CN211578382U - Solid-state chip radiating fin capable of radiating heat quickly - Google Patents

Abstract

The utility model discloses a quick radiating solid state chip fin, including two shells, two the internally mounted of shell has solid state chip, the heating panel is installed to solid state chip's upper end, the heating panel is installed down to solid state chip's lower extreme, the left and right ends symmetry of heating panel is provided with four buttons down. The solid-state chip radiating fin capable of fast radiating can conveniently fix the upper radiating plate and the lower radiating plate on the solid-state chip by arranging the upper connecting blocks at the left and right ends of the upper radiating plate, arranging the connecting sheet and the clamping head at the lower end of the upper connecting block and arranging the lower connecting blocks at the left and right ends of the lower radiating plate; the button is arranged, so that the clamping head can be conveniently pushed out of the limiting groove, and the upper heat dissipation plate and the lower heat dissipation plate can be conveniently detached from the solid-state chip; through setting up two shells and fixed sleeving, spliced pole, its dismantlement installation of can being convenient for to finally improve its practicality, reduce extravagantly simultaneously.

Description

Solid-state chip radiating fin capable of radiating heat quickly

Technical Field

The utility model relates to a heat dissipation technical field, in particular to quick radiating solid state chip fin.

Background

The solid state drive is commonly called a solid state disk, the solid state disk is a hard disk made of a solid state electronic storage chip array, a solid state chip in the solid state disk can generate certain heat in the working process, if the generated heat is not timely dissipated as soon as possible, the working efficiency of the solid state disk can be influenced, and the fast radiating fins of the solid state chip can provide fast radiating for the solid state chip; however, when the solid chip is damaged, the fast heat sink is inconvenient to disassemble and assemble, and is often lost together with the damaged solid chip, thereby causing a certain waste, so that the fast heat sink of the existing solid chip needs to be improved, thereby improving the practicability of the solid chip and reducing the waste.

SUMMERY OF THE UTILITY MODEL

The utility model discloses a main aim at provides quick radiating solid state chip fin, can effectively solve the problem in the background art.

In order to achieve the above purpose, the utility model adopts the following technical scheme:

quick radiating solid state chip fin, including two shells, two the internally mounted of shell has solid state chip, the heating panel is installed to the upper end of solid state chip, heating panel under the lower extreme of solid state chip is installed, the left and right sides both ends symmetry of heating panel is provided with four buttons down.

Preferably, two the spread groove has been seted up to the front end of shell, two all be provided with a heat dissipation window on the shell, the downside the upper end symmetry of shell is provided with four fixed sleeving, upside the lower extreme symmetry of shell is provided with four spliced poles, upside four spliced poles of shell lower extreme imbed respectively in the downside four fixed sleeving of shell upper end are intraductal, through setting up two shells and fixed sleeving, spliced pole, can be convenient for its dismantlement installation.

Preferably, the solid-state chip is installed between four fixed sleeves and four connecting posts, the front end of the solid-state chip is provided with a connector, and the connector is arranged at the front end of the solid-state chip, so that the solid-state chip can be conveniently connected with other equipment.

Preferably, a plurality of louvre has been seted up to the symmetry on the last heating panel, the upper end of going up the heating panel evenly is provided with a plurality of fin, both ends symmetry is provided with four last connecting blocks, four about going up the heating panel the lower extreme of going up the connecting block all is provided with a connection piece, four the outer end of connecting piece all is provided with a dop, sets up the connecting block and sets up connection piece, dop at the lower extreme of last connecting block through both ends about last heating panel, can be convenient for its cooperation down the connecting block fix last heating panel, lower heating panel on solid-state chip.

Preferably, a plurality of louvre has been seted up to the symmetry on the heating panel down, the lower extreme of heating panel evenly is provided with a plurality of fin down, both ends symmetry is provided with four lower connecting blocks, four about the heating panel down a draw-in groove has all been seted up to the upper end of lower connecting block, four a spacing groove has all been seted up on the inner wall of draw-in groove, four a flexible groove has all been seted up to the connecting block outer end down, flexible groove runs through the outer end and the spacing groove of connecting block down, and through both ends set up lower connecting block about the heating panel down, the connecting block will be gone up in its cooperation and the heating panel is fixed on solid-state chip down.

Preferably, four the inboard of button all is provided with a spacing post in the inside that is located four flexible grooves, the outside of spacing post is provided with annular separation blade, through setting up the button, can be convenient for release the spacing groove with the dop to be convenient for dismantle last heating panel, lower heating panel from solid-state chip.

