CN211661028U

CN211661028U - Mold for producing electronic components

Info

Publication number: CN211661028U
Application number: CN201922322244.2U
Authority: CN
Inventors: 石福裕; 刘星
Original assignee: Xiamen Yuxin Industry Co ltd
Current assignee: Xiamen Yuxin Industry Co ltd
Priority date: 2019-12-21
Filing date: 2019-12-21
Publication date: 2020-10-13
Anticipated expiration: 2029-12-21

Abstract

The utility model relates to a mould for producing electronic components, it includes the mould and with the lower mould that goes up the mould matching, the lower mould bottom is provided with the die holder, the bottom fixed connection of die holder is on the surface of workstation, the one end wall of lower mould is articulated with the one end wall of die holder. The utility model has the advantages of take off the electronic components finished product conveniently.

Description

Mold for producing electronic components

Technical Field

The utility model belongs to the technical field of the technique of production electronic components and parts and specifically relates to a mould for producing electronic components and parts is related to.

Background

The die is a variety of dies and tools for obtaining required products by injection molding, blow molding, extrusion, die casting or forging molding, smelting, stamping and other methods in industrial production. In short, a mold is a tool used to make a shaped article, the tool being made up of various parts, different molds being made up of different parts.

The utility model discloses a disclose a forming die for electronic components in chinese utility model patent that bulletin number is CN205309101U, including the die holder, open at the die holder middle part has the middle part through-hole, be equipped with well mould in the through-hole of middle part, be equipped with on the well mould upper surface and run through the shaping hole of well mould, and locate the first side pan feeding hole that is used for loading the pan feeding on the well mould side, first side pan feeding hole with the shaping hole communicates with each other, open on the side of die holder with the communicating second side pan feeding hole of first side pan feeding hole.

The above prior art solutions have the following drawbacks: the temperature of the finished product of the electronic component produced by injecting the high-temperature molten metal into the grinding tool for molding is very high, the finished product of the electronic component is difficult to take down manually, the time for cooling the finished product of the electronic component is long, and the production efficiency is low.

SUMMERY OF THE UTILITY MODEL

The utility model aims at providing a not enough to prior art exists, the utility model aims at providing a mould for producing electronic components, it has the convenient advantage of taking off electronic components finished product.

The above utility model discloses an above-mentioned utility model purpose can realize through following technical scheme:

the utility model provides a mould for producing electronic components, includes mould and the lower mould that matches with last mould, the lower mould bottom is provided with the die holder, the bottom fixed connection of die holder is on the surface of workstation, an end wall of lower mould is articulated with an end wall of die holder.

Through adopting above-mentioned technical scheme, the shaping of electronic components product is accomplished the back, and the staff overturns the lower mould along the articulated shaft between lower mould and the die holder, because the electronic components finished product receives the influence of self gravity, electronic components can directly drop from the lower mould, need not the staff and goes to touching electronic components with the hand, not only conveniently takes off the electronic components finished product in the lower mould, improves staff's work efficiency moreover.

The present invention may be further configured in a preferred embodiment as: the top wall of the die holder is embedded with a magnet, the top wall of the die holder is provided with a placing groove, a spring in a compression state is vertically arranged in the placing groove, and the top end of the spring is abutted against the bottom wall of the lower die.

Through adopting above-mentioned technical scheme, after the lower mould pushes down, magnet can be in the same place lower mould and die holder laminating, and the lower mould is broken off gently to the staff, and the lower mould receives the elasticity influence of spring, and the lower mould can be opened by automatic bullet, can take off the electronic components finished product from the lower mould this moment, improves staff's work efficiency.

The present invention may be further configured in a preferred embodiment as: one end of the spring, far away from the lower die, is fixedly connected with the bottom wall of the placing groove.

Through adopting above-mentioned technical scheme, the spring extension back, the spring is opened the lower mould bullet, and at this moment, the spring is unrestricted, pops out in the standing groove easily, influences subsequent further use, and keeps away from the one end of lower mould and the bottom fixed connection of spring with the spring, and the spring is fixed can not pop out, guarantees that staff's work efficiency is high-efficient.

The present invention may be further configured in a preferred embodiment as: the peripheral side wall of the lower die is provided with a holding part.

Through adopting above-mentioned technical scheme, regular shape's lower mould is difficult to break off with the fingers and thumb, and sets up the portion of gripping in the week lateral wall of lower mould after, and the staff separates lower mould and base with the help of the portion of gripping convenience, improves staff's work efficiency.

The present invention may be further configured in a preferred embodiment as: the holding part is provided with a heat insulation layer.

