CN211580193U - Centering support piece and loudspeaker - Google Patents

Abstract

The utility model discloses a centering support piece and a loudspeaker, wherein the centering support piece is of a multilayer structure formed by compounding a plurality of material layers; the material layer comprises a conductive layer and an insulating layer; the insulating layer comprises a first high polymer layer and a second high polymer layer which are respectively arranged on two side faces of the conducting layer in a stacking mode, and the thickness of the first high polymer layer is larger than or equal to the sum of the thickness of the conducting layer and the thickness of the polymer of the second high polymer layer. The first high polymer layer comprises a first flexible base material layer and a first rigid base material layer, the thickness of the first flexible base material layer is smaller than that of the first basic base material layer, and the rigidity of the first flexible base material layer is smaller than that of the first rigid base material layer. The conducting layer is arranged at the position of the lamination layer with the minimum stress through the thickness of the centering branch piece, so that the conducting layer is protected most comprehensively, the stress value of the conducting layer during vibration is reduced, the fatigue resistance service life of the conducting layer is prolonged, and the reliability of the centering branch piece is enhanced.

Description

Centering support piece and loudspeaker

Technical Field

The utility model relates to a super linear loudspeaker technical field, specifically say and relate to a centring disk and use this centring disk's speaker.

Background

Compared with the traditional loudspeaker, the ultra-linear loudspeaker greatly improves the loudness of low frequency in the loudspeaker, better inhibits sound distortion, can bring more shocking bass enjoyment and better sound playback effect for users, and is widely applied to modern electronic products. The structure of super linear speaker includes casing supporting component, magnetic circuit subassembly and vibration subassembly, and wherein casing supporting component is used for connecting and supporting magnetic circuit subassembly and vibration subassembly, and magnetic circuit subassembly is used for constituting the magnetic field clearance that holds the voice coil loudspeaker voice coil, and the vibration subassembly includes vibrating diaphragm, voice coil loudspeaker voice coil and centering piece, and vibrating diaphragm, voice coil loudspeaker voice coil and centering piece combine together, and the voice coil loudspeaker voice coil sets up in the magnetic field clearance.

The centering disk is one of basic components of the super linear loudspeaker, and the use of the centering disk improves the vibration amplitude of a vibration component in the super linear loudspeaker and improves the loudness of the super linear loudspeaker. The centering support sheet is made of a flexible circuit board with multiple material layers, each material layer comprises an insulating material layer and a conducting layer, the insulating material layers and the conducting layers can be bonded through glue layers, and the conducting layers can also be directly formed on the insulating material layers. The centering support piece comprises an outer fixing part on the outermost side, an inner fixing part on the inner side and a plurality of cantilevers for connecting the outer fixing part and the inner fixing part, wherein the outer fixing part is connected with the shell supporting assembly, and the inner fixing part is connected with the vibrating diaphragm and the voice coil. The centering support is used for conducting the current of the voice coil and maintaining the correct position of the voice coil in the magnetic field gap. When the voice coil vibrates under the action of current and magnetic field, the centering support piece reciprocates along the axial direction along with the voice coil. In the prior art, the thickness of an insulating base material layer close to a voice coil is smaller than that of an insulating material layer far away from the voice coil, the thickness is set to enable a rolled copper layer to deviate from a central shaft, in the vibration process of the centering branch piece, the rolled copper is not located near a neutral axis, and the rolled copper layer is easy to generate fatigue cracks in a large stress amplitude area under a sine displacement load in a specific period, so that the rolled copper layer is broken and fails.

In addition, the existing centering disk layer is generally a combination of polyimide + basic polyimide + calendered copper + polyimide, as shown in fig. 6, the polyimide layer on the outermost surface is thickest, the basic polyimide layer is thinnest, and the thickness of the conductive layer is greater than that of the basic polyimide layer.

