CN211702332U - Earphone assembly, earphone and mobile device - Google Patents
Earphone assembly, earphone and mobile device Download PDFInfo
- Publication number
- CN211702332U CN211702332U CN202020369224.0U CN202020369224U CN211702332U CN 211702332 U CN211702332 U CN 211702332U CN 202020369224 U CN202020369224 U CN 202020369224U CN 211702332 U CN211702332 U CN 211702332U
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- cover plate
- earphone
- circuit board
- printed circuit
- silica gel
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Abstract
The utility model discloses an earphone component, which comprises a first cover plate, a second cover plate, a printed circuit board and a silica gel sleeve; the first cover plate is connected with the second cover plate, a structure containing a first empty groove is formed after the first cover plate is connected with the second cover plate, and the printed circuit board is arranged in the first empty groove; a square groove is formed in one end of the second cover plate, and the silica gel sleeve is arranged in the square groove; and a microphone element is arranged at one end of the printed circuit board and is attached to the silica gel sleeve. The earphone component of the utility model has simple structure and convenient production, reduces the defective goods caused by the blockage of the microphone hole by glue in the existing product, and improves the quality and the production efficiency of the product; the echo formed in the microphone earphone component can be effectively limited, the noise interference at the earphone loudspeaker is reduced, and the use experience of a user is improved. The utility model discloses but wide application in the electronic equipment technical field.
Description
Technical Field
The utility model belongs to the technical field of the electronic equipment technique and specifically relates to an earphone subassembly, earphone and mobile device.
Background
The wireless earphone comprises a Bluetooth earphone and an infrared earphone. Taking bluetooth headset as an example, the bluetooth technology is applied to hands-free headset, so that users can avoid annoying wiring stumbling and can easily talk in various ways. Since the wireless earphone comes out, the wireless earphone is always a good tool in daily life and work of people.
In the prior art, referring to fig. 1, when an earphone assembly is assembled, a printed circuit board needs to be assembled between two cover plates, and in order to separate a microphone in the earphone from a loudspeaker to achieve an echo elimination effect, glue grooves in corresponding positions are often formed in the upper cover plate and the lower cover plate respectively, and glue is filled in the glue grooves to separate the microphone at the tail end of the earphone. However, in this embodiment, it is difficult to control the amount of glue before filling, the microphone hole on the cover plate may be blocked due to improper operation, and the process is complicated and inefficient. Therefore, there is still a need for solution and optimization of the problems of the prior art.
SUMMERY OF THE UTILITY MODEL
The utility model aims to at least solve one of the technical problem that exists among the prior art to a certain extent.
Therefore, an object of the embodiments of the present invention is to provide an earphone assembly, which can effectively reduce noise interference at an earphone speaker, and improve user experience; and the assembly has simple structure and easy production, reduces defective products caused by blockage of microphone holes by glue in the existing product, and improves the quality and the production efficiency of the product.
In order to achieve the technical purpose, the embodiment of the present invention adopts a technical solution including:
in a first aspect, an embodiment of the present invention provides an earphone assembly, including: the device comprises a first cover plate, a second cover plate, a printed circuit board and a silica gel sleeve;
the first cover plate is connected with the second cover plate, a structure containing a first empty groove is formed after the first cover plate is connected with the second cover plate, and the printed circuit board is arranged in the first empty groove;
a square groove is formed in one end of the second cover plate, and the silica gel sleeve is arranged in the square groove;
and a microphone element is arranged at one end of the printed circuit board and is attached to the silica gel sleeve.
In addition, according to the earphone assembly of the present invention, the following additional technical features may also be provided:
further, in an embodiment of the present invention, the first cover plate and the second cover plate are detachably connected.
Further, in an embodiment of the present invention, the earphone assembly further includes: the loudspeaker, the first front cover and the second front cover;
the first front cover is connected with the second front cover, a structure containing a second empty groove is formed after the first front cover is connected with the second front cover, and the horn is arranged in the second empty groove;
the loudspeaker is connected with the printed circuit board.
Further, in an embodiment of the present invention, the earphone assembly further includes: a battery;
the battery is arranged in the second empty groove.
Further, in an embodiment of the present invention, the silica gel sleeve is provided with an annular protrusion;
the microphone element is attached to the annular protrusion.
Further, in an embodiment of the present invention, a microphone hole is disposed on the second cover plate.
In a second aspect, an embodiment of the present invention provides an earphone, which includes the earphone assembly.
In a third aspect, an embodiment of the present invention provides an earphone assembly, where the mobile terminal includes the earphone.
