CN211630204U - Heat dissipation device for mobile phone motherboard shielding case - Google Patents

Heat dissipation device for mobile phone motherboard shielding case Download PDF

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Publication number
CN211630204U
CN211630204U CN202020804761.3U CN202020804761U CN211630204U CN 211630204 U CN211630204 U CN 211630204U CN 202020804761 U CN202020804761 U CN 202020804761U CN 211630204 U CN211630204 U CN 211630204U
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CN
China
Prior art keywords
heat
rod
mobile phone
copper pipe
inserted bar
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Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CN202020804761.3U
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Chinese (zh)
Inventor
林仰彬
何宏海
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Shenzhen Diyi Communication Co ltd
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Shenzhen Diyi Communication Co ltd
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Priority to CN202020804761.3U priority Critical patent/CN211630204U/en
Application granted granted Critical
Publication of CN211630204U publication Critical patent/CN211630204U/en
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

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Abstract

The utility model discloses a mobile phone motherboard shield cover heat abstractor relates to cell-phone heat dissipation technical field. This mobile phone motherboard shield cover heat abstractor includes the mobile phone main part, the inside mainboard shield cover that is provided with of mobile phone main part, mainboard shield cover openly passes through heat conduction copper and heat conduction copper pipe fixed connection, the winding of heat conduction copper pipe is at the outer wall of heat dissipation copper pipe, heat dissipation copper pipe and mobile phone main part fixed connection, heat dissipation copper pipe both ends are provided with miniature heat abstractor, miniature heat abstractor and connection kelly fixed connection. This mobile phone motherboard shield cover heat abstractor, the heat that the mobile phone main part produced in the use is passed through the heat conduction copper pipe by the heat conduction copper and is transmitted for the heat dissipation copper pipe, and the inside hot-air outgoing of copper pipe and the input cold air that will dispel the heat of rethread miniature heat abstractor make the temperature of cell-phone reduce, can effectual reduction because the problem that the mobile phone main part temperature rise and lead to damages.