SUMMERY OF THE UTILITY MODEL

An object of the utility model is to overcome the weak point of above-mentioned conventional art, provide one kind and provide effectual buffering guard action to the conducting layer, improve the fatigue life of conducting layer, reduce its stress value when the vibration, a centering support piece of reinforcing centering support piece reliability and use this centering support piece's speaker.

The purpose of the utility model is achieved through the following technical measures:

a centering support piece is of a multilayer structure formed by compounding a plurality of material layers or a multilayer structure formed by compounding a plurality of material layers and a glue layer; the material layer comprises a conductive layer positioned at the inner part and an insulating layer positioned at the outer surface; the centering support piece comprises a fixing part fixed with the basin frame, a vibration part fixed with the voice coil and a plurality of cantilevers connected with the vibration part and the voice coil, and is characterized in that: the insulating layer includes first high-molecular polymer layer and the second high-molecular polymer layer that the range upon range of sets up in conducting layer both sides face, first high-molecular polymer layer is located the connection face fixed with the voice coil loudspeaker voice coil, the thickness of first high-molecular polymer layer more than or equal to the thickness of conducting layer and the sum of second high-molecular polymer layer polymer thickness.

As a preferable scheme, the first polymer layer includes a first flexible substrate layer and a first rigid substrate layer, the rigidity of the first rigid substrate layer is greater than that of the first flexible substrate layer, and the first flexible substrate layer is fixedly connected to the voice coil. In general, the first flexible substrate layer and the first rigid substrate layer can meet different rigidity requirements by selecting different types of polyimides, and the first flexible substrate layer and the first rigid substrate layer can also adopt other high-molecular polymers with different types and rigidity besides polyimides so as to meet the rigidity requirements.

Preferably, the thickness of the conductive layer is smaller than or equal to that of the first flexible substrate layer, and the thickness of the first flexible substrate layer is smaller than that of the first rigid substrate layer. First polymer layer has the first flexible substrate layer and the first rigidity substrate layer of different rigidity, and the first flexible substrate layer rigidity that bonds with the voice coil loudspeaker voice coil at the surface is lower, and is softer relatively, and the first rigidity substrate layer rigidity that presses close to the conducting layer is higher. The conductive layer is typically a calendered copper layer having a young's modulus significantly higher than that of the high molecular weight polymer. With the thickness less than or equal to first flexible substrate layer of conducting layer and be less than the thickness of first rigidity substrate layer, for the higher conducting layer of rigidity, constitute a gradient that rigidity improves gradually, and the first rigidity substrate layer of high rigidity has bigger thickness and presses close to the conducting layer, has better buffering damping effect to the conducting layer, can play better protection conducting layer and exert better shock attenuation and buffering effect than conventional structure.

Preferably, the thickness of the conductive layer is defined as a, and a is less than or equal to 1.5 a.

Preferably, the thickness of the conductive layer is defined as a, 2a is less than or equal to the thickness of the first rigid substrate layer and less than or equal to 2.5 a.

Preferably, the thickness of the first rigid substrate layer is equal to or less than the thickness of the second polymer layer.

Preferably, the thickness of the conductive layer is defined as a, 2a ≦ 3a for the second high polymer layer.

Thickness less than or equal to of conducting layer the thickness of first rigidity substrate layer, the thickness of first rigidity substrate layer equals 2 times of the thickness of conducting layer at least, the thickness less than or equal to second high polymer layer of the thickness of first rigidity substrate layer, by the first rigidity substrate layer laminating conducting layer of thicker and rigidity height, play fine guard action to the conducting layer, and thinner conducting layer production heat is lower, the higher first rigidity substrate layer of rigidity also can exert better radiating effect, reduce the local temperature of conducting layer, delay the crystallization of conducting layer metal particle thick, slow down the time of conducting layer metal fatigue failure, the life-span of improvement conducting layer.

