CN211641260U - Wear-resistant high-pressure resin laminated plate - Google Patents
Wear-resistant high-pressure resin laminated plate Download PDFInfo
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- CN211641260U CN211641260U CN201921799665.8U CN201921799665U CN211641260U CN 211641260 U CN211641260 U CN 211641260U CN 201921799665 U CN201921799665 U CN 201921799665U CN 211641260 U CN211641260 U CN 211641260U
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Abstract
The utility model discloses a wear-resisting high pressure resin lamination board, including lamination board, connecting plate and puigging, the shaping has the spread groove on the lamination board lateral wall, the shaping has on another lateral wall of lamination board the connecting plate, the lamination board includes the transparent polymer layer one of top layer, a transparent polymer layer lower extreme is provided with resin layer one, be provided with high-pressure paperboard layer in the resin layer one, resin layer lower extreme is provided with the sound absorbing layer, sound absorbing layer lower extreme is provided with the puigging. Has the advantages that: the utility model discloses a set up transparent macromolecule layer one and transparent macromolecule layer two, can further promote the wear resistance of resin layer one and resin layer two to form the protection on resin layer one and two surfaces of resin layer, make the resin lamination board surface have splendid wear resistance, make the resin lamination board more durable, thereby make the life of resin lamination board promote greatly.
Description
Technical Field
The utility model relates to a resin lamination board technical field, concretely relates to wear-resisting high pressure resin lamination board.
Background
A High-pressure Laminate, abbreviated as HPL (High-pressure Laminate), is a fire-resistant building material for surface decoration, has abundant surface colors, lines and special physical properties, is widely used in the fields of interior decoration, furniture, kitchen cabinets, laboratory tables, exterior walls and the like, and is mostly manufactured by the steps of impregnation, drying, High temperature and High pressure and the like of Decorative paper and kraft paper.
The existing high-pressure resin laminated plate has limited wear resistance, and the service life of the existing high-pressure resin laminated plate is difficult to meet the use requirement of high strength.
SUMMERY OF THE UTILITY MODEL
Technical problem to be solved
In order to overcome the defects in the prior art, the wear-resistant high-pressure resin laminated plate is provided, and the problems that the wear-resistant performance of the existing high-pressure resin laminated plate is limited, and the service life of the existing high-pressure resin laminated plate is difficult to meet the use requirement of high strength are solved.
(II) technical scheme
The utility model discloses a following technical scheme realizes: the utility model provides a wear-resisting high-pressure resin lamination board, including lamination board, connecting plate and puigging, the shaping has the spread groove on the lamination board lateral wall, the shaping has on another lateral wall of lamination board the connecting plate, the lamination board includes transparent polymer layer one of top layer, a transparent polymer layer lower extreme is provided with resin layer one, be provided with high-pressure paperboard layer one in the resin layer one, a resin layer lower extreme is provided with the sound-absorbing layer, sound-absorbing layer lower extreme is provided with the puigging, the puigging lower extreme is provided with the heat preservation, the heat preservation lower extreme is provided with resin layer two, be provided with high-pressure paperboard layer two in the resin layer two, resin layer two lower extreme is provided with transparent polymer layer two.
Further, the first transparent polymer layer and the first resin layer are connected together in a high-temperature extrusion mode, and the first high-pressure paperboard layer and the first resin layer are connected together in a high-temperature extrusion mode.
By adopting the technical scheme, the first resin layer has better wear resistance, boiling water resistance, impact resistance, dimensional stability and the like, and the first transparent polymer layer can further improve the wear resistance of the first resin layer and form protection on the surface of the first resin layer, so that the resin laminated plate is more durable.
Furthermore, the sound absorption layer is connected with the first resin layer in a high-temperature extrusion mode, and the sound insulation layer is connected with the sound absorption layer in a high-temperature extrusion mode.
Through adopting above-mentioned technical scheme, the sound absorbing layer can carry out the absorption of certain degree to the noise, the puigging can completely cut off the noise to a certain extent, the sound absorbing layer with the puigging cooperation can make resin laminated board have better sound insulation performance.
Furthermore, the heat preservation layer is connected with the sound-proof layer through a high-temperature extrusion mode, and the second resin layer is connected with the heat preservation layer through a high-temperature extrusion mode.
By adopting the technical scheme, the heat insulation layer can greatly improve the heat insulation performance of the resin laminated plate.
