CN211701888U - Thermoelectric power generation device utilizing waste heat - Google Patents
Thermoelectric power generation device utilizing waste heat Download PDFInfo
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- CN211701888U CN211701888U CN202020378163.4U CN202020378163U CN211701888U CN 211701888 U CN211701888 U CN 211701888U CN 202020378163 U CN202020378163 U CN 202020378163U CN 211701888 U CN211701888 U CN 211701888U
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- waste heat
- semiconductor chip
- heat dissipation
- heat
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Abstract
The utility model relates to an utilize thermoelectric generation device of used heat, related to thermoelectric generation device technical field, it is general to have solved thermoelectric generation structure radiating effect for the temperature difference at the both ends of semiconductor is inhomogeneous, the lower problem of generating efficiency, including mount pad and waste heat recovery device, be provided with semiconductor chip group on the mount pad, semiconductor chip group's upper portion is fixed with the high temperature end piece, and heat dissipation channel has been seted up to the mount pad, and heat dissipation channel internal fixation has the radiating basal plate, and a plurality of wind-guiding grooves have been seted up in week side of mount pad, and the inner wall of mount pad is pasted and is had a plurality of heat radiation fins. The utility model discloses utilize radiating basal plate and heat dissipation channel to dispel the heat to the heat of the semiconductor chip group other end, strengthen the radiating effect through wind-guiding groove and heat radiation fins to the difference in temperature at guarantee semiconductor chip group both ends is stable, and the generating effect is better, and the generating efficiency is higher.
Description
Technical Field
The utility model belongs to the technical field of the thermoelectric generation device technique and specifically relates to an utilize thermoelectric generation device of used heat.
Background
Thermoelectric power generation is a new power generation technology, and utilizes the seebeck effect to realize power generation, the seebeck effect refers to a thermoelectric phenomenon that the voltage difference between two substances is caused by the temperature difference of two different electric conductors or semiconductors, a complex equipment device is not needed, the temperature difference is applied to the two ends of the semiconductor, and the semiconductor can generate electric energy with certain power through the temperature difference.
In the prior art, the total combustion energy of various semiconductor thermoelectric generators, particularly in the automobile industry, is 30% of the total combustion energy of automobiles due to the kinetic energy of the generators and 40% of the total combustion energy of the automobiles is dissipated in the air in the form of automobile exhaust, so that the energy is fully utilized, the heat of the automobile exhaust is recycled through thermoelectric generation, and the energy is saved.
SUMMERY OF THE UTILITY MODEL
Not enough to prior art exists, one of the purposes of the utility model is to provide and to carry out recycle to car tail gas heat, have better radiating effect, the used heat's of generating efficiency a kind of utilization thermoelectric generation device that promotes to some extent.
The above utility model discloses an above-mentioned utility model purpose can realize through following technical scheme:
a thermoelectric power generation device utilizing waste heat comprises a mounting seat and a waste heat recovery device, wherein a semiconductor chip set is arranged on the mounting seat, a high-temperature end piece connected with the waste heat recovery device is fixed on the upper portion of the semiconductor chip set, a heat dissipation channel is formed in the mounting seat under the semiconductor chip set, a heat dissipation substrate fixed with the semiconductor chip set is fixed in the heat dissipation channel, a plurality of air guide grooves communicated with the interior of the heat dissipation channel are formed in the peripheral side of the mounting seat, and a plurality of heat dissipation fins are adhered to the inner wall of the mounting seat.
By adopting the technical scheme, in the application process, the waste heat of automobile exhaust is transferred to the high-temperature end piece through the waste heat recovery device, the high temperature generated by the high-temperature end piece enables the two sides of the semiconductor chip set to generate temperature difference, meanwhile, the heat of the other end of the semiconductor chip set is radiated by the heat radiation substrate and the heat radiation channel, and the heat radiation effect is enhanced through the air guide groove and the heat radiation fins, so that the temperature difference at the two ends of the semiconductor chip set is stable, the power generation effect is better, and the power generation efficiency is higher.
The present invention may be further configured in a preferred embodiment as: the area of the mounting seat close to the semiconductor chip group is larger than that of the semiconductor chip group, and one end of the heat dissipation channel close to the semiconductor chip group penetrates through the mounting seat.