Description

Heat dissipation device for mobile phone motherboard shielding case
Technical Field
The utility model relates to a cell-phone heat dissipation technical field specifically is a mobile phone motherboard shield cover heat abstractor.
Background
The shielding cover is a tool for shielding electronic signals, has the function of shielding the influence of external electromagnetic waves on an internal circuit and the outward radiation of the electromagnetic waves generated inside, and is directly arranged on a circuit board in the mobile phone.
Due to the fact that the shielding case is installed, the heat dissipation function of the mobile phone can be affected to a certain degree, the service life of internal elements of the mobile phone can be shortened due to the high temperature of the mobile phone, even the mobile phone explosion can be caused to hurt a user when the temperature is serious, and therefore how to dissipate the heat of the mobile phone shielding case is a problem which needs to be solved urgently.
SUMMERY OF THE UTILITY MODEL
Technical problem to be solved
Not enough to prior art, the utility model provides a mobile phone motherboard shield cover heat abstractor has solved the unable heat dissipation of mobile phone shield cover and has leaded to the cell-phone temperature to rise and the safety problem who produces.
(II) technical scheme
In order to achieve the above purpose, the utility model discloses a following technical scheme realizes: a heat dissipation device for a mobile phone mainboard shielding case comprises a mobile phone main body, wherein a mainboard shielding case is arranged inside the mobile phone main body, a heat conduction copper plate is fixedly connected to the front side of the mainboard shielding case, a heat conduction copper pipe is fixedly connected to the bottom of the heat conduction copper plate, the heat conduction copper pipe is wound on the outer wall of the heat dissipation copper pipe, the heat dissipation copper pipe is fixedly connected with the mobile phone main body, miniature heat dissipation devices are arranged at two ends of the heat dissipation copper pipe, one side of each miniature heat dissipation device is fixedly connected with one end of a connecting clamping rod, the other end of the connecting clamping rod is arranged inside a miniature device fixing box, the miniature device fixing box is fixedly connected with the outer wall of the heat dissipation copper pipe, one end of the connecting clamping rod, which is positioned inside the miniature device fixing box, is movably connected with an insert rod fixing device through a first hydraulic, the device comprises a connecting clamping rod, an inserting rod movable sleeve, a spring, a second hydraulic transmission assembly, a combined control rod and a combined control rod, wherein one end of the inserting rod movable sleeve is fixedly connected with the inner wall of a device box, the bottom of the device box is fixedly connected with the inner wall of a micro device fixing box, the inner wall of the inserting rod movable sleeve is fixedly connected with one end of the spring, the other end of the spring is fixedly connected with the inserting rod, the inserting rod is inserted into a slot formed in the connecting clamping rod, and the top end of the inserting rod is.
Preferably, the first hydraulic transmission assembly comprises a first piston, and the first piston is movably connected with a first hydraulic rod through a first hydraulic chamber.
Preferably, the first gear transmission assembly comprises a first rack rod, one end of the first rack rod is fixedly connected with the first hydraulic rod, the first rack rod is meshed with a first gear, the first gear is fixedly connected with a second gear, and the second gear is meshed with the second rack rod.
Preferably, the inside inserted bar fixed block that is provided with of inserted bar fixing device, the inserted bar fixed slot has been seted up to inserted bar fixed block one side, inserted bar fixed block opposite side and second rack bar fixed connection.
Preferably, the second gear transmission assembly comprises a third rack bar, one end of the third rack bar is fixedly connected with the inserted bar, the third rack bar is meshed with a third gear, and the third gear is meshed with a fourth rack bar.
Preferably, the second hydraulic transmission assembly comprises a second hydraulic rod, the second hydraulic rod is fixedly connected with the fourth rack rod, and the second hydraulic rod is movably connected with the combined control rod through a second hydraulic cabin.
(III) advantageous effects
The utility model provides a mobile phone motherboard shield cover heat abstractor. The method has the following beneficial effects:
(1) this mobile phone motherboard shield cover heat abstractor, the heat that the mobile phone main part produced in the use is passed through the heat conduction copper pipe by the heat conduction copper and is transmitted for the heat dissipation copper pipe, and the inside hot-air outgoing of copper pipe and the input cold air that will dispel the heat of rethread miniature heat abstractor make the temperature of cell-phone reduce, can effectual reduction because the problem that the mobile phone main part temperature rise and lead to damages.
(2) This mobile phone motherboard shield cover heat abstractor sets up the fixed box of micro device and can fix micro heat abstractor at heat dissipation copper pipe both ends, when micro heat abstractor damaged, only need press into the fixed box of micro device with the combination control pole and just can dismantle micro heat abstractor, and it is very convenient to change, has improved this heat abstractor's practicality.
Drawings
FIG. 1 is a schematic view of the main structure of the present invention;
FIG. 2 is an enlarged schematic view of part A of the present invention;
FIG. 3 is a bottom cross-sectional view of the fixing case of the micro device of the present invention;
FIG. 4 is an enlarged schematic view of part B of the present invention;
fig. 5 is an enlarged schematic view of part C of the present invention.
In the figure: 1 mobile phone body, 2 mainboard shield cover, 3 heat conduction copper plate, 4 heat conduction copper pipes, 5 heat dissipation copper pipes, 6 miniature heat abstractor, 7 miniature device fixed box, 8 connection kelly, 81 slot, 9 first hydraulic transmission subassembly, 91 first piston, 92 first hydraulic pressure storehouse, 93 first hydraulic pressure pole, 10 first gear drive subassembly, 101 first rack bar, 102 first gear, 103 second gear, 104 second rack bar, 11 inserted bar fixing device, 111 inserted bar fixed block, 1111 inserted bar fixed slot, 12 inserted bar movable sleeve, 13 spring, 14 device box, 15 inserted bar, 16 second gear drive subassembly, 161 third rack bar, 162 third gear, 163 fourth rack bar, 17 second hydraulic transmission subassembly, 171 second hydraulic pressure pole, 172 second hydraulic pressure storehouse, 18 combination control pole.
