CN211640555U

CN211640555U - Fine wire cutting machine for silicon wafer

Info

Publication number: CN211640555U
Application number: CN202020200415.4U
Authority: CN
Inventors: 陈源; 汪建顺; 俞建勇; 陈雷刚
Original assignee: Quzhou Jingzhe Electronic Materials Co ltd
Current assignee: Quzhou Jingzhe Electronic Materials Co ltd
Priority date: 2020-02-24
Filing date: 2020-02-24
Publication date: 2020-10-09
Anticipated expiration: 2030-02-24

Abstract

The utility model discloses a fine rule cutting machine for silicon chip, including operation panel, horizontal pole and connecting block, the last surface intermediate position fixed mounting of operation panel has the hydraulic stem, second electric telescopic handle is installed to the inboard of montant, the right side of carrier block is connected with the shower nozzle, and the right-hand member of shower nozzle is connected with the connecting pipe, the fifth wheel is installed to the top of supporting shoe, and the intermediate position of fifth wheel runs through and installs the bull stick, the end-to-end connection of bull stick has first motor, the surface laminating of fifth wheel has the clamp plate, and the inside of clamp plate runs through and installs the screw rod, the bracing piece is installed in the outside of hydraulic stem, the montant runs through in the inside of carrier bar, and the end-to-end connection of carrier bar has the second motor, the baffle is. This fine rule cutting machine for silicon chip can not only cool down the sample and the fine rule of cutting, conveniently changes the fine rule of different thicknesses moreover.

Description

Fine wire cutting machine for silicon wafer

Technical Field

The utility model relates to a silicon chip technology field specifically is a fine rule cutting machine for silicon chip.

Background

The crust of the earth contains very high content of silicon, which provides a source for the production of monocrystalline silicon, the silicon wafer has high hardness and fine texture, and needs to be cut by a special cutting device, and the fine wire cutting machine is a device for cutting the silicon wafer.

At present, a commonly-used fine wire cutting machine for silicon wafers cannot cool cut samples and fine wires, and the fine wires with different thicknesses are inconvenient to replace, so that the fine wire cutting machine for the silicon wafers is provided, and the problem provided in the method is solved.

SUMMERY OF THE UTILITY MODEL

An object of the utility model is to provide a fine rule cutting machine for silicon chip to solve the present fine rule cutting machine for silicon chip commonly used that above-mentioned background art provided, not only can not cool down the sample and the fine rule of cutting, the inconvenient problem of changing the fine rule of different thicknesses moreover.

In order to achieve the above object, the utility model provides a following technical scheme: a fine wire cutting machine for silicon wafers comprises an operating platform, a cross rod and a connecting block, wherein a hydraulic rod is fixedly installed in the middle position of the upper surface of the operating platform, the top of the hydraulic rod is connected with a placing plate, the cross rod penetrates through the left end and the right end of the upper surface of the cross rod, a supporting block is installed above the cross rod, the connecting block is installed on the left side and the right side of the supporting block respectively, a first roller is connected to the front side of the connecting block, a first electric telescopic rod is connected to the outer side of the connecting block, a vertical rod is symmetrically connected to the bottom of the supporting block, the tail end of the vertical rod is connected with a second roller, a second electric telescopic rod is installed on the inner side of the vertical rod, the tail end of the second electric telescopic rod is connected with a bearing block, a spray head is connected to the right side of the bearing block, a, the end-to-end connection of bull stick has first motor, the surface laminating of fifth wheel has the clamp plate, and the inside of clamp plate runs through to install the screw rod, the bracing piece is installed in the outside of hydraulic stem, the montant runs through in the inside of carrier bar, and the end-to-end connection of carrier bar has the second motor, the baffle is installed to the inboard of bracing piece.

Preferably, the upper surface of the operating platform is of a porous structure, and the operating platform and the supporting rod are of an integrated structure.

Preferably, a front-back sliding structure is formed between the vertical rod and the supporting block, and a linkage structure is formed between the vertical rod and the bearing rod.

Preferably, the second roller is of a groove-shaped structure, and the width of the groove-shaped structure is gradually increased from inside to outside.

Preferably, the left end of the connecting pipe is of a telescopic structure, and the second electric telescopic rod arranged on the left side of the connecting pipe is hinged to the bearing block.

Preferably, the baffle is connected with the support rod in a clamping manner, and the height of the baffle is higher than that of the spray head.

Compared with the prior art, the beneficial effects of the utility model are that: the thin line cutting machine for the silicon wafer can not only cool a cut sample and thin lines, but also conveniently replace the thin lines with different thicknesses;

1. the second electric telescopic rod is hinged with the bearing block, the bearing block is fixedly connected with the spray head, the head end of a connecting pipe connected with the spray head is of a telescopic structure, the spray head rotates through the telescopic action of the second electric telescopic rod, so that water sprayed by the spray head can just fall on a sample, and the cut sample and a fine wire can be cooled;

2. the height of the baffle is higher than that of the spray head, clear water can be shielded, and the clear water is prevented from splashing, the baffle is connected with the support rod in a clamping manner, so that the baffle is convenient to disassemble, groove-shaped structures with different widths are formed on the outer surfaces of the second roller and the first roller, and thin lines with different thicknesses can be wound;

3. the cutting fine rule twines the surface of second gyro wheel and first gyro wheel in proper order, takes the end of cutting fine rule to put in the below of clamp plate, fixes through the threaded connection between clamp plate, screw rod and the fifth wheel, can make the cutting fine rule be in the state of tensioning through first electric telescopic handle's flexible.

