CN211702030U - Internet of things cross-network communication module - Google Patents
Internet of things cross-network communication module Download PDFInfo
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- CN211702030U CN211702030U CN201922244290.5U CN201922244290U CN211702030U CN 211702030 U CN211702030 U CN 211702030U CN 201922244290 U CN201922244290 U CN 201922244290U CN 211702030 U CN211702030 U CN 211702030U
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Abstract
The utility model discloses a network communication module is striden to thing networking, communication module includes following module: the communication module sends a control signal to the eSIM integrated component, communication data and the eSIM integrated component send communication data in two directions, the eSIM is adopted to replace the SIM, the eSIM has the advantages of smaller size, firmer assembly mode and longer service life, OTA (over the air number writing management) is adopted, people do not need to go far or dangerous areas to replace oxidized SIM cards or change tariff packages at the end of the Internet of things, remote equipment is upgraded, OTA technology of the eSIM can be completely used for realizing data interaction between the eSIM and the communication module by adopting a power supply cutting mode, and the communication module only needs to open 1 pin interface to complete switching control.
Description
Technical Field
The utility model relates to a thing networking communication module of striding.
Background
The internet of things eSIM has just opened a data license plate in China, eSIM terminals are very few, only two eSIM internet of things terminals (intelligent smoke sense and intelligent geomagnetism) are connected in the prior art, due to the unique technical advantages of the eSIM, the future internet of things equipment is gradually changed from SIM to eSIM, and in use, the network intensity needs to be adapted to the operator according to the current network condition in order to ensure that the internet of things equipment is continuously stable and does not drop the line in actual use because the network layout strategies of each operator are different.
At present, the conversion of the traditional double SIM card chips is also realized by using an MCU microprocessor, and the data transmission is realized by adopting a multi-serial port module, so that the data delay is long in the transmission process, and the difficulty is high in case that the SIM card chips need to be replaced.
SUMMERY OF THE UTILITY MODEL
In order to solve the technical problem, the utility model provides a thing networking communication module across networks.
The utility model discloses a following technical scheme can realize.
The utility model provides a pair of thing networking communication module of striding, including power VCC, communication module, the integrated subassembly of eSIM, the power VCC supplies power to the integrated subassembly of eSIM, and the communication module sends control signal and communication data and the two-way communication data that sends of the integrated subassembly of eSIM to the integrated subassembly of eSIM.
The eSIM chip A, eSIM chip B model was ST33G1M 2.
The communication module comprises a wireless communication module U1A, a resistor R10, a diode D10, a triode Q1 and a switched capacitor SC, wherein a pin 15 of the wireless communication module U1A is connected with a cathode of a diode D10, a pin 17 of the wireless communication module U1A is connected with a base electrode of the triode Q1, an emitter of the triode Q1 is grounded, a collector of a triode Q1 is connected with one end of the resistor R10, the other end of the resistor R10 is connected with a power supply VCC, pins 53 and 54 of the wireless communication module U1A are respectively connected with two ends of the switched capacitor SC, pins 45 and 46 of the wireless communication module U1A are respectively connected with the power supply VCC, pins 47 and 48 of the wireless communication module U1A are grounded after short circuit, and pins 51 and 52 of the wireless communication module U1A are grounded after short circuit;
the pin 39 of the wireless communication module U1A is connected to one end of a resistor R1 and one end of a resistor R2, respectively, the other end of the resistor R1 is connected to pin 1 of the eSIM chip a, and the other end of the resistor R2 is connected to pin 1 of the eSIM chip B.
