CN211630260U - Heat dissipation compact digit high definition hybrid matrix - Google Patents
Heat dissipation compact digit high definition hybrid matrix Download PDFInfo
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- CN211630260U CN211630260U CN202020598030.8U CN202020598030U CN211630260U CN 211630260 U CN211630260 U CN 211630260U CN 202020598030 U CN202020598030 U CN 202020598030U CN 211630260 U CN211630260 U CN 211630260U
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Abstract
The utility model discloses a digital high definition hybrid matrix of compact dispels heat, place control panel, mainboard, a plurality of input integrated circuit board, a plurality of output integrated circuit board, power module, signal interface module, button module and the heat dissipation module of installation casing in including the installation casing. The utility model has the advantages of reasonable overall design, compact structure, and input integrated circuit board, the output integrated circuit board, power module and heat dissipation module all adopt the mode of plug to install in the installation casing, the installation is simple, it is convenient to dismantle, be convenient for maintain, and simultaneously, installation cavity inner space is great, can place a plurality of input integrated circuit boards and a plurality of output integrated circuit boards according to actual demand, and heat dissipation module direct arrangement is in the below of input integrated circuit board and output integrated circuit board, can reduce the interval between heat dissipation module and input integrated circuit board and the output integrated circuit board, and then can realize the direct heat dissipation to input integrated circuit board and output integrated circuit board, the radiating effect is good, therefore.
Description
Technical Field
The utility model relates to a high definition hybrid matrix technical field especially relates to a heat dissipation compact digit high definition hybrid matrix.
Background
The high-definition hybrid matrix is a high-performance high-definition video signal switching device and supports multi-channel signal input and multi-channel signal output. The matrix is used for the input and output exchange of a plurality of high-definition digital signals, any one path of signal output can freely select any one path of signal source without interfering other output, the signal transmission attenuation is reduced to the minimum, and the image and sound signals can be output in high fidelity. The existing high-definition hybrid matrix generally has the defects of complex installation, inconvenient maintenance, poor heat dissipation effect, disordered structure and the like.
SUMMERY OF THE UTILITY MODEL
The utility model aims at providing a digit high definition hybrid matrix of heat dissipation compact, this hybrid matrix overall design is reasonable, compact structure, and input integrated circuit board, the output integrated circuit board, power module and heat dissipation module all adopt the mode of plug to install in the installation casing, the installation is simple, it is convenient to dismantle, be convenient for maintain, and simultaneously, installation cavity inner space is great, can place a plurality of input integrated circuit boards and a plurality of output integrated circuit boards according to actual demand, and the heat dissipation module direct arrangement is in the below of input integrated circuit board and output integrated circuit board, can reduce the interval between heat dissipation module and input integrated circuit board and the output integrated circuit board, and then can realize the direct heat dissipation to input integrated circuit board and output integrated circuit board, the radiating effect is good, therefore, the clothes.
In order to realize the purpose, the following technical scheme is adopted:
a heat dissipation compact type digital high-definition hybrid matrix comprises a mounting shell, a control board, a mainboard, a plurality of input board cards, a plurality of output board cards, a power module, a signal interface module, a key module and a heat dissipation module, wherein the control board, the mainboard, the plurality of input board cards, the plurality of output board cards, the power module, the signal interface module, the key module and the heat dissipation module are; the main board is arranged in the mounting shell along the vertical direction, and the signal interface module is arranged on one side of the mounting shell in parallel with the main board; the input board cards and the output board cards are sequentially arranged between the main board and the signal interface module at intervals along the vertical direction, and both ends of each input board card and both ends of each output board card are respectively electrically connected with the main board and the signal interface module; the heat dissipation module is arranged below the input board cards and the output board cards and used for dissipating heat and cooling the whole hybrid matrix; the key module is arranged on the other side of the mounting shell and is electrically connected with the control panel, and the control panel is also electrically connected with the main board, the power supply module and the heat dissipation module respectively; the signal interface module is used for receiving and transmitting network signals and various different audio and video signals, the key module is used for controlling the hybrid matrix to work through the control panel, and the power supply module is used for supplying power to the hybrid matrix.
Further, the mounting shell comprises a front plate and a rear plate which are arranged in parallel at intervals, and a top plate, a bottom plate and two side plates which are arranged between the front plate and the rear plate; enclose into a mounting cavity between front bezel, backplate and roof, bottom plate and the both sides board, control panel, mainboard, a plurality of input integrated circuit board, a plurality of output integrated circuit board, power module and heat dissipation module equipartition are arranged in the mounting cavity.
