CN211695537U - Refrigerating appliance - Google Patents

Abstract

The utility model relates to a refrigeration appliance, including the box that has the storeroom, the door body, system ice device and distributor, distributor includes passageway and lid, the ice-cube that system ice device made is carried to the passageway, the lid is used for opening or closing the export of passageway, the lid includes semiconductor component, utilize semiconductor component can the one end characteristics of refrigerating one end heating, make its cold junction towards the passageway, the hot junction is the passageway dorsad, the hot junction heats the air conditioning of revealing from the passageway, reduce the possibility that takes place the condensation phenomenon on the lid, the cold junction is used for reducing the temperature of passageway, the cold volume that the cold junction produced simultaneously can enter into inside the refrigeration appliance, improve the holistic work efficiency of refrigeration appliance.

Description

Refrigerating appliance

Technical Field

The application relates to the technical field of household appliances, in particular to a refrigeration appliance.

Background

Along with the improvement of living standard, the refrigerator has become the domestic appliance that people used commonly, and current well high-end refrigerator has the ice machine usually, sets up the upset apron in the exit of ice machine, plugs the ice machine inner chamber through this upset apron, simultaneously, in order to avoid upset apron and apron peripheral temperature to hang down and produce the condensation phenomenon, sets up the heater strip at the upset apron under the normal conditions and improves upset apron and peripheral temperature. However, heat generated by the heating wire arranged on the turnover cover plate can enter the ice maker to affect the quality of ice cubes, and meanwhile, the heating wire can increase the load of the refrigerator and increase the power consumption.

SUMMERY OF THE UTILITY MODEL

The application provides a refrigeration appliance to reduce the risk that cold air flows out from the export and produces the condensation, and reduce power consumption.

The embodiment of the application provides a refrigeration device, includes:

a case including a storage chamber;

a door for opening or closing the storage chamber;

an ice making device provided at the storage compartment;

a dispensing device including a passage for conveying ice pieces made by the ice making device and a cover for opening or closing an outlet of the passage;

the cover body comprises at least one semiconductor assembly, the semiconductor assembly comprises a cold end and a hot end, the cold end absorbs heat, and the hot end releases heat;

the cold end is thermally coupled to a wall of the cover facing the channel, and the hot end is thermally coupled to a wall of the cover facing away from the channel.

The cover body for opening or closing the channel is provided with the semiconductor assembly, and the characteristic that one end of the cover body is used for refrigerating and the other end of the cover body is used for heating is utilized, so that the possibility that condensation phenomenon occurs due to cold air leakage is reduced, and meanwhile, the possibility that heat released by the hot end of the semiconductor assembly enters the ice making device and the refrigerating appliance to influence the working efficiency of the ice making device and the refrigerating appliance can be reduced.

The cover body comprises a cavity, and the semiconductor assembly is arranged in the cavity;

the cavity comprises a first side wall and a second side wall which are oppositely arranged, the first side wall faces the channel, and the second side wall faces away from the channel.

The semiconductor assembly is arranged in the cavity of the cover body, so that the cover body can protect the semiconductor assembly.

The cover body comprises a mounting plate, and the mounting plate is arranged in the cavity and connected with the cover body;

the mounting plate is positioned between the first side wall and the second side wall;

the semiconductor assembly is disposed on the mounting board.

Through setting up the mounting panel so that the installation semiconductor module, reduce the possibility that semiconductor module's position took place the skew, make semiconductor module's cold junction towards first lateral wall, hot junction towards the second lateral wall, improve semiconductor module's work efficiency.

The end cap includes a filler disposed between the cold end and the first sidewall and/or between the hot end and the second sidewall.

Through the inside space of filler in order to fill the lid, can also play heat retaining effect simultaneously, reduce the risk that air conditioning flowed out and heat flowed in.

The cover body comprises a plurality of semiconductor assemblies, and the adjacent semiconductor assemblies are connected with each other.

Through set up a plurality of semiconductor component in the lid to increase the coverage area of cold junction and hot junction to first lateral wall and second lateral wall, improve semiconductor component's work efficiency.

Each semiconductor assembly is arranged in a ring shape.

Through setting up semiconductor component to the circularity, make semiconductor component's distribution even, it is more reasonable to set up the position to improve work efficiency.

The cover body comprises a reinforcing structure, and the reinforcing structure is arranged on the second side wall.

