CN211580196U - High signal-to-noise ratio microphone - Google Patents
High signal-to-noise ratio microphone Download PDFInfo
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- CN211580196U CN211580196U CN202020020997.8U CN202020020997U CN211580196U CN 211580196 U CN211580196 U CN 211580196U CN 202020020997 U CN202020020997 U CN 202020020997U CN 211580196 U CN211580196 U CN 211580196U
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- waterproof
- mems chip
- microphone
- receiving hole
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Abstract
The utility model discloses a high signal-to-noise ratio microphone, which comprises a substrate and a shell, wherein the substrate and the shell form a holding cavity, an MEMS chip and an ASIC chip are arranged in the holding cavity, a mounting groove is arranged on the surface of the substrate, and the end part of the shell is clamped and arranged in the mounting groove; the MEMS chip and the ASIC chip are arranged on the inner side surface of the substrate, an installation clamping groove for installing the MEMS chip is formed in the inner side surface of the substrate, a sound receiving hole corresponding to the MEMS chip is formed in the outer side surface of the substrate, the sound receiving hole is communicated with the installation clamping groove through a conical hole, and the inner diameter of the conical hole is gradually reduced along the direction from the installation clamping groove to the sound receiving hole; an annular mounting groove is coaxially formed on the outer side surface of the substrate corresponding to the sound receiving hole, and a waterproof assembly is mounted in the annular mounting groove; the waterproof assembly comprises a waterproof membrane, and two annular reinforcing plates are symmetrically arranged on the surface of the waterproof membrane along the circumferential direction of the waterproof membrane. The utility model discloses the mounting structure of current MEMS microphone is improved to the technical side, improves its waterproof performance and acoustic performance.
Description
Technical Field
The utility model relates to a microphone technical field, in particular to high SNR microphone.
Background
With the development of mobile communication technology, a microphone is also rapidly developed as one of important parts of mobile communication equipment, wherein an MEMS microphone is an electric transducer manufactured by using a micromachining technology, and has the characteristics of small volume, good frequency response characteristic, low noise and the like. A MEMS microphone generally includes a MEMS chip for converting an external sound signal into an electrical signal, and an ASIC chip electrically connected to the MEMS chip. In the prior art, the MEMS microphone is limited by a structural design, and the inside of the MEMS microphone is easily exposed to dust or moisture, which reduces the service life of the MEMS microphone.
Accordingly, the prior art is deficient and needs improvement.
SUMMERY OF THE UTILITY MODEL
The utility model aims at providing a high SNR microphone aims at improving the mounting structure of current MEMS microphone, improves its waterproof performance and acoustic performance.
In order to achieve the above object, the present invention provides a high signal-to-noise ratio microphone, which includes a substrate and a casing that are spliced with each other, wherein the substrate and the casing form a holding cavity, an MEMS chip and an ASIC chip are installed in the holding cavity, the MEMS chip is electrically connected to the ASIC chip, a mounting groove for installing the casing is formed on the surface of the substrate, and the end of the casing is clamped in the mounting groove; the MEMS chip and the ASIC chip are arranged on the inner side surface of the substrate, an installation clamping groove for installing the MEMS chip is formed in the inner side surface of the substrate, a sound receiving hole corresponding to the MEMS chip is formed in the outer side surface of the substrate, the sound receiving hole is communicated with the installation clamping groove through a conical hole, and the inner diameter of the conical hole is gradually reduced along the direction from the installation clamping groove to the sound receiving hole; an annular mounting groove is coaxially formed in the outer side surface of the substrate corresponding to the sound receiving hole, and a waterproof assembly is mounted in the annular mounting groove; the waterproof assembly comprises a waterproof membrane, and two annular reinforcing plates are symmetrically arranged on the surface of the waterproof membrane along the circumferential direction of the waterproof membrane.
Preferably, the substrate is fixed to the housing by welding or gluing.
Preferably, the MEMS chip is adhered and sealed by epoxy glue between the mounting clamping grooves, the waterproof assembly is arranged between the annular mounting grooves and the waterproof membrane is adhered and sealed by the annular reinforcing plate.
Preferably, the waterproof membrane is provided as a PTFE membrane.
