CN211650458U - Purifying and heat-dissipating wallboard - Google Patents
Purifying and heat-dissipating wallboard Download PDFInfo
- Publication number
- CN211650458U CN211650458U CN201922393728.6U CN201922393728U CN211650458U CN 211650458 U CN211650458 U CN 211650458U CN 201922393728 U CN201922393728 U CN 201922393728U CN 211650458 U CN211650458 U CN 211650458U
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- heat
- plate
- heat dissipation
- dissipation plate
- wallboard
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Abstract
The utility model discloses a purify heat dissipation wallboard, it includes: the heat dissipation plate is embedded with a plurality of heat conduction pipes which are uniformly distributed; the enclosing plate is perpendicular to the heat dissipation plate, arranged along the outer edge of the heat dissipation plate and surrounded to form an accommodating space; the back plate is arranged opposite to the heat dissipation plate and detachably covered on the coaming. Compared with the prior art, the beneficial effects of the utility model include: the heat dissipation plate, the surrounding plate and the back plate are encircled to form accommodating cavities, the heating radiators are arranged between the accommodating cavities, the heat dissipation plate faces indoors, when heating is needed in winter, the heating radiators arranged in the accommodating cavities generate heat, and the heat is transferred indoors through the heat conduction pipes. And the heating panel is smooth and level towards indoor one side, can not the laying dust, breed the bacterium, can satisfy sanitary standard, also can in time transmit the produced heat of radiator to indoor simultaneously to guarantee indoor heating.
Description
Technical Field
The utility model relates to a building materials field, concretely relates to purify heat dissipation wallboard.
Background
In winter in the north, the heater is used for heating, but in order to increase the heat dissipation area of the heater, the appearance of the heater is mostly in a laminated structure. However, in the environment with strict requirements on environmental sanitation standards, such as an operating room, the laminated structure of the heater becomes a sanitary dead angle which is difficult to clean, and is easy to store dirt and carry germs. Therefore, how to perform heat dissipation and heating indoors is achieved on the premise that the sanitary standard is guaranteed.
SUMMERY OF THE UTILITY MODEL
An object of the utility model is to overcome above-mentioned technique not enough, propose one kind, solve among the prior art heating installation heating can not satisfy the technical problem of harsh sanitary requirement.
In order to achieve the technical purpose, the technical scheme of the utility model provides a purify heat dissipation wallboard, include:
the heat dissipation plate is embedded with a plurality of heat conduction pipes which are uniformly distributed;
the enclosing plate is perpendicular to the heat dissipation plate, arranged along the outer edge of the heat dissipation plate and surrounded to form an accommodating space;
the back plate is arranged opposite to the heat dissipation plate and detachably covered on the coaming.
Compared with the prior art, the beneficial effects of the utility model include: the heat dissipation plate, the surrounding plate and the back plate are encircled to form accommodating cavities, the heating radiators are arranged between the accommodating cavities, the heat dissipation plate faces indoors, when heating is needed in winter, the heating radiators arranged in the accommodating cavities generate heat, and the heat is transferred indoors through the heat conduction pipes. And the heating panel is smooth and level towards indoor one side, can not the laying dust, breed the bacterium, can satisfy sanitary standard, also can in time transmit the produced heat of radiator to indoor simultaneously to guarantee indoor heating.
Drawings
Fig. 1 is a schematic structural diagram of a purification and heat dissipation wallboard according to an embodiment of the present invention;
fig. 2 is an exploded view of the purification and heat dissipation wall panel according to the embodiment of the present invention;
fig. 3 is a schematic view of a heat dissipating plate according to an embodiment of the present invention.
Detailed Description
In order to make the objects, technical solutions and advantages of the present invention more clearly understood, the present invention is further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the invention and are not intended to limit the invention.
The utility model provides a purify heat dissipation wallboard, include: heat dissipation plate 100, enclosure 200, and back plate 300. A surrounding plate 200 perpendicular to the heat dissipation plate 100, disposed along an outer edge of the heat dissipation plate 100, and having a receiving space formed therearound; and a back plate 300 which is disposed opposite to the heat dissipation plate 100 and detachably fixed to the surrounding plate 200.