The eSIM integrated component comprises a gating chip U2, an eSIM chip A, eSIM chip B, resistors R1-R9, a triode Q2, capacitors C1-C10 and diodes D1-D8, wherein a pin 1 of the gating chip U2 is respectively connected with a cathode of a diode D8 and a pin 6 of the eSIM chip B, a pin 2 of the gating chip U2 is respectively connected with a pin 6 of the eSIM chip A and one end of a capacitor C9, the other end of the capacitor C9 is grounded, a pin 3 of the gating chip U2 is respectively connected with a cathode of a diode D5 and a pin 0 of the eSIM chip B, a pin 4 of the gating chip U2 is respectively connected with a pin 38 of a wireless communication module U1A, a pin 5 of the gating chip U2 is respectively connected with a cathode of the diode D2 and a pin 0 of the eSIM chip A, a pin 9 of the gating chip U2 is respectively connected with a pin 36 of the wireless communication module U1 2 and one end of the resistor R2, the other end of the resistor Q2 is connected with a base of the triode 2, and a base of the triode 3611, a collector of the triode Q2 is connected with one end of a resistor R8, the other end of the resistor R8 is connected with a power supply VCC, a pin 12 of a gating chip U2 is connected with a cathode of a diode D3 and one end of a resistor R6 respectively, the other end of the resistor R6 is connected with a pin 2 of an eSIM chip a, a pin 13 of a gating chip U2 is connected with one end of a resistor R5, one end of a resistor R7 and a cathode of a diode D7 respectively, the other end of the resistor R7 is connected with a pin 2 of an eSIM chip B, a pin 14 of the gating chip U2 is connected with a pin 41 of a wireless communication module U1A, a pin 15 of the gating chip U2 is connected with a pin 40 of a wireless communication module U1A and one end of a resistor R3 respectively, and pins 6 and 16 of;
diodes D1-D4 share a common anode, the anode is connected with a power supply VCC, the cathode of the diode D2 is connected with the node between the resistor R1 and the pin 1 of the eSIM chip A, the node is connected with one end of a capacitor C1, the other end of the capacitor C1 is connected with a grounding point and one end of a capacitor C2 respectively, the other end of the capacitor C2 is connected with a node between a resistor R2 and an eSIM chip B, the other ends of resistors R3-R5 are connected with a power supply VCC respectively, the two ends of the capacitor C3 are connected with pins 0 and 4 of the eSIM chip A respectively, a capacitor C4 is connected in parallel with the two ends of a capacitor C3, one end of a capacitor C5 is connected with a node between a resistor R6 and the eSIM chip A, the other end of a capacitor C5 is connected with one end of a capacitor C7, the other end of a capacitor C7 is connected with pin 0 of the eSIM chip B, a capacitor C6 is connected in parallel with the two ends of the capacitor C7, one end of a capacitor C8 is connected with a node between the resistor R7 and the eSIM chip B;
the diodes D5-D8 share the anode, the anode is grounded, and the cathodes of the diodes D5 and D6 are respectively connected with the pin 0 and the pin 1 of the eSIM chip B;
the 4 pins of the eSIM chip A, eSIM, chip B, are each connected to ground.
The wireless communication module U1A model is BC95, the gating chip U2 model is CD4053, and the triode Q1 and the triode Q2 model are both 2N 3904.
The beneficial effects of the utility model reside in that:
the utility model discloses adopt the eSIM to replace SIM at first, the eSIM advantage lies in having smaller volume, more firm assembly methods, longer life to and OTA (overhead number writing management), need not personnel to go to remote or dangerous area change oxidation SIM card or change the price package at the thing networking end, remote equipment upgrades, can use the OTA technique realization of eSIM completely;
the utility model discloses combine communication module LPA firmware package (UNICOM's definition standardization firmware package), can pass through the remote monitoring network environment, automatic switching communication operator adaptation optimum network intensity;
the utility model discloses a standardized module product, can quick adaptation transform all kinds of thing networking terminal products of upgrading;
the utility model selects the CD4053 chip for signal selection, which is convenient for the expansion of two operators to the cross network, and the CD4053 chip is a high-speed gating chip, thus ensuring the lowest switching delay influence;
the utility model discloses a data interaction between eSIM and the communication module is realized to power supply cutting mode, and the advantage lies in that communication module only need open 1 pin interface and accomplishes switching control.