Preferably, the second polymer layer is a second flexible substrate layer and/or a second rigid substrate layer, and the rigidity of the second rigid substrate layer is greater than the rigidity of the second flexible substrate layer. In general, the second flexible substrate layer and the second rigid substrate layer can meet different rigidity requirements by selecting different types of polyimides, and the second flexible substrate layer and the second rigid substrate layer can also adopt other high-molecular polymers with different types and rigidity besides polyimides so as to meet the rigidity requirements.

As a preferable scheme, the second polymer layer is a second rigid substrate layer, the first polymer layer includes a first flexible substrate layer and a first rigid substrate layer, the thickness of the first flexible substrate layer is equal to the thickness of the conductive layer, and the thickness of the second rigid substrate layer is equal to the thickness of the first rigid substrate layer and is greater than or equal to 2 times the thickness of the conductive layer. Under the condition that the conditions are met, the conducting layer is located on the central shaft of the laminated structure of the centering support piece, the stress value borne by the conducting layer during vibration bending is reduced to the minimum, the deformation degree is the minimum, the heat generated by local vibration is reduced to the minimum, the temperature rise generated by local vibration is reduced, the coarse particles of metal crystals are delayed, the metal fatigue failure time is prolonged, the product is not easy to damage, and the conducting layer is the optimal structural arrangement.

The utility model provides a loudspeaker, includes equipment casing subassembly, magnetic circuit subassembly and vibrating diaphragm subassembly as an organic whole, the vibrating diaphragm subassembly includes interconnect's voice coil loudspeaker voice coil, vibrating diaphragm and centering branch piece, its characterized in that: the centering support piece is the centering support piece, and the voice coil is arranged on one side of the first high polymer layer of the centering support piece.

Owing to adopted above-mentioned technical scheme, compare with prior art, the utility model has the advantages that:

the utility model discloses a laminated structure of centering piece is close to the voice coil loudspeaker voice coil the thickness on first polymer layer is greater than the thickness of conducting layer and the sum of second polymer layer polymer thickness, can the centering piece when the vibration, the conducting layer is in central axis position as far as possible to reduce the vibration of conducting layer in the high-speed vibration of voice coil loudspeaker voice coil, bending, the range of deformation, reduce stress value and alleviate the conducting layer fatigue, and simultaneously, also can make polymer layer can exert the bigger shock attenuation and cushioning effect of more traditional structure, restrain the fracture of conducting layer, improve the antifatigue characteristic of centering piece.

First flexible substrate layer thickness is less than the thickness of first rigidity substrate layer, the rigidity of first flexible substrate layer is less than the rigidity of first rigidity substrate layer, compare in prior art, the first flexible substrate layer and the first rigidity substrate layer that will paste the first high-molecular polymer layer of voice coil loudspeaker voice coil carry out the gradient setting that rigidity slowly increases relatively, adopt the lower first flexible substrate layer of thinner and rigidity to connect the voice coil loudspeaker voice coil, the higher first rigidity substrate layer of thick and rigidity, bond the voice coil loudspeaker voice coil in the one side of keeping away from the conducting layer, make the conducting layer be close to the neutral axis. The setting of the high molecular polymer thickness through different Young's moduli sets up the conducting layer thickness to be the thinnest and the conducting layer in the material layer and arranges the minimum stack position of stress in, it has realized carrying out the most comprehensive protection to the conducting layer to set up the higher and thicker high molecular polymer of thickness of rigidity through the conducting layer both sides, bear more stress by the thicker high molecular polymer layer of conducting layer both sides face, the stress value of conducting layer when the vibration has been reduced, the fatigue life of conducting layer is improved, the reliability of centering branch piece has been increased, can effectively improve the anti fatigue characteristic of this application centering branch piece. When the voice coil vibrates at a high speed, the vibration energy of the voice coil is firstly absorbed by the softer first flexible substrate layer, the buffering effect is strong, the thicker first rigid substrate layer with higher rigidity enables the conducting layer to be positioned near the central axis with the minimum stress amplitude, and more effective conducting layer protection and buffering effects are provided.