Advantages and benefits of the present invention will be set forth in part in the description which follows and, in part, will be obvious from the description, or may be learned by practice of the invention:
the embodiment of the utility model provides a realize the effect that gives sound insulation through the silica gel cover that sets up in one end side groove of second apron, after first apron, second apron, printed circuit board assembled to corresponding position, the microphone component with the silica gel cover laminating, silica gel cover can well play the effect that gives sound insulation, just so make the echo of microphone component in earphone subassembly effectively restrain; the assembly mode can effectively limit echo formed in the microphone and earphone assembly without glue, reduce noise interference at the position of an earphone loudspeaker and improve the use experience of a user; and the structure is simple and easy to produce, defective products caused by blocking microphone holes by glue in the existing product are reduced, and the quality and the production efficiency of the product are improved.
Drawings
Fig. 1 is a schematic diagram of an embodiment of a conventional earphone assembly;
fig. 2 is a schematic diagram of an embodiment of an earphone assembly provided by the present invention;
fig. 3 is a schematic diagram of a specific embodiment of a silicone sleeve in an earphone assembly provided by the present invention;
fig. 4 is an outside schematic view of a second cover plate in an earphone assembly provided by the present invention.
Detailed Description
Reference will now be made in detail to embodiments of the present invention, examples of which are illustrated in the accompanying drawings, wherein like reference numerals refer to the same or similar elements or elements having the same or similar function throughout. The embodiments described below with reference to the drawings are exemplary only for the purpose of explaining the present invention, and should not be construed as limiting the present invention.
In the description of the present invention, it is to be understood that the terms "length", "upper", "lower", "front", "rear", "left", "right", "top", "inner", "outer", "axial", "radial", "circumferential", and the like, indicate orientations or positional relationships based on those shown in the drawings, and are merely for convenience of description and simplicity of description, and do not indicate or imply that the device or element so referred to must have a particular orientation, be constructed and operated in a particular orientation, and thus, are not to be construed as limiting the present invention. Furthermore, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of the present invention, "a plurality" means two or more unless otherwise specified.
In the description of the present invention, it is to be noted that, unless otherwise explicitly specified or limited, the terms "disposed," "mounted," "connected," and "connected" are to be construed broadly, and may be, for example, fixedly connected, detachably connected, or integrally connected; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meaning of the above terms in the present invention can be understood in specific cases to those skilled in the art.
Referring to fig. 2, an embodiment of the present invention provides an earphone assembly, including: the first cover plate 10, the second cover plate 20, the printed circuit board 30 and the silicone sleeve 40;
the first cover plate 10 is connected with the second cover plate 20, the first cover plate 10 is connected with the second cover plate 20 to form a structure containing a first empty slot, and the printed circuit board 30 is arranged in the first empty slot;
one end of the second cover plate 20 is provided with a square groove 201, and the silica gel sleeve 40 is arranged in the square groove 201;
one end of the printed circuit board 30 is provided with a microphone element 301, and the microphone element 301 is attached to the silica gel sleeve 40.
In the embodiment of the application, the structure of using the glue groove is omitted, which is different from the arrangement mode of the traditional earphone component. Specifically, the earphone assembly in the embodiment of the present application includes a first cover plate 10 and a second cover plate 20 on an external structure, and the two cover plates have the same shape and size and can be combined together in the form of a jack. In an alternative embodiment, the first cover plate 10 and the second cover plate 20 are detachably connected. After the first cover plate 10 and the second cover plate 20 are connected, a structure containing a first empty slot is formed, the printed circuit board 30 is placed in the first empty slot, the printed circuit board 30 is an electronic device for realizing a wireless earphone function, a microphone element 301 is arranged at one end of the printed circuit board and used for collecting the sound of a user in a call, and the other end of the printed circuit board is connected to a loudspeaker 50 and a battery 80 at the front end of the earphone; and in order to further play the effect of keeping apart, still set up silica gel cover 40 in this application embodiment, silica gel cover 40 sets up in a terminal side groove 201 of second apron 20, after first apron 10, second apron 20, printed circuit board 30 assembled corresponding position, microphone component 301 with silica gel cover 40 laminates, and silica gel cover 40 can well play syllable-dividing effect, just so makes microphone component 301 obtain effective suppression at the inside echo of earphone subassembly.
As a further optional embodiment, the earphone assembly further comprises: a horn 50, a first front cover 60, and a second front cover 70;
the first front cover 60 is connected with the second front cover 70, and the first front cover 60 is connected with the second front cover 70 to form a structure containing a second empty groove, and the horn 50 is arranged in the second empty groove;
the speaker 50 is connected to the printed circuit board 30.
As described above, in the embodiment of the present application, the other end of the printed circuit board 30 is connected to the speaker 50 at the front end of the earphone, and the microphone element 301 and the speaker 50 are arranged at a longer distance, so that the interference effect of echo brought to the earphone can be avoided as much as possible, and the user experience can be effectively improved. The front end of the earphone, specifically, the part formed by the first front cover 60 and the second front cover 70, that is, the part of the shell of the earplug, likewise, the first front cover 60 and the second front cover 70 may also be arranged in a detachable snap-fit manner.