Compared with the prior art, the utility model discloses following beneficial effect has:

the upper connecting blocks are arranged at the left end and the right end of the upper heat dissipation plate, the connecting sheets and the clamping heads are arranged at the lower end of the upper connecting blocks, and the lower connecting blocks are arranged at the left end and the right end of the lower heat dissipation plate, so that the upper heat dissipation plate and the lower heat dissipation plate can be conveniently fixed on the solid-state chip; the button is arranged, so that the clamping head can be conveniently pushed out of the limiting groove, and the upper heat dissipation plate and the lower heat dissipation plate can be conveniently detached from the solid-state chip; through setting up two shells and fixed sleeving, spliced pole, its dismantlement installation of can being convenient for to finally improve its practicality, reduce extravagantly simultaneously.

Drawings

Fig. 1 is a schematic view of the overall structure of the solid-state chip heat sink for fast heat dissipation according to the present invention;

fig. 2 is a schematic diagram of the internal structure of the housing of the fast-heat-dissipating solid-state chip heat sink according to the present invention;

fig. 3 is a schematic view of the overall structure of the upper heat dissipating plate and the lower heat dissipating plate of the solid-state chip heat dissipating fin for fast heat dissipation according to the present invention;

fig. 4 is a schematic structural view of a button of the fast-heat-dissipating solid-state chip heat sink according to the present invention;

fig. 5 is an enlarged view of fig. 4 at a.

In the figure: 1. a housing; 2. a solid-state chip; 3. an upper heat dissipation plate; 4. a lower heat dissipation plate; 5. a button; 6. connecting grooves; 7. a heat dissipation window; 8. fixing the sleeve; 9. connecting columns; 10. a connector; 11. heat dissipation holes; 12. a heat sink; 13. an upper connecting block; 14. connecting sheets; 15. clamping a head; 16. a lower connecting block; 17. a card slot; 18. a limiting groove; 19. a telescopic groove; 20. a limiting column; 21. an annular baffle plate.

Detailed Description

In order to make the technical means, creation features, achievement purposes and functions of the present invention easy to understand, the present invention is further described below with reference to the following embodiments.

In the description of the present invention, it should be noted that the terms "upper", "lower", "inner", "outer", "front end", "rear end", "both ends", "one end", "the other end" and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, and are only for convenience of description and simplification of description, but do not indicate or imply that the device or element to which the reference is made must have a specific orientation, be constructed in a specific orientation, and be operated, and thus, should not be construed as limiting the present invention. Furthermore, the terms "first" and "second" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance.

In the description of the present invention, it is to be noted that, unless otherwise explicitly specified or limited, the terms "mounted," "disposed," "connected," and the like are to be construed broadly, and for example, "connected" may be either fixedly connected or detachably connected, or integrally connected; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meaning of the above terms in the present invention can be understood in specific cases to those skilled in the art.

As shown in fig. 1-5, the fast-heat-dissipation solid-state chip heat sink includes two housings 1, a solid-state chip 2 is installed inside the two housings 1, an upper heat-dissipating plate 3 is installed at the upper end of the solid-state chip 2, a lower heat-dissipating plate 4 is installed at the lower end of the solid-state chip 2, and four buttons 5 are symmetrically arranged at the left and right ends of the lower heat-dissipating plate 4;

the front ends of the two shells 1 are provided with connecting grooves 6, the two shells 1 are respectively provided with a heat dissipation window 7, the upper end of the lower shell 1 is symmetrically provided with four fixed sleeves 8, the lower end of the upper shell 1 is symmetrically provided with four connecting columns 9, and the four connecting columns 9 at the lower end of the upper shell 1 are respectively embedded in the four fixed sleeves 8 at the upper end of the lower shell 1; the solid-state chip 2 is arranged between the four fixed sleeves 8 and the four connecting posts 9, and the front end of the solid-state chip 2 is provided with a connector 10; a plurality of heat dissipation holes 11 are symmetrically formed in the upper heat dissipation plate 3, a plurality of heat dissipation fins 12 are uniformly arranged at the upper end of the upper heat dissipation plate 3, four upper connection blocks 13 are symmetrically arranged at the left end and the right end of the upper heat dissipation plate 3, a connection sheet 14 is arranged at the lower end of each of the four upper connection blocks 13, and a chuck 15 is arranged at the outer end of each of the four connection sheets 14; a plurality of heat dissipation holes 11 are symmetrically formed in the lower heat dissipation plate 4, a plurality of heat dissipation fins 12 are uniformly arranged at the lower end of the lower heat dissipation plate 4, four lower connection blocks 16 are symmetrically arranged at the left end and the right end of the lower heat dissipation plate 4, a clamping groove 17 is formed in each of the upper ends of the four lower connection blocks 16, a limiting groove 18 is formed in each of the inner walls of the four clamping grooves 17, a telescopic groove 19 is formed in each of the outer ends of the four lower connection blocks 16, and the telescopic groove 19 penetrates through the outer end of each of the lower connection blocks; the inner sides of the four buttons 5 are respectively provided with a limiting column 20 inside the four telescopic grooves 19, and the outer side of the limiting column 20 is provided with an annular baffle 21.