Through setting up additional strengthening to improve the structural strength of lid second lateral wall, reduce the second lateral wall and take place cracked risk because of intensity is not enough, make lid life obtain the extension.

The dispensing device comprises a drive part connected with a housing of the dispensing device;

the cover body is connected with the distribution device through the driving part, and the driving part is used for driving the cover body to move relative to the channel so as to open or close the outlet of the channel.

The driving part is arranged to drive the cover body to move relative to the channel, so that the cover body can open or close the outlet of the channel, and the operation of a user is facilitated.

The driving part comprises a motor and a driving shaft, an output shaft of the motor is connected with the driving shaft, and the driving shaft is connected with the cover body.

Through setting up the motor and the drive shaft of being connected with the lid to the realization is to the automatic control of lid motion, and the person of facilitating the use operates, promotes user's use and experiences.

The driving part comprises a driving plate, and the driving shaft is connected with the cover body through the driving plate;

the drive plate is connected with the second sidewall.

Through setting up the drive plate in order to increase the area of contact of drive shaft and lid, improve the stability that drive shaft and lid are connected.

The technical scheme provided by the application can achieve the following beneficial effects:

the application provides a refrigeration appliance includes: the box, the door body, ice making device and distributor, distributor is including the lid that is used for carrying the passageway of ice-cube and is used for opening or closing the export of passageway, the lid includes semiconductor component, semiconductor component includes cold junction and hot junction, wherein, the cold junction sets up towards the passageway, the hot junction sets up towards the passageway dorsad, the hot junction is used for heating the air conditioning of revealing from the passageway, reduce the possibility that the condensation phenomenon takes place in the vapor contact in air conditioning and the outside air, the cold junction is used for absorbing the heat that the orientation passageway direction of hot junction release flows, with the inside possibility of heat entering ice making device and refrigeration utensil along the passageway, guarantee refrigeration utensil's work efficiency.

It is to be understood that both the foregoing general description and the following detailed description are exemplary and explanatory only and are not restrictive of the application.

Drawings

FIG. 1 is a schematic view of a refrigeration appliance provided in accordance with an embodiment of the present application;

FIG. 2 is a partial cross-sectional view of FIG. 1;

fig. 3 is a schematic structural diagram of a cover and a driving portion according to an embodiment of the present disclosure;

FIG. 4 is a schematic structural diagram of a drive plate of a drive shaft provided in an embodiment of the present application;

FIG. 5 is a schematic view of the structure of FIG. 4 from another perspective;

fig. 6 is a schematic view of a cover provided in an embodiment of the present application;

FIG. 7 is a cross-sectional view taken along line B-B of FIG. 6;

fig. 8 is a schematic view of an internal structure of a cover according to an embodiment of the present disclosure;

fig. 9 is a schematic structural diagram of a semiconductor device according to an embodiment of the present disclosure;

fig. 10 is a schematic diagram of a semiconductor device according to an embodiment of the present disclosure.

Reference numerals:

1-a box body;

11-a storage compartment;

2-a door body;

3-an ice making device;

4-a dispensing device;

41-a housing;

42-channel;

43-a cover;

431-a semiconductor component;

431 a-cold end;

431 b-hot side;

432-a cavity;

433 — a first side wall;

434-a second sidewall;

435-mounting plate;

436-a filler;

437-reinforcing structures;

44-a drive section;

441-motor;

442-a drive shaft;

443-a drive plate;

444-transition section.

The accompanying drawings, which are incorporated in and constitute a part of this specification, illustrate embodiments consistent with the present application and together with the description, serve to explain the principles of the application.

Detailed Description

For better understanding of the technical solutions of the present application, the following detailed descriptions of the embodiments of the present application are provided with reference to the accompanying drawings.

It should be understood that the embodiments described are only a few embodiments of the present application, and not all embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present application.

The terminology used in the embodiments of the present application is for the purpose of describing particular embodiments only and is not intended to be limiting of the application. As used in the examples of this application and the appended claims, the singular forms "a", "an", and "the" are intended to include the plural forms as well, unless the context clearly indicates otherwise.

It should be understood that the term "and/or" as used herein is merely one type of association that describes an associated object, meaning that three relationships may exist, e.g., a and/or B may mean: a exists alone, A and B exist simultaneously, and B exists alone. In addition, the character "/" herein generally indicates that the former and latter related objects are in an "or" relationship.