The thickness of the first flexible base material layer is equal to that of the conductive layer, namely the thickness of the polyimide close to the voice coil is equal to that of the rolled copper layer, the thickness of the conductive layer is reduced, the thickness of the first rigid base material layer is equal to that of the second rigid base material layer, and the thickness of the first rigid base material layer is at least 2 times of that of the conductive layer, so that the conductive layer can be placed in a neutral axis area as far as possible through the laying layer, the stress amplitude of the conductive layer during vibration is reduced, and the fatigue resistance of the conductive.

The present invention will be further described with reference to the accompanying drawings and the following detailed description.

Drawings

FIG. 1 is a schematic diagram of the stress distribution of a cross section of a cantilever structure of a centering strut when the cantilever structure is bent.

Fig. 2 is a schematic view of a laminated structure of a cantilever according to embodiment 1 of the present invention.

Fig. 3 is a schematic structural view of a laminated structure of a cantilever according to an embodiment 17 of the present invention.

Fig. 4 is a schematic structural diagram of a laminated structure of a cantilever according to an embodiment 18 of the present invention.

FIG. 5 is a cross-sectional stress profile of example 18.

FIG. 6 is a conventional spider cantilever configuration.

Fig. 7 is a cross-sectional stress profile of a conventional cantilever structure.

Detailed Description

The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.

A centering support piece is of a multilayer structure formed by compounding a plurality of material layers or a multilayer structure formed by compounding a plurality of material layers and a glue layer; the material layer comprises a conductive layer positioned at the inner part and an insulating layer positioned at the outer surface; the centering support piece comprises a fixing part fixed with the basin frame, a vibrating part fixed with the voice coil and a plurality of cantilevers connected with the fixing part and the vibrating part. Referring to the stress distribution diagram on the cantilever cross section of the centering branch plate in the bending state in fig. 1, the stress distribution characteristics on the cross section in bending can be known: the outermost stress on the cantilever cross section of the centering branch piece is the largest, and the stress is smaller when the cantilever cross section is closer to the central shaft, so that the stress on the neutral shaft is zero. The conductive layer bears most stress when vibrating up and down, the stress amplitude of the rolled copper is large, and fatigue fracture failure is easy to occur after reliability verification. Particularly, in a high-frequency state, for example, under 20KHz audio frequency, the vibration acceleration of the centering support is large, the vibration impact force borne by the root of the cantilever is large, the vibration effect is strong, the heat generated in the vibration of the local conductive layer is remarkably increased, the temperature of rolled copper serving as the conductive layer is increased, metal crystal particles are increased, the metal texture becomes brittle, the insulating material layer on the conductive layer is rapidly aged due to the temperature increase and is not enough to protect the conductive layer, the conductive layer is easy to fatigue, fracture and lose efficacy due to the factors, so that the failure of the centering support is caused, and finally, the loudspeaker is completely damaged. The application provides a laminated structure of centering branch piece carries out the most comprehensive protection with the conducting layer, reduces its stress value when the vibration, improves the fatigue life-span of conducting layer, increases the reliability of centering branch piece.

