CN211629056U - Conveying device for semiconductor packaging - Google Patents

Conveying device for semiconductor packaging Download PDF

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Publication number
CN211629056U
CN211629056U CN202020174266.9U CN202020174266U CN211629056U CN 211629056 U CN211629056 U CN 211629056U CN 202020174266 U CN202020174266 U CN 202020174266U CN 211629056 U CN211629056 U CN 211629056U
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China
Prior art keywords
damping
shock
base
motor
rotating shaft
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CN202020174266.9U
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Chinese (zh)
Inventor
赖金榜
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Guangxi Huaxin Zhenbang Semiconductor Co ltd
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Lianli Xuzhou Semiconductor Co ltd
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Abstract

The utility model discloses a conveying device for semiconductor packaging, which belongs to the technical field of semiconductor packaging and processing, and comprises a base, four damping sleeves are symmetrically arranged at four corners of the upper end of the base, and four damping columns are arranged at the inner ends of the damping sleeves, the utility model is provided with the damping columns, the damping sleeves, damping sheets, a main motor, a rotating shaft, a roller, a second bolt, a pin, a support rod and a connecting rod, so that the vibration amplitude and the noise of the conveyor belt can be reduced in the conveying process, the vibration of the conveyor belt is reduced, the semiconductor packaging finished product is prevented from falling, the safety is improved, the auxiliary motor, the bracket, the cable, the speed reducer, the rotating shaft, the rotating disc, the brush disc and the cleaning rod are arranged, the novel component is matched for use, so that the cleanness of the conveying belt can be kept, the working quality of the conveying belt is improved, and a good working environment is provided.