It should be noted that the terms "upper", "lower", "left", "right", and the like used in the embodiments of the present application are described in terms of the angles shown in the drawings, and should not be construed as limiting the embodiments of the present application. In addition, in this context, it will also be understood that when an element is referred to as being "on" or "under" another element, it can be directly on "or" under "the other element or be indirectly on" or "under" the other element via an intermediate element.

Fig. 1 to 10 show a schematic view of a refrigeration device provided in an embodiment of the present application, in which fig. 1 is a schematic view; FIG. 2 is a partial cross-sectional view of FIG. 1; fig. 3 is a schematic structural diagram of the cover 43 and the driving portion 44 provided in the embodiment of the present application; fig. 4 is a schematic structural diagram of a driving plate 443 of the driving shaft 442 provided in the embodiment of the present application; FIG. 5 is a schematic view of the structure of FIG. 4 from another perspective; fig. 6 is a schematic view of a cover 43 according to an embodiment of the present disclosure; FIG. 7 is a cross-sectional view taken along line B-B of FIG. 6; fig. 8 is a schematic view of an internal structure of the cover 43 according to an embodiment of the present disclosure; fig. 9 is a schematic structural diagram of a semiconductor device 431 according to an embodiment of the present disclosure; fig. 10 is a schematic diagram of a semiconductor device 431 provided in accordance with an embodiment of the present invention.

With the development of technology and the increasing living standard of people, a refrigerator and other refrigeration appliances become common household appliances, and generally, the refrigeration appliance includes an ice making device 3 for making ice cubes, a channel 42 for transporting ice cubes, and a cover 43 for opening or closing an outlet of the channel 42, because the cover 43 cannot achieve complete sealing of the outlet of the channel 42, cold air inside the ice making device 3 leaks out from between the cover 43 and the outlet of the channel 42, the leaked cold air contacts with outside air, so that water vapor in the air is condensed, water drops are generated and attached to one side of the cover 43 far away from the outlet of the channel 42, condensation occurs, the service life of the cover 43 is affected, and therefore, in order to avoid the condensation affecting the service life of the cover 43, the cover 43 needs to be frequently wiped to ensure that the cover 43 is in a dry state, the condensation phenomenon not only brings negative effects to the refrigeration appliance, but also brings inconvenience to the user and influences the use experience of the user.

Under the normal condition, in order to avoid the condensation phenomenon, the inside heat conduction silk that is provided with of lid 43 for the air conditioning that the heating was revealed makes its intensification before air conditioning and the contact of outside air, thereby avoids air conditioning and the steam contact in the air, takes place the condensation phenomenon. However, although the above method solves the condensation phenomenon, the heat released by the heat conducting wires is transferred to the inside of the ice making device 3, so that the temperature inside the ice making device 3 is increased, the workload of the ice making device 3 is increased, and meanwhile, the heat entering the inside of the ice making device 3 melts the ice cubes, thereby affecting the quality of the ice cubes to reduce the user experience, so that the heat conducting wires arranged inside the cover body 43 additionally increase the power consumption of the refrigerator, and reduce the refrigeration of the refrigerator and the working efficiency of the ice making device 3.

In order to solve the technical problem, the embodiment of the present application provides a refrigeration appliance, as shown in fig. 1 to 2, the refrigeration appliance includes a cabinet 1 having a storage chamber 11, a door 2 for opening or closing the storage chamber 11, an ice making device 3 disposed inside the storage chamber 11 for making ice cubes, and a dispensing device 4 for dispensing the ice cubes made by the ice making device 3. The dispensing device 4 comprises a channel 42 for conveying ice cubes and a cover 43 for opening or closing an outlet of the channel 42, wherein the cover 43 is provided with at least one semiconductor assembly 431, the semiconductor assembly 431 comprises a cold end 431a and a hot end 431b, the cold end 431a is arranged towards the channel 42, the hot end 431b is arranged opposite to the channel 42, the cold end 431a is thermally coupled with the wall surface of the cover 43 facing the channel 42 to absorb heat and reduce the temperature in the channel 42, and the hot end 431b is thermally coupled with the wall surface of the cover 43 opposite to the channel 42 to release heat, so that the condensation phenomenon caused by cold air leakage is avoided, meanwhile, cold generated by the cold end 431a can enter the interior of the refrigeration appliance, and the overall working efficiency of the refrigeration appliance is further improved.