In examples 1 to 16: a centering support piece is of a multilayer structure formed by compounding a plurality of material layers or a multilayer structure formed by compounding a plurality of material layers and a glue layer; the material layer is including the conducting layer that is located central zone and the insulating layer that is located the surface, the material layer is from the fixed first macromolecular polymer layer, conducting layer 3, the second macromolecular polymer layer that sets up of stacking gradually to the direction of keeping away from the voice coil loudspeaker voice coil with the fixed face of being connected of voice coil loudspeaker voice coil, the thickness on first macromolecular polymer layer more than or equal to conducting layer 3's thickness and the sum of second macromolecular polymer thickness. The cross-sectional structure of the centering branch piece in the above embodiment is shown in fig. 2. The high molecular polymer in the first high molecular polymer layer and the second high molecular polymer layer generally adopts polyimide, i.e. PI, and can also adopt other types of high molecular polymers, and the conducting layer mostly adopts a calendered copper layer, and can also adopt other metal layers such as a gold layer and the like. As shown in fig. 1, the thickness of the first polymer layer close to the voice coil is greater than or equal to the sum of the thickness of the conductive layer and the thickness of the second polymer layer, so that the conductive layer can be located at the position of the central axis as far as possible, thereby reducing the vibration, bending and deformation amplitude of the conductive layer in the high-speed vibration of the voice coil, reducing the stress value, alleviating the fatigue of the conductive layer, and simultaneously enabling the polymer layer to exert larger damping and buffering effects than the traditional structure, inhibiting the fracture of the conductive layer, and improving the fatigue resistance of the centering branch piece.

The first high polymer layer comprises a first flexible substrate layer 1 and a first rigid substrate layer 2, the rigidity of the first rigid substrate layer 2 is greater than that of the first flexible substrate layer 1, and the first flexible substrate layer 1 is fixedly connected with the voice coil; the second high polymer layer is a second flexible substrate layer 4. In examples 1 to 16, the first flexible base material layer 1, the first rigid base material layer 2, the conductive layer 3, and the second flexible base material layer 4 were laminated in this order from the connection surface fixed to the voice coil to the direction away from the voice coil in the layer structure of the damper material layer. The first flexible substrate layer 1 and the second flexible substrate layer 4 are made of polyimide (namely PI), the first rigid substrate layer 2 is made of basic polyimide (namely BasePI), the Young modulus of the polyimide PI selected for use by the first flexible substrate layer 1 and the second flexible substrate layer 4 is about 2.5GPa, the rigidity of the basic polyimide BasePI selected for use by the first rigid substrate layer 2 is larger than that of the polyimide, and the Young modulus of the basic polyimide is 5.3 GPa. Of course, the first flexible substrate layer 1, the second flexible substrate layer 4 and the first rigid substrate layer 2 can meet different rigidity requirements by selecting different types of polyimides or other types of high molecular polymers. As shown in fig. 2, the thickness of the conductive layer 3 is less than or equal to that of the first flexible substrate layer 1, the thickness of the first flexible substrate layer 1 is less than that of the first rigid substrate layer 2, and the thickness of the first rigid substrate layer 2 is less than or equal to that of the second polymer layer.

The following criteria are met for the thickness of the material layers of the centering disk:

if the thickness of the conductive layer 3 is a, the thickness of the first flexible substrate layer 1 is not less than 1.5a, the thickness of the first rigid substrate layer 2 is not less than 2.5a, and the thickness of the second high polymer layer is not less than 2a and not more than 3 a.

The thicknesses of the individual material layers in examples 1 to 16 are shown in tables one (1) to one (2).

TABLE 1 thickness of each material layer of examples 1-8

	Example 1	Example 2	Example 3	Example 4	Example 5	Example 6	Example 7	Example 8
									A first flexible substrate layer	12	12	12.5	18	15	15	16	22.5
A first rigid substrate layer	25	24	24	30	35	30	32	37.5
									Conductive layer	12	12	12	12	15	15	15	15
Second flexible substrate layer	25	24	25	36	40	30	40	45

TABLE 2 thickness of each material layer of examples 9-16

	Example 9	Example 10	Example 11	Example 12	Example 13	Example 14	Example 15	Example 16
									A first flexible substrate layer	25	18	22.5	27	27	24	32	36
A first rigid substrate layer	42	36	42	45	54	48	56	60
									Conductive layer	18	18	18	18	24	24	24	24
Second flexible substrate layer	42	36	45	54	54	48	60	72

