CN211694439U - Heat dissipation device for LED lighting equipment and LED lighting equipment - Google Patents

Abstract

The application belongs to the technical field of LED lamps and lanterns, especially relates to a heat abstractor and LED lighting apparatus for LED lighting apparatus. The heat dissipation device for the LED lighting equipment comprises a PCB, an electrical component and a shell, wherein the electrical component and the shell are assembled on one side of the PCB, and further the heat dissipation device further comprises a heat dissipation component which is assembled on the other side, opposite to the side with the electrical component, of the PCB, the PCB with the electrical component and the heat dissipation component is arranged in the shell, the heat dissipation component is provided with a light source end and a light source end which are opposite to each other, and a heat dissipation rib which can conduct heat between the heat dissipation component and the shell is arranged between the light source end and the shell. Use the technical scheme of the utility model the heat in the lamps and lanterns among the prior art has been solved and has stayed unable derivation in lamps and lanterns, leads to the inner part to have the technical problem of higher damage risk.

Description

Heat dissipation device for LED lighting equipment and LED lighting equipment

Technical Field

The application belongs to the technical field of lamps and lanterns, especially relates to a heat abstractor and LED lighting apparatus for LED lighting apparatus.

Background

Along with the development of lighting technology, the application of various lamps is rapidly popularized, and especially how to improve the utilization rate of LED lighting equipment, reduce the maintenance rate and prolong the service life of the LED lighting equipment becomes a topic of enthusiasm. The LED lighting device is commonly applied to various places such as malls, office buildings, streets, homes, etc., but the use cost is still high due to the heat dissipation problem. In the existing design, in order to avoid part damage caused by local high temperature, a plastic sleeve in contact with an electrical component is often used for homogenizing the temperature in the LED lighting device, but the part of heat still remains in the LED lighting device, and the internal parts still have higher damage risk.

SUMMERY OF THE UTILITY MODEL

An object of the application is to provide a heat abstractor and LED lighting apparatus for LED lighting apparatus, aims at solving the heat in the lamps and lanterns among the prior art and persists in lamps and lanterns and can't derive, leads to the technical problem that internals has higher damage risk.

In order to achieve the purpose, the technical scheme adopted by the application is as follows: the utility model provides a heat abstractor for LED lighting apparatus, including the PCB board, assemble in electrical component and the casing of PCB board one side, furthermore, heat abstractor still includes radiator unit, radiator unit assembles in the PCB board with be provided with the opposite side that one side of electrical component carried on the back mutually, the PCB board that is equipped with electrical component and radiator unit sets up in the casing, radiator unit has relative keep away from the light source end and is close to the light source end, be close to and be equipped with the heat dissipation rib that can conduct heat between radiator unit and casing between light source end and the casing.

Optionally, the heat dissipation device further includes a heat dissipation support, the heat dissipation assembly is connected to one end of the heat dissipation support, the other end of the heat dissipation support is a free end extending in a direction toward the light source end, a distance between the heat dissipation support and the heat dissipation assembly is gradually increased from a connection position of the heat dissipation assembly and the heat dissipation support toward the free end, the heat dissipation rib is disposed on the heat dissipation support, and the heat dissipation rib abuts against an inner wall of the housing.

Optionally, the number of the heat dissipation supporting members is two, the two heat dissipation supporting members are symmetrically arranged relative to a central axis of the heat dissipation assembly, and each heat dissipation supporting member is provided with a plurality of heat dissipation ribs.

Optionally, the plurality of heat dissipation ribs are obliquely arranged from a position far away from the light source end to a position close to the light source end, and two adjacent heat dissipation ribs are arranged in parallel.

Optionally, the inner wall of the housing is provided with a plurality of ribs extending in a direction pointing away from the light source end near the light source end, the ribs being used for positioning the light source plate of the luminaire.

Optionally, the end of each rib away from the heat sink assembly is provided with a guide chamfer for cooperating with an auxiliary chamfer provided on the circumferential side wall of the light source plate.

According to another aspect of the present invention, there is provided a LED lighting device, which includes the heat dissipation device for LED lighting device as described above, further, the LED lighting device further includes a light source board and a radio frequency transceiver, the light source board is connected to the housing, the radio frequency transceiver is installed on the light source board, and the radio frequency transceiver is electrically connected to the electrical component.

Optionally, a through groove is formed in the edge of the light source board, a part of the extension section of the radio frequency transceiver is corresponding to the through groove in an overhead manner, and the height of the radio frequency transceiver relative to the light source board surface is not higher than the height of a lamp bead mounted on the light source board relative to the light source board surface.

