CN211627883U

CN211627883U - Grating built-in type packaging device

Info

Publication number: CN211627883U
Application number: CN201922407862.7U
Authority: CN
Inventors: 周志刚; 胡礼初; 朱月林
Original assignee: O Net Communications Shenzhen Ltd
Current assignee: O Net Technologies Shenzhen Group Co Ltd
Priority date: 2019-12-27
Filing date: 2019-12-27
Publication date: 2020-10-02
Anticipated expiration: 2029-12-27

Abstract

The utility model relates to a laser device technical field, concretely relates to built-in encapsulation device of grating. The grating built-in packaging device comprises an optical fiber, a packaging shell, a laser chip and a supporting platform, wherein the laser chip and the supporting platform are arranged in the packaging shell and are in coupling connection with the optical fiber, the optical fiber comprises a bare fiber with a Bragg grating, and the bare fiber with the Bragg grating is fixed on the supporting platform. The utility model discloses a set up optic fibre, the packaging shell to and locate in the packaging shell and with fiber coupling's laser instrument chip and supporting platform, the bare fiber that has carved with the Bragg grating in the optic fibre is fixed in on the supporting platform, it is fixed with the Bragg grating, when the device encapsulation, stress direct action on the isolated optic fibre is on the Bragg grating, prevent that the Bragg grating from producing the drift because of the optic fibre stress effect, play the guard action to the Bragg grating, effectively improve the stability of the central wavelength of Bragg grating, guarantee the built-in encapsulation device's of grating performance.

Description

Grating built-in type packaging device

Technical Field

The utility model relates to a laser device technical field, concretely relates to built-in encapsulation device of grating.

Background

In small packaged devices such as TO-can and Mini enclosures, Fiber Bragg Gratings (FBGs) are typically placed inside the device. Compared with an external FBG, the built-in FBG mode can avoid the problem that the external FBG is bent and deformed due to winding action when the device optical fiber is wound inside the subsystem module.

However, due to the internal space limitations of small packaged devices, the length of the internal optical fiber is very short, typically less than 10 mm. When the device is packaged, stress that is difficult to release is easily generated in the optical fiber. Such stress acts on the FBG of the optical fiber, thereby shifting the center wavelength of the FBG. When the stress is large to a certain degree, the drift amount of the central wavelength exceeds the specification of the product, thereby causing the failure of the device.

SUMMERY OF THE UTILITY MODEL

The to-be-solved technical problem of the utility model lies in, to the above-mentioned defect of prior art, provide a built-in encapsulation device of grating, the grating on the optic fibre receives the stress that optic fibre produced easily and makes central wavelength take place to drift when overcoming current small-size device encapsulation, leads to the problem of product inefficacy.

The utility model provides a technical scheme that its technical problem adopted is: the optical fiber comprises a bare fiber engraved with a Bragg grating, and the bare fiber engraved with the Bragg grating is fixed on the supporting platform.

The utility model discloses a further preferred scheme is: the bare fiber engraved with the Bragg grating is covered and fixed on the supporting platform through a fixing medium.

The utility model discloses a further preferred scheme is: the fixing medium comprises one of glue, low-temperature glass solder and solder.

The utility model discloses a further preferred scheme is: the grating built-in type packaging device further comprises a ceramic substrate for placing the laser chip, and the supporting platform is connected with the ceramic substrate.

The utility model discloses a further preferred scheme is: the support platform and the ceramic substrate are integrally arranged.

The utility model discloses a further preferred scheme is: and a first groove is formed in the position, close to the coupling connection part of the optical fiber and the laser chip, of the supporting platform.

The utility model discloses a further preferred scheme is: the packaging shell is a TO-CAN packaging shell.

The utility model discloses a further preferred scheme is: the packaging shell is a miniaturized pump source device packaging shell.

The utility model has the advantages that, compared with the prior art, through setting up optic fibre, the packaging shell to and locate in the packaging shell and with optical fiber coupling's laser chip and supporting platform, the naked fibre that has inscribed the Bragg grating in the optic fibre is fixed on supporting platform, fix the Bragg grating, when the device encapsulation, the stress on the isolated optic fibre directly acts on the Bragg grating, prevent that the Bragg grating from producing the drift because of the optic fibre stress, play the guard action to the Bragg grating, effectively improve the stability of the central wavelength of Bragg grating, guarantee the performance of the built-in encapsulated device of grating; and the bare fiber engraved with the Bragg grating is covered and fixed on the supporting platform through the fixing medium, so that the Bragg grating is protected, and the performance of the grating built-in packaging device is ensured.

Drawings

The invention will be further explained with reference to the drawings and examples, wherein:

FIG. 1 is a schematic structural diagram of a grating built-in package device (the package case is a TO-CAN package case) according TO the present invention;

fig. 2 is a schematic structural diagram of the grating built-in package device (the package housing is a miniaturized pump source device package housing) of the present invention.

Detailed Description

The preferred embodiments of the present invention will now be described in detail with reference to the accompanying drawings.

As shown in fig. 1, the present invention provides a preferred embodiment of a grating built-in package device.

A grating built-in type packaging device comprises an optical fiber 10, a packaging shell 20, a laser chip 30 and a supporting platform 40, wherein the laser chip 30 and the supporting platform 40 are arranged in the packaging shell 20 and are in coupling connection with the optical fiber 10, the optical fiber 10 comprises a bare fiber with a Bragg grating 50, and the bare fiber with the Bragg grating 50 is fixed on the supporting platform 40.