The thickness of the conducting layer is smaller than or equal to that of the first flexible base material layer and smaller than that of the first rigid base material layer, and the rigidity of the first flexible base material layer is smaller than that of the first rigid base material layer. In the above examples 1 to 16, the young's modulus of the Polyimide (PI) selected for the first flexible substrate layer and the second flexible substrate layer was about 2.5 GPa; the rigidity of basic polyimide (BasePI) selected for the first rigid base material layer is greater than that of the polyimide, and the Young modulus of the base polyimide is 5.3 GPa; the conductive layer is a rolled copper layer, and the Young modulus of the conductive layer is about 106 GPa. That is, the thickness of the first flexible substrate layer Polyimide (PI) is smaller than the thickness of the first rigid substrate layer polyimide (BasePI) and the rigidity of the first flexible substrate layer Polyimide (PI) is smaller than the rigidity of the first rigid substrate layer polyimide (BasePI), compared with the prior art, the material layer forming the centering support sheet forms a gradient distribution layer structure in which the rigidity of the first flexible substrate layer and the rigidity of the first rigid substrate layer between the conductive layer and the voice coil is relatively slowly increased, the voice coil is connected by the first flexible substrate layer with lower thickness and rigidity, the first rigid substrate layer with higher thickness and rigidity bonds the voice coil on the side far away from the conductive layer. The utility model discloses a centering buttress laminated structure disclosed in this application, the setting of the high polymer thickness through different Young's moduli sets up the conducting layer thickness to be the minimum and the conducting layer arranges the laminating position that the stress is minimum in the material layer in thinnest and conducting layer, it has realized carrying out the most comprehensive protection to the conducting layer to set up the higher and thicker high polymer of thickness of rigidity through the conducting layer both sides, bear more stress by the thicker high polymer layer of conducting layer both sides face, the stress value of conducting layer when the vibration has been reduced, the fatigue life of conducting layer has been improved, the reliability of centering buttress has been increased, can effectively improve this application centering buttress antifatigue characteristic. When the voice coil vibrates at a high speed, the vibration energy of the voice coil is firstly absorbed by the softer first flexible substrate layer, the buffering effect is strong, the thicker first rigid substrate layer with higher rigidity enables the conducting layer to be positioned near the central axis with the minimum stress amplitude, and more effective conducting layer protection and buffering effects are provided. Of course, the first flexible substrate layer, the second flexible substrate layer and the first rigid substrate layer can meet different rigidity requirements by selecting other types of polyimides or other types of high molecular polymers. In examples 1, 2, 10, and 14, the thickness of the first flexible base material layer adjacent to the voice coil was the same as the thickness of the conductive layer, the thickness of the conductive layer was reduced, the thickness of the first rigid base material layer was the same as the thickness of the second rigid base material layer, and the thickness was at least 2 times the thickness of the conductive layer.

Example 17: the centering disk in this embodiment is different from embodiment 1 in that: the second high polymer layer is a second rigid base material layer 5; the layering structure of centering piece material layer stacks in proper order from the fixed connection face of voice coil loudspeaker voice coil to the direction of keeping away from the voice coil loudspeaker voice coil and sets up to first flexible substrate layer 1, first rigidity substrate layer 2, conducting layer 3, second rigidity substrate layer 5. The thickness of the second rigid substrate layer 5 is equal to the thickness of the first rigid substrate layer 2, and the thickness of the first rigid substrate layer 2 and the thickness of the second rigid substrate layer 5 are both more than or equal to 2 times of the thickness of the conductive layer 3. The cross-sectional structure of the centering chip in example 17 is shown in fig. 3.

The first rigid substrate layer 2 and the second rigid substrate layer 5 are made of base material polyimide (i.e. BasePI), and the rigidity of the base material polyimide is greater than that of the polyimide (i.e. PI) used for manufacturing the first flexible substrate layer 1.