Optionally, the groove bottom periphery of the through groove and the rib arranged on the inner wall of the shell are mutually abutted and positioned.

Optionally, the LED lighting device further comprises a light-transmitting portion, and the lamp bead faces the light-transmitting portion to emit light for lighting.

The application has at least the following beneficial effects:

the heat dissipation device is applied to the LED lighting equipment, the LED lighting equipment works and generates heat in the process, the heat can be radiated and absorbed by the heat dissipation assembly, the heat dissipation ribs are designed between the heat dissipation assembly and the shell, then the heat can be conducted to the shell through the heat dissipation ribs after being absorbed by the heat dissipation assembly, the exposed shell radiates the heat to the external air environment, the heat generated by the LED lighting equipment is smoothly conducted to the outside from the inside to achieve the heat dissipation performance of the LED lighting equipment for heat dissipation and cooling, the risk that internal parts of the LED lighting equipment are not influenced by high-temperature environment and damaged is effectively protected, and the LED lighting equipment can be stably lighted for a long time.

Drawings

In order to more clearly illustrate the technical solutions in the embodiments of the present application, the drawings needed to be used in the embodiments or the prior art descriptions will be briefly described below, and it is obvious that the drawings in the following description are only some embodiments of the present application, and it is obvious for those skilled in the art to obtain other drawings based on these drawings without inventive exercise.

Fig. 1 is a schematic structural diagram of an LED lighting device provided in an embodiment of the present application;

fig. 2 is a schematic assembly structure diagram of a heat dissipation device for an LED lighting apparatus according to an embodiment of the present application;

fig. 3 is a schematic assembly structure diagram of a heat dissipation device for an LED lighting apparatus according to an embodiment of the present application;

fig. 4 is a schematic structural diagram illustrating an assembly relationship among a light source plate, a radio frequency transceiver, and a housing in an LED lighting device according to an embodiment of the present disclosure;

fig. 5 is a schematic structural view of an assembly relationship between a light source plate and a housing in an LED lighting device provided in an embodiment of the present application;

fig. 6 is a schematic structural diagram of a housing in an LED lighting device provided in an embodiment of the present application;

fig. 7 is an enlarged view of a portion a of fig. 6.

Wherein, in the figures, the respective reference numerals:

10. an electrical component; 11. a PCB board; 20. a heat dissipating component; 21. close to the light source end; 22. away from the light source end; 23. a heat dissipating rib; 24. a heat dissipating support; 30. a housing; 31. a rib; 33. a light-transmitting portion; 40. a light source plate; 41. a lamp bead; 42. a through groove; 43. a radio frequency transceiver.

Detailed Description

Reference will now be made in detail to embodiments of the present application, examples of which are illustrated in the accompanying drawings, wherein like or similar reference numerals refer to the same or similar elements or elements having the same or similar function throughout. The embodiments described below with reference to fig. 1-4 are exemplary and intended to be used to illustrate the present application and should not be construed as limiting the present application.

In the description of the present application, it is to be understood that the terms "length," "width," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," and the like, as used herein, refer to an orientation or positional relationship indicated in the drawings, which is for convenience and simplicity of description, and does not indicate or imply that the referenced device or element must have a particular orientation, be constructed and operated in a particular orientation, and thus, is not to be considered as limiting.

Furthermore, the terms "first", "second" and "first" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of the present application, "a plurality" means two or more unless specifically limited otherwise.

In this application, unless expressly stated or limited otherwise, the terms "mounted," "connected," "secured," and the like are to be construed broadly and can include, for example, fixed connections, removable connections, or integral parts; can be mechanically or electrically connected; either directly or indirectly through intervening media, either internally or in any other relationship. The specific meaning of the above terms in the present application can be understood by those of ordinary skill in the art as appropriate.

The embodiment of the present invention mainly designs an LED lighting device, and particularly, a heat dissipation device with a novel design is applied in the LED lighting device, as shown in fig. 1 to 7, the heat dissipation device applied in the LED lighting device according to the embodiment of the present invention includes a PCB 11, an electrical component 10, a heat dissipation component 20, a housing 30 and heat dissipation ribs 23, the housing 30 is a lamp housing of the LED lighting device, the electrical component 10 and the heat dissipation component 20 are both assembled on the PCB 11, the electrical component 10 and the heat dissipation component 20 are respectively installed on two side surfaces of the PCB 11, a gap is formed between the heat dissipation component 20 and the PCB 11, the housing 30 is sleeved on the PCB 11 and the heat dissipation component 20 (i.e., the housing 30 covers the heat dissipation component 20 and the electrical component 10), wherein the heat dissipation component 20 has a position close to the light source end 21 and a position far away from the light source end 22, and a position close to the light source end 21 and a far away from the light source end 22 are relatively arranged along a central axis, the heat dissipating ribs 23 are disposed near the light source end 21 and the housing 30, and the heat dissipating ribs 23 can conduct heat between the light source end 21 and the housing 30, so as to conduct the heat collected by the heat dissipating assembly 20 to the housing 30 and dissipate the heat to the outside environment. Preferably, the heat dissipation assembly 20 and the heat dissipation ribs 23 may be integrally formed.