As a further optional embodiment, the earphone assembly further comprises: a battery 80;
the battery 80 is disposed in the second empty groove.
In the embodiment of the present application, considering that the space inside the earphone is limited, the battery 80 in the earphone can be placed in the front end portion of the earphone, i.e. the second empty slot formed after the first front cover 60 and the second front cover 70 are connected, so as to reduce the volume of the earphone as much as possible, achieve miniaturization, and facilitate carrying by the user.
Referring to fig. 3, as a further alternative embodiment, an annular protrusion 401 is disposed on the silicone sleeve 40;
the microphone element 301 is attached to the annular protrusion 401.
In the embodiment of the present application, the annular protrusion 401 on the silica gel sleeve 40 is further adopted to attach the microphone element 301, so as to limit the echo formed inside the earphone assembly, reduce the noise interference at the loudspeaker 50, and improve the use experience of the user.
Referring to fig. 4, as a further alternative embodiment, a microphone hole 202 is provided on the second cover plate 20.
In the embodiment of the application, the echo formed inside the microphone and earphone assembly can be effectively limited without glue, the noise interference at the position of the earphone loudspeaker 50 is reduced, and the use experience of a user is improved. And the structure is simple and easy to produce, defective products caused by blocking microphone holes by glue in the existing product are reduced, and the quality and the production efficiency of the product are improved.
The embodiment of the application also provides an earphone which comprises the earphone component in the embodiment.
It can be seen that, the contents in the above-mentioned embodiment of the earphone assembly are all applicable to this embodiment of the earphone, the functions specifically implemented in this embodiment of the earphone assembly are the same as those in the above-mentioned embodiment of the earphone assembly, and the beneficial effects achieved by this embodiment of the earphone assembly are also the same as those achieved by the above-mentioned embodiment of the earphone assembly.
The embodiment of the application also provides a mobile terminal which comprises the earphone in the embodiment.
Similarly, the contents in the foregoing embodiment of the earphone assembly are all applicable to this embodiment of the mobile terminal, and the functions specifically implemented in this embodiment of the mobile terminal are the same as those in the foregoing embodiment of the earphone assembly, and the beneficial effects achieved by this embodiment of the mobile terminal are also the same as those achieved by the foregoing embodiment of the earphone assembly.
In the description herein, references to the description of "one embodiment," "another embodiment," or "certain embodiments," etc., mean that a particular feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of the invention. In this specification, schematic representations of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the particular features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples.
While embodiments of the present invention have been shown and described, it will be understood by those of ordinary skill in the art that: various changes, modifications, substitutions and alterations can be made to the embodiments without departing from the principles and spirit of the invention, the scope of which is defined by the claims and their equivalents.
Claims (8)
1. An earphone assembly, comprising: the device comprises a first cover plate, a second cover plate, a printed circuit board and a silica gel sleeve;
the first cover plate is connected with the second cover plate, a structure containing a first empty groove is formed after the first cover plate is connected with the second cover plate, and the printed circuit board is arranged in the first empty groove;
a square groove is formed in one end of the second cover plate, and the silica gel sleeve is arranged in the square groove;
and a microphone element is arranged at one end of the printed circuit board and is attached to the silica gel sleeve.
2. The earphone assembly of claim 1 wherein: the first cover plate is detachably connected with the second cover plate.
3. The earphone assembly of claim 1 further comprising: the loudspeaker, the first front cover and the second front cover;
the first front cover is connected with the second front cover, a structure containing a second empty groove is formed after the first front cover is connected with the second front cover, and the horn is arranged in the second empty groove;
the loudspeaker is connected with the printed circuit board.
4. The earphone assembly of claim 3 further comprising: a battery;
the battery is arranged in the second empty groove.
5. The earphone assembly of claim 1 wherein: an annular bulge is arranged on the silica gel sleeve;
the microphone element is attached to the annular protrusion.
6. The earphone assembly of claim 1 wherein: and a microphone hole is formed in the second cover plate.
7. An earphone, characterized by: comprising an earphone assembly as claimed in any one of claims 1-6.
8. A mobile terminal, characterized by: comprising the headset of claim 7.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202020369224.0U CN211702332U (en) | 2020-03-20 | 2020-03-20 | Earphone assembly, earphone and mobile device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202020369224.0U CN211702332U (en) | 2020-03-20 | 2020-03-20 | Earphone assembly, earphone and mobile device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN211702332U true CN211702332U (en) | 2020-10-16 |
Family
ID=72779669
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202020369224.0U Expired - Fee Related CN211702332U (en) | 2020-03-20 | 2020-03-20 | Earphone assembly, earphone and mobile device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN211702332U (en) |
-
2020
- 2020-03-20 CN CN202020369224.0U patent/CN211702332U/en not_active Expired - Fee Related
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20201016 |