, large silicon material loss and poor section verticality, and can reach the required size only by repeated back cutting, so the band saw cutting machine is basically replaced by diamond wire cutting.
And secondly, the single-knife cutting machine drives a single wire to perform single-knife cutting by using a set of winding and unwinding mechanisms. The automatic cutting machine is mainly used for silicon rod back cutting and silicon rod automatic cutting. Due to the limitation of the use, the realization structure has defects: on the one hand, the cutting mode also needs an integral take-up and pay-off control system, but only single-time single-knife cutting can be realized, and the input cost is higher. On the other hand, after the single-blade cutting is carried out through complex feeding actions, the cutting of only one blade is finished, the comprehensive time of the cutting actions is long, and the cutting efficiency is low.
And thirdly, a cutting device of the multi-cutter cutting machine is formed by winding a single wire into a cutting wire net, the whole cutting wire net is formed by a group of cutting tool bits which are connected in series, and only one wire can be cut when a single-crystal long rod is cut. When the single crystal short rod is cut, the polycrystal is cut and the cutting is carried out again, the single crystal short rod can only be placed manually, the placing time is long, the waste of the productivity is very large, and the automatic cutting is difficult to realize.
In the aspect of silicon rod cleaning and conveying, the manual cleaning is mainly relied on at present. The manual cleaning is carried out by workers among all the stations, and the cutting is manually operated. The semi-automatic logistics line conveying is partially realized, the semi-automatic logistics line conveying is also only carried out by a belt conveyor to a cutter for cutting, then the semi-automatic logistics line conveying is carried out manually to a conveying belt, then the conveying belt is conveyed to a cleaning workshop, and finally the carrying and cleaning work is finished manually by workers. This mode of operation has the following problems:
the labor intensity is large: the production mode can not integrate cutting, transportation and cleaning, workers need to carry the cutting, transportation and cleaning manually, and the labor intensity is high.
High investment cost: this mode of production need purchase and cut equipment, conveying equipment, cleaning device, and each process all needs a large amount of workman to accomplish moreover, and the input and use cost are high.
③ the silicon material has large loss: on one hand, the conventional silicon rod cutting equipment needs manual line drawing and manual placement, the cutting error is large, the back cutting rate is high, and the silicon material loss is large; on the other hand, the silicon rods are conveyed by using a conventional belt conveyor, so that the silicon rods are easy to collide with each other, and the silicon rod loss is caused; in the third aspect, misoperation is easy to occur when the silicon rod is manually conveyed back and forth between the belt conveyor and the equipment, so that the silicon rod loss is caused.
Fourthly, the occupied area is large: according to the production scheme, because the cutting and cleaning work cannot be integrated, a large amount of cutting equipment and cleaning equipment need to be installed, and a large production field is occupied.
SUMMERY OF THE UTILITY MODEL
Aiming at various defects in the prior art, the device capable of integrating automatic positioning, automatic cutting and cleaning operation of the crystal silicon into a whole is provided, automatic positioning is realized, multi-cutter cutting and crystal silicon cleaning automation are realized at any position of the crystal silicon, the manual input is reduced to a great extent, and the productivity is increased.
In order to achieve the above object, the utility model provides a following technical scheme:
the utility model provides a quick automatic device that cuts of crystalline silicon, includes the base, automatic positioning conveying unit, clean unit and detection righting unit have set gradually on the advancing direction along crystalline silicon on the base, automatic positioning conveying unit's top is provided with segmentation cutting unit for fix a position, cut, clean and carry crystalline silicon.
Furthermore, the automatic positioning and conveying unit comprises a horizontal conveying assembly, at least two groups of vertical lifting assemblies, a positioning assembly, at least one group of supporting assemblies and a fixing box, wherein the supporting assemblies and the positioning assembly are sequentially arranged along the conveying direction of the crystalline silicon to position the crystalline silicon on the automatic conveying unit;
the segmented cutting unit comprises a lifting assembly and a cutting-off assembly, and the cutting-off assembly is fixedly connected with the base through the lifting assembly and is used for cutting off the crystalline silicon on the automatic positioning conveying unit;
the cleaning unit comprises a cleaning component and a drying component which are sequentially arranged along the conveying direction of the crystal silicon and is used for cleaning, drying and conveying the cut crystal silicon;
the detection righting unit comprises a righting conveying assembly, a detection assembly and a righting assembly and is used for carrying out in-place detection on the crystalline silicon and righting the toppled crystalline silicon.
Furthermore, at least two sets of vertical lifting unit lie in the below of horizontal transport component, and it links firmly with horizontal transport component, locating component and supporting component set firmly between the horizontal transport component, fixed case is fixed to be located horizontal transport component's below for fixed supporting component and locating component.