It should be noted that, the utility model relates to a solid-state chip heat sink for fast heat dissipation, when in use, the connector 10 at the front end of the solid-state chip 2 is connected with the equipment, when the solid-state chip 2 is damaged, the two shells 1 can be separated firstly, the separation method is that the connecting column 9 is drawn out from the fixing sleeve 8, then the solid-state chip 2, the upper heat-dissipating plate 3 and the lower heat-dissipating plate 4 are taken out from the shell 1 together, then the four buttons 5 are pressed by hands respectively, the limiting column 20 at the inner side of the button 5 can push the clamping head 15 out from the limiting groove 18, then the upper heat-dissipating plate 3 is pulled upwards, so that the clamping head 15 and the connecting sheet 14 are drawn out from the clamping groove 17, at this moment, the solid-state chip 2 can be taken out, then the new solid-state chip 2 is placed on the lower heat-dissipating plate 4, then the upper heat-dissipating plate, the two housings 1 are fixed.

The basic principles and the main features of the invention and the advantages of the invention have been shown and described above. It will be understood by those skilled in the art that the present invention is not limited to the above embodiments, and that the foregoing embodiments and descriptions are provided only to illustrate the principles of the present invention without departing from the spirit and scope of the present invention. The scope of the invention is defined by the appended claims and equivalents thereof.

Claims (6)

1. Quick radiating solid state chip fin, its characterized in that: including two shells (1), two the internally mounted of shell (1) has solid-state chip (2), heating panel (3) are installed to the upper end of solid-state chip (2), heating panel (4) down are installed to the lower extreme of solid-state chip (2), the left and right sides both ends symmetry of heating panel (4) is provided with four buttons (5) down.

2. The fast dissipating solid state chip heat sink of claim 1 wherein: two spread groove (6), two have been seted up to the front end of shell (1) all be provided with one heat dissipation window (7), downside on shell (1) the upper end symmetry of shell (1) is provided with four fixed sleeving (8), upside the lower extreme symmetry of shell (1) is provided with four spliced poles (9), upside four spliced poles (9) of shell (1) lower extreme are embedded in the downside respectively in four fixed sleeving (8) of shell (1) upper end.

3. The fast dissipating solid state chip heat sink of claim 1 wherein: the solid-state chip (2) is arranged between four fixed sleeves (8) and four connecting columns (9), and the front end of the solid-state chip (2) is provided with a connector (10).

4. The fast dissipating solid state chip heat sink of claim 1 wherein: go up the heating panel (3) and go up the symmetry and seted up a plurality of louvre (11), the upper end of going up heating panel (3) evenly is provided with a plurality of fin (12), the left and right sides both ends symmetry of going up heating panel (3) is provided with four and goes up connecting block (13), four the lower extreme of going up connecting block (13) all is provided with one connection piece (14), four the outer end of connecting piece (14) all is provided with one dop (15).

5. The fast dissipating solid state chip heat sink of claim 1 wherein: a plurality of louvre (11) have been seted up to the symmetry on lower heating panel (4), the lower extreme of heating panel (4) evenly is provided with a plurality of fin (12) down, the both ends symmetry is provided with four lower connecting block (16), four about heating panel (4) down one draw-in groove (17), four have all been seted up to the upper end of lower connecting block (16) one spacing groove (18), four have all been seted up on the inner wall of draw-in groove (17) down one flexible groove (19) have all been seted up to connecting block (16) outer end down, flexible groove (19) are run through the outer end and the spacing groove (18) of connecting block (16) down.

6. The fast dissipating solid state chip heat sink of claim 1 wherein: the inner sides of the four buttons (5) are provided with a limiting column (20) in the four telescopic grooves (19), and the outer side of the limiting column (20) is provided with an annular blocking piece (21).

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