CN211577836U - Heat dissipation functional type main frame - Google Patents
Heat dissipation functional type main frame Download PDFInfo
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- CN211577836U CN211577836U CN202020544183.4U CN202020544183U CN211577836U CN 211577836 U CN211577836 U CN 211577836U CN 202020544183 U CN202020544183 U CN 202020544183U CN 211577836 U CN211577836 U CN 211577836U
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- cavity
- cooling
- host computer
- liquid storage
- cooling plate
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Abstract
The utility model discloses a heat dissipation functional type computer mainframe relates to computer technology field, including host computer body and two cooling plates, the cooling plate includes radiator fan, first cavity and second cavity, and the cooling inboard is equipped with the stock solution chamber between first cavity and second cavity, and the vertical third cavity that is equipped with that runs through in stock solution chamber top, cooling plate outer wall keep away from radiator fan one side and are equipped with a plurality of exhaust vent, and the exhaust vent link up with the second cavity, and the inside level of third cavity is equipped with a plurality of cooling pipe, and the inside fourth cavity that is equipped with of cooling pipe. The utility model discloses can carry out multiple cooling to the inside air current of getting into the host computer body and handle, can effectively strengthen the heat dissipation treatment effect to the inside of host computer body, the cooling treatment effeciency is high, guarantees the normal work of host computer, can increase the area of contact inside with the air current of third cavity, further improves the radiating effect to the inside air current of getting into the host computer body.
Description
Technical Field
The utility model relates to a computer technology field, more specifically say, the utility model relates to a heat dissipation functional type main frame.
Background
The computer host refers to a container (Mainframe) for placing a mainboard and other main components in a computer hardware system. Typically including a CPU, memory, hard disk, optical drive, power supply, and other input/output controllers and interfaces, such as USB controller, video card, network card, sound card, etc. The device inside the main cabinet is generally called as an interior device, and the device outside the main cabinet is generally called as an exterior device (such as a display, a keyboard, a mouse, an external hard disk, an external optical drive, etc.). Generally, the host itself (after being loaded with software) is a computer system capable of operating independently, and a computer with special purpose such as a server is usually only the host and has no other peripheral.
The existing computer host has poor heat dissipation effect, high heat generation amount during the operation of the host, low cooling treatment efficiency and easy influence on the normal operation of the host.
SUMMERY OF THE UTILITY MODEL
In order to overcome the above-mentioned defect of prior art, the embodiment of the utility model provides a heat dissipation functional type computer mainframe, the utility model aims to solve the problem that: how to enhance the heat dissipation effect of the computer host, improve the cooling efficiency and ensure the normal work of the host.
In order to achieve the above object, the utility model provides a following technical scheme: a heat dissipation functional computer host comprises a host body and two cooling plates, wherein the two cooling plates are symmetrically arranged on two sides in the host body, a cooling fan is arranged on one side, close to the inner wall of the host body, of the outer wall of each cooling plate, one side, far away from the outer wall of each cooling plate, of each cooling plate extends to the outer side of the host body, a first cavity is arranged on one side in the cooling plate, a second cavity is arranged on the other side in the cooling plate, a liquid storage cavity is arranged between the first cavity and the second cavity in the cooling plate, a third cavity vertically penetrates through the top of the liquid storage cavity, the cooling fan is communicated with the bottom of the first cavity, the first cavity is communicated with the top of the third cavity, the bottom of the third cavity is communicated with the second cavity, and a plurality of air outlet holes are formed in one side, far away from the cooling fan, of the outer wall of each cooling plate, the exhaust vent with the second cavity link up, the inside level of third cavity is equipped with a plurality of cooling tube, the inside fourth cavity that is equipped with of cooling tube, the fourth cavity with the stock solution chamber link up.