Further, horizontal feed subassembly includes the hold-in range, vertical lift subassembly sets firmly below the hold-in range, and it includes vertical lift electric jar and fixed bolster, and vertical lift electric jar sets up and links firmly with the hold-in range along vertical direction and through fixed bolster.
Further, locating component includes positioning support frame and first locating plate, the positioning support frame cover is located fixed case periphery and can be followed the hold-in range and slide, and its upper portion sets firmly the first locating plate of level to, vertical direction removal regulation in the position of vertical direction can be followed to first locating plate for fix a position crystal silicon.
Further, the supporting component comprises a supporting frame body and a supporting column, the supporting frame body is sleeved on the periphery of the fixed box and slides along the synchronous belt through a supporting lead screw, and the supporting column is fixedly arranged on the upper portion of the supporting frame body and used for being abutted to the crystal silicon.
Furthermore, a horizontal supporting table is fixedly arranged on the fixing box and is positioned between the synchronous belts and used for supporting the crystal silicon.
Furthermore, the lifting assembly is fixedly arranged on two sides of the cutting assembly and comprises a lifting support and a lifting screw rod arranged in the vertical direction, and the lifting support is fixedly connected with the base;
cut the subassembly including cutting the mount, receive and release the line wheelset and a set of at least cutting wheelset, cut the mount and set up along the direction of delivery of crystal silicon, and its both ends link firmly with elevating assembly, the cutting wheelset is through cutting feed screw and cutting mount sliding connection along the direction of delivery of crystal silicon setting, receive and release the line wheelset and set up in the base both sides for receive and release the line of cut.
Further, the cleaning assembly comprises a cleaning fixing seat and a spraying and cleaning conveying belt, the spraying and cleaning conveying belt is fixedly connected with the base through the cleaning fixing seat, the cleaning conveying belt is connected with the synchronous belt and arranged along the direction of the synchronous belt, and the spraying is arranged on the periphery of the cleaning conveying belt;
the drying assembly comprises a drying fixing seat, an air knife and a drying conveying belt, the drying conveying belt and the air knife are fixedly connected with the base through the drying fixing seat, the drying conveying belt is connected with the cleaning conveying belt and arranged along the direction of the cleaning conveying belt, and the air knife is fixedly arranged on the periphery of the drying conveying belt.
Further, the centralizing conveying assembly comprises a centralizing synchronous belt, the detection assembly is fixedly arranged at the end part of the centralizing synchronous belt and comprises an installation plate, two contact rods and a second positioning plate, the two contact rods are positioned at the upper part and the lower part of the installation plate, the installation plate is vertically and fixedly connected with the centralizing synchronous belt, the second positioning plate is fixedly arranged at one side of the installation plate close to the crystalline silicon, and the contact rods vertically penetrate through the installation plate and the second positioning plate along the horizontal direction and are used for abutting against the crystalline silicon;
the righting component is fixedly arranged under the righting synchronous belt and comprises a righting fixed plate, a righting rod and a righting cylinder, the righting fixed plate is fixedly connected with the bottom of the righting synchronous belt, the righting cylinder is obliquely and fixedly arranged on the righting fixed plate and is arranged at an acute angle with the vertical direction, the righting cylinder piston end is fixedly provided with the righting rod, and the righting rod is provided with a righting wheel which is abutted to crystalline silicon and is used for righting the toppled crystalline silicon.
The utility model has the advantages that:
1. the positioning is quick and accurate: the cutting tool bit of the device, the feeding device are all driven by the servo motor to complete, and meanwhile, the correction functions of the positioning surface and the positioning sensor are combined, so that the cutting and feeding positioning is accurate and rapid, and the error is small.
2. The work efficiency is high: the device integrates the work of cutting off, cleaning and the like, and in the aspect of cutting off, the device adopts double-rod multi-knife cutting, so that the cutting efficiency is high; the cleaning work can be finished in the conveying process after the cutting, the labor intensity is low, and the working efficiency is high.
3. The investment cost is low: this device has integrateed work such as cut, carry, clean, does not need to purchase alone and cuts equipment, conveying equipment and cleaning equipment, has also saved operation workman's quantity simultaneously, has practiced thrift use cost greatly.
4. Reducing damage of the silicon rod: the device automatically searches for a cutting position according to the truncation section length information, and has small truncation error and low back-cutting rate; meanwhile, in the process of conveying the silicon rods, the silicon rods and the conveying belt are in a relatively static state, and the surface and the interior of the silicon rods cannot be damaged.
5. The occupied area is small: the device does not need to be provided with a cutting workshop, a cleaning workshop and the like according to the process requirements, and the use area is reduced.