Description

Conveying device for semiconductor packaging
Technical Field
The utility model belongs to the technical field of the semiconductor package processing, concretely relates to be used for conveyer for semiconductor package.
Background
In the process of packaging and processing semiconductor materials, corresponding transmission conveying devices are generally required to be used for conveying materials, and with the development of semiconductor and electronic technologies, the thickness of a semiconductor packaging structure is thinner and thinner, and the weight of the semiconductor packaging structure is lighter and lighter, so that when materials are conveyed on a common conveyor belt, the materials are easy to vibrate and shift.
The prior art conveying device for semiconductor packaging has the following problems: the existing conveying device for semiconductor packaging can vibrate when conveying packaged finished products, so that the semiconductor finished products can fall off in the conveying process, a conveying belt can generate a large amount of dust and other articles after long-time conveying and operation, the packaged finished products can generate dirt and dust in the conveying process, the working efficiency and quality of machine operation can be influenced, and the working environment is poor.
SUMMERY OF THE UTILITY MODEL
For solving the problem that proposes among the above-mentioned background art, the utility model provides a be used for semiconductor packaging to use conveyer has the shock attenuation, clear characteristics.
In order to achieve the above object, the utility model provides a following technical scheme: a conveying device for semiconductor packaging comprises a base, four damping sleeves are symmetrically arranged at four corners of the upper end of the base, four damping columns are arranged at the inner ends of the four damping sleeves, buffer springs are arranged on the outer side walls of the four damping columns, a main motor is arranged at one side in front of the damping columns at the left front, a rotating shaft is arranged at the output end of the main motor, two rotating shafts are arranged, rollers are arranged at the middle positions of the two rotating shafts, a conveying belt is arranged on the outer side walls of the two rollers, four damping sheets are symmetrically arranged on the upper surface and the lower surface of the middle of the conveying belt respectively, supporting rods are symmetrically arranged on the front side and the rear side of the middle end of the base from top to bottom in sequence, supporting rods are symmetrically arranged on the front side and the rear side of the middle end of the four damping sheets from top to bottom in sequence, the middle part of bracing piece is provided with the connecting rod, the connecting rod is provided with the pin with the both sides junction of bracing piece, the upper end of shock attenuation post is provided with vice motor, the shock attenuation post is provided with the bolt No. one with one side junction of vice motor, the output of vice motor is provided with three speed reducer, is close to vice motor one side the speed reducer is with vice motor and adjacent all rotate through the axis of rotation between the speed reducer and connect, be close to vice motor one side the speed reducer is with vice motor and adjacent all carry out the electricity through the cable between the speed reducer and connect, it is three the output axle head of speed reducer all is provided with the dwang, it is three one side that the speed reducer was kept away from to the dwang all is provided with the carousel.
Preferably, the main motor and the shock absorption column are connected through brazing.
Preferably, the carousel passes through electric welding mode fixed connection with the brush dish, the dwang passes through brazed connection with the carousel.
Preferably, the rotating shaft is fixedly connected with the roller through brazing, and the rotating shaft is connected with the main motor through a coupler.
Preferably, the support rod and the damping sheet are fixedly connected through a second bolt, and the support rod and the connecting rod are fixedly connected through a pin.
Preferably, the shock absorption column is connected with the base in an electric welding mode.
Compared with the prior art, the beneficial effects of the utility model are that:
1. the utility model discloses set up the shock attenuation post, the shock attenuation cover, the shock attenuation piece, main motor, the pivot, the gyro wheel, No. two bolts, the pin, bracing piece and connecting rod etc. are used under the cooperation of these structures for the conveyer belt can reduce the range and the noise of vibrations at the in-process of carrying, reduces the vibration of conveyer belt itself, prevents that the semiconductor package finished product from dropping, has improved the security.
2. The utility model discloses set up vice motor, support, cable, speed reducer, dwang, carousel, brush dish and clean pole, used under the cooperation through these structures for can keep the clean of conveyer belt, improve the operating mass with rated load of conveyer belt, thereby provide fine operational environment.
Drawings
Fig. 1 is a schematic structural view of the present invention;
FIG. 2 is a left side view of the structure of the present invention;
FIG. 3 is a top view of the structure of the present invention;
in the figure: 1. a base; 2. a shock-absorbing sleeve; 3. a shock-absorbing post; 4. a buffer spring; 5. a main motor; 6. a rotating shaft; 7. a conveyor belt; 8. a first bolt; 9. a secondary motor; 10. a support bar; 11. a damping sheet; 12. a second bolt; 13. a connecting rod; 14. a pin; 15. a roller; 16. a rotating shaft; 17. a cable; 18. a speed reducer; 19. rotating the rod; 20. a turntable; 21. and (7) brushing the disc.
Detailed Description
The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.
Referring to fig. 1-3, the present invention provides the following technical solutions: a conveying device for semiconductor packaging comprises a base 1, four damping sleeves 2 are symmetrically arranged at four corners of the upper end of the base 1, four damping columns 3 are arranged at the inner ends of the four damping sleeves 2, in order to facilitate damping, the damping columns 3 are connected with the base 1 in an electric welding mode, buffer springs 4 are arranged on the outer side walls of the four damping columns 3, a main motor 5 is arranged on one side in front of the damping column 3 in the left front, in order to facilitate connection, the main motor 5 is connected with the damping columns 3 in a brazing mode, a rotating shaft 6 is arranged at the output end of the main motor 5, two rotating shafts 6 are arranged, idler wheels 15 are arranged in the middle positions of the two rotating shafts 6, in order to facilitate fixing, the rotating shaft 6 is fixedly connected with the idler wheels 15 in a brazing mode, the rotating shaft 6 is connected with the main motor 5 in a coupling mode, a conveying belt 7 is arranged on the outer side, the utility model discloses a base 1's middle-end front and back both sides from the top down symmetry in proper order has set up bracing piece 10, four shock attenuation pieces 11 are connected with base 1 through bracing piece 10, the junction of bracing piece 10 and shock attenuation piece 11 is provided with No. two bolts 12, the middle part of bracing piece 10 is provided with connecting rod 13, connecting rod 13 is provided with pin 14 with the both sides junction of bracing piece 10, for convenient connection, bracing piece 10 carries out fixed connection through No. two bolts 12 with shock attenuation piece 11, bracing piece 10 carries out fixed connection through pin 14 with connecting rod 13, the upper end of shock absorber 3 is provided with vice motor 9, shock absorber 3 is provided with bolt 8 with one side junction of vice motor 9, the output of vice motor 9 is provided with three speed reducer 18, all rotate through axis of rotation 16 between being close to vice motor 9 one side speed reducer 18 and vice motor 9 and the adjacent speed reducer 18, all carry out the electricity through cable 17 between being close to vice motor 9 one side Connect, the output axle head of three speed reducer 18 all is provided with dwang 19, and one side that speed reducer 18 was kept away from to three dwang 19 all is provided with carousel 20, and one side that dwang 19 was kept away from to three carousel 20 all is provided with brush dish 21, and for convenient rotation, carousel 20 and brush dish 21 are through electric welding mode fixed connection, and dwang 19 is connected through brazing with carousel 20.
The utility model discloses well main motor 5 and vice motor 15 are for the wide application that has disclosed and daily life's known technique, theory of operation: the mechanical principle of the motor is used to convert the motor into circular motion, and the model TG-985 is used.
The utility model discloses a theory of operation and use flow: in the initial state of the utility model, firstly, the main motor 5 is started to operate to drive the rotating shaft 6 and the roller 15 to rotate, thereby the conveyor belt 7 starts to rotate on the roller 15, the support rod 10 and the connecting rod 13 are fixedly connected through the second bolt 12, the damping sheet 11 connected with the support rod 10 through the second bolt 12 damps the conveyor belt 7, the situation that the semiconductor finished product can deviate and fall due to too large vibration amplitude in the conveying process of the conveyor belt 7 is prevented, in the rotating process of the conveyor belt 7, the assembly on the base 1 can generate vibration and noise, the damping column 3 in the damping sleeve 2 is provided with the buffer spring 4 for buffering the whole weight of the conveyor belt 7, when the semiconductor finished product is not required to be conveyed, the auxiliary motor 9 on the first bolt 8 can be opened, so that the cable 17 on the rotating shaft 16 drives the speed reducer 18 to work, the rotating rod 19 at the lower end of the speed reducer 18 starts to work to drive the rotating disc 20 and the brush disc 21 to start cleaning, so that the working quality is improved, and a good working environment is provided for workers.
Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.