Drawings
FIG. 1 is a flow diagram of the present invention;
fig. 2 is a schematic circuit diagram of the present invention.
Detailed Description
The technical solution of the present invention is further described below, but the scope of the claimed invention is not limited to the described.
In order to make the objects, technical solutions and advantages of the present invention clearer, the present invention will be described in detail with reference to the accompanying drawings and specific embodiments.
The utility model provides a thing networking cross-network communication module and communication mode, includes power VCC, communication module, the integrated subassembly of eSIM, and power VCC supplies power to the integrated subassembly of eSIM, and the communication module sends control signal and communication data and the two-way communication data that send of the integrated subassembly of eSIM to the integrated subassembly of eSIM.
The eSIM chip A, eSIM chip B model was ST33G1M 2.
The operator eSIM equipment management platform adopts an OC platform, the communication protocol can adopt a coach protocol, the same equipment management platform can improve the consistency of the transmission protocol at the communication module side, and the resource loss in the communication module is reduced.
The communication module comprises a wireless communication module U1A, a resistor R10, a diode D10, a triode Q1 and a switched capacitor SC, wherein a pin 15 of the wireless communication module U1A is connected with a cathode of the diode D10, a pin 17 of the wireless communication module U1A is connected with a base electrode of the triode Q1, an emitter of the triode Q1 is grounded, a collector of the triode Q1 is connected with one end of the resistor R10, the other end of the resistor R10 is connected with a power supply VCC, pins 53 and 54 of the wireless communication module U1A are respectively connected with two ends of the switched capacitor SC, pins 45 and 46 of the wireless communication module U1A are respectively connected with the power supply VCC, pins 47 and 48 of the wireless communication module U1A are grounded after short circuit, and pins 51 and 52 of the wireless communication module U1A are grounded after short circuit;
the pin 39 of the wireless communication module U1A is connected to one end of a resistor R1 and one end of a resistor R2, respectively, the other end of the resistor R1 is connected to pin 1 of the eSIM chip a, and the other end of the resistor R2 is connected to pin 1 of the eSIM chip B.
The eSIM integrated component comprises a gating chip U2, an eSIM chip A, eSIM chip B, resistors R1-R9, a triode Q2, capacitors C1-C10 and diodes D1-D8, wherein a pin 1 of the gating chip U2 is respectively connected with a cathode of a diode D8 and a pin 6 of the eSIM chip B, a pin 2 of the gating chip U2 is respectively connected with one ends of a pin 6 of the eSIM chip A and a pin C9 of the eSIM chip A, the other end of the capacitor C9 is grounded, a pin 3 of the gating chip U2 is respectively connected with a cathode of a diode D5 and a pin 0 of the eSIM chip B, a pin 4 of the gating chip U2 is respectively connected with a pin 38 of a wireless communication module U1A, a pin 5 of the gating chip U2 is respectively connected with a cathode of the diode D2 and a pin 0 of the eSIM chip A, a pin 9 of the gating chip U2 is respectively connected with a pin 36 of the wireless communication module U1 2 and one end of the resistor R2, the other end of the resistor Q2 is connected with a base of the triode 2, and a, the collector of a triode Q2 is connected with one end of a resistor R8, the other end of a resistor R8 is connected with a power supply VCC, a pin 12 of a gating chip U2 is respectively connected with a cathode of a diode D3 and one end of a resistor R6, the other end of a resistor R6 is connected with a pin 2 of an eSIM chip A, a pin 13 of the gating chip U2 is respectively connected with one end of a resistor R5, one end of a resistor R7 and a cathode of a diode D7, the other end of the resistor R7 is connected with a pin 2 of an eSIM chip B, a pin 14 of the gating chip U2 is connected with a pin 41 of a wireless communication module U1A, a pin 15 of the gating chip U2 is respectively connected with a pin 40 of a wireless communication module U1A and one end of a resistor R3, pins 6 and 16 of the gating chip U2 are respectively connected with the power supply VCC, the gating chip U2 is a high-speed gating chip CD 4053.