6. The expansibility is strong: the cutting module can be provided with different numbers of cutter heads according to requirements; the drying component can be additionally provided with a hot air knife, an ion air knife and the like, so that the functions of drying, static electricity removal and the like are realized; an alcohol spraying and cotton roller wiping device can be added behind the drying component to obtain an adhesive cleaning surface.
Drawings
Fig. 1 is a schematic view of the overall structure of the present invention;
FIG. 2 is a schematic view of the structure of the automatic positioning and conveying unit;
FIG. 3 is a side view of the automatic positioning conveyor unit;
FIG. 4 is a schematic structural view of a cleaning unit and a detecting and centering unit;
FIG. 5 is a schematic structural diagram of a detecting and centering unit;
FIG. 6 is a schematic structural view of a detection assembly;
FIG. 7 is a schematic structural view of a segment cutting unit;
FIG. 8 is a schematic structural view of a cut-off assembly;
FIG. 9 is another schematic view of the construction of the cut-off assembly;
fig. 10 is a schematic structural view of the base.
In the drawings:
1-a base, 101-a first sewage collecting tank, 102-a second sewage collecting tank;
2-automatic positioning conveying unit, 201-horizontal conveying assembly, 2011-synchronous belt, 202-vertical lifting assembly, 2021-fixed support frame, 203-positioning assembly, 2031-positioning support frame, 2032-first positioning plate, 204-supporting assembly, 2041-supporting frame body, 2042-supporting column, 205-fixed box and 2051-supporting table;
3-cleaning unit, 301-cleaning assembly, 3011-cleaning fixing seat, 3012-spraying, 3013-cleaning conveying belt, 302-drying assembly, 3021-drying fixing seat, 3022-air knife and 3023-drying conveying belt;
4-detection centering unit, 401-centering conveying component, 4011-centering synchronous belt, 402-detection component, 4021-mounting plate, 4022-second positioning plate, 4023-contact rod, 403-centering component, 4031-centering fixing plate, 4032-centering rod, 4033-centering cylinder and 4034-centering wheel;
the cutting device comprises a 5-segmented cutting unit, a 501-lifting assembly, a 5011-lifting support, a 502-cutting assembly, a 5021-cutting fixing frame, a 5022-wire winding and unwinding wheel set, a 5023-left cutting wheel set, a 5024-right cutting wheel set, a 5025-cutting feed screw, a 5026-first cutting wheel, a 5027-second cutting wheel and a 5028-tensioning assembly.
Detailed Description
In order to make those skilled in the art better understand the technical solution of the present invention, the following description, together with the drawings of the present invention, clearly and completely describes the technical solution of the present invention, and based on the embodiments in the present application, other similar embodiments obtained by those skilled in the art without creative efforts shall all belong to the protection scope of the present application. In addition, directional terms such as "upper", "lower", "left", "right", etc. in the following embodiments are directions with reference to the drawings only, and thus, the directional terms are used for illustrating the present invention and not for limiting the present invention.
The present invention will be further described with reference to the accompanying drawings and preferred embodiments.
Referring to fig. 1-10, a quick automatic device that cuts of crystalline silicon, includes base 1, automatic positioning conveying unit 2, clean unit 3 and detection righting unit 4 have set gradually along the length direction of crystalline silicon on base 1, automatic positioning conveying unit 2's top is provided with segmentation cutting unit 5, can realize the automation to crystalline silicon location, cut, clean and transport operation, reduces artifical input, increases the productivity.
The rotary positioning conveying unit 2 comprises a horizontal conveying assembly 201, at least two groups of vertical lifting assemblies 202, a positioning assembly 203, at least one group of supporting assemblies 204 and a fixing box 205, and is used for positioning and cutting the crystalline silicon on the automatic conveying unit.
The automatic positioning and conveying unit 2 comprises a horizontal conveying assembly 201, at least two groups of vertical lifting assemblies 202, a positioning assembly 203, at least one group of supporting assemblies 204 and a fixing box 205, and is used for positioning the crystalline silicon on the automatic conveying unit; the segmented cutting unit 5 comprises a cutting-off component 502 and a lifting component 501, the lifting component 501 is fixedly connected with the base 1 and is arranged along the vertical direction, the cutting-off component 502 is fixedly connected with the upper part of the lifting component 501 and is fixedly connected with the base 1 through the lifting component 501 and is used for cutting off the crystalline silicon on the automatic positioning conveying unit 2; cleaning unit 3 includes washing subassembly 301 and the dry subassembly 302 that sets gradually on the crystal silicon direction of delivery for wash, weather and carry the crystal silicon after cutting, it includes detection component 13, rights subassembly 403 and rights conveyor components 401 to detect rightting unit 4, is used for targetting in place the detection and righting the operation to the crystal silicon of empting.