Claims (6)

1. A transfer device for semiconductor packaging, comprising a base (1), characterized in that: four shock-absorbing sleeves (2) are symmetrically arranged at four corners of the upper end of the base (1), four shock-absorbing columns (3) are arranged at the inner ends of the four shock-absorbing sleeves (2), two buffer springs (4) are arranged on the outer side walls of the four shock-absorbing columns (3), a main motor (5) is arranged on one side of the front of the shock-absorbing column (3) in the left front, a rotating shaft (6) is arranged at the output end of the main motor (5), two rotating shafts (6) are arranged, idler wheels (15) are arranged at the middle positions of the two rotating shafts (6), a conveying belt (7) is arranged on the outer side walls of the two idler wheels (15), four shock-absorbing sheets (11) are symmetrically arranged on the upper surface and the lower surface of the middle of the conveying belt (7) respectively, supporting rods (10) are sequentially and symmetrically arranged at the front side and the rear side of the middle end of the base (1), a second bolt (12) is arranged at the joint of the supporting rod (10) and the damping sheet (11), a connecting rod (13) is arranged in the middle of the supporting rod (10), pins (14) are arranged at the joints of the connecting rod (13) and the two sides of the supporting rod (10), an auxiliary motor (9) is arranged at the upper end of the damping column (3), a first bolt (8) is arranged at the joint of the damping column (3) and one side of the auxiliary motor (9), three speed reducers (18) are arranged at the output end of the auxiliary motor (9), the speed reducers (18) and the auxiliary motor (9) as well as the adjacent speed reducers (18) are rotatably connected through rotating shafts (16) at one side close to the auxiliary motor (9), the speed reducers (18) and the auxiliary motor (9) as well as the adjacent speed reducers (18) are electrically connected through cables (17), it is three the output axle head of speed reducer (18) all is provided with dwang (19), and is three one side that speed reducer (18) were kept away from in dwang (19) all is provided with carousel (20), and is three one side that dwang (19) were kept away from in carousel (20) all is provided with brush dish (21).
2. A transfer apparatus for semiconductor packages according to claim 1, wherein: the main motor (5) is connected with the damping column (3) through brazing.
3. A transfer apparatus for semiconductor packages according to claim 1, wherein: carousel (20) and brush dish (21) are through electric welding mode fixed connection, dwang (19) are connected through brazing with carousel (20).
4. A transfer apparatus for semiconductor packages according to claim 1, wherein: the rotating shaft (6) is fixedly connected with the roller (15) through brazing, and the rotating shaft (6) is connected with the main motor (5) through a coupler.
5. A transfer apparatus for semiconductor packages according to claim 1, wherein: the supporting rod (10) and the damping sheet (11) are fixedly connected through a second bolt (12), and the supporting rod (10) and the connecting rod (13) are fixedly connected through a pin (14).
6. A transfer apparatus for semiconductor packages according to claim 1, wherein: the shock absorption column (3) is connected with the base (1) in an electric welding mode.
CN202020174266.9U 2020-02-14 2020-02-14 Conveying device for semiconductor packaging Active CN211629056U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN202020174266.9U CN211629056U (en) 2020-02-14 2020-02-14 Conveying device for semiconductor packaging

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN202020174266.9U CN211629056U (en) 2020-02-14 2020-02-14 Conveying device for semiconductor packaging

Publications (1)

Publication Number Publication Date
CN211629056U true CN211629056U (en) 2020-10-02

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ID=72618348

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202020174266.9U Active CN211629056U (en) 2020-02-14 2020-02-14 Conveying device for semiconductor packaging

Country Status (1)

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CN (1) CN211629056U (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN112222038A (en) * 2020-10-13 2021-01-15 宁波丞达精机股份有限公司 Feeding mechanism for semiconductor packaging device

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN112222038A (en) * 2020-10-13 2021-01-15 宁波丞达精机股份有限公司 Feeding mechanism for semiconductor packaging device

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GR01 Patent grant
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TR01 Transfer of patent right

Effective date of registration: 20221114

Address after: 530000 No. T964, Floor 2, Building 16, No. 8, Jinlong Road, Nanning District, Nanning City, Guangxi Zhuang Autonomous Region

Patentee after: Guangxi Huaxin Zhenbang Semiconductor Co.,Ltd.

Address before: 221000 room 213, Clean Technology Industrial Park Service Center, Xuzhou Economic and Technological Development Zone, Jiangsu Province

Patentee before: LIANLI (Xuzhou) Semiconductor Co.,Ltd.

TR01 Transfer of patent right