The heat dissipation device for the LED lighting equipment further comprises a lamp cap, and one end of the PCB 11 is inserted into the lamp cap. The lamp holder can be connected with an external power supply to supply power for the lighting device. The electrical component 10 provided on one side of the PCB board 11 includes a driver for an LED lighting device.

The heat dissipation device provided by the utility model is applied to the LED lighting device, in the process of generating heat when the LED lighting device works, the heat generated in the working process of the electrical component 10 is dissipated inside the casing 30, and is transmitted to the heat dissipation component 20 by taking air as a medium to be gathered, and the heat can be radiated and absorbed by the heat dissipation component 20, so that the heat can be gathered on the heat dissipation component 20, because the heat dissipation ribs 23 are designed between the heat dissipation component 20 and the casing 30, then the heat can be transmitted to the casing 30 through the heat dissipation ribs 23 after being absorbed by the heat dissipation component 20, the heat can be dissipated to the external air environment by one side surface of the exposed casing 30, so that the heat generated by the LED lighting device can be smoothly transmitted from the inside to the outside, so as to achieve the heat dissipation performance of heat dissipation and cooling of the LED lighting device, thereby effectively protecting the risk that the internal parts of the LED lighting device are not influenced and damaged, the LED lighting equipment can be ensured to stably illuminate for a long time.

As shown in fig. 3, in the present embodiment, the heat dissipating device further includes a heat dissipating support 24, one end of the heat dissipating support 24 is connected to the heat dissipating component 20, specifically, one end of the heat dissipating support 24 is connected to an end of the heat dissipating component 20 close to the housing 30, and the other end of the heat dissipating support 24 is a free end extending in a direction toward the light source end 21 (i.e., the heat dissipating support 24 extends in a direction toward the light source end 21), so that the heat dissipating support 24 is formed as an arm portion connecting the heat dissipating component 20 and extending toward the light source end 21. The heat dissipation support 24 and the heat dissipation assembly 20 have a distance therebetween, and the distance therebetween gradually increases from the connection point of the heat dissipation assembly 20 and the heat dissipation support 24 toward the direction close to the light source end 21, so that the heat dissipation support 24 can have a certain elastic force capability with the connection point of the heat dissipation support 24 and the heat dissipation assembly 20 as a fulcrum, wherein the heat dissipation rib 23 is disposed on the heat dissipation support 24, and the heat dissipation rib 23 is disposed at a position of the heat dissipation support 24 close to the free end thereof. Thus, in the assembly process, the light source end 22 of the heat dissipation component 20, which is far away from the light source end 22, firstly extends into the housing 30 and is inserted, then the end of the heat dissipation rib 23 contacts with the inner wall of the housing 30, in the continuous insertion process, the inner wall of the housing 30 extrudes the heat dissipation support piece 24, so that the heat dissipation support piece 24 elastically extrudes and deforms, and by means of the elastic force of the heat dissipation support piece 24, the heat dissipation rib 23 is stably abutted against the inner wall of the housing 30, so that a good heat conduction effect is realized. Preferably, the heat dissipation assembly 20, the heat dissipation support 24 and the heat dissipation ribs 23 are integrally formed.

Preferably, the number of the heat dissipation support members 24 of the heat dissipation device of the present embodiment is two, and the two heat dissipation support members 24 are symmetrically arranged with respect to the central axis of the heat dissipation assembly 20, so that when the heat dissipation assembly 20 is assembled on the PCB 11 and integrally inserted into the housing 30, the two symmetrical heat dissipation support members 24 mutually generate an elastic force while taking the central axis of the heat dissipation assembly 20 as an acting point of an interaction force, and each heat dissipation support member 24 is provided with a plurality of heat dissipation ribs 23, so that the heat dissipation ribs 23 connected to each other are stably abutted against the inner wall of the housing 30 at the same time, thereby achieving a good heat conduction effect.