Example one
Referring to fig. 1, fig. 2, fig. 3, horizontal transport assembly 201 sets up along the direction of delivery of crystal silicon, and it includes hold-in range 2011, the below interval of hold-in range 2011 is provided with at least two sets of vertical lift subassembly 202, vertical lift subassembly 202 includes vertical lift electric cylinder and fixed bolster 2021, specifically, vertical lift electric cylinder sets up along vertical direction, just the cylinder bottom end of vertical lift electric cylinder links firmly with base 1, its piston end fixedly connected with fixed bolster 2021, fixed bolster 2021 becomes frame construction, and its cross section becomes the rectangle, the upper surface of fixed bolster 2021 links firmly with the bottom surface of hold-in range 2011, and its lower bottom surface and the piston end fixed connection of vertical lift electric cylinder. The piston end of one of the vertical lifting electric cylinders is also fixedly provided with a belt driving motor for driving the synchronous belt 2011 to move.
The positioning component 203 and the supporting component 204 are both arranged between the horizontal conveying components 201, and the supporting component 204 and the positioning component 203 are arranged along the conveying direction of the crystalline silicon. The fixing box 205 is fixedly arranged below the horizontal conveying assembly 201 and is used for fixing the supporting assembly 204 and the positioning assembly 203. Specifically, the positioning assembly 203 includes a positioning support frame 2031, a guide rail cylinder, a first positioning plate 2032 and a positioning screw, wherein the positioning support frame 2031 is a frame structure and is sleeved on the periphery of the fixing box 205. The positioning screw is fixedly arranged in the positioning box 205, and the positioning support frame 2031 is connected with the positioning screw, that is, the positioning screw drives the positioning support frame 2031 to slide between the synchronous belts 2011. Meanwhile, a vertical guide rail cylinder is fixedly arranged on the upper part of the positioning support frame 2031, the cylinder body end of the guide rail cylinder is fixedly connected with the positioning support frame 2031, and the piston end of the guide rail cylinder is fixedly connected with a first positioning plate 2032 in the horizontal direction and used for adjusting the position of the first positioning plate 2032 in the vertical direction and effectively positioning the crystalline silicon. Meanwhile, a positioning sensor is further disposed on the first positioning plate 2032, and is used for detecting whether the crystalline silicon is conveyed in place.
In addition, a horizontal support platform 2051 is further disposed at the upper portion of the fixed box 205, and the support platform 2051 is adjacent to the support frame body 2041 and is located at an end far away from the positioning assembly 203. The upper surface of the support column 2042 and the support table 2051 are located in the same plane and used for supporting the cut crystalline silicon.
Example two
Referring to fig. 1, 7-9, segmentation cutting unit 5 includes and cuts subassembly 502 and lifting unit 502, lifting unit 501 symmetry set firmly in the both sides of cutting subassembly 502, cut subassembly 502 and set up along the length direction of crystal silicon, just cut subassembly 502 and lifting unit 501 and link firmly.
Specifically, the lifting assembly 501 comprises a lifting support 5011 and a lifting screw rod arranged along the vertical direction, the lifting support 5011 is arranged along the vertical direction, the bottom of the lifting support 5011 is fixedly connected with the base 1, and two ends of the lifting screw rod are fixedly connected with the lifting support 5011. The lifting screw rods positioned on the two sides of the cutting-off assembly 502 are fixedly connected with the cutting-off assembly 502, namely, the cutting-off assembly 502 slides along the vertical direction through the lifting screw rods so as to adjust the position of the cutting-off assembly 502 in the vertical direction, and crystalline silicon is convenient to cut.
Cut subassembly 502 including cutting mount 5021, receipts and releases line wheelset 5022 and at least a set of cutting wheelset, at least a set of cutting wheelset includes relative left cutting wheelset 5023 and the right cutting wheelset 5024 that sets up, specifically, cut the direction of delivery of mount 5021 along crystal silicon and set up, and the lift lead screw fixed connection of its both ends and both sides, simultaneously, left cutting wheelset 5023 and right cutting wheelset 5024 are through cutting feed screw 5025 with cut but mount 5021 sliding connection, that is to say, left cutting wheelset 5023, the interval of right cutting wheelset 5024 is adjustable, and the cutting line is apart from adjustable promptly, and the practicality is strong.