The embodiment of the utility model provides a heat dissipation function type computer mainframe, turn on the radiator fan, the radiator fan sends the air current in the air into the interior of cooling plate, the air current enters first cavity at first, then enters third cavity, and then enters second cavity, the air current of second cavity passes the exhaust vent and enters the interior of the main frame body to carry out heat dissipation and cooling treatment, the air current entering first cavity carries out preliminary cooling treatment under the effect of liquid storage cavity, the air current entering third cavity carries out cooling treatment again under the effect of liquid storage cavity, the air current entering second cavity carries out heat preservation treatment under the effect of liquid storage cavity, the heat dissipation treatment effect of the air current entering the interior of the main frame body can be further strengthened, the cooling treatment efficiency is high, the normal work of the main frame is guaranteed, the cooling liquid in the interior of liquid storage cavity enters the interior of fourth cavity, the cooling pipe can absorb heat to the air current entering third cavity, the contact area between the inside of the third cavity and the air flow can be increased, the heat dissipation effect of the air flow entering the main body is further improved, and the cooling treatment efficiency is enhanced, so that the problem in the background technology is solved.
In a preferred embodiment, a fixing frame is disposed outside the cooling fan, the fixing frame is fixedly connected with an outer wall of the main body, and the fixing frame is used for fixedly mounting the cooling fan.
In a preferred embodiment, the outer wall of the main body is provided with a dust screen outside the fixing frame, and the dust screen is used for preventing dust.
In a preferred embodiment, the volumes of the first cavity and the second cavity are equal, and the volume of the third cavity is greater than the volume of the first cavity, so that the cooling effect of the air flow passing through the cooling plate and entering the main body is good, and the heat dissipation effect of the air flow passing through the cooling plate and entering the main body is good.
In a preferred embodiment, the volume of the third cavity is smaller than that of the liquid storage cavity, so that the liquid storage cavity is enabled to perform good cooling treatment on the third cavity.
In a preferred embodiment, the stock solution chamber includes the vice stock solution chamber of first pair stock solution chamber and second, first pair stock solution chamber with the vice stock solution chamber of second link up, and first pair stock solution chamber outside is cooled down the processing to first cavity, and the vice stock solution chamber of second is outside to be cooled down the processing to the second cavity, and first pair stock solution chamber and the vice stock solution chamber of second cool down the processing to the third cavity jointly, and the treatment effect of cooling down is better.
In a preferred embodiment, adjacent two the interval of cooling tube is greater than the external diameter of cooling tube, and adjacent two the interval of cooling tube is less than the twice of cooling tube external diameter can guarantee the intensity of stock solution chamber when guaranteeing to get into the inside air current cooling effect of third cavity.
The utility model discloses a technological effect and advantage:
the utility model can carry out multiple cooling treatment on the air flow entering the interior of the main body by arranging the cooling plate, the cooling fan, the first cavity, the second cavity, the liquid storage cavity, the third cavity and the air outlet, can effectively enhance the cooling treatment effect on the interior of the main body, has high cooling treatment efficiency and ensures the normal work of the main body;
the utility model discloses a set up cooling tube and fourth cavity, can increase the area of contact of the inside and air current of third cavity, further improve the radiating effect to getting into the inside air current of host computer body, reinforcing cooling treatment effeciency.
Drawings
Fig. 1 is an overall front sectional view of the present invention.
Fig. 2 is an enlarged schematic view of a point a in fig. 1 according to the present invention.
Fig. 3 is a side view of the present invention as a whole.
Fig. 4 is a top sectional view of the liquid storage chamber of the present invention.
Fig. 5 is an enlarged schematic view of the present invention at C in fig. 4.
The reference signs are: the main engine comprises a main engine body 1, a cooling plate 2, a cooling fan 3, a first cavity 4, a second cavity 5, a liquid storage cavity 6, a third cavity 7, an air outlet hole 8, a cooling pipe 9, a fourth cavity 10, a fixing frame 11, a dust screen 12, a first auxiliary liquid storage cavity 13 and a second auxiliary liquid storage cavity 14.