Through adopting above-mentioned technical scheme, in electronic components's forming process, the temperature on mould surface can rise fast, sets up the insulating layer on the surface of portion of holding, can avoid the staff to take place the danger of scalding.

The present invention may be further configured in a preferred embodiment as: the bottom of the holding part is provided with an air cylinder, and an output shaft of the air cylinder is hinged with the holding part.

Through adopting above-mentioned technical scheme, the bottom of the portion of gripping is provided with the cylinder, and the output shaft and the portion of gripping of cylinder are articulated, will grip the top through the cylinder and stretch, realize the upset of lower mould, labour saving and time saving improves production efficiency.

The present invention may be further configured in a preferred embodiment as: and a material collecting barrel for collecting finished products of the electronic components is arranged on the periphery of the die holder.

By adopting the technical scheme, after the lower die is turned, the finished electronic component falls into the material receiving barrel for collection, and the collection is convenient and fast.

The present invention may be further configured in a preferred embodiment as: and the material receiving barrel is internally provided with heat dissipation holes for dissipating heat of finished products of electronic components.

Through adopting above-mentioned technical scheme, the electronic components finished product that falls into in the receipts storage bucket with the help of the louvre, forms the convection current of air, and the temperature can reduce fast, improves production efficiency.

To sum up, the utility model discloses a following at least one useful technological effect:

one end wall of the lower die is hinged with one end wall of the bottom film, and after the finished electronic component product is formed, a worker can conveniently take the finished electronic component product out of the lower die only by turning the lower die along a hinged shaft between the lower die and the die holder, so that the working efficiency of the worker is improved;

the top of the die holder is provided with a placing groove, the spring is vertically placed in the placing groove, the bottom of the spring is fixedly connected with the bottom wall of the placing groove, a magnet is embedded in the top wall of the die holder, the spring is compressed after the lower die is pressed down, the magnet attracts the lower die, so that the lower die is attached to the die holder, a worker gently breaks the lower die, the lower die is automatically bounced off by the elastic force of the spring, and at the moment, a finished product of an electronic component can be taken down from the lower die, so that the working efficiency of the worker is improved;

the side wall of the lower die is provided with a holding part, the bottom of the holding part is provided with a cylinder, an output shaft of the cylinder is hinged to the holding part, the holding part is pushed and extended through the cylinder, the lower die is turned, time and labor are saved, and the production efficiency is improved.

Drawings

FIG. 1 is an overall schematic view of the present embodiment;

FIG. 2 is a cross-sectional view taken along line A-A of FIG. 1;

FIG. 3 is an enlarged schematic view of portion A of FIG. 2;

FIG. 4 is an exploded view of the salient magnet of this embodiment;

fig. 5 is an enlarged schematic view of a portion B in fig. 4.

In the figure, 1, an upper die; 2. a lower die; 3. a die holder; 4. a work table; 5. a magnet; 6. a placement groove; 7. a spring; 8. a grip portion; 9. a thermal insulation layer; 10. a cylinder; 11. a hinge plate; 12. a material receiving barrel; 13. and (4) heat dissipation holes.

Detailed Description

The present invention will be described in further detail with reference to the accompanying drawings.

Referring to fig. 1, for the utility model discloses a mould for producing electronic components, including last mould 1, the bottom of going up mould 1 is provided with lower mould 2, goes up mould 1 and lower mould 2 phase-match, goes up mould 1 and lower mould 2 and all is the cuboid form, goes up mould 1 and lower mould 2 and is the metal material and makes.

The bottom of the lower die 2 is provided with a die holder 3, the die holder 3 is rectangular, the die holder 3 is made of metal materials, and the bottom of the die holder 3 is fixedly connected to the surface of a workbench 4. The end wall of one of the width sides of the lower die 2 is hinged with the end wall of one of the width sides of the die holder 3, wherein the hinged shaft is parallel to the width sides of the lower die 2 and the die holder 3.

Referring to fig. 2 and 5, the top wall of the die holder 3 is provided with a magnet 5, the magnet 5 is in a strip shape, and the magnet 5 is embedded in the die holder 3. The standing groove 6 has vertically been seted up to the roof of die holder 3, and standing groove 6 is cylindricly. A spring 7 is placed in the placing groove 6, a gap is formed between the peripheral side wall of the placing groove 6 and the peripheral side wall of the spring 7, the spring 7 is cylindrical, the axis of the spring 7 is perpendicular to the die holder 3, one end, far away from the lower die 2, of the spring 7 is fixedly bonded with the bottom of the placing groove 6, and the original length of the spring 7 is larger than the depth of the placing groove 6. After the lower die 2 is pressed down, the spring 7 is compressed, and the magnet 5 can ensure that the lower die 2 is attached to the die holder 3.