Further, the high-pressure paperboard layer II and the resin layer II are connected together in a high-temperature extrusion mode.
Further, the second transparent polymer layer and the second resin layer are connected together in a high-temperature extrusion mode.
By adopting the technical scheme, the second resin layer has better wear resistance, boiling water resistance, impact resistance, dimensional stability and the like, the wear resistance of the first resin layer can be further improved by the second transparent polymer layer, and protection is formed on the surface of the second resin layer, so that the resin laminated plate is more durable.
(III) advantageous effects
Compared with the prior art, the utility model, following beneficial effect has:
for the wear resistance who solves current high-pressure resin lamination board is limited, life is difficult to satisfy the problem of high strength's user demand, the utility model discloses a set up transparent high molecular layer one and transparent high molecular layer two, can further promote the wear resistance of resin layer one and resin layer two to form the protection on resin layer one and resin layer two surfaces, make the resin lamination board surface have splendid wear resistance, make the resin lamination board more durable, thereby make the life of resin lamination board promote greatly.
Drawings
Fig. 1 is a schematic structural view of a wear-resistant high-pressure resin laminate according to the present invention;
fig. 2 is a cross-sectional view of a wear-resistant high-pressure resin laminate according to the present invention;
fig. 3 is a right side view of the wear-resistant high-pressure resin laminate according to the present invention.
The reference numerals are explained below:
1. a laminated board; 2. connecting grooves; 3. a connecting plate; 4. a first transparent polymer layer; 5. a first resin layer; 6. a lower end upright rod; 7. a sound absorbing layer; 8. a sound insulating layer; 9. a heat-insulating layer; 10. a second resin layer; 11. a second high-pressure paperboard layer; 12. and a second transparent polymer layer.
Detailed Description
In order to make the objects, technical solutions and advantages of the present invention more clearly understood, the present invention is further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the invention and are not intended to limit the invention.
As shown in fig. 1-3, the wear-resistant high-pressure resin laminated board in the embodiment comprises a laminated board 1, a connecting plate 3 and a sound insulation layer 8, wherein a connecting groove 2 is formed on one side wall of the laminated board 1, the connecting plate 3 is formed on the other side wall of the laminated board 1, the laminated board 1 comprises a top transparent polymer layer one 4, a resin layer one 5 is arranged at the lower end of the transparent polymer layer one 4, a high-pressure paperboard layer one 6 is arranged in the resin layer one 5, a sound absorption layer 7 is arranged at the lower end of the resin layer one 5, the sound insulation layer 8 is arranged at the lower end of the sound absorption layer 7, a heat insulation layer 9 is arranged at the lower end of the sound insulation layer 8, a resin layer two 10 is arranged at the lower end of the heat insulation layer 9, a high-pressure paperboard layer two 11 is arranged in the resin layer two 10, a transparent polymer layer two 12 is arranged at the lower end of the resin layer two, the first resin layer 5 has good wear resistance, boiling water resistance, shock resistance, dimensional stability and the like, the first transparent polymer layer 4 can further improve the wear resistance of the first resin layer 5 and form protection on the surface of the first resin layer 5, so that the resin laminated plate is more durable, the sound absorption layer 7 is connected with the first resin layer 5 in a high-temperature extrusion mode, the sound insulation layer 8 is connected with the sound absorption layer 7 in a high-temperature extrusion mode, the sound absorption layer 7 can absorb noise to a certain degree, the sound insulation layer 8 can isolate the noise to a certain degree, the sound absorption layer 7 is matched with the sound insulation layer 8 to ensure that the resin laminated plate has good sound insulation performance, the heat insulation layer 9 is connected with the sound insulation layer 8 in a high-temperature extrusion mode, the second resin layer 10 is connected with the heat insulation layer 9 in a high-temperature extrusion mode, and the heat insulation layer 9 can greatly improve the heat insulation performance of the resin laminated plate, two 11 and two 10 of resin layers of high-pressure cardboard layer link together through the mode of high temperature extrusion, and transparent polymer layer two 12 links together through the mode of high temperature extrusion with two 10 of resin layers, and two 10 of resin layers have better wear resistance, boiling water resistance ability, shock resistance, dimensional stability etc. transparent polymer layer two 12 can further promote the wear resistance of resin layer one 5 to form the protection on two 10 surfaces of resin layer, make the resin lamination board more durable.