In the embodiment that the application provided, can refrigerate by one side through setting up, the semiconductor component 431 that heats by one side solves the condensation phenomenon, when utilizing hot junction 431b to heat the air conditioning of revealing, through the cold junction 431a towards the setting of passageway 42 reduce the heat that hot junction 431b released and get into the risk of the inside of ice making device 3 along passageway 42, thereby improve the work efficiency of ice making device 3, improve the quality of ice-cube, and simultaneously, semiconductor component 431's power is less, reduce the whole load of refrigeration utensil, compare in the scheme environmental protection more that uses the heat conduction silk, accord with the demand of modern life energy saving and emission reduction.

Specifically, as shown in fig. 6 to 8, the cover 43 includes a cavity 432, the semiconductor device 431 is located inside the cavity 432, a wall of the cover 43 facing to the side of the channel 42 is a first side wall 433, a cold end 431a of the semiconductor device 431 is disposed toward the first side wall 433, a wall of the cover 43 facing away from the channel 42 is a second side wall 434, and a hot end 431b of the semiconductor device 431 is disposed toward the second side wall 434.

By disposing the semiconductor device 431 in the cavity 432, the cover 43 can protect the semiconductor device 431, so that the semiconductor device 431 is in a relatively closed environment, and the risk that the broken ice generated after the ice bumps against the cover 43 contacts the semiconductor device 431, and the semiconductor device 431 is short-circuited or fails to work normally is reduced.

In one possible design, as shown in fig. 8, the cover 43 includes a mounting plate 435, the mounting plate 435 is located in the cavity 432 and is fixedly connected to the cover 43, and the semiconductor device 431 is fixedly connected to the mounting plate 435 by bonding, welding, or any other connection method that can satisfy the stability of installation, and the mounting plate 435 is provided to facilitate the placement of the semiconductor device 431 in the cover 43 and to maintain the position of the semiconductor device 431 fixed, thereby improving the working efficiency of the semiconductor device 431.

A flange is arranged along the periphery of the mounting plate 435, and the flange is connected with the wall surface of the cover 43 to increase the contact area between the mounting plate 435 and the cover 43, improve the connection stability between the mounting plate 435 and the cover 43, and reduce the possibility of the position deviation of the cold end 431a and the hot end 431b of the semiconductor module 431, so that the cold end 431a faces the first side wall 433, and the hot end 431b faces the second side wall 434.

As shown in fig. 7, the present application provides an embodiment, wherein the end cap includes a filler 436, the filler 436 may be a substance such as foam, the filler 436 may be disposed between the cold end 431a and the first side wall 433 and/or between the hot end 431b and the second side wall 434 for filling the cavity 432 of the cover 43, and with the heat preservation effect of the filler 436, the possibility that cold air leaks to the outside and/or heat emitted from the hot end 431b enters the inside of the channel 42 and the inside of the ice making device 3 can be reduced, and the working efficiency and the ice quality of the ice making device 3 can be further improved.

As shown in fig. 8, the present application provides an embodiment, wherein the cover 43 includes a plurality of semiconductor devices 431, adjacent semiconductor devices 431 are connected to each other to form a series structure, and by providing a plurality of semiconductor devices 431, the area of the cold end 431a and the hot end 431b of the whole semiconductor devices 431 is increased, and the heat absorption and release capacity of the whole semiconductor devices 431 is improved, so as to better solve the problem of condensation and the problem of heat entering the ice making device 3.

In one possible design, each semiconductor device 431 is disposed in a ring shape, so that the semiconductor devices 431 are distributed more uniformly inside the lid 43, the area of the semiconductor devices 431 covering the first sidewall 433 and the second sidewall 434 is increased, the thermal coupling between the cold end 431a and the first sidewall 433, and between the hot end 431b and the second sidewall 434 is enhanced, and further the working efficiency of the semiconductor devices 431 inside the lid 43 is improved to solve the condensation phenomenon. The arrangement of the semiconductor devices 431 in the cover 43 includes, but is not limited to, a ring-shaped configuration, and any arrangement that can increase the area of the semiconductor devices 431 covering the first sidewall 433 and the second sidewall 434 is within the scope of the present application.