By adopting the technical scheme, the heat dissipation channel is in a state that two ends of the heat dissipation channel penetrate through, the penetrating heat conveying channel is formed, air flowing type heat dissipation is formed, transfer type heat dissipation is reduced, and therefore the heat dissipation effect is enhanced.
The present invention may be further configured in a preferred embodiment as: the air guide grooves and the radiating fins are arranged at equal intervals in a crossed mode.
By adopting the technical scheme, heat flowing between the adjacent radiating fins can conveniently penetrate out of the air guide groove, and meanwhile, air flow in the air guide groove can conveniently cool the radiating fins.
The present invention may be further configured in a preferred embodiment as: the bottom of mount pad is connected with a plurality of heat dissipation fan blades through the support rotation.
Through adopting the technical scheme, will the utility model discloses carry on back to the car on, the car removes the in-process, and the air current drive heat dissipation fan blade through flowing rotates, and then strengthens radiating effect in the heat dissipation channel.
The present invention may be further configured in a preferred embodiment as: and temperature sensors are fixed at one end of the mounting seat close to the high-temperature end piece and on the inner wall of the heat dissipation channel.
By adopting the technical scheme, the heat values at the two ends of the semiconductor chip set can be conveniently detected in real time by utilizing the temperature sensor. Facilitating data recording and adjustment.
The present invention may be further configured in a preferred embodiment as: the waste heat recovery device comprises a waste heat recovery box, a heat collector connected with the high-temperature end piece is fixed in the waste heat recovery box, and an air outlet pipe and an air inlet pipe communicated with an automobile exhaust pipe are respectively fixed at two ends of the waste heat recovery box.
Through adopting above-mentioned technical scheme, automobile exhaust passes through the intake pipe and gets into in the waste heat recovery case, retrieves and transmits to the high temperature end piece through the heat collector heat in to the tail gas, and automobile exhaust after the filtration passes through the outlet duct and discharges.
The present invention may be further configured in a preferred embodiment as: and a filter screen is fixed in the waste heat recovery tank.
By adopting the technical scheme, the automobile exhaust is less damaged to the heat collector after being filtered by the filter screen.
The present invention may be further configured in a preferred embodiment as: the intake pipe with the week side of outlet duct all is equipped with the governing valve.
Through adopting above-mentioned technical scheme, be convenient for according to the ambient temperature condition, utilize the governing valve to adjust the air output of intake pipe and outlet duct to adjust the heat temperature of retrieving in the heat collector.
To sum up, the utility model discloses a following at least one kind benefits technological effect:
1. automobile exhaust enters the waste heat recovery tank through the air inlet pipe, heat in the exhaust is recovered through the heat collector and is transferred to the high-temperature end piece, and the filtered automobile exhaust is discharged through the air outlet pipe, so that the heat recovery of the automobile exhaust is realized;
2. the heat dissipation substrate and the heat dissipation channel are utilized to dissipate heat of the other end of the semiconductor chip set, and the heat dissipation effect is enhanced through the air guide groove, the heat dissipation fins and the heat dissipation fan blades, so that the temperature difference at two ends of the semiconductor chip set is stable, the power generation effect is better, and the power generation efficiency is higher.
Drawings
Fig. 1 is a first schematic structural diagram of the present invention;
FIG. 2 is a second schematic structural diagram of the present invention;
FIG. 3 is a cross-sectional view taken along line A-A of FIG. 2;
fig. 4 is a sectional view taken along line B-B in fig. 1.
Reference numerals: 1. a mounting seat; 2. a semiconductor chip set; 3. a high temperature end piece; 4. a heat dissipation channel; 5. a heat-dissipating substrate; 6. a wind guide groove; 7. heat dissipation fins; 8. a heat dissipation fan blade; 9. a temperature sensor; 10. a waste heat recovery tank; 11. a heat collector; 12. an air outlet pipe; 13. an air inlet pipe; 14. filtering with a screen; 15. and adjusting the valve.
Detailed Description
The present invention will be described in further detail with reference to the accompanying drawings.