Specifically, the cutting feed screw 5025 is fixedly arranged on the cutting fixing frame 5021. The left cutting wheel set 5023 and the right cutting wheel set 5024 comprise a wire mesh bracket, a first cutting wheel 5026 and a second cutting wheel 5027, wherein the first cutting wheel 5026 and the second cutting wheel 5027 are located on the wire mesh bracket, and the bottom of the wire mesh bracket is fixedly connected with a cut-off feed screw 5025. The first cutting wheel 5026 and the second cutting wheel 5027 are located in the same vertical plane. The cutting lines sequentially pass around the first cutting wheel 5026 and the second cutting wheel 5027 of the left cutting assembly 5023 and the right cutting assembly 5024 to form parallel lines for cutting the single crystal silicon rods, and the parallel lines are arranged in a horizontal direction. In this embodiment, the parallel lines are arranged along the horizontal direction, and in other embodiments, the parallel lines may be arranged along the horizontal direction or inclined.
Specifically, the two ends of the cutoff feed screw 5025 are fixedly connected with the cutoff fixing frame 5021 and arranged along the conveying direction of the crystalline silicon. A first guide wheel in the vertical direction is arranged on the wire mesh bracket, and the first guide wheel is positioned above the second cutting wheel 5027. Meanwhile, a second guide wheel and a third guide wheel are provided at one side of the first cutting wheel 5026, and the second guide wheel and the third guide wheel are located in a vertical plane perpendicular to the first cutting wheel 5026, and at the same time, the third guide wheel is located above the second guide wheel. A group of first cutting wheels 5026 in the left cutting wheel group 5023 and the right cutting wheel group 5024 are connected with a cutting motor for driving the entire wire net to operate to cut the crystalline silicon. In addition, a cutting line spraying device is further arranged on the wire net support and used for spraying and cooling the cutting lines.
In this embodiment, what cut on the mount 5021 symmetry is provided with two sets of left cutting wheel set 5023 and right cutting wheel set 5024, simultaneously, the both sides of cutting the mount 5021 set firmly leading wheel and transition leading wheel group that the level is to for the line of cut switching-over, the transition leading wheel group includes the first transition guide pulley of vertical setting and the second transition guide pulley of level setting, just leading wheel and second transition guide pulley are located same horizontal plane.
Receive and release line wheelset 5022 set up in base 1's both sides for receive line and unwrapping wire, receive and release line wheelset 5022 including receiving a line section of thick bamboo and a section of thick bamboo of unwrapping wire, just receive a line section of thick bamboo and a section of thick bamboo of unwrapping wire is located base 1's different sides, receive a line section of thick bamboo and a section of thick bamboo department of unwrapping wire and all be provided with wire winding drive assembly and winding displacement drive assembly, wire winding drive assembly is used for driving and receives a line section of thick bamboo and a section of thick bamboo rotation of unwrapping wire, realizes receiving and releasing the line. In addition, wire arranging wheels are arranged on one sides of the wire collecting cylinder and the wire releasing cylinder and used for arranging wires.
Simultaneously, for the rate of tension of assurance gauze, all be provided with tensioning assembly 5028 in the both sides of vertical lifting unit 202, tensioning assembly 5028 includes take-up pulley, first reel, second reel and third reel, and take-up pulley, first reel, second reel are located same vertical plane, and just first reel is located the below of second reel and take-up pulley, the third reel be located with take-up pulley looks vertically vertical plane.
That is, the cutting line passes through the pay-off drum, the transition guide wheel set, bypasses the left cutting wheel set 5023 and the right cutting wheel set 5024, changes the direction of the cutting line through the guide wheel, enters the other cutting wheel set and is finally connected with the take-up drum.
Meanwhile, the cutting assembly 502 generates displacement along the vertical direction through the lifting screw, the cutting assembly 502 moves upwards to provide a yielding space for conveying and positioning of the crystalline silicon on the synchronous belt 2011, and the cutting assembly 502 moves downwards to cut the crystalline silicon on the supporting assembly 204.
EXAMPLE III
Referring to fig. 1 and 4, the cleaning assembly 301 includes a cleaning fixing seat 3011, a spray 3012 and a cleaning conveying belt 3013, the cleaning conveying belt 3013 is fixed on the cleaning fixing seat 3011 and is fixedly connected to the base 1 through the cleaning fixing seat 3011, and a spray shield is spanned above the cleaning fixing seat 3011. Spray 3012 and set firmly in washing conveyor belt 3013's all around, it includes a plurality of spray pipes and is located a plurality of nozzles of the equipartition on the spray pipe, and spray pipe sets up along the direction of delivery of crystal silicon. Specifically, the spray pipes are respectively arranged above, below and on both sides of the cleaning conveyor belt 3013, the spray pipes above and on both sides of the cleaning conveyor belt 3013 are fixedly arranged on the spray shield, and the spray pipes below the cleaning conveyor belt 3013 are arranged between the cleaning conveyor belts 3013. For better washing crystal silicon, the nozzles above and below the cleaning and conveying belt 3013 are arranged in the vertical plane relatively, and the nozzles on both sides of the cleaning and conveying belt 3013 are arranged relatively along the horizontal direction to form a cubic water curtain, so that the silicon rod can be cleaned in all directions.
