CN211671189U

CN211671189U - Heat radiating device for high-voltage high-power device

Info

Publication number: CN211671189U
Application number: CN202020683279.9U
Authority: CN
Inventors: 张锦峰
Original assignee: Hefei Zhaoyang Electronic Technology Co ltd
Current assignee: Hefei Zhaoyang Electronic Technology Co ltd
Priority date: 2020-04-29
Filing date: 2020-04-29
Publication date: 2020-10-13
Anticipated expiration: 2030-04-29

Abstract

The utility model discloses a heat dissipation device for high-voltage high-power devices, which comprises a bus chamber, an extension chamber and heat dissipation devices arranged on the bus chamber and the extension chamber, wherein the bus chamber adopts a direct liquid method for heat dissipation, and the extension chamber adopts a natural cooling method for heat dissipation; the sub-machine room is provided with a plurality of groups of integrated circuit boxes from top to bottom, and a plurality of groups of air inlets are staggered at the bottom; the ratio of the height to the width of the compartment is limited within a threshold value, so that the maximization of the chimney effect is realized; the bus chamber is provided with a plurality of groups of integrated circuit boxes and power transformers from top to bottom, one side of the bus chamber is connected with the sub-chamber through a ventilation pipeline, and the other side of the bus chamber is connected with the heat exchanger through a refrigerant liquid heat pipe; one side of the heat exchanger is connected with a cold and hot water circulating pipeline through a pipeline. The utility model discloses realize the chimney effect maximize and guarantee indoor fluidic chimney effect at the extension indoor based on building structure, prevent the emergence of backward flow phenomenon, promote thermal scattering and disappearing.

Description

Heat radiating device for high-voltage high-power device

Technical Field

The utility model relates to a heat dissipation technical field especially relates to a high-pressure high-power device heat abstractor.

Background

The size and layout of the building or profile often creates a self-induced draft phenomenon, namely the "chimney effect". The chimney effect is strong for parts such as high-rise buildings, internal stairs or elevators, air conditioning vents and the like, and the chimney effect is also one of the main reasons for difficulty in controlling and extinguishing during fire.

The chimney effect not only exists in high-rise buildings, but also can be realized under natural conditions as long as the structural design is reasonable, and the chimney effect is used in natural convection heat dissipation in structures which only need a natural cooling method or a partial forced air cooling method, so that the heat dissipation coefficient can be greatly improved, and the heat dissipation performance is improved.

Present chimney effect is used in the research of high-rise building, mountain, tunnel and conflagration more, the utility model discloses be used for the heat radiation structure of basis with the chimney effect, improve heat dispersion.

SUMMERY OF THE UTILITY MODEL

The present invention is directed to a heat dissipation device for high voltage high power device to solve the above problems.

In order to achieve the above purpose, the utility model is realized by the following technical scheme: a heat dissipating double-fuselage of the high-pressure high-power device, it includes bus-bar room, extension room and heat dissipating double-fuselage set up in bus-bar room, extension room, the said bus-bar room adopts the direct liquid method to dispel the heat, the extension room adopts the natural cooling method to dispel the heat;

the sub-machine room is provided with a plurality of groups of integrated circuit boxes from top to bottom, and a plurality of groups of air inlets are staggered at the bottom; the ratio of the height to the width of the compartment is limited within a threshold value, so that the maximization of the chimney effect is realized;

the bus chamber is provided with a plurality of groups of integrated circuit boxes and power transformers from top to bottom, one side of the bus chamber is connected with the sub-chamber through a ventilation pipeline, and the other side of the bus chamber is connected with the heat exchanger through a refrigerant liquid heat pipe; one side of the heat exchanger is connected with a cold and hot water circulating pipeline through a pipeline.

Further, the ratio of the height to the width of the compartment is 2-3: 1.

Still further, the ratio of the height to the width of the divider chamber is 50: 19.

Furthermore, the integrated circuit boxes or power transformers in the extension rooms and the bus rooms are classified up and down according to the working temperature, and a temperature gradient is formed in the extension rooms or the bus rooms; the integrated circuit box with high working temperature is arranged below the integrated circuit box with low working temperature.

Preferably, the extension rooms containing the same integrated circuit boxes or different groups with the same working temperature are connected to one side of the bus room with the same temperature gradient through a ventilation pipeline; the temperature gradients formed by the bus chamber integrated circuit box or the power transformer correspond to the temperature gradients formed by different ventilation pipelines one by one.

Particularly, the refrigerant liquid heat pipe is provided with a heat absorption section, a heat insulation section and a condensation section from left to right once; the heat exchanges heat with the refrigerant liquid in the heat absorption section, is condensed again in the condensation section through the heat insulation section and then flows back to the heat absorption section; and the other side of the condensation section is connected with a cold and hot water circulating pipeline through a heat exchanger.

To sum up the utility model discloses following beneficial effect has:

1. the utility model is based on the chimney effect formed by high-rise buildings, and the reasonable structural design ensures that the chimney effect of the fluid is realized in the agent distributing chamber;

2. temperature gradient is realized in the branch room or the bus room, and self-air draft is realized indoors to accelerate indoor fluid to flow into the exchange room;

3. and at the joint of the branch machine room and the bus room, a ventilation pipeline is reasonably designed to realize the temperature gradient conjunction of the branch machine room and the bus room.

Drawings

FIG. 1 is a schematic structural diagram of a heat dissipation device for high-voltage high-power devices;

FIG. 2 is a schematic structural view of a dispensing chamber;

fig. 3 is a schematic diagram of the principle structure of the refrigerant liquid heat pipe.