As shown in fig. 1 to 3, in this embodiment, the transparent polymer layer one 4 and the transparent polymer layer two 12 can further improve the wear resistance of the resin layer one 5 and the resin layer two 10, and form protection on the surfaces of the resin layer one 5 and the resin layer two 10, so that the resin laminated plate is more durable.
The specific implementation process of this embodiment is as follows: resin layer 5 has better wear resistance, boiling water resistance, shock resistance, dimensional stability etc, transparent polymer layer 4 can further promote resin layer 5's wear resistance, and form the protection on resin layer 5 surface, make the resin lamination board more durable, resin layer two 10 also has better wear resistance, boiling water resistance, shock resistance, dimensional stability etc, transparent polymer layer two 12 can further promote resin layer 5's wear resistance, and form the protection on resin layer two 10 surfaces, make the resin lamination board more durable, sound absorbing layer 7 and puigging 8 cooperation can make the resin lamination board have better sound insulation, heat preservation 9 can make the thermal insulation performance of resin lamination board promote greatly.
The above-described embodiments are merely illustrative of the preferred embodiments of the present invention and are not intended to limit the spirit and scope of the present invention. Without departing from the design concept of the present invention, various modifications and improvements made by the technical solution of the present invention by those skilled in the art should fall into the protection scope of the present invention, and the technical contents claimed by the present invention have been fully recorded in the claims.
Claims (6)
1. A wear-resistant high-pressure resin laminate characterized by: comprises a laminated board (1), a connecting board (3) and a sound insulation layer (8), wherein a connecting groove (2) is formed on one side wall of the laminated board (1), the other side wall of the laminated plate (1) is formed with the connecting plate (3), the laminated plate (1) comprises a transparent macromolecule layer I (4) at the top layer, the lower end of the transparent polymer layer I (4) is provided with a resin layer I (5), a first high-pressure paperboard layer (6) is arranged in the first resin layer (5), a sound absorption layer (7) is arranged at the lower end of the first resin layer (5), the sound insulation layer (8) is arranged at the lower end of the sound absorption layer (7), the heat insulation layer (9) is arranged at the lower end of the sound insulation layer (8), a second resin layer (10) is arranged at the lower end of the heat-insulating layer (9), a second high-pressure paperboard layer (11) is arranged in the second resin layer (10), and a second transparent polymer layer (12) is arranged at the lower end of the second resin layer (10).
2. A wear-resistant high-pressure resin laminate according to claim 1, characterized in that: the transparent polymer layer I (4) and the resin layer I (5) are connected together in a high-temperature extrusion mode, and the high-pressure paperboard layer I (6) and the resin layer I (5) are connected together in a high-temperature extrusion mode.
3. A wear-resistant high-pressure resin laminate according to claim 2, characterized in that: the sound absorption layer (7) is connected with the first resin layer (5) in a high-temperature extrusion mode, and the sound insulation layer (8) is connected with the sound absorption layer (7) in a high-temperature extrusion mode.
4. A wear-resistant high-pressure resin laminate according to claim 3, characterized in that: the heat preservation layer (9) is connected with the sound insulation layer (8) in a high-temperature extrusion mode, and the second resin layer (10) is connected with the heat preservation layer (9) in a high-temperature extrusion mode.
5. A wear-resistant high-pressure resin laminate according to claim 4, characterized in that: and the high-pressure paperboard layer II (11) and the resin layer II (10) are connected together in a high-temperature extrusion mode.
6. A wear-resistant high-pressure resin laminate according to claim 5, characterized in that: and the second transparent polymer layer (12) and the second resin layer (10) are connected together in a high-temperature extrusion mode.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201921799665.8U CN211641260U (en) | 2019-10-24 | 2019-10-24 | Wear-resistant high-pressure resin laminated plate |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201921799665.8U CN211641260U (en) | 2019-10-24 | 2019-10-24 | Wear-resistant high-pressure resin laminated plate |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN211641260U true CN211641260U (en) | 2020-10-09 |
Family
ID=72690923
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201921799665.8U Expired - Fee Related CN211641260U (en) | 2019-10-24 | 2019-10-24 | Wear-resistant high-pressure resin laminated plate |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN211641260U (en) |
-
2019
- 2019-10-24 CN CN201921799665.8U patent/CN211641260U/en not_active Expired - Fee Related
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| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20201009 Termination date: 20211024 |
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| CF01 | Termination of patent right due to non-payment of annual fee |