Reference is made to examples 1 to 16 for the thickness of each material layer of the centering disk, wherein the thickness of the second rigid substrate layer is in accordance with the thickness standard of the first flexible substrate layer. And are not described in detail. The rest of this example 17 is the same as example 1.

In this embodiment, the second rigid substrate layer 5 with higher rigidity is adopted as the surface layer of the conductive layer 3 far away from the voice coil, so that both surfaces of the conductive layer 3 are coated by the material layers with higher rigidity and at least 2 times of thickness, the conductive layer 3 is protected more sufficiently by the high-rigidity high polymer, the stress of the first rigid substrate layer 2 and the second rigid substrate layer 5 during bending of more centering support pieces can be shared, the stress amplitude of the conductive layer 3 is reduced, and the fatigue resistance of the conductive layer 3 is further improved compared with embodiment 1.

Example 18: the centering chip in this embodiment is different from embodiment 17 in that: as shown in fig. 4, the first polymer layer of the centering support sheet in this embodiment includes a first flexible substrate layer 1 and a first rigid substrate layer 2, the second polymer layer includes a second flexible substrate layer 4 and a second rigid substrate layer 5, and the rigidity of the second rigid substrate layer 5 is greater than the rigidity of the second flexible substrate layer 4. The layering structure of the centering support sheet material layer is sequentially stacked from the connecting surface fixed with the voice coil to the direction far away from the voice coil to form a first flexible substrate layer 1, a first rigid substrate layer 2, a conducting layer 3, a second flexible substrate layer 4, a second rigid substrate layer 5 or the layering structure of the centering support sheet material layer is sequentially stacked from the connecting surface fixed with the voice coil to the direction far away from the voice coil to form a first flexible substrate layer 1, a first rigid substrate layer 2, a conducting layer 3, a second rigid substrate layer 5 and a second flexible substrate layer 4. In the present embodiment, the first flexible substrate layer 1 and the second flexible substrate layer 4 are made of Polyimide (PI), and the first rigid substrate layer 2 and the second rigid substrate layer 5 are made of base polyimide (BasePI).

As shown in fig. 4, the thickness of the conductive layer 3 is less than or equal to the thickness of the first flexible substrate layer 1 and the second flexible substrate layer 4, the thicknesses of the first flexible substrate layer 1 and the second flexible substrate layer 4 are the same, and the sum of the thicknesses of the first flexible substrate layer 1 and the first rigid substrate layer 2 is greater than or equal to the sum of the thicknesses of the conductive layer 3, the second flexible substrate layer 4 and the second rigid substrate layer 5.

In this embodiment, the thicknesses of the material layers are: the thickness of the conductive layer is 12 microns, the thickness of the first flexible base material layer is 12 microns, the thickness of the first rigid base material layer is 24 microns, the thickness of the second rigid base material layer is 12 microns, and the thickness of the second flexible base material layer is 12 microns.

Fig. 5 is a cross-sectional stress distribution diagram of the product in this embodiment, fig. 6 is a cross-sectional stress distribution diagram of the centering pad in a conventional structure, the PI layer 6 and the rolled copper layer 8 as the polymer layer are thicker, and the PI layer on the other side of the BasePI and the rolled copper layer is too thin, so that the stress of the centering pad is basically borne by the rolled copper layer, the polymer layer does not protect the function and effect of the rolled copper layer, and fig. 7 is a cross-sectional stress distribution diagram of the product in a conventional structure. Comparing fig. 5 and fig. 7, the stress amplitude of the conducting layer of the damper in this embodiment is reduced by 18% compared with the conventional structure under the same vibration amplitude through finite element analysis. The centering branch piece in the application can effectively improve the anti-fatigue property of the centering branch piece.

Example 19: the utility model provides a loudspeaker, includes equipment casing subassembly, magnetic circuit subassembly and vibrating diaphragm subassembly as an organic whole, the vibrating diaphragm subassembly includes interconnect's voice coil loudspeaker voice coil, vibrating diaphragm and centering branch piece, its characterized in that: the centering support piece is the centering support piece, and the voice coil is arranged on one side of the first high polymer layer of the centering support piece.