Furthermore, the mounting shell also comprises a mounting plate which is arranged between the two side plates in parallel with the front plate, and the main plate is embedded on one side of the mounting plate close to the rear plate; the signal interface module comprises a signal interface board arranged on the inner side of the back plate, a plurality of VGA signal input interfaces, a plurality of HDMI signal input interfaces, a plurality of DVI signal input interfaces, a plurality of network signal interfaces, a plurality of VGA signal output interfaces, a plurality of HDMI signal output interfaces and a plurality of DVI signal output interfaces, wherein the VGA signal input interfaces, the HDMI signal input interfaces, the network signal interfaces, the VGA signal output interfaces, the HDMI signal output interfaces and the DVI signal output interfaces are embedded on the outer; the input board cards and the output board cards are arranged between the main board and the signal interface board, and two ends of each input board card and two ends of each output board card are respectively and electrically connected with the main board and the signal interface board.
Furthermore, a plurality of adapter seats are correspondingly arranged at intervals in the length direction of one side of the main board opposite to the signal interface board, each adapter seat is provided with a first slot along the vertical direction, and the plurality of input board cards and the plurality of output board cards are sequentially inserted between the main board and the signal interface board through the first slots on the main board and the signal interface board.
Furthermore, the heat dissipation module comprises a heat dissipation mounting seat inserted below the input board cards and the output board cards, a plurality of heat dissipation fans installed in the heat dissipation mounting seat, and a plurality of heat dissipation holes arranged on the periphery of the installation shell.
Furthermore, the power module comprises a power seat inserted on one side of the output board card, a power body arranged in the power seat, a power adapter plate electrically connected with the power body and used for being connected with the control panel, and a power interface embedded on the outer side of the rear shell and connected with the power body.
Adopt above-mentioned scheme, the beneficial effects of the utility model are that:
overall design is reasonable, compact structure, and the input integrated circuit board, the output integrated circuit board, power module and heat dissipation module all adopt the mode of plug to install in the installation casing, the installation is simple, it is convenient to dismantle, the maintenance of being convenient for, simultaneously, installation cavity inner space is great, can place a plurality of input integrated circuit boards and a plurality of output integrated circuit boards according to the actual demand, and heat dissipation module direct arrangement is in the below of input integrated circuit board and output integrated circuit board, can reduce the interval between heat dissipation module and input integrated circuit board and the output integrated circuit board, and then can realize the direct heat dissipation to input integrated circuit board and output integrated circuit board, the radiating effect is good, therefore.
Drawings
Fig. 1 is a perspective view of the present invention;
FIG. 2 is a perspective view of FIG. 1 with the top, back and side panels omitted;
FIG. 3 is a perspective view of FIG. 2 with the input board card and the output board card omitted;
wherein the figures identify the description:
1, mounting a shell; 2-control panel;
3, a main board; 4, inputting a board card;
5, outputting a board card; 6, a power supply module;
7-signal interface module; 8, a key module;
9-a heat dissipation module; 11-a mounting plate;
31-an adapter; 61-power supply seat;
62, a power supply adapter plate; 63-power interface;
71-a signal interface board; 72-network signal interface;
91-heat dissipation mounting base; 92-a radiator fan;
93-heat dissipation holes.
Detailed Description
The present invention will be described in detail below with reference to the accompanying drawings and specific embodiments.
Referring to fig. 1 to 3, the utility model provides a heat dissipation compact type digital high definition hybrid matrix, which comprises an installation shell 1, a control panel 2 arranged in the installation shell 1, a mainboard 3, a plurality of input board cards 4, a plurality of output board cards 5, a power module 6, a signal interface module 7, a key module 8 and a heat dissipation module 9; the main board 3 is installed in the installation shell 1 along the vertical direction, and the signal interface module 7 is installed on one side of the installation shell 1 in parallel with the main board 3; the input board cards 4 and the output board cards 5 are sequentially arranged between the main board 3 and the signal interface module 7 at intervals along the vertical direction, and two ends of each input board card 4 and two ends of each output board card 5 are respectively electrically connected with the main board 3 and the signal interface module 7; the heat dissipation module 9 is arranged below the input board cards 4 and the output board cards 5 and used for dissipating heat and cooling the whole hybrid matrix; the key module 8 is arranged on the other side of the mounting shell 1 and is electrically connected with the control panel 2, and the control panel 2 is also electrically connected with the main board 3, the power module 6 and the heat dissipation module 9 respectively; the signal interface module 7 is used for receiving and transmitting network signals and various audio and video signals, the key module 8 is used for controlling the hybrid matrix to work through the control panel 2, and the power supply module 6 is used for supplying power to the hybrid matrix.