Drawings

FIG. 1 is a front sectional structure of the present invention;

FIG. 2 is a schematic view of the top view structure of the connection between the support rod and the baffle plate of the present invention;

FIG. 3 is a schematic view of the connection structure of the vertical bar and the carrying bar of the present invention;

fig. 4 is a schematic view of the connecting wheel of the present invention.

In the figure: 1. an operation table; 2. a hydraulic lever; 3. placing the plate; 4. a cross bar; 5. a support block; 6. connecting blocks; 7. a first roller; 8. a first electric telescopic rod; 9. a vertical rod; 10. a second roller; 11. a second electric telescopic rod; 12. a bearing block; 13. a spray head; 14. a connecting pipe; 15. a connecting wheel; 16. a rotating rod; 17. a first motor; 18. pressing a plate; 19. a screw; 20. a support bar; 21. a carrier bar; 22. a second motor; 23. and a baffle plate.

Detailed Description

The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.

Referring to fig. 1-4, the present invention provides a technical solution: a fine wire cutting machine for silicon wafers comprises an operation table 1, a hydraulic rod 2, a placing plate 3, a cross rod 4, supporting blocks 5, connecting blocks 6, first idler wheels 7, a first electric telescopic rod 8, a vertical rod 9, a second idler wheel 10, a second electric telescopic rod 11, a bearing block 12, a spray head 13, a connecting pipe 14, a connecting wheel 15, a rotating rod 16, a first motor 17, a pressing plate 18, a screw rod 19, a supporting rod 20, a bearing rod 21, a second motor 22 and a baffle plate 23, wherein the hydraulic rod 2 is fixedly arranged in the middle of the upper surface of the operation table 1, the placing plate 3 is connected to the top of the hydraulic rod 2, the upper surface of the operation table 1 is of a porous structure, the operation table 1 and the supporting rod 20 are of an integrated structure, waste water conveniently flows down from the operation table 1, the cross rod 4 penetrates through the left end and the right end of the upper surface of the cross rod 4, the supporting blocks 5 are arranged above the cross rod 4, the front side of the connecting block 6 is connected with a first roller 7, the outer side of the connecting block 6 is connected with a first electric telescopic rod 8, a front-back sliding structure is formed between the vertical rod 9 and the supporting block 5, a linkage structure is formed between the vertical rod 9 and the bearing rod 21, the movement of the vertical rod 9 is convenient, the bottom of the supporting block 5 is symmetrically connected with the vertical rod 9, the tail end of the vertical rod 9 is connected with a second roller 10, the second roller 10 is of a groove-shaped structure, the width of the groove-shaped structure is sequentially increased from inside to outside, the second roller 10 can place fine wires with different thicknesses, the inner side of the vertical rod 9 is provided with a second electric telescopic rod 11, the tail end of the second electric telescopic rod 11 is connected with a bearing block 12, the right side of the bearing block 12 is connected with a spray head 13, the right end of the spray head 13 is connected with a connecting pipe 14, a, the end connection of bull stick 16 has first motor 17, and the surface laminating of fifth wheel 15 has clamp plate 18, and the inside of clamp plate 18 runs through and installs screw rod 19, and bracing piece 20 is installed in the outside of hydraulic stem 2, and montant 9 runs through in the inside of carrier bar 21, and the end connection of carrier bar 21 has second motor 22, and baffle 23 is installed to the inboard of bracing piece 20.

As shown in fig. 1, the left end of the connecting pipe 14 is a telescopic structure, and the second electric telescopic rod 11 mounted on the left side of the connecting pipe 14 is connected with the bearing block 12 in a hinged manner, and the spray head 13 can be rotated by the telescopic action of the second electric telescopic rod 11.

As shown in fig. 1 and 2, the baffle 23 and the support rod 20 are connected by a snap connection, and the height of the baffle 23 is higher than that of the spray head 13, so that the baffle 23 can shield the clear water.