Referring to fig. 1 and 2, for the utility model discloses an utilize thermoelectric generation device of used heat, including mount pad 1 and waste heat recovery device, mount pad 1 is cylindric setting, and waste heat recovery device includes waste heat recovery case 10. Referring to fig. 3, a heat collector 11 connected with the high-temperature end piece 3 is fixed in the waste heat recovery tank 10, an air outlet pipe 12 and an air inlet pipe 13 communicated with an automobile exhaust pipe are respectively fixed at two ends of the waste heat recovery tank 10, the air inlet pipe 13 and the air outlet pipe 12 are both communicated with the interior of the waste heat recovery tank 10, a filter screen 14 is fixed in the waste heat recovery tank 10, and the filter screen 14 is located between the air inlet pipe 13 and the heat collector 11. Automobile exhaust passes through intake pipe 13 and gets into in the waste heat recovery case 10, retrieves and transmits to high temperature end piece 3 through heat collector 11 to the heat in the exhaust, and automobile exhaust after filter 14 filters passes through outlet duct 12 and discharges.
Referring to fig. 1 and 3, the intake pipe 13 and the outlet pipe 12 are provided with regulating valves on the circumferential sides. 15 the gas output of the gas inlet pipe 13 and the gas outlet pipe 12 can be adjusted by the adjusting valve according to the external temperature, thereby adjusting the temperature of the heat recovered in the heat collector 11.
The semiconductor chip set 2 is arranged on the mounting seat 1, the cross sectional area of the mounting seat 1 is larger than the overall surface area of the semiconductor chip set 2, the high-temperature end piece 3 connected with the heat collector 11 is fixed on the upper portion of the semiconductor chip set 2, and the high-temperature end piece 3 is arranged in a cuboid pile. The temperature difference is formed on the semiconductor chip group 2 by the high-temperature end piece 3, so that the conductive function of the semiconductor chip group 2 is realized.
The mounting seat 1 is provided with a heat dissipation channel 4 under the semiconductor chip set 2, two ends of the heat dissipation channel 4 are arranged by penetrating through the mounting seat 1, a heat dissipation substrate 5 fixed with the semiconductor chip set 2 is fixed in the heat dissipation channel 4, the heat dissipation substrate 5 is tightly attached to the semiconductor chip set 2, a plurality of air guide grooves 6 communicated with the inside of the heat dissipation channel 4 are formed in the peripheral side of the mounting seat 1, and a plurality of heat dissipation fins 7 are adhered to the inner wall of the mounting seat 1. Referring to fig. 4, the air guide grooves 6 and the heat dissipation fins 7 are arranged in an axial direction of the mounting base 1, and the plurality of air guide grooves 6 and the plurality of heat dissipation fins 7 are arranged at equal intervals in a crossing manner. The heat dissipation channel 4 forms a through heat delivery channel, the air guide groove 6 is combined to form air flow type heat dissipation in the heat dissipation channel 4, and the transmission type heat dissipation is further reduced through the heat dissipation fins 7, so that the heat dissipation effect is enhanced, the air guide groove 6 and the heat dissipation fins 7 which are arranged in a crossed and equidistant mode are convenient for heat flowing between the adjacent heat dissipation fins 7 to penetrate out of the air guide groove 6, and meanwhile, the air flow in the air guide groove 6 is convenient for cooling the heat dissipation fins 7.
Referring to fig. 1, the bottom end of the mounting base 1 is rotatably connected with a plurality of heat dissipation fan blades 8 through a support. Will the utility model discloses carry on back to the car on, the car removes the in-process, and the air current drive heat dissipation fan blade 8 through flowing rotates, and then strengthens radiating effect in the heat dissipation channel 4.
A temperature sensor 9 is fixed on one end of the mounting seat 1 close to the high-temperature end piece 3 and the inner wall of the heat dissipation channel 4. The temperature sensor 9 is used for detecting the heat value at two ends of the semiconductor chip set 2 in real time conveniently. Facilitating data recording and adjustment.