After the optical fiber 10 is coupled with the laser chip 30, the bare fiber with the bragg grating 50 inscribed thereon is fixed on the supporting platform 40 arranged in the package shell 20, the bragg grating 50 is fixed, the bragg grating 50 is protected, the bragg grating 50 is prevented from drifting due to the stress action of the optical fiber 10 in the device packaging process, the stability of the central wavelength of the bragg grating 50 is effectively improved, and the performance of the grating built-in package device is ensured.

Further, the bare fiber with the bragg grating 50 is covered and fixed on the supporting platform 40 through a fixing medium 60. The bare fiber with the written Bragg grating 50 is covered and fixed on the supporting platform 40 through the fixing medium 60, the Bragg grating 50 is covered and fixed on the supporting platform 40, the Bragg grating 50 is fixed, the Bragg grating 50 is prevented from drifting due to the stress action of the optical fiber 10 in the device packaging process, the stability of the central wavelength of the Bragg grating 50 is effectively improved, and the performance of the grating built-in packaging device is ensured.

Wherein the fixing medium 60 includes one of glue, low temperature glass solder and solder. The fixing medium 60 in the present embodiment is preferably a low-temperature glass solder.

And when the optical fiber 10 and the laser chip 30 are coupled to the maximum power, the bragg grating 50 is just positioned on the supporting platform 40, an operator can cover and fix the bare fiber with the bragg grating 50 on the supporting platform 40 by coating the low-temperature glass solder, cover and fix the bragg grating 50 on the supporting platform 40, and protect the bragg grating 50. The support platform 40 may be provided in addition to or as an extension of the structure for placing the laser chip 30 in the grating built-in package device.

In this embodiment, the grating built-in package device further includes a ceramic substrate 70 for placing the laser chip 30, and the supporting platform 40 is connected to the ceramic substrate 70. Support platform 40 is coupled to ceramic substrate 70 such that support platform 40 is secured within package 20.

Further, the support platform 40 is integrally provided with the ceramic substrate 70. That is, the supporting platform 40 is an extension of the ceramic substrate 70 for placing the laser chip 30, and a fixing structure for fixing a bare fiber for writing the bragg grating 50 is not required to be additionally arranged, so that the operation is convenient.

Wherein, referring TO fig. 1, the package 20 is a TO-CAN package. The support platform 40 arranged in the TO-CAN packaging shell is connected with the ceramic substrate 70 for placing the laser chip 30, the support platform 40 is fixed, then the bare fiber with the Bragg grating 50 engraved is fixed on the support platform 40 by using the fixing medium 60, and the Bragg grating 50 is fixed on the support platform 40, so that the Bragg grating 50 is fixed in the TO-CAN packaging shell, the Bragg grating 50 is prevented from drifting due TO the stress action of the optical fiber 10 in the device packaging process, and the stability of the central wavelength of the Bragg grating 50 is effectively improved.

Of course, referring to fig. 2, the package 20 may be a miniaturized pump source device package.

And the support platform 40 is integrally provided with the ceramic substrate 70. The supporting platform 40 can be used for placing the laser chip 30 and placing the bare fiber with the bragg grating 50, fixing the bragg grating 50, and the structure for fixing the bare fiber with the bragg grating 50 is not required to be additionally arranged, so that the operation is convenient.

Further, the supporting platform 40 is provided with a first groove 41 corresponding to a coupling connection between the optical fiber 10 and the laser chip 30.

In this embodiment, a second groove capable of accommodating the bare fiber with the bragg grating 50 may be further disposed on the supporting platform 40, the bare fiber with the bragg grating 50 may be disposed in the second groove, the bragg grating 50 is disposed in the groove, and then the fixing medium 60 is used to cover and fix the groove, so that the bragg grating 50 is not prone to drift, and the bare fiber with the bragg grating 50 may be better fixed on the supporting platform 40.

It should be understood that the above embodiments are only used for illustrating the technical solutions of the present invention, and not for limiting the same, and those skilled in the art can modify the technical solutions described in the above embodiments, or make equivalent substitutions for some technical features; and all such modifications and alterations should fall within the scope of the appended claims.

Claims

1. The grating built-in packaging device is characterized by comprising an optical fiber, a packaging shell, a laser chip and a supporting platform, wherein the laser chip and the supporting platform are arranged in the packaging shell and are in coupling connection with the optical fiber, the optical fiber comprises a bare fiber engraved with a Bragg grating, and the bare fiber engraved with the Bragg grating is fixed on the supporting platform.

2. The grating built-in packaging device as claimed in claim 1, wherein the bare fiber with the written Bragg grating is covered and fixed on the supporting platform through a fixing medium.

3. The grating built-in package device according to claim 2, wherein the fixing medium comprises one of glue, low temperature glass solder and solder.

4. The grating built-in packaging device according to claim 1 or 2, further comprising a ceramic substrate for placing a laser chip, wherein the supporting platform is connected with the ceramic substrate.

5. The grating built-in package device of claim 4, wherein the support platform is integrally disposed with the ceramic substrate.

6. The grating built-in package device according to claim 4, wherein the supporting platform is provided with a first groove corresponding to a coupling connection position between the optical fiber and the laser chip.

7. The grating built-in package device according TO claim 4, wherein the package CAN is a TO-CAN package CAN.

8. The grating built-in package device according to claim 5, wherein the package is a miniaturized pump source device package.