Detailed Description
The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.
Referring to fig. 1-5, the present invention provides a technical solution: a heat dissipation device for a mobile phone mainboard shielding case comprises a mobile phone main body 1, a mainboard shielding case 2 is arranged inside the mobile phone main body 1, a heat conducting copper plate 3 is fixedly connected to the front of the mainboard shielding case 2, a heat conducting copper pipe 4 is fixedly connected to the bottom of the heat conducting copper plate 3, the heat conducting copper pipe 4 is wound on the outer wall of the heat conducting copper pipe 5, the heat dissipation effect of the device is better as the heat conducting copper pipe 4 is wound on the outer wall of the heat conducting copper pipe 5, the heat conducting copper pipe 5 is fixedly connected with the mobile phone main body 1, micro heat dissipation devices 6 are arranged at the two ends of the heat conducting copper pipe 5, one side of each micro heat dissipation device 6 is fixedly connected with one end of a connecting clamping rod 8, the other end of the connecting clamping rod 8 is arranged inside a micro device fixing box 7, the micro device fixing box 7 is fixedly connected with the, the miniature heat sink 6 can be disassembled only by pressing the combined control rod 18 into the miniature device fixing box 7, the replacement is very convenient, the practicability of the heat sink is improved, one end of the connecting clamping rod 8 positioned in the miniature device fixing box 7 is movably connected with the inserted rod fixing device 11 through the first hydraulic transmission component 9 and the first gear transmission component 10, the first hydraulic transmission component 9 comprises a first piston 91, the first piston 91 is movably connected with a first hydraulic rod 93 through a first hydraulic chamber 92, the first gear transmission component 10 comprises a first rack rod 101, one end of the first rack rod 101 is fixedly connected with the first hydraulic rod 93, the first rack rod 101 is meshed with the first gear 102, the first gear 102 is fixedly connected with a second gear 103, the second gear 103 is meshed with a second rack rod 104, one side of the inserted rod fixing device 11 is fixedly connected with the bottom of the inserted rod movable sleeve 12, the inserted rod fixing device 11 is internally provided with an inserted rod fixing block 111, one side of the inserted bar fixing block 111 is provided with an inserted bar fixing groove 1111, the other side of the inserted bar fixing block 111 is fixedly connected with the second rack bar 104, one end of the inserted bar movable sleeve 12 is fixedly connected with the inner wall of the device box 14, the bottom of the device box 14 is fixedly connected with the inner wall of the micro device fixing box 7, the inner wall of the inserted bar movable sleeve 12 is fixedly connected with one end of the spring 13, the other end of the spring 13 is fixedly connected with the inserted bar 15, the inserted bar 15 is inserted in the slot 81 formed in the connecting clamping bar 8, the top end of the inserted bar 15 is movably connected with the combined control rod 18 through the second gear transmission component 16 and the second hydraulic transmission component 17, the second gear transmission component 16 comprises a third rack bar 161, one end of the third rack bar 161 is fixedly connected with the inserted bar 15, the third rack bar 161 is meshed with a third gear 162, the third gear 162 is meshed with a fourth rack bar 163, the second hydraulic transmission component 17 comprises a second hydraulic rod 171, and the second hydraulic, the second hydraulic rod 171 is movably connected with the combination control rod 18 through a second hydraulic chamber 172.
In this mobile phone motherboard shield cover heat abstractor, the heat that mobile phone main part 1 produced in the use is transmitted for heat dissipation copper pipe 5 through heat conduction copper pipe 4 by heat conduction copper 3, and the inside hot-air outgoing of heat dissipation copper pipe 5 and input cold air make the temperature of mobile phone main part 1 reduce through miniature heat abstractor 6, can effectual reduction because the problem that mobile phone main part 1 damage that leads to of mobile phone main part 1 temperature rising.
During operation (or during the use), in mobile phone body 1 use, heat on mainboard shield cover 2 is transmitted to heat dissipation copper pipe 5 by heat conduction copper 3 and heat conduction copper pipe 4 on, under miniature heat abstractor 6's effect, and the inside hot-air of heat dissipation copper pipe 5 can be distributed away, and outside cold air can be inputed in the heat dissipation copper pipe 5.
When the micro heat dissipation device 6 needs to be disassembled, the part of the combined control rod 18, which is positioned outside the micro device fixing box 7, is directly rotated by ninety degrees, then the combined control rod 18 is pressed into the micro device fixing box 7, under the action of the second hydraulic transmission component 17 and the second gear transmission component 16, the inserted link 15 can move towards the direction far away from the slot 81 and compress the spring 13, after the inserted link 15 is completely moved out of the slot 81, the micro heat dissipation device 6 can be directly taken out, after the connecting clamping rod 8 is moved out of the micro device fixing box 7, under the action of the first hydraulic transmission component 9 and the first gear transmission component 10, the inserted link fixing block 111 automatically moves and fixes the joint of the inserted link 15 and the spring 13 in the inserted link fixing groove 1111, at the moment, the combined control rod 18 is loosened, when the micro heat dissipation device 6 is installed, the connecting clamping rod 8 is directly inserted into the micro device fixing box 7, the connection clamping rod 8 can move the insertion rod fixing block 111 under the action of the first hydraulic transmission assembly 9 and the first gear transmission assembly 10, and when the insertion rod 15 is positioned outside the insertion rod fixing groove 1111, the insertion rod 15 is ejected out and inserted into the insertion groove 81 under the action of the spring 13, so that the position of the connection clamping rod 8 is fixed.
It is noted that, herein, relational terms such as first and second, and the like may be used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions. Also, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus.
Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.