Diodes D1-D4 share a common anode, the anode is connected with a power supply VCC, the cathode of the diode D2 is connected with the node between the resistor R1 and the pin 1 of the eSIM chip A, the node is connected with one end of a capacitor C1, the other end of the capacitor C1 is connected with a grounding point and one end of a capacitor C2 respectively, the other end of the capacitor C2 is connected with a node between a resistor R2 and an eSIM chip B, the other ends of resistors R3-R5 are connected with a power supply VCC respectively, the two ends of the capacitor C3 are connected with pins 0 and 4 of the eSIM chip A respectively, a capacitor C4 is connected in parallel with the two ends of a capacitor C3, one end of a capacitor C5 is connected with a node between a resistor R6 and the eSIM chip A, the other end of a capacitor C5 is connected with one end of a capacitor C7, the other end of a capacitor C7 is connected with pin 0 of the eSIM chip B, a capacitor C6 is connected in parallel with the two ends of the capacitor C7, one end of a capacitor C8 is connected with a node between the resistor R7 and the eSIM chip B;
the diodes D5-D8 share the anode, the anode is grounded, and the cathodes of the diodes D5 and D6 are respectively connected with the pin 0 and the pin 1 of the eSIM chip B;
the 4 pins of the eSIM chip A, eSIM, chip B, are each connected to ground.
The model of the wireless communication module U1A is BC95, the model of the gating chip U2 is CD4053, and the models of the triode Q1 and the triode Q2 are both 2N 3904.
The utility model discloses a theory of operation is: the method comprises the steps that a communication module and an eSIM integrated component are powered on, the communication module starts to work, an operator eSIM chip A is started, the communication module sends a control signal to the eSIM integrated component, the eSIM integrated component sends communication data to the communication module, the communication module accesses the network and checks the CSQ value of the current network, if the CSQ value is larger than 16, the communication module extracts eSIM chip authentication information and sends the eSIM chip authentication information to a core network platform side, authentication is executed, and then terminal service is executed; if the CSQ value is smaller than 16, the communication module judges the current control signal, and when the level is 1, the operator eSIM chip A is started; when the level is 0, an operator eSIM chip B is started; after the operator eSIM chip is started, the communication module sends a control signal to the eSIM integrated component; the eSIM integrated component sends communication data to the communication module; the communication module accesses the network and checks the current network, and the step S6 is repeated; and fusing the Unicom LPA firmware package to complete the downloading of the standard execution control logic, and completing the conversion by the dual-operator eSIM chip.
Claims (4)
1. The utility model provides a thing networking communication module of striding net which characterized in that: the communication module sends a control signal to the eSIM integrated component, and the communication data and the eSIM integrated component send communication data in a two-way mode.
2. The internet-of-things cross-network communication module of claim 1, wherein: the eSIM chip is a micro-control chip packaged with MFF2 and provided with a UICC solution.
3. The internet-of-things cross-network communication module of claim 1, wherein: the communication module comprises a wireless communication module U1A, a resistor R10, a diode D10, a triode Q1 and a switched capacitor SC, wherein a pin 15 of the wireless communication module U1A is connected with a cathode of a diode D10, a pin 17 of the wireless communication module U1A is connected with a base electrode of the triode Q1, an emitter of the triode Q1 is grounded, a collector of a triode Q1 is connected with one end of the resistor R10, the other end of the resistor R10 is connected with a power supply VCC, pins 53 and 54 of the wireless communication module U1A are respectively connected with two ends of the switched capacitor SC, pins 45 and 46 of the wireless communication module U1A are respectively connected with the power supply VCC, pins 47 and 48 of the wireless communication module U1A are grounded after short circuit, and pins 51 and 52 of the wireless communication module U1A are grounded after short circuit;
the pin 39 of the wireless communication module U1A is connected to one end of a resistor R1 and one end of a resistor R2, respectively, the other end of the resistor R1 is connected to pin 1 of the eSIM chip a, and the other end of the resistor R2 is connected to pin 1 of the eSIM chip B.