As shown in fig. 7, the present application provides an embodiment, a first side wall 433 of the cover 43 faces the channel 42 for opening or closing an outlet of the channel 42, a second side wall 434 faces away from the channel 42 for connecting with the driving part 44, so that the driving part 44 can drive the cover 43 to move, the second side wall 434 includes a reinforcing structure 437, which is used for reinforcing the overall structural strength of the second side wall 434 to improve the stability of the connection between the cover 43 and the driving part 44, and the reinforcing structure 437 can be a convex hull, a rib, or any other structure capable of reinforcing the strength of the cover 43.

As shown in fig. 3 to 5, the present application provides an embodiment, wherein the dispensing device 4 includes a driving portion 44, the driving portion 44 is connected to the housing 41 and the cover 43 of the dispensing device 4, the driving portion 44 is normally connected to a side of the cover 43 away from the channel 42, i.e. the second side wall 434, and the driving portion 44 drives the cover 43 to move relative to the channel 42, so that the cover 43 can open or close the outlet of the channel 42.

Specifically, the driving portion 44 includes a motor 441 and a driving shaft 442, the motor 441 is fixedly connected to the housing 41 of the dispensing device 4 and drives the driving shaft 442 to rotate through the output shaft, the driving shaft 442 passes through at least a portion of the housing 41 and is fixedly connected to the cover 43, and when the driving shaft 442 rotates, the cover 43 is driven by the driving shaft 442 to rotate to approach or separate from the outlet of the channel 42. The user can open or close the outlet of the channel 42 by only adjusting the rotation direction of the output shaft of the motor 441, which is very convenient and fast to operate.

In order to improve the stability of the connection between the driving shaft 442 and the cover 43, the driving portion 44 further includes a driving plate 443, the driving plate 443 is connected to the driving shaft 442, in one possible design, the driving plate 443 is disposed in the middle of the driving shaft 442 and is fixedly connected to the second side wall 434 of the cover 43, the driving shaft 442 is connected to the cover 43 through the driving plate 443 to increase the contact area with the cover 43, when the driving shaft 442 rotates, the driving shaft 442 drives the driving plate 443 to rotate, the cover 43 is driven to move through the driving plate 443, and the driving shaft 442 can drive the cover 43 to move more stably because the contact area with the cover 43 is increased through the driving plate 443.

The driving shaft 442 may be directly connected to the driving plate 443, or may be connected to the driving plate 443 through the transition section 444, and a preset included angle exists between the transition section 444 and the driving plate 443, so that the overall structure of the driving shaft 442 and the driving plate 443 is more reasonable, and the driving shaft 442 and the driving plate 443 are more favorable for driving the cover 43 to move.

When a user needs to take out ice cubes, the driving portion 44 is controlled to move the cover 43 in a direction away from the channel 42 to open the outlet of the channel 42, the ice cubes slide into the container along the outlet of the channel 42, and when the user obtains enough ice cubes, the driving portion 44 is controlled to move the cover 43 in a direction close to the channel 42 to close the outlet of the channel 42, so that cold air leakage and outside hot air are prevented from entering the ice making device 3, and the working efficiency of the ice making device 3 and the quality of the ice cubes are prevented from being affected.

As shown in fig. 9, semiconductor assembly 431 includes a cold side 431a and a hot side 431b and conductors that communicate with the circuit to allow cold side 431a to cool and hot side 431b to heat.

As shown in fig. 10, which is a schematic diagram of the operation principle of the semiconductor device 431, the semiconductor device 431 includes two different semiconductors of N type and P type, a metal sheet and a power supply, when the power supply is arranged as shown in fig. 10, after the circuit is connected, electrons flow from the negative electrode to the positive electrode through the semiconductor of metal B, P type, the semiconductor of metal A, N type and the metal B, and when current flows through a loop formed by different conductors, heat absorption and heat release phenomena occur at the joints of the different conductors respectively according to the difference of the current directions according to the peltier effect. When electrons flow through the P-type semiconductor, the thermal energy of the P-type semiconductor is converted into potential energy, so that the temperature of the metal a is lowered and heat absorption is started to form the cold end 431a of the semiconductor assembly 431, and when electrons flow through the N-type semiconductor, the potential energy is converted into thermal energy, so that the temperature of the metal B is increased and heat is released to the outside, so that the hot end 431B of the semiconductor assembly 431 is formed. When the polarity of the power source is set in the opposite manner to that shown in fig. 10, the potential energy of the metal a is converted into heat energy and releases the heat to form the hot end 431B, and the heat energy of the metal B is converted into potential energy and absorbs the heat to form the cold end 431 a.