Preferably, the annular reinforcing plate is provided as a metal reinforcing plate.
Compared with the prior art, the beneficial effects of the utility model are that: the mounting structure of traditional microphone has been improved, sets up the mounting groove that is used for installing the casing on the base plate, makes things convenient for the location and the installation of casing, improves production efficiency. Install the MEMS chip to correspond with the sound receiving hole, make things convenient for the collection of sound, simultaneously, set up the installation draw-in groove that is used for installing the MEMS chip on the base plate, can make things convenient for its installation with in MEMS chip embedding installation draw-in groove, the rethread glues epoxy and fixes, can prevent that sound from getting into the holding intracavity and forming the echo, influences the radio reception effect of microphone to guarantee the acoustic performance of microphone. The installation clamping groove is communicated with the sound receiving hole through a taper hole, so that the sound collection effect can be further improved. Finally, through installing waterproof assembly at the radio reception hole end, moisture and dust are effectively prevented from entering the interior of the microphone shell, and the service life of the microphone shell is guaranteed.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings needed to be used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the following description are only some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to the structures shown in the drawings without creative efforts.
Fig. 1 is a schematic structural diagram of a microphone of the present invention;
FIG. 2 is an enlarged view of a portion A of FIG. 1;
fig. 3 is an exploded view of the structure of the waterproof assembly of the present invention;
the objects, features and advantages of the present invention will be further described with reference to the accompanying drawings.
Detailed Description
Referring to fig. 1 to 3, the microphone with a high signal-to-noise ratio provided in this embodiment includes a substrate 1 and a casing 2 that are spliced with each other, where the substrate 1 and the casing 2 form an accommodating cavity, an MEMS chip 3 and an ASIC chip 4 are installed in the accommodating cavity, the MEMS chip 3 and the ASIC chip 4 are electrically connected, a mounting groove 11 for installing the casing 2 is formed in a surface of the substrate 1, and an end portion of the casing 2 is clamped in the mounting groove 11; the MEMS chip 3 and the ASIC chip 4 are arranged on the inner side surface of the substrate 1, the inner side surface of the substrate 1 is provided with an installation clamping groove 12 for installing the MEMS chip 3, the outer side surface of the substrate 1 is provided with a sound receiving hole 13 corresponding to the MEMS chip 3, the sound receiving hole 13 is communicated with the installation clamping groove 12 through a conical hole 14, and the inner diameter of the conical hole 14 is gradually reduced along the direction from the installation clamping groove 12 to the sound receiving hole 13; an annular mounting groove 15 is coaxially formed in the outer side surface of the substrate 1 corresponding to the sound receiving hole 13, and a waterproof component 5 is mounted in the annular mounting groove 15; the waterproof assembly 5 comprises a waterproof membrane 51, and two annular reinforcing plates 52 are symmetrically arranged on the surface of the waterproof membrane 51 along the circumferential direction of the waterproof membrane.
It should be noted that, the present application is to improve the overall mounting structure of the microphone, and the acoustic principle and the circuit control of the microphone are prior art and will not be described herein again. The mounting structure of traditional microphone has been improved to this embodiment, sets up the mounting groove 11 that is used for installing casing 2 on base plate 1, makes things convenient for casing 2's location and installation, improves production efficiency. Install MEMS chip 3 to correspond with the sound receiving hole 13, make things convenient for the collection of sound, simultaneously, set up the installation draw-in groove 12 that is used for installing MEMS chip 3 on base plate 1, can make things convenient for its installation with MEMS chip 3 embedding installation draw-in groove 12 in, the rethread glues epoxy glue and fixes, can prevent that sound from getting into the holding intracavity and forming the echo, influences the radio reception effect of microphone to guarantee the acoustic performance of microphone. The installation clamping groove 12 is communicated with the sound collecting hole 13 through a taper hole 14, so that the sound collecting effect can be further improved. Finally, the waterproof component 5 is installed at the end of the sound receiving hole 13, so that moisture and dust are effectively prevented from entering the microphone shell 2, and the service life of the microphone shell is guaranteed.