Detailed Description

The present invention will be described in further detail with reference to the following examples, which are not intended to limit the invention.

The utility model relates to a high-pressure high-power device heat abstractor, the chimney effect under natural condition is reasonable in structural design, and the point is used in natural convection heat dissipation in some structures which only need a natural cooling method or a partial forced air cooling method, so that the heat dissipation coefficient can be greatly improved, and the heat dissipation performance is improved;

the present invention will be explained in more detail with reference to the attached drawing dimensions and specific simulation data;

as shown in fig. 2, in order to find the best chimney effect, the ratio of the height and the width of the sub-chamber and the influence on the heat flux density are combined with the similarity principle, wherein the chamber height is L, the outlet width is W, and the heat source heat flux density is q; selecting a Laminar Laminar flow model, selecting an SLMPLE algorithm through pressure-velocity coupling, selecting a Boby Force Weighted as a pressure discrete format, and selecting a Boussinesq model through natural convection to obtain a contact equation of the model:

based on numerical and theoretical analysis therefore: the height and width walls in the chamber of the chimney effect have a critical point, the average temperature of a heat source reaches a corresponding minimum value at the critical point, the critical point is taken as a reference, a backflow phenomenon occurs when the height is small, gas flow resistance occurs when the height is higher than the critical point, and along with the increase of heat flow density, the critical width value at the same height approaches to a fixed finger along with the increase of the heat flow density;

as shown in fig. 1 and 3, a heat dissipation device for high-voltage high-power devices comprises a bus bar room 100, a sub-room 200 and heat dissipation devices arranged on the bus bar room 100 and the sub-room 200, wherein the bus bar room 100 adopts a direct liquid method for heat dissipation, and the sub-room 200 adopts a natural cooling method for heat dissipation;

the sub-chamber 200 is provided with a plurality of groups of integrated circuit boxes 300 from top to bottom, and a plurality of groups of air inlets 400 are staggered at the bottom; the ratio of the height to the width of the divider chamber 200 is limited within a threshold value, so that the chimney effect is maximized;

the bus chamber 100 is provided with a plurality of groups of integrated circuit boxes and power transformers from top to bottom, one side of the bus chamber is connected with the sub-chamber 200 through a ventilation pipeline 500, and the other side of the bus chamber is connected with the heat exchanger 700 through a refrigerant liquid heat pipe 600; one side of the heat exchanger 700 is connected with a cold and hot water circulating pipeline 800 through a pipeline.

The ratio of the height to the width of the divider chamber is 2-3: 1.

The ratio of the height to the width of the divider chamber is 50: 19.

The integrated circuit boxes 300 or power transformers in the extension room 200 and the bus room 100 are classified up and down according to the working temperature, and a temperature gradient is formed in the extension room 100 or the bus room 200; the integrated circuit package 300 having a high operating temperature is placed under the integrated circuit package 300 having a low operating temperature.

The component chambers 200 containing the same plurality of integrated circuit boxes or different groups with the same working temperature are connected to one side of the bus bar chamber 100 with the same temperature gradient through the ventilation duct 500; the temperature gradients formed by the integrated circuit boxes or the power transformers of the busbar compartment 100 correspond to the temperature gradients formed by the different ventilation ducts 500 one to one.

The refrigerant liquid heat pipe 600 is provided with a heat absorption section, a heat insulation section and a condensation section from left to right once; the heat exchanges heat with the refrigerant liquid in the heat absorption section, is condensed again in the condensation section through the heat insulation section and then flows back to the heat absorption section; and the other side of the condensation section is connected with a cold and hot water circulating pipeline through a heat exchanger.

The above embodiment is the preferred embodiment of the present invention, which is only used to facilitate the explanation of the present invention, it is not right to the present invention, which makes the restriction on any form, and any person who knows commonly in the technical field can use the present invention to make the equivalent embodiment of local change or modification without departing from the technical features of the present invention.

Claims

1. The utility model provides a high-pressure high-power device heat abstractor, it includes generating line room, extension room and sets up the heat abstractor on generating line room, extension room which characterized in that: the bus room adopts a direct liquid method for heat dissipation, and the branch room adopts a natural cooling method for heat dissipation;

2. The heat dissipating device for high-voltage high-power device as claimed in claim 1, wherein: the ratio of the height to the width of the divider chamber is 2-3: 1.

3. The heat dissipating device for high voltage high power device as claimed in claim 2, wherein: the ratio of the height to the width of the divider chamber is 50: 19.

4. The heat dissipating device for high-voltage high-power device as claimed in claim 1, wherein: the integrated circuit boxes or power transformers in the extension rooms and the bus rooms are classified up and down according to working temperature, and temperature gradients are formed in the extension rooms or the bus rooms; the integrated circuit box with high working temperature is arranged below the integrated circuit box with low working temperature.

5. The heat dissipating device for high-voltage high-power device as claimed in claim 4, wherein: the branch rooms containing the same integrated circuit boxes or different groups with the same working temperature are connected to one side of the bus room with the same temperature gradient through a ventilation pipeline; the temperature gradients formed by the bus chamber integrated circuit box or the power transformer correspond to the temperature gradients formed by different ventilation pipelines one by one.

6. The heat dissipating device for high-voltage high-power device as claimed in claim 1, wherein: the refrigerating fluid heat pipe is provided with a heat absorption section, a heat insulation section and a condensation section from left to right once; the heat exchanges heat with the refrigerant liquid in the heat absorption section, is condensed again in the condensation section through the heat insulation section and then flows back to the heat absorption section; and the other side of the condensation section is connected with a cold and hot water circulating pipeline through a heat exchanger.