With reference to fig. 1-3, in the present embodiment, the input board card 4 is located on the left side in fig. 2, the output board card 5 is located on the right side in fig. 2, and the plurality of input board cards 4 and the plurality of output board cards 5 are sequentially arranged in the mounting housing 1 at intervals along the vertical direction, so that the structure is simple, clear and convenient to disassemble and maintain; each input board card 4 and each output board card 5 are respectively used for single-path input and single-path output, in the embodiment, the number of the input board cards 4 and the number of the output board cards 5 are both designed to be 9, so that the maximum 9-path input and 9-path output can be met, the requirements of different use environments are met, and the universal applicability is strong; the heat dissipation module 9 is directly arranged below the input board cards 4 and the output board cards 5, so that on one hand, the space between the heat dissipation module 9 and the input board cards 4 and the space between the heat dissipation module 9 and the output board cards 5 can be reduced, the heat dissipation module 9 can directly dissipate heat of the input board cards 4 and the output board cards 5, the heat dissipation efficiency is improved, and on the other hand, the whole hybrid matrix structure is more compact and convenient to carry and install; control panel 2 and mainboard 3 are through 34PIN winding displacement electric connection, and accessible button module 8 is through control panel 2 control hybrid matrix work, convenient operation.
Specifically, the mounting housing 1 includes a front plate and a rear plate arranged in parallel and at an interval, and a top plate, a bottom plate and two side plates arranged between the front plate and the rear plate; a mounting cavity is defined by the front plate, the rear plate, the top plate, the bottom plate and the two side plates, and the control panel 2, the main board 3, the input board cards 4, the output board cards 5, the power module 6 and the heat dissipation module 9 are uniformly distributed in the mounting cavity. The inner space of the installation cavity is large, and a plurality of input board cards 4 and output board cards 5 can be placed according to customer requirements, so that customized assembly is realized; meanwhile, the inner space of the installation cavity is larger, so that the gas exchange speed between the inside and the outside of the installation cavity can be increased, and the heat dissipation effect is indirectly improved; in addition, the front plate outside still is equipped with the display screen, can show the system information that mixes matrix work, is convenient for look over, and simultaneously, front plate outside both ends still are equipped with a handle respectively, are convenient for carry and install and mix the matrix.
Specifically, the mounting shell 1 further comprises a mounting plate 11 arranged between the two side plates in parallel with the front plate, and the main plate 3 is embedded on one side of the mounting plate 11 close to the rear plate; the signal interface module 7 comprises a signal interface board 71 arranged on the inner side of the back plate, a plurality of VGA signal input interfaces, a plurality of HDMI signal input interfaces, a plurality of DVI signal input interfaces, a plurality of network signal interfaces 72, a plurality of VGA signal output interfaces, a plurality of HDMI signal output interfaces and a plurality of DVI signal output interfaces, wherein the VGA signal input interfaces, the HDMI signal input interfaces, the DVI signal input interfaces, the network signal interfaces 72, the VGA signal output interfaces, the HDMI signal output interfaces and the DVI signal; the input boards 4 and the output boards 5 are disposed between the main board 3 and the signal interface board 71, and two ends of each input board 4 and two ends of each output board 5 are electrically connected to the main board 3 and the signal interface board 71, respectively. The audio and video signal input interface and the output interface are arranged, different signal sources can be accessed according to actual requirements, and the audio and video signal input interface and the audio and video signal output interface are convenient to use and high in universality.
Specifically, a plurality of adapter bases 31 are further correspondingly arranged at intervals in the length direction of the opposite side of the main board 3 and the signal interface board 71, each adapter base 31 is provided with a first slot along the vertical direction, and a plurality of input board cards 4 and a plurality of output board cards 5 are sequentially inserted between the main board 3 and the signal interface board 71 through the main board 3 and the first slots on the signal interface board 71; the heat dissipation module 9 comprises a heat dissipation mounting seat 91 inserted below the input board cards 4 and the output board cards 5, a plurality of heat dissipation fans 92 mounted in the heat dissipation mounting seat 91, and a plurality of heat dissipation holes 93 formed in the peripheral side of the mounting shell 1; the power module 6 comprises a power socket 61 inserted at one side of the output board 5, a power body arranged in the power socket 61, a power adapter plate 62 electrically connected with the power body and used for being connected with the control board 2, and a power interface 63 embedded at the outer side of the rear shell and connected with the power body. The input board card 4, the output board card 5, the power module 6 and the heat dissipation module 9 are installed in the installation shell 1 in a plugging mode, and the installation is simple, the disassembly is convenient, and the maintenance is convenient; in this embodiment, the number of the heat dissipation fans 92 is 4 (which can be freely installed according to actual requirements), and the air fanned out by the heat dissipation fans 92 forms air convection with the outside through the plurality of heat dissipation holes 93, so that heat in the installation cavity can be timely dissipated to the outside, cooling inside the installation cavity is realized, and the service life of the product can be further prolonged; the power module 6 is placed on one side of the output board card 5 (namely, the rightmost side of the installation cavity in fig. 2), so that the interference of a power supply on signal input can be effectively isolated, and the stability of signal transmission is ensured.