In order to dry the cleaned crystalline silicon in time, a drying assembly 302 is arranged on one side of the cleaning assembly 301, and the drying assembly 302 is arranged along the conveying direction of the crystalline silicon. Specifically, the drying assembly 302 includes a drying fixing seat 3021, an air knife 3022 and a drying conveyor belt 3023, wherein the air knife 3022 and the drying conveyor belt 3023 are fixedly disposed on the drying fixing seat 3021 and fixedly connected to the base 1 through the drying fixing seat 3021. The drying conveyor belt 3023 is connected to the cleaning conveyor belt 3013 and is disposed along the direction of the cleaning conveyor belt 3013, and the air knives 3022 are disposed above, below, and on both sides of the drying conveyor belt 3023 and all face the direction of the drying conveyor belt 3023. In this embodiment, air knife 3022 includes horizontal air knife and vertical air knife, horizontal air knife sets firmly in the top and the below of wasing conveyor belt 3013 along crystal silicon direction of delivery to towards wasing conveyor belt 3013 setting, vertical setting firmly in the both sides of wasing conveyor belt 3013 that vertical air knife is relative, vertical air knife and horizontal air knife form the rectangle wind knife face, carry out the all-round drying to crystal silicon for the drying process on crystal silicon surface. In addition, the top of dry conveyor belt 3023 strides and is equipped with the weather guard shield, washs fixing base 3011 and weather guard shield and forms inclosed drying space, does benefit to and accelerates the drying process and prevents that the waste water that weathers the production from outwards splashing.
Example four
Referring to fig. 1, 4-6, the centering conveyor assembly 401 includes a centering synchronous belt 4011, the centering synchronous belt 4011 is disposed along a conveying direction of the crystalline silicon, and one end of the centering synchronous belt 4011 is connected to a drying conveyor belt 3023, and the other end of the centering synchronous belt is provided with a detection assembly 402.
The detecting component 402 comprises a mounting plate 4021, a second positioning plate 4022 and two contact rods 4023 arranged at intervals in the vertical direction, the two contact rods 4023 are respectively and fixedly arranged on the upper part and the lower part of the mounting plate 4021, the mounting plate 4021 is vertically and fixedly connected with the end part of a centering synchronous belt 4011, one side of the contact rod close to crystalline silicon is fixedly provided with the second positioning plate 4022, the contact rod 4023 vertically penetrates through the mounting plate 4021 and the second positioning plate 4022, one end of the contact rod 4023 far away from the crystalline silicon is connected with a sensor 4024 located on the same side, and the other end of the contact rod 4023 is located on one side close to the crystalline. Meanwhile, a reset spring is sleeved on the periphery of one end of the contact rod 4023 and fixedly connected with the mounting plate 4021, and when the crystalline silicon extrudes the contact rod 4023, the reset spring assists the contact rod 4023 to reset. When the two sensors detect the crystalline silicon at the same time, the crystalline silicon does not topple over and does not need to be righted; when only the sensor positioned below detects the crystalline silicon, the crystalline silicon is toppled, and the crystalline silicon needs to be righted.
In order to centralize toppled crystalline silicon, a centralizing component 403 is fixedly arranged below the centralizing synchronous belt, the centralizing component 403 comprises a centralizing fixed plate 4031, a centralizing rod 4032 and a centralizing cylinder 4033, the centralizing fixed plate 4031 is located below the centralizing synchronous belt 4011 and is obliquely fixed with the centralizing synchronous belt 4011, in this embodiment, the centralizing fixed plate 4031 is in a long strip shape, one end of the centralizing fixed plate 4031 is obliquely fixed with the centralizing fixed plate 4031, the centralizing cylinder 4033 is fixedly arranged on the centralizing fixed plate 4031, and the piston end of the centralizing cylinder 4033 is obliquely arranged upwards and forms an acute angle with the vertical direction. Meanwhile, two centralizing rods 4032 are fixedly arranged at the piston end of the centralizing cylinder 4033 at intervals, in order to prevent the crystal silicon from being scratched in the process of centralizing the crystal silicon, a centralizing wheel 4034 is rotatably arranged between the two centralizing rods 4032, and the centralizing wheel 4034 is fixedly connected with the centralizing rods 4032 through a bearing and can rotate along the conveying direction of the crystal silicon. When the toppled crystal silicon is righted, the righting cylinder 4033 is started, the piston end of the righting cylinder is inclined upwards to generate displacement until the piston end of the righting cylinder butts against the toppled crystal silicon, at the moment, the righting synchronous belt 4011 rotates reversely, namely rotates along the opposite direction of the crystal silicon conveying direction, and the crystal silicon is righted.