4. The internet-of-things cross-network communication module of claim 1, wherein: the eSIM integrated component comprises a gating chip U2, an eSIM chip A, eSIM chip B, resistors R1-R9, a triode Q2, capacitors C1-C10 and diodes D1-D8, wherein a pin 1 of the gating chip U2 is respectively connected with a cathode of a diode D8 and a pin 6 of the eSIM chip B, a pin 2 of the gating chip U2 is respectively connected with a pin 6 of the eSIM chip A and one end of a capacitor C9, the other end of the capacitor C9 is grounded, a pin 3 of the gating chip U2 is respectively connected with a cathode of a diode D5 and a pin 0 of the eSIM chip B, a pin 4 of the gating chip U2 is respectively connected with a pin 38 of a wireless communication module U1A, a pin 5 of the gating chip U2 is respectively connected with a cathode of the diode D2 and a pin 0 of the eSIM chip A, a pin 9 of the gating chip U2 is respectively connected with a pin 36 of the wireless communication module U1 2 and one end of the resistor R2, the other end of the resistor Q2 is connected with a base of the triode 2, and a base of the triode 3611, a collector of the triode Q2 is connected with one end of a resistor R8, the other end of the resistor R8 is connected with a power supply VCC, a pin 12 of a gating chip U2 is connected with a cathode of a diode D3 and one end of a resistor R6 respectively, the other end of the resistor R6 is connected with a pin 2 of an eSIM chip a, a pin 13 of a gating chip U2 is connected with one end of a resistor R5, one end of a resistor R7 and a cathode of a diode D7 respectively, the other end of the resistor R7 is connected with a pin 2 of an eSIM chip B, a pin 14 of the gating chip U2 is connected with a pin 41 of a wireless communication module U1A, a pin 15 of the gating chip U2 is connected with a pin 40 of a wireless communication module U1A and one end of a resistor R3 respectively, and pins 6 and 16 of;
diodes D1-D4 share a common anode, the anode is connected with a power supply VCC, the cathode of the diode D2 is connected with the node between the resistor R1 and the pin 1 of the eSIM chip A, the node is connected with one end of a capacitor C1, the other end of the capacitor C1 is connected with a grounding point and one end of a capacitor C2 respectively, the other end of the capacitor C2 is connected with a node between a resistor R2 and an eSIM chip B, the other ends of resistors R3-R5 are connected with a power supply VCC respectively, the two ends of the capacitor C3 are connected with pins 0 and 4 of the eSIM chip A respectively, a capacitor C4 is connected in parallel with the two ends of a capacitor C3, one end of a capacitor C5 is connected with a node between a resistor R6 and the eSIM chip A, the other end of a capacitor C5 is connected with one end of a capacitor C7, the other end of a capacitor C7 is connected with pin 0 of the eSIM chip B, a capacitor C6 is connected in parallel with the two ends of the capacitor C7, one end of a capacitor C8 is connected with a node between the resistor R7 and the eSIM chip B;
the diodes D5-D8 share the anode, the anode is grounded, and the cathodes of the diodes D5 and D6 are respectively connected with the pin 0 and the pin 1 of the eSIM chip B;
the 4 pins of the eSIM chip A, eSIM, chip B, are each connected to ground.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201922244290.5U CN211702030U (en) | 2019-12-13 | 2019-12-13 | Internet of things cross-network communication module |
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| Application Number | Priority Date | Filing Date | Title |
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| CN201922244290.5U CN211702030U (en) | 2019-12-13 | 2019-12-13 | Internet of things cross-network communication module |
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| CN211702030U true CN211702030U (en) | 2020-10-16 |
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