Detailed Description
Example embodiments will now be described more fully with reference to the accompanying drawings. Example embodiments may, however, be embodied in many different forms and should not be construed as limited to the examples set forth herein; rather, these example embodiments are provided so that this disclosure will be thorough and complete, and will fully convey the concept of example embodiments to those skilled in the art. The drawings are merely schematic illustrations of the present disclosure and are not necessarily drawn to scale. The same reference numerals in the drawings denote the same or similar parts, and thus their repetitive description will be omitted.
Furthermore, the described features, structures, or characteristics may be combined in any suitable manner in one or more example embodiments. In the following description, numerous specific details are provided to give a thorough understanding of example embodiments of the disclosure. One skilled in the relevant art will recognize, however, that the subject matter of the present disclosure can be practiced without one or more of the specific details, or with other methods, components, steps, and so forth. In other instances, well-known structures, methods, implementations, or operations are not shown or described in detail to avoid obscuring aspects of the disclosure.
As shown in fig. 1-5, a heat dissipation functional computer mainframe comprises a mainframe body 1 and two cooling plates 2, wherein the two cooling plates 2 are symmetrically arranged at two sides inside the mainframe body 1, a cooling fan 3 is arranged at one side of the outer wall of the cooling plate 2 close to the inner wall of the mainframe body 1, one side of the cooling fan 3 far away from the outer wall of the cooling plate 2 extends to the outside of the mainframe body 1, a first cavity 4 is arranged at one side inside the cooling plate 2, a second cavity 5 is arranged at the other side inside the cooling plate 2, a liquid storage cavity 6 is arranged inside the cooling plate 2 between the first cavity 4 and the second cavity 5, a third cavity 7 is vertically arranged at the top of the liquid storage cavity 6 in a penetrating manner, the cooling fan 3 is communicated with the bottom of the first cavity 4, the first cavity 4 is communicated with the top of the third cavity 7, and the bottom of the third cavity 7 is communicated with the second cavity 5, a plurality of air outlet holes 8 are formed in one side, away from the cooling fan 3, of the outer wall of the cooling plate 2, and the air outlet holes 8 are communicated with the second cavity 5;
a fixing frame 11 is arranged outside the heat dissipation fan 3, the fixing frame 11 is fixedly connected with the outer wall of the host body 1, and the fixing frame 11 is used for fixedly mounting the heat dissipation fan 3;
the outer wall of the main body 1 is provided with a dustproof net 12 at the outer side of the fixed frame 11, and the dustproof net 12 is used for preventing dust;
the volumes of the first cavity 4 and the second cavity 5 are equal, and the volume of the third cavity 7 is larger than that of the first cavity 4, so that the air flow which passes through the cooling plate 2 and enters the main body 1 is ensured to have good cooling effect, and the heat dissipation effect on the interior of the main body 1 is good;
the volume of the third cavity 7 is smaller than that of the liquid storage cavity 6, so that the liquid storage cavity 6 has a good cooling treatment effect on the third cavity 7;
The implementation mode is specifically as follows: when in use, the cooling plate 2, the cooling fan 3, the first cavity 4, the second cavity 5, the liquid storage cavity 6, the third cavity 7 and the air outlet 8 are arranged, the cooling fan 3 is opened, the cooling fan 3 sends the airflow in the air into the cooling plate 2, the airflow firstly enters the first cavity 4, then enters the third cavity 7 and then enters the second cavity 5, the airflow in the second cavity 5 passes through the air outlet 8 and enters the main body 1 for cooling and heat dissipation, the airflow entering the first cavity 4 is subjected to primary cooling treatment under the action of the liquid storage cavity 6, the airflow entering the third cavity 7 is subjected to secondary cooling treatment under the action of the liquid storage cavity 6, the airflow entering the second cavity 5 is subjected to heat preservation under the action of the liquid storage cavity 6, the heat dissipation treatment effect of the airflow entering the main body 1 can be further enhanced, the cooling treatment efficiency is high, ensuring the normal work of the host