The implementation principle of the embodiment is as follows:
in the application, automobile exhaust passes through intake pipe 13 and inputs in the waste heat recovery case 10, filter through filter screen 14, rethread heat collector 11 shifts the heat to high temperature end piece 3 on, the high temperature that high temperature end piece 3 produced makes 2 both sides of semiconductor chip group produce the difference in temperature, realize the current circulation of 2 both ends points of semiconductor chip group, utilize heat dissipation substrate 5 simultaneously, heat dissipation channel 4 dispels the heat to the heat of 2 other ends of semiconductor chip group, strengthen the radiating effect through wind-guiding groove 6 and heat radiation fins 7, thereby the difference in temperature at guarantee 2 both ends of semiconductor chip group is stable, the generating effect is better, the generating efficiency is higher.
The embodiment of this specific implementation mode is the preferred embodiment of the present invention, not limit according to this the utility model discloses a protection scope, so: all equivalent changes made according to the structure, shape and principle of the utility model are covered within the protection scope of the utility model.
Claims (8)
1. The thermoelectric power generation device utilizing waste heat is characterized by comprising a mounting seat (1) and a waste heat recovery device, wherein a semiconductor chip set (2) is arranged on the mounting seat (1), a high-temperature end piece (3) connected with the waste heat recovery device is fixed on the upper portion of the semiconductor chip set (2), a heat dissipation channel (4) is formed in the mounting seat (1) under the semiconductor chip set (2), a heat dissipation substrate (5) fixed with the semiconductor chip set (2) is fixed in the heat dissipation channel (4), a plurality of air guide grooves (6) communicated with the interior of the heat dissipation channel (4) are formed in the peripheral side of the mounting seat (1), and a plurality of heat dissipation fins (7) are adhered to the inner wall of the mounting seat (1).
2. The thermoelectric power generation device using waste heat according to claim 1, wherein an area of the mounting base (1) near the semiconductor chip group (2) is larger than an area of the semiconductor chip group (2), and one end of the heat dissipation channel (4) near the semiconductor chip group (2) penetrates the mounting base (1).
3. The thermoelectric power generation device using waste heat as claimed in claim 2, wherein a plurality of the air guide grooves (6) and a plurality of the heat dissipating fins (7) are arranged at equal intervals across each other.
4. The thermoelectric power generation device using waste heat according to claim 1, wherein the bottom end of the mounting base (1) is rotatably connected with a plurality of heat dissipation blades (8) through a bracket.
5. The thermoelectric power generation device using waste heat according to claim 1, wherein a temperature sensor (9) is fixed to one end of the mounting base (1) near the high temperature end piece (3) and an inner wall of the heat dissipation channel (4).
6. The thermoelectric power generation device using waste heat according to claim 1, wherein the waste heat recovery device comprises a waste heat recovery tank (10), a heat collector (11) connected to the high temperature end piece (3) is fixed in the waste heat recovery tank (10), and an air outlet pipe (12) and an air inlet pipe (13) communicated with an automobile exhaust pipe are respectively fixed at two ends of the waste heat recovery tank (10).
7. The thermoelectric power generation device using waste heat according to claim 6, wherein a screen (14) is fixed inside the waste heat recovery tank (10).
8. The thermoelectric power generation device using waste heat according to claim 6, wherein a regulating valve (15) is provided on each of the peripheral sides of the inlet pipe (13) and the outlet pipe (12).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202020378163.4U CN211701888U (en) | 2020-03-23 | 2020-03-23 | Thermoelectric power generation device utilizing waste heat |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202020378163.4U CN211701888U (en) | 2020-03-23 | 2020-03-23 | Thermoelectric power generation device utilizing waste heat |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN211701888U true CN211701888U (en) | 2020-10-16 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202020378163.4U Active CN211701888U (en) | 2020-03-23 | 2020-03-23 | Thermoelectric power generation device utilizing waste heat |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN211701888U (en) |
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2020
- 2020-03-23 CN CN202020378163.4U patent/CN211701888U/en active Active
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| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20230727 Address after: 441002 Room 1108, Unit 2, Building 1, Gushan Building, No. 56, Changhong Road, Fancheng District, Xiangyang, Hubei Province Patentee after: Hubei Tianyang Mechanical and Electrical Engineering Co.,Ltd. Address before: 430040 xujiatai 1 (15), Xinandu office, Dongxihu District, Wuhan City, Hubei Province Patentee before: Wuhan chuhao Construction Engineering Co.,Ltd. |
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| TR01 | Transfer of patent right |