To sum up, in the refrigeration appliance provided by the embodiment of the present application, through setting the semiconductor component 431 in the cover 43, the heat released by the hot end 431b is utilized to heat the cold air leaked from the outlet of the channel 42, thereby reducing the contact between the cold air and the air, condensing the water vapor in the air into water drops, generating the risk of condensation phenomenon, and simultaneously utilizing the cold end 431a to absorb the heat, thereby reducing the possibility that the redundant heat released by the hot end 431b enters the ice making device 3 along the channel 42 and is inside the refrigeration appliance, and generating the possibility of negative influence on the overall refrigeration effect and the working efficiency.

The above description is only a preferred embodiment of the present application and is not intended to limit the present application, and various modifications and changes may be made by those skilled in the art. Any modification, equivalent replacement, improvement and the like made within the spirit and principle of the present application shall be included in the protection scope of the present application.

Claims (10)

1. A refrigeration appliance comprising:

a case (1), the case (1) including a storage chamber (11);

a door (2), wherein the door (2) is used for opening or closing the storage chamber (11);

an ice making device (3), the ice making device (3) being provided at the storage compartment (11);

a dispensing device (4), the dispensing device (4) comprising a channel (42) for conveying ice pieces made by the ice making device (3) and a cover (43) for opening or closing an outlet of the channel (42);

characterized in that the cover (43) comprises at least one semiconductor assembly (431), the semiconductor assembly (431) comprises a cold end (431a) and a hot end (431b), the cold end (431a) absorbs heat, and the hot end (431b) releases heat;

the cold end (431a) is thermally coupled to a wall of the cover (43) facing the channel (42), and the hot end (431b) is thermally coupled to a wall of the cover (43) facing away from the channel (42).

2. The refrigeration appliance according to claim 1, wherein the cover (43) comprises a cavity (432), the semiconductor component (431) being arranged in the cavity (432);

the cavity (432) comprises a first side wall (433) and a second side wall (434) which are oppositely arranged, the first side wall (433) faces the channel (42), and the second side wall (434) faces away from the channel (42).

3. The refrigeration appliance according to claim 2, wherein the cover (43) comprises a mounting plate (435), the mounting plate (435) being arranged in the cavity (432) and being connected to the cover (43);

the mounting plate (435) is located between the first sidewall (433) and the second sidewall (434);

the semiconductor component (431) is disposed on the mounting plate (435).

4. The refrigeration appliance according to claim 2, wherein the cover comprises a filler (436), the filler (436) being arranged between the cold end (431a) and the first side wall (433) and/or between the hot end (431b) and the second side wall (434).

5. The refrigeration appliance according to claim 1, wherein the cover (43) comprises a plurality of said semiconductor assemblies (431), adjacent semiconductor assemblies (431) being interconnected.

6. A cold appliance according to claim 5, wherein each semiconductor member (431) is arranged in a ring shape.

7. A cold appliance according to any of the claims 2-6, wherein the cover (43) comprises a reinforcement structure (437), wherein the reinforcement structure (437) is arranged at the second side wall (434) of the cavity of the cover.

8. The refrigeration appliance according to any of the claims 2 to 6, wherein the distribution device (4) comprises a drive portion (44), the drive portion (44) being connected with the housing (41) of the distribution device (4);

the cover body (43) is connected with the distribution device (4) through the driving part (44), and the driving part (44) is used for driving the cover body (43) to move relative to the channel (42) so as to open or close the outlet of the channel (42).

9. The refrigeration appliance according to claim 8, wherein the driving portion (44) comprises a motor (441) and a driving shaft (442), an output shaft of the motor (441) is connected with the driving shaft (442), and the driving shaft (442) is connected with the cover (43).

10. The refrigerator according to claim 9, wherein the drive portion (44) comprises a drive plate (443), the drive shaft (442) being connected with the cover (43) through the drive plate (443);

the drive plate (443) is connected to a second side wall (434) of the cavity of the cover.

Images