Referring to fig. 10, a first sewage collecting tank 101 is provided on the base 1 corresponding to the cleaning unit 3 for collecting sewage, and a second sewage collecting tank 102 is provided at a position corresponding to the sectioning unit 5, the second sewage collecting tank 102 being in communication with the first sewage collecting tank 101 for collecting sewage and cut-off silicon waste pieces. One side of the base 1 is fixedly provided with an electric control cabinet and a control panel which are connected with a control center.
When using the device, workman or manipulator will take cutting crystal silicon to carry to the hold-in range 2011 in the one end of hold-in range 2011 on, the input is waited to cut the section length information of crystal silicon, locating component 203 fixes a position crystal silicon, supporting component 204 effectively supports crystal silicon, it cuts crystal silicon to required section length to cut subassembly 502, then, hold-in range 2011 raises, carry crystal silicon to cleaning unit 3 department, cleaning component 11 and dry subassembly 302 clean and dry back to crystal silicon respectively, carry crystal silicon to detecting and right unit 4 department, if crystal silicon emptys, then right the operation to crystal silicon, if crystal silicon does not emptys, then carry out positioning operation to crystal silicon, can.
The above description is only a preferred embodiment of the present invention, and should not be taken as limiting the scope of the invention, i.e. the present invention is intended to cover all equivalent variations and modifications within the scope of the present invention.
Claims (10)
1. The utility model provides a quick automatic device that cuts of crystalline silicon, includes the base, its characterized in that, automatic positioning conveying unit (2), clean unit (3) and detection righting unit (4) have set gradually on base (1) along the advancing direction of crystalline silicon, the top of automatic positioning conveying unit (2) is provided with segmentation cutting unit (5) for fix a position, cut, clean and carry crystalline silicon.
2. The crystalline silicon rapid automatic cut-off device as claimed in claim 1, wherein the automatic positioning and conveying unit (2) comprises a horizontal conveying assembly (201), at least two sets of vertical lifting assemblies (202), a positioning assembly (203), at least one set of supporting assembly (204) and a fixing box (205), the supporting assembly (204) and the positioning assembly (203) are sequentially arranged along the conveying direction of crystalline silicon to position the crystalline silicon on the automatic conveying unit;
the segmented cutting unit (5) comprises a lifting assembly (501) and a cutting assembly (502), wherein the cutting assembly is fixedly connected with the base (1) through the lifting assembly and is used for cutting off the crystalline silicon on the automatic positioning conveying unit (2);
the cleaning unit (3) comprises a cleaning component (301) and a drying component (302) which are sequentially arranged along the conveying direction of the crystalline silicon and are used for cleaning, drying and conveying the cut crystalline silicon;
the detection centralizing unit (4) comprises a centralizing conveying assembly (401), a detection assembly (402) and a centralizing assembly (403) and is used for detecting the crystalline silicon in place and centralizing the toppled crystalline silicon.
3. The crystalline silicon rapid automatic truncation device according to claim 2, wherein the at least two sets of vertical lifting assemblies (202) are positioned below the horizontal conveying assembly (201) and fixedly connected with the horizontal conveying assembly (201), the positioning assembly (203) and the supporting assembly (204) are fixedly arranged between the horizontal conveying assembly (201), and the fixing box (205) is fixedly arranged below the horizontal conveying assembly (201) and used for fixing the supporting assembly (204) and the positioning assembly (203).
4. The device for rapidly and automatically truncating crystalline silicon according to claim 3, wherein the horizontal conveying assembly (201) comprises a synchronous belt (2011), the vertical lifting assembly (202) is fixedly arranged below the synchronous belt (2011) and comprises a vertical lifting electric cylinder and a fixed support frame (2021), and the vertical lifting electric cylinder is vertically arranged and fixedly connected with the synchronous belt (2011) through the fixed support frame (2021).
5. The quick automatic device that cuts of crystalline silicon of claim 4, characterized in that, locating component (203) includes positioning support frame (2031) and first locating plate (2032), fixing case (205) periphery is located in positioning support frame (2031) cover and can be followed hold-in range (2011) and slide, and its upper portion sets firmly first locating plate (2032) of level direction, first locating plate (2032) can be followed vertical direction and removed the position of adjusting in vertical direction for fix a position crystalline silicon.