As shown in fig. 2 and fig. 3, in order to insert the heat dissipation assembly 20 into the housing 30 more smoothly during the assembly process, on each heat dissipation support 24, the plurality of heat dissipation ribs 23 are disposed in an inclined manner from the light source end 22 to the direction close to the light source end 21 (i.e., an acute angle is formed between the heat dissipation support 24 and the heat dissipation ribs 23, and the opening of the acute angle faces the free end of the heat dissipation support 24), so that during the insertion assembly process, the heat dissipation support 24 directly pushes the heat dissipation ribs 23 close to the light source end 21, and the two heat dissipation support 24 are automatically pressed by force to approach each other to form an elastic force under the inclined trend of the heat dissipation ribs 23, so as to push the plurality of heat dissipation ribs 23 against the inner wall of the housing 30 at the same time. Further, on each heat dissipation support 24, two adjacent heat dissipation ribs 23 are disposed in parallel. Preferably, from the connection point of the heat dissipation support 24 and the heat dissipation assembly 20 to the free end of the heat dissipation support 24, the lengths of the plurality of heat dissipation ribs 23 extending toward the housing 30 are sequentially increased to match the diameter change of the housing 30, so that the heat dissipation ribs 23 can more reliably abut against the housing 30 to achieve better heat conduction effect.

According to another aspect of the present invention, as shown in fig. 1 to 7, there is provided an LED lighting device, which includes a light source board 40, a radio frequency transceiver 43, a light transmission portion 33 and the aforementioned heat dissipation apparatus for the LED lighting device.

As shown in fig. 4 to 7, in the heat dissipating device of the LED lighting apparatus, a plurality of ribs 31 are provided on an inner wall of the housing 30, each rib 31 extends in a direction toward the light source end 21 and away from the light source end 22, and the ribs 31 are used to conveniently position the light source board 40 of the luminaire, thereby connecting the light source board 40 to the housing 30. Specifically, the end of each rib 31 far from the heat dissipation assembly 20 is provided with a guiding chamfer (see fig. 6), and correspondingly, an auxiliary chamfer (not shown) matched with the guiding chamfer is arranged on the edge position of the axial side wall of the light source plate 40, so that in the process of assembling the light source plate 40, the auxiliary chamfer of the light source plate 40 corresponds to the guiding chamfer of the rib 31, and then the light source plate 40 is pushed forcibly to slide smoothly, and at this time, each rib 31 has an effect of extruding and stabilizing the light source plate 40, so that the light source plate 40 is stably installed.

The radio frequency transceiver 43 is stably installed on the light source board 40 and electrically connected with the electrical assembly 10 for wireless communication to realize intelligent control. In the present embodiment, the through groove 42 is opened at the edge position of the light source plate 40, and the position where the through groove 42 is opened corresponds to the position of the case 30 where the rib 31 is provided, the peripheral edge at the groove bottom of the through groove 42 is positioned in abutment with each rib 31 at the time of assembly. When assembled, a part of the extension section of the rf transceiver 43 is corresponding to the through slot 42 in an overhead manner, and the overhead extension section of the rf transceiver 43 forms an rf antenna to enhance the transceiving function of rf signals. In addition, in order to avoid affecting the lighting effect by the shadow formed by the rf transceiver 43 in the lighting process without affecting the lighting light emitted by the lamp beads 41 on the light source plate 40 in the lighting process, the height of the rf transceiver 43 relative to the surface of the light source plate 40 is not higher than the height of the lamp beads 41 mounted on the light source plate 40 relative to the surface of the light source plate 40, in this embodiment, on the premise of ensuring the stable signal receiving capability and signal transmitting capability of the rf transceiver 43, the overall height of the rf transceiver 43 is preferably smaller than the height of the lamp beads 41 on the light source plate 40.

Further, as shown in fig. 1, in the assembly process of the lighting device of the present embodiment, the heat dissipation device applied to the LED lighting apparatus is firstly assembled, the electrical component 10 is assembled on one side of the PCB 11, the integrally connected heat dissipation component 20, heat dissipation support 24 and heat dissipation rib 23 are assembled on the other side of the PCB 11, then the assembled PCB 11 is inserted into the housing 30, and the heat dissipation support 20 and the heat dissipation rib 23 abut against the housing 30, and one end of the PCB 11 is inserted into the lamp cap. Further, the light source board 40 and the radio frequency transceiver 43 are mounted on the assembled heat sink, and then the light-transmitting portion 33 is covered on the housing 30 to seal the heat sink, the radio frequency transceiver 43, the light source board 40, the electrical component 10, the PCB 11, and other components, and at this time, the lamp beads 41 face the light-transmitting portion 33 to emit light for illumination.