Further, base plate 1 with casing 2 welding or viscose are fixed, during the installation, only need insert 2 tip of casing in the mounting groove 11 that corresponds on the base plate 1, according to actual material difference between them, can select to beat to glue or the concatenation that can accomplish the structure at both contact departments, simple to operate, and efficient practices thrift manufacturing cost.
Further, MEMS chip 3 with between installation slot 12 waterproof component 5 with between the annular mounting groove 15 waterproof membrane 51 with it is sealed all to paste through epoxy glue between the annular reinforcing plate 52, pastes sealedly through adopting epoxy glue, when guaranteeing overall structure installation stability, can guarantee the sealing performance of structure to improve the whole waterproof sealing effect of microphone, guarantee its life.
Further, the waterproof film 51 is set to be a PTFE film, so that on the basis of ensuring normal sound reception of the sound receiving hole, external moisture and dust can be effectively prevented from entering the accommodating cavity to influence the normal use of the microphone. Further, can set up multilayer PTFE membrane stack structure according to actual waterproof demand, improve its waterproof performance, can restart the edge viscose between the PTFE membrane and fix. Meanwhile, the annular reinforcing plates 52 are adhered to two symmetrical side surfaces of the PTFE membrane, so that the PTFE membrane can be tensioned, the stretching property of the PTFE membrane is ensured, and effective water resistance is achieved. Meanwhile, due to the fact that the PTFE film is soft, the annular reinforcing plate 52 can be conveniently installed in the annular installation groove 1511 after being added, and production efficiency is improved. In this embodiment, the annular reinforcing plate 52 is a metal reinforcing plate, and a copper plate or an aluminum plate can be selected according to actual production requirements.
The above is only the preferred embodiment of the present invention, and not the scope of the present invention, all the equivalent structures or equivalent flow changes made by the contents of the specification and the drawings or the direct or indirect application in other related technical fields are included in the patent protection scope of the present invention.
Claims (5)
1. A microphone with high signal-to-noise ratio comprises a substrate and a shell which are spliced with each other, wherein the substrate and the shell form an accommodating cavity, an MEMS chip and an ASIC chip are installed in the accommodating cavity, and the MEMS chip is electrically connected with the ASIC chip; the MEMS chip and the ASIC chip are arranged on the inner side surface of the substrate, an installation clamping groove for installing the MEMS chip is formed in the inner side surface of the substrate, a sound receiving hole corresponding to the MEMS chip is formed in the outer side surface of the substrate, the sound receiving hole is communicated with the installation clamping groove through a conical hole, and the inner diameter of the conical hole is gradually reduced along the direction from the installation clamping groove to the sound receiving hole; an annular mounting groove is coaxially formed in the outer side surface of the substrate corresponding to the sound receiving hole, and a waterproof assembly is mounted in the annular mounting groove; the waterproof assembly comprises a waterproof membrane, and two annular reinforcing plates are symmetrically arranged on the surface of the waterproof membrane along the circumferential direction of the waterproof membrane.
2. A high signal-to-noise ratio microphone according to claim 1, wherein the substrate is welded or adhesively secured to the housing.
3. The high signal-to-noise ratio microphone of claim 2, wherein the space between the MEMS chip and the mounting slot, the space between the waterproof component and the annular mounting slot, and the space between the waterproof membrane and the annular reinforcing plate are sealed by epoxy glue.
4. A high signal-to-noise ratio microphone as claimed in claim 2, wherein the water-proof membrane is provided as a PTFE membrane.
5. A high signal-to-noise ratio microphone according to claim 1, wherein the annular stiffener is provided as a metal stiffener.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202020020997.8U CN211580196U (en) | 2020-01-06 | 2020-01-06 | High signal-to-noise ratio microphone |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202020020997.8U CN211580196U (en) | 2020-01-06 | 2020-01-06 | High signal-to-noise ratio microphone |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN211580196U true CN211580196U (en) | 2020-09-25 |
Family
ID=72552818
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202020020997.8U Active CN211580196U (en) | 2020-01-06 | 2020-01-06 | High signal-to-noise ratio microphone |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN211580196U (en) |
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2020
- 2020-01-06 CN CN202020020997.8U patent/CN211580196U/en active Active
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