Referring to fig. 3, a holding portion 8 is provided on a peripheral side wall of the lower die 2 away from a hinge shaft between the lower die 2 and the die holder 3, the holding portion 8 is cylindrical, an axis of the holding portion 8 is perpendicular to the peripheral side wall of the lower die 2, and one end of the holding portion 8 close to the lower die 2 is welded to the peripheral side wall of the lower die 2. The peripheral side wall of the holding part 8 is provided with a heat insulation layer 9, the heat insulation layer 9 is fixedly bonded on the peripheral side wall of the holding part 8, and the heat insulation layer 9 is made of asbestos materials.

Referring to fig. 3 and 4, a cylinder 10 is obliquely arranged at the bottom of the holding part 8, one end of the cylinder 10 far away from the holding part 8 is hinged on the workbench 4, and a hinge shaft between the cylinder 10 and the workbench 4 is perpendicular to the axis of the holding part 8. The end of the output shaft of the cylinder 10 is integrally formed with a ring (not shown), and two hinged plates 11 are welded on the end wall of the holding part 8 away from the lower die 2, the two hinged plates 11 are parallel to each other, and the hinged plates 11 are parallel to the axis of the holding part 8. A gap is reserved between the two hinged plates 11, a circular ring at the end part of an output shaft of the air cylinder 10 is positioned between the two hinged plates 11, the circular ring is rotatably connected between the two hinged plates 11, and the rotating shaft of the circular ring is parallel to a hinge shaft between the air cylinder 10 and the workbench 4, so that the holding part 8 is hinged with the air cylinder 10.

The bottom of die holder 3 is provided with receipts storage bucket 12, receives storage bucket 12 to be located 4 surfaces of workstation and keeps away from one side of the portion of gripping 8, receives storage bucket 12 open-top, and a plurality of louvres 13 have been seted up to the week lateral wall and the diapire of receiving storage bucket 12, and louvre 13 makes the air in receiving storage bucket 12 form the convection current, can cool off the electric components and parts finished product of the high temperature that falls into in receiving storage bucket 12 fast.

The implementation principle of the embodiment is as follows: the bottom of the lower die 2 is provided with a die holder 3, one end wall of the die holder 3 is hinged with one end wall of the lower die 2, a magnet 5 is embedded in the die holder 3, a placing groove 6 is vertically formed in the top wall of the die holder 3, a spring 7 is placed in the placing groove 6, and after the lower die 2 is pressed down, the magnet 5 can attach the lower die 2 and the die holder 3 together; the side wall of lower mould 2 has welded the portion of gripping 8, and the one end of the portion of gripping 8 is articulated with the output shaft of cylinder 10, and when the output shaft of cylinder 10 extended, can make lower mould 2 overturn along its articulated shaft, and electronic components after the shaping falls into receiving bucket 12, and the louvre 13 cooling through receiving bucket 12 is again.

The embodiment of this specific implementation mode is the preferred embodiment of the present invention, not limit according to this the utility model discloses a protection scope, so: all equivalent changes made according to the structure, shape and principle of the utility model are covered within the protection scope of the utility model.

Claims

1. The utility model provides a mould for producing electronic components, includes last mould (1) and with last mould (1) lower mould (2) that match, its characterized in that: the utility model discloses a die holder, including lower mould (2), the bottom fixed connection of die holder (3) is on the surface of workstation (4), the one end wall of lower mould (2) is articulated with the one end wall of die holder (3), the roof of die holder (3) is inlayed and is equipped with magnet (5), standing groove (6) have been seted up to the roof of die holder (3), vertically be provided with spring (7) that are compression state in standing groove (6), the diapire butt of the top of spring (7) and lower mould (2).

2. A mold for manufacturing an electronic component as claimed in claim 1, wherein: one end of the spring (7) far away from the lower die (2) is fixedly connected with the bottom wall of the placing groove (6).

3. A mold for manufacturing an electronic component as claimed in claim 1, wherein: the peripheral side wall of the lower die (2) is provided with a holding part (8).

4. A mold for manufacturing an electronic component as claimed in claim 3, wherein: the holding part (8) is provided with a heat insulation layer (9).

5. A mold for manufacturing an electronic component as claimed in claim 3, wherein: an air cylinder (10) is arranged at the bottom of the holding part (8), and an output shaft of the air cylinder (10) is hinged with the holding part (8).

6. A mold for manufacturing an electronic component as claimed in claim 1, wherein: and a material collecting barrel (12) for collecting finished products of electronic components is arranged on the periphery of the die holder (3).

7. A mold for manufacturing an electronic component as claimed in claim 6, wherein: and heat dissipation holes (13) for dissipating heat of the finished electronic component are formed in the material receiving barrel (12).