6. The quick automatic device that cuts of crystalline silicon according to claim 4, characterized in that, support assembly (204) is including supporting support body (2041), support column (2042), support body (2041) cover is located the periphery of fixed case (205) and is passed through the support lead screw and slide along hold-in range (2011), support column (2042) set firmly in the upper portion of support body (2041) for offset with crystalline silicon.
7. The crystalline silicon rapid automatic cutting device as claimed in claim 6, characterized in that a horizontal support table (2051) is further fixedly arranged on the fixed box (205), and the support table (2051) is positioned between the synchronous belts (2011) and used for supporting crystalline silicon.
8. The crystalline silicon rapid automatic truncation device according to claim 2, wherein the lifting assembly (501) is fixedly arranged at two sides of the truncation assembly (502) and comprises a lifting support (5011) and a lifting lead screw arranged along a vertical direction, and the lifting support (5011) is fixedly connected with the base (1);
cut subassembly (502) including cutting mount (5021), receipts and releases line wheelset (5022) and at least a set of cutting wheelset, cut the direction of delivery setting along the crystal silicon of mount (5021), and its both ends link firmly with lifting unit, cutting wheelset through cutting feed screw (5025) and cutting mount (5021) sliding connection along the direction of delivery setting of crystal silicon, receive and release line wheelset (5022) and set up in base (1) both sides for receive and release the cutting line.
9. The crystalline silicon rapid automatic cut-off device as claimed in claim 2, wherein the cleaning assembly (301) comprises a cleaning fixing seat (3011), a spray (3012) and a cleaning conveying belt (3013), the spray (3012) and the cleaning conveying belt (3013) are fixedly connected with the base (1) through the cleaning fixing seat (3011), the cleaning conveying belt (3013) is connected with a synchronous belt (2011) and arranged along the direction of the synchronous belt (2011), and the spray (3012) is arranged around the cleaning conveying belt (3013);
dry subassembly (302) are including dry fixing base (3021), air knife (3022) and dry conveyor belt (3023), dry conveyor belt (3023) and air knife (3022) link firmly with base (1) through dry fixing base (3021), dry conveyor belt (3023) meet and set up along the direction of wasing conveyor belt (3013) with wasing conveyor belt (3013), the air knife sets firmly around dry conveyor belt (3023).
10. The crystalline silicon rapid automatic cut-off device as claimed in any one of claims 2 to 9, wherein the centering conveyor assembly (401) comprises a centering synchronous belt (4011), the detection assembly (402) is fixedly arranged at the end of the centering synchronous belt (4011), and comprises a mounting plate (4021), two contact rods (4023) positioned at the upper part and the lower part of the mounting plate (4021), and a second positioning plate (4022), the mounting plate (4021) is vertically fixedly connected with the centering synchronous belt (4011), the second positioning plate (4022) is fixedly arranged at one side of the mounting plate (4021) close to crystalline silicon, and the contact rods (4023) vertically penetrate through the mounting plate (4021) and the second positioning plate (4022) along the horizontal direction and are used for abutting against the crystalline silicon;
the centralizing component (403) is fixedly arranged below a centralizing synchronous belt (4011), and comprises a centralizing fixed plate (4031), a centralizing rod (4032) and a centralizing cylinder (4033), wherein the centralizing fixed plate (4031) is fixedly connected with the bottom of the centralizing synchronous belt (4011), the centralizing cylinder (4033) is obliquely and fixedly arranged on the centralizing fixed plate (4031) and is arranged at an acute angle with the vertical direction, the piston end of the centralizing cylinder (4033) is fixedly provided with the centralizing rod (4032), and a centralizing wheel (4034) is arranged on the centralizing rod (4032) and is abutted to crystalline silicon to centralize the toppled crystalline silicon.
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202020086795.3U CN211709741U (en) | 2020-01-15 | 2020-01-15 | Quick automatic device that cuts of crystalline silicon |
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| Application Number | Priority Date | Filing Date | Title |
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| CN202020086795.3U CN211709741U (en) | 2020-01-15 | 2020-01-15 | Quick automatic device that cuts of crystalline silicon |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN116330505A (en) * | 2023-04-13 | 2023-06-27 | 先恩光电（苏州）有限公司 | Silicon material processing device for manufacturing solar cell panel |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN116330505A (en) * | 2023-04-13 | 2023-06-27 | 先恩光电（苏州）有限公司 | Silicon material processing device for manufacturing solar cell panel |
| CN116330505B (en) * | 2023-04-13 | 2023-09-12 | 先恩光电（苏州）有限公司 | Silicon material processing device for manufacturing solar cell panel |
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