In the LED lighting device, the heat dissipation support member 24 and the heat dissipation ribs 23 on the heat dissipation assembly 20 are conducted to the housing 30 and finally dissipated to the outside air environment, so as to dissipate the heat inside the LED lighting device, thereby ensuring that the temperature inside the LED lighting device is not too high and affects the working state of the electrical assembly 10, effectively protecting the internal parts of the LED lighting device from being affected by the high temperature environment and causing damage, and ensuring that the LED lighting device can stably illuminate for a long time.

The above description is only exemplary of the present application and should not be taken as limiting the present application, as any modification, equivalent replacement, or improvement made within the spirit and principle of the present application should be included in the protection scope of the present application.

Claims (10)

1. A heat dissipating arrangement for an LED lighting device comprising a PCB board (11), an electrical component (10) mounted to one side of the PCB board (11), and a housing (30), characterized in that: the heat dissipation device further comprises a heat dissipation assembly (20), the heat dissipation assembly (20) is assembled on the other side, opposite to one side of the electrical assembly (10), of the PCB (11), the electrical assembly (10) and the heat dissipation assembly (20) are assembled on the PCB (11) in the shell (30), the heat dissipation assembly (20) is provided with a light source end (22) and a light source end (21) which are opposite to each other, and a heat dissipation rib (23) capable of conducting heat between the heat dissipation assembly (20) and the shell (30) is arranged between the light source end (21) and the shell (30).

2. The heat dissipating apparatus for an LED lighting device as set forth in claim 1, wherein: this heat abstractor still includes heat dissipation support piece (24), radiator unit (20) with the one end of heat dissipation support piece (24) is connected, the other end of heat dissipation support piece (24) is along the orientation near the free end of the direction extension of light source end (21), heat dissipation support piece (24) with interval between radiator unit (20) is by radiator unit (20) with the junction orientation of heat dissipation support piece (24) the free end direction is crescent, heat dissipation rib (23) are located on heat dissipation support piece (24), and heat dissipation rib (23) butt the inner wall of casing (30).

3. The heat dissipating apparatus for an LED lighting device according to claim 2, wherein: the number of the heat dissipation support pieces (24) is two, the two heat dissipation support pieces (24) are symmetrically arranged relative to the central axis of the heat dissipation assembly (20), and each heat dissipation support piece (24) is provided with a plurality of heat dissipation ribs (23).

4. The heat dissipating apparatus for an LED lighting device as set forth in claim 3, wherein: the plurality of heat dissipation ribs (23) are obliquely arranged from the direction far away from the light source end (22) to the direction close to the light source end (21), and the adjacent two heat dissipation ribs (23) are arranged in parallel.

5. The heat dissipating apparatus for an LED lighting device as set forth in claim 1, wherein: the inner wall of casing (30) is equipped with a plurality of ribs (31), rib (31) are followed it points to near light source end (21) keep away from the direction extension of light source end (22), rib (31) are used for the light source board of location lamps and lanterns.

6. The heat dissipating apparatus for an LED lighting device as set forth in claim 5, wherein: each rib (31) is far away from the tip of radiator unit (20) is equipped with the direction chamfer for the supplementary chamfer of cooperation the circumference lateral wall setting of light source board.

An LED lighting device, characterized in that: the heat dissipating arrangement for an LED lighting device comprising any of claims 1 to 6, the LED lighting device further comprising a light source board (40) and a radio frequency transceiver (43), the light source board (40) being connected to the housing (30), the radio frequency transceiver (43) being mounted on the light source board (40), the radio frequency transceiver (43) being electrically connected with the electrical component (10).

8. The LED lighting apparatus according to claim 7, wherein: the edge of the light source board (40) is provided with a through groove (42), a part of the extending section of the radio frequency transceiver (43) is in overhead correspondence to the through groove (42), and the height of the radio frequency transceiver (43) relative to the board surface of the light source board (40) is not higher than the height of a lamp bead (41) mounted on the light source board (40) relative to the board surface of the light source board (40).

9. The LED lighting apparatus of claim 8, wherein: the periphery of the bottom of the through groove (42) is abutted and positioned with a rib (31) arranged on the inner wall of the shell (30).

10. The LED lighting apparatus of claim 8, wherein: the LED lighting device further comprises a light-transmitting part (33), and the lamp beads (41) face the light-transmitting part (33) to emit light for lighting.

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