Claims (6)

1. The utility model provides a mobile phone motherboard shield cover heat abstractor, includes mobile phone body (1), mobile phone body (1) inside is provided with mainboard shield cover (2), its characterized in that: the main board shielding case (2) is fixedly connected with a heat-conducting copper plate (3) on the front side, the bottom of the heat-conducting copper plate (3) is fixedly connected with a heat-conducting copper pipe (4), the heat-conducting copper pipe (4) is wound on the outer wall of the heat-radiating copper pipe (5), the heat-radiating copper pipe (5) is fixedly connected with a mobile phone main body (1), two ends of the heat-radiating copper pipe (5) are provided with miniature heat-radiating devices (6), one side of each miniature heat-radiating device (6) is fixedly connected with one end of a connecting clamping rod (8), the other end of the connecting clamping rod (8) is arranged in a miniature device fixing box (7), the miniature device fixing box (7) is fixedly connected with the outer wall of the heat-radiating copper pipe (5), one end of the connecting clamping rod (8) in the miniature device fixing box (7) is movably connected with an inserting rod fixing device (11) through a first, inserted bar fixing device (11) one side and inserted bar movable sleeve (12) bottom fixed connection, inserted bar movable sleeve (12) one end and device box (14) inner wall fixed connection, device box (14) bottom and the fixed box of micro device (7) inner wall fixed connection, inserted bar movable sleeve (12) inner wall and spring (13) one end fixed connection, the spring (13) other end and inserted bar (15) fixed connection, inserted bar (15) are pegged graft with slot (81) of seting up on connecting clamping bar (8), inserted bar (15) top is through second gear drive subassembly (16) and second hydraulic drive subassembly (17) and combination control lever (18) swing joint.
2. The heat dissipation device of claim 1, wherein: the first hydraulic transmission assembly (9) comprises a first piston (91), and the first piston (91) is movably connected with a first hydraulic rod (93) through a first hydraulic chamber (92).
3. The heat dissipation device of claim 1, wherein: the first gear transmission assembly (10) comprises a first rack rod (101), one end of the first rack rod (101) is fixedly connected with a first hydraulic rod (93), the first rack rod (101) is meshed with a first gear (102), the first gear (102) is fixedly connected with a second gear (103), and the second gear (103) is meshed with a second rack rod (104).
4. The heat dissipation device of claim 1, wherein: inserted bar fixed block (111) is provided with in inserted bar fixing device (11) inside, inserted bar fixed slot (1111) has been seted up to inserted bar fixed block (111) one side, inserted bar fixed block (111) opposite side and second rack bar (104) fixed connection.
5. The heat dissipation device of claim 1, wherein: the second gear transmission assembly (16) comprises a third rack rod (161), one end of the third rack rod (161) is fixedly connected with the inserted rod (15), the third rack rod (161) is meshed with a third gear (162), and the third gear (162) is meshed with a fourth rack rod (163).
6. The heat dissipation device of claim 1, wherein: the second hydraulic transmission assembly (17) comprises a second hydraulic rod (171), the second hydraulic rod (171) is fixedly connected with a fourth rack rod (163), and the second hydraulic rod (171) is movably connected with the combined control rod (18) through a second hydraulic chamber (172).
CN202020804761.3U 2020-05-14 2020-05-14 Heat dissipation device for mobile phone motherboard shielding case Expired - Fee Related CN211630204U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN202020804761.3U CN211630204U (en) 2020-05-14 2020-05-14 Heat dissipation device for mobile phone motherboard shielding case

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN202020804761.3U CN211630204U (en) 2020-05-14 2020-05-14 Heat dissipation device for mobile phone motherboard shielding case

Publications (1)

Publication Number Publication Date
CN211630204U true CN211630204U (en) 2020-10-02

Family

ID=72623315

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202020804761.3U Expired - Fee Related CN211630204U (en) 2020-05-14 2020-05-14 Heat dissipation device for mobile phone motherboard shielding case

Country Status (1)

Country Link
CN (1) CN211630204U (en)

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Granted publication date: 20201002