The working principle is as follows: when the fine wire cutting machine for the silicon wafer is used, cutting fine wires are sequentially wound on the outer surfaces of a second roller 10 and a first roller 7, the tail ends of the cutting fine wires are placed below a pressing plate 18 and are fixed through threaded connection among the pressing plate 18, a screw rod 19 and a connecting wheel 15, the cutting fine wires can be in a tensioning state through the extension and retraction of a first electric telescopic rod 8, the connecting wheel 15 is driven to rotate through a first motor 17, the cutting fine wires can be driven to rotate through the rotation of the connecting wheel 15, a sample carrying block, a resin ceramic block and a sample are placed on a heating platform, a heating device is lifted to be more than 90 degrees, paraffin is uniformly coated on the surfaces of the sample carrying block and the resin ceramic block, the resin ceramic block is placed on the sample carrying block to be pressed, the sample is placed on the resin ceramic block and is fixed in an auxiliary mode according to actual conditions, the sample carrying block is placed on the upper surface of a placing plate 3, the sample carrying block is fixed through the threaded connection between the placing plate 3 and the cross rod 4, the sample can move upwards through the extension and retraction of the hydraulic rod 2, so that the silicon wafer is cut fixedly, water in the water tank can reach the spray head 13 through the connecting pipe 14 through the suction pump arranged on the outer wall of the connecting pipe 14 and is sprayed out from the spray head 13, clear water is sprayed out through the spray head 13, the water from the spray head 13 can cool the cut sample and fine wires, the waste water flows into the collecting box at the bottom of the operating platform 1 because the operating platform 1 is of a porous structure, the bearing block 12 is fixedly connected with the spray head 13 because the connecting mode of the second electric telescopic rod 11 and the bearing block 12 is hinged, the head end of the connecting pipe 14 connected with the spray head 13 is of a telescopic structure, the spray head 13 rotates through the extension and retraction of the second electric telescopic rod 11, and the water sprayed out by the spray head 13 just falls on the sample, baffle 23 highly be higher than shower nozzle 13's height, can shelter from the clear water, avoid the clear water to spatter all around, and baffle 23 and bracing piece 20 between the connected mode be the block and be connected, be convenient for dismantle baffle 23, this is this fine rule cutting machine's for the silicon chip whole course of work.

Those not described in detail in this specification are within the skill of the art. The utility model discloses the standard part that uses all can purchase from the market, and dysmorphism piece all can be customized according to the description with the record of drawing of description, and the concrete connection mode of each part all adopts conventional means such as ripe bolt, rivet, welding among the prior art, and machinery, part and equipment all adopt prior art, and conventional model, including circuit connection adopts conventional connection mode among the prior art, does not detailed here again.

Although the present invention has been described in detail with reference to the foregoing embodiments, it will be apparent to those skilled in the art that modifications may be made to the embodiments or portions thereof without departing from the spirit and scope of the invention.

Claims

1. The utility model provides a fine rule cutting machine for silicon chip, includes operation panel (1), horizontal pole (4) and connecting block (6), its characterized in that: the hydraulic rod (2) is fixedly installed at the middle position of the upper surface of the operating table (1), the top of the hydraulic rod (2) is connected with the placing plate (3), the transverse rod (4) penetrates through the left end and the right end of the upper surface of the transverse rod (4), the supporting block (5) is installed above the transverse rod (4), the connecting blocks (6) are respectively installed on the left side and the right side of the supporting block (5), the front side of the connecting block (6) is connected with first rollers (7), the outer side of the connecting block (6) is connected with first electric telescopic rods (8), the bottoms of the supporting blocks (5) are symmetrically connected with vertical rods (9), the tail ends of the vertical rods (9) are connected with second rollers (10), second electric telescopic rods (11) are installed on the inner sides of the vertical rods (9), the tail ends of the second electric telescopic rods (11) are connected with bearing blocks (12), and the right sides of the bearing blocks (, and the right-hand member of shower nozzle (13) is connected with connecting pipe (14), fifth wheel (15) are installed to the top of supporting shoe (5), and the intermediate position of fifth wheel (15) runs through and installs bull stick (16), the end-to-end connection of bull stick (16) has first motor (17), the surface laminating of fifth wheel (15) has clamp plate (18), and the inside of clamp plate (18) runs through and installs screw rod (19), bracing piece (20) are installed in the outside of hydraulic stem (2), montant (9) run through in the inside of carrier bar (21), and the end-to-end connection of carrier bar (21) has second motor (22), baffle (23) are installed to the inboard of bracing piece (20).

2. The fine wire saw for silicon wafers as claimed in claim 1, wherein: the upper surface of the operating platform (1) is of a porous structure, and the operating platform (1) and the supporting rod (20) are of an integrated structure.

3. The fine wire saw for silicon wafers as claimed in claim 1, wherein: a front-back sliding structure is formed between the vertical rod (9) and the supporting block (5), and a linkage structure is formed between the vertical rod (9) and the bearing rod (21).

4. The fine wire saw for silicon wafers as claimed in claim 1, wherein: the second idler wheel (10) is of a groove-shaped structure, and the width of the groove-shaped structure is sequentially increased from inside to outside.

5. The fine wire saw for silicon wafers as claimed in claim 1, wherein: the left end of the connecting pipe (14) is of a telescopic structure, and the second electric telescopic rod (11) and the bearing block (12) are arranged on the left side of the connecting pipe (14) in a hinged mode.

6. The fine wire saw for silicon wafers as claimed in claim 1, wherein: the baffle (23) and the support rod (20) are connected in a clamping manner, and the height of the baffle (23) is higher than that of the spray head (13).