The above description is only exemplary of the present invention and should not be construed as limiting the present invention, and any modifications, equivalents and improvements made within the spirit and principles of the present invention are intended to be included within the scope of the present invention.
Claims (6)
1. A heat dissipation compact type digital high-definition hybrid matrix is characterized by comprising an installation shell, a control board, a main board, a plurality of input board cards, a plurality of output board cards, a power supply module, a signal interface module, a key module and a heat dissipation module, wherein the control board, the main board, the plurality of input board cards, the plurality of output board cards, the power supply module, the signal interface module, the key module and the heat; the main board is arranged in the mounting shell along the vertical direction, and the signal interface module is arranged on one side of the mounting shell in parallel with the main board; the input board cards and the output board cards are sequentially arranged between the main board and the signal interface module at intervals along the vertical direction, and both ends of each input board card and both ends of each output board card are respectively electrically connected with the main board and the signal interface module; the heat dissipation module is arranged below the input board cards and the output board cards and used for dissipating heat and cooling the whole hybrid matrix; the key module is arranged on the other side of the mounting shell and is electrically connected with the control panel, and the control panel is also electrically connected with the main board, the power supply module and the heat dissipation module respectively; the signal interface module is used for receiving and transmitting network signals and various different audio and video signals, the key module is used for controlling the hybrid matrix to work through the control panel, and the power supply module is used for supplying power to the hybrid matrix.
2. The thermally dissipative compact digital high definition hybrid matrix of claim 1, wherein said mounting housing comprises a front plate, a rear plate spaced parallel to each other, and a top plate, a bottom plate and two side plates disposed between said front plate and said rear plate; enclose into a mounting cavity between front bezel, backplate and roof, bottom plate and the both sides board, control panel, mainboard, a plurality of input integrated circuit board, a plurality of output integrated circuit board, power module and heat dissipation module equipartition are arranged in the mounting cavity.
3. The heat-dissipating compact digital high-definition hybrid matrix according to claim 2, wherein the mounting housing further comprises a mounting plate disposed between the two side plates in parallel with the front plate, the main plate being embedded in a side of the mounting plate adjacent to the rear plate; the signal interface module comprises a signal interface board arranged on the inner side of the back plate, a plurality of VGA signal input interfaces, a plurality of HDMI signal input interfaces, a plurality of DVI signal input interfaces, a plurality of network signal interfaces, a plurality of VGA signal output interfaces, a plurality of HDMI signal output interfaces and a plurality of DVI signal output interfaces, wherein the VGA signal input interfaces, the HDMI signal input interfaces, the network signal interfaces, the VGA signal output interfaces, the HDMI signal output interfaces and the DVI signal output interfaces are embedded on the outer; the input board cards and the output board cards are arranged between the main board and the signal interface board, and two ends of each input board card and two ends of each output board card are respectively and electrically connected with the main board and the signal interface board.
4. The heat-dissipating compact digital high-definition hybrid matrix according to claim 3, wherein a plurality of adapter sockets are correspondingly arranged at intervals in the length direction of the opposite side of the main board and the signal interface board, each adapter socket is provided with a first slot along the vertical direction, and the plurality of input boards and the plurality of output boards are sequentially inserted between the main board and the signal interface board through the first slots on the main board and the signal interface board.
5. The thermally dissipative compact digital high-definition hybrid matrix according to claim 2, wherein said thermal dissipation module comprises a thermal dissipation mount inserted under said plurality of input boards and said plurality of output boards, a plurality of thermal dissipation fans mounted in said thermal dissipation mount, and a plurality of thermal dissipation holes opened on the periphery of said mounting housing.
6. The heat-dissipating compact digital high-definition hybrid matrix according to claim 2, wherein the power module comprises a power socket inserted into one side of the output board, a power body embedded in the power socket, a power adapter electrically connected to the power body for connecting to the control board, and a power interface embedded in the outer side of the rear housing and connected to the power body.
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| Application Number | Priority Date | Filing Date | Title |
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| CN202020598030.8U CN211630260U (en) | 2020-04-20 | 2020-04-20 | Heat dissipation compact digit high definition hybrid matrix |
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| Application Number | Priority Date | Filing Date | Title |
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| CN202020598030.8U CN211630260U (en) | 2020-04-20 | 2020-04-20 | Heat dissipation compact digit high definition hybrid matrix |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112278021A (en) * | 2020-10-22 | 2021-01-29 | 交控科技股份有限公司 | Train remote input and output module and processing method |
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2020
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112278021A (en) * | 2020-10-22 | 2021-01-29 | 交控科技股份有限公司 | Train remote input and output module and processing method |
| CN112278021B (en) * | 2020-10-22 | 2022-07-19 | 交控科技股份有限公司 | Train remote input and output module and processing method |
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