The heat sink 100 has a plurality of mounting holes 110 uniformly distributed therein and a heat pipe 120 embedded in the mounting holes 110, wherein a clamping groove 111 is formed at one end of the mounting hole 110 close to the receiving cavity, and a clamping end 121 is formed at one end of the heat pipe 120 close to the receiving cavity. The engaging end 121 is inserted into the engaging groove 111, and the main body of the heat pipe 120 is inserted into the mounting hole 110, so as to fix the heat pipe 120 on the heat sink 100. And heat pipe 120 preferably adopts the copper pipe to make processing and form, and the inside cavity of copper pipe 120, and half its inside volume packing has water, seals up copper pipe both ends at last to obtain the utility model discloses required heat pipe 120.
And bounding wall 200 is perpendicular to heating panel 100, and it sets up around heating panel 100 outer fringe simultaneously, because bounding wall 200 sets up between heating panel 100 and backplate 300, has played the supporting role, consequently need have sufficient intensity, simultaneously in order to avoid the heat to reveal from bounding wall 200 and go out, consequently bounding wall 200 need adopt thermal insulation material to make, in addition, mating holes 210 has still been seted up on bounding wall 200 to let the heating pipe pass, thereby to setting up the radiator heat supply in accommodating the intracavity.
The back plate 300 includes a substrate 310 and a heat insulation plate 320, wherein the substrate 310 has a C-shaped cross section, and two ends of the substrate 310 are respectively formed with a sliding slot 311, two ends of the heat insulation plate 320 are respectively formed with a sliding key 321, and the sliding keys 321 are embedded in the sliding slots 311, so as to fix the heat insulation plate 320 in the substrate 310. The heat insulation plate 320 is made of a heat insulation material, so that heat is blocked, and the back plate 300 penetrates through the heat insulation plate, but for some working occasions, a plurality of indoor heating devices cause too high indoor temperature, and when heat dissipation to the outside is needed, the heat insulation plate 320 and the substrate 310 are detached, so that the back plate 300 is convenient to dissipate heat, and at the moment, the indoor heat penetrates through the heat dissipation plate 100 and finally passes through the back plate 300 to the outside. In addition, in order to facilitate the installation and maintenance of the radiator in the receiving cavity, the back plate 300 is fixed on the enclosing plate 200 in an openable and closable manner, a pivot 330 is formed on one side of the back plate 300, the pivot 330 is pivoted to the enclosing plate 200, and a buckle is formed on the side opposite to the pivot 330, so that the back plate 300 is fixed on the enclosing plate by the buckle.
The above description of the present invention does not limit the scope of the present invention. Any other corresponding changes and modifications made according to the technical idea of the present invention should be included in the scope of the claims of the present invention.
Claims (5)
1. A purification and heat dissipation wallboard, comprising:
the heat dissipation plate is embedded with a plurality of heat conduction pipes which are uniformly distributed;
the enclosing plate is perpendicular to the heat dissipation plate, arranged along the outer edge of the heat dissipation plate and surrounded to form an accommodating space;
the back plate is arranged opposite to the heat dissipation plate and detachably covered on the coaming.
2. The purifying and heat dissipating wallboard of claim 1, wherein the heat dissipating board has a plurality of mounting holes uniformly distributed thereon, and a clamping groove is formed at one end of the mounting hole close to the receiving cavity, and a clamping end is formed at one end of the heat conducting pipe, and the clamping groove is embedded at the clamping end, and the heat conducting pipe is embedded in the mounting hole.
3. The purifying heat dissipating wall panel of claim 1, wherein the heat conducting tube is hollow inside, and half volume of the heat conducting tube is filled with water.
4. The wallboard of claim 1, wherein a pivot is formed on one side of the back plate, the pivot is pivotally connected to the surrounding plate, and a buckle is formed on an end of the back plate opposite to the pivot and is clamped to the surrounding plate.
5. The purifying and heat dissipating wallboard of claim 1, wherein the back plate comprises a substrate and a heat insulating plate, two ends of the substrate form a sliding slot, two ends of the heat insulating plate form a sliding key, and the two sliding keys are embedded in the two sliding slots respectively.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201922393728.6U CN211650458U (en) | 2019-12-26 | 2019-12-26 | Purifying and heat-dissipating wallboard |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201922393728.6U CN211650458U (en) | 2019-12-26 | 2019-12-26 | Purifying and heat-dissipating wallboard |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN211650458U true CN211650458U (en) | 2020-10-09 |
Family
ID=72699758
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201922393728.6U Active CN211650458U (en) | 2019-12-26 | 2019-12-26 | Purifying and heat-dissipating wallboard |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN211650458U (en) |
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2019
- 2019-12-26 CN CN201922393728.6U patent/CN211650458U/en active Active
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