The structure and connection relationship of the conventional speaker are well known in the art and will not be described in detail.

It is obvious to a person skilled in the art that the invention is not restricted to details of the above-described exemplary embodiments, but that it can be implemented in other specific forms without departing from the spirit or essential characteristics of the invention. The present embodiments are therefore to be considered in all respects as illustrative and not restrictive, the scope of the invention being indicated by the appended claims rather than by the foregoing description, and all changes which come within the meaning and range of equivalency of the claims are therefore intended to be embraced therein. Any reference sign in a claim should not be construed as limiting the claim concerned.

Furthermore, it should be understood that although the present description refers to embodiments, not every embodiment may contain only a single embodiment, and such description is for clarity only, and those skilled in the art should integrate the description, and the embodiments may be combined as appropriate to form other embodiments understood by those skilled in the art.

Claims (10)

1. A centering support piece is of a multilayer structure formed by compounding a plurality of material layers or a multilayer structure formed by compounding a plurality of material layers and a glue layer; the material layer comprises a conductive layer positioned at the inner part and an insulating layer positioned at the outer surface; the centering support piece comprises a fixing part fixed with the basin frame, a vibration part fixed with the voice coil and a plurality of cantilevers connected with the vibration part and the voice coil, and is characterized in that: the insulating layer includes first polymer layer and the second polymer layer that the range upon range of sets up in conducting layer both sides face, first polymer layer is the connection face with voice coil loudspeaker voice coil fixed connection, the thickness of first polymer layer more than or equal to conducting layer and the sum of second polymer layer polymer thickness.

2. A centring disk as claimed in claim 1, wherein: the first high polymer layer comprises a first flexible substrate layer and a first rigid substrate layer, the rigidity of the first rigid substrate layer is greater than that of the first flexible substrate layer, and the first flexible substrate layer is connected with the voice coil fixed connection face.

3. A centring disk as claimed in claim 2, wherein: the thickness of the conducting layer is smaller than or equal to that of the first flexible base material layer, and the thickness of the first flexible base material layer is smaller than that of the first rigid base material layer.

4. A centring disk as claimed in claim 3, wherein: the thickness of the conducting layer is defined as a, and the thickness of the first flexible base material layer is not more than 1.5 a.

5. A centring disk as claimed in claim 3, wherein: the thickness of the conductive layer is defined as a, 2a is smaller than or equal to the thickness of the first rigid base material layer, and 2.5a is smaller than or equal to the thickness of the conductive layer.

6. A centring disk as claimed in claim 3, wherein: the thickness of the first rigid base material layer is smaller than or equal to that of the second high polymer layer.

7. A centring disk as claimed in claim 6, wherein: the thickness of the conductive layer is defined as a, 2a is less than or equal to the thickness of the second high polymer layer and is less than or equal to 3 a.

8. A centring disk as claimed in claim 2, wherein: the second high polymer layer is a second flexible base material layer and/or a second rigid base material layer, and the rigidity of the second rigid base material layer is greater than that of the second flexible base material layer.

9. A centring disk as claimed in claim 8, wherein: the second high polymer layer is a second rigid base material layer, the thickness of the first flexible base material layer is equal to that of the conducting layer, and the thickness of the second rigid base material layer is equal to that of the first rigid base material layer and is more than or equal to 2 times of that of the conducting layer.

10. The utility model provides a loudspeaker, includes equipment casing subassembly, magnetic circuit subassembly and vibrating diaphragm subassembly as an organic whole, the vibrating diaphragm subassembly includes interconnect's voice coil loudspeaker voice coil, vibrating diaphragm and centering branch piece, its characterized in that: the damper as claimed in any one of claims 1 to 9, wherein the voice coil is disposed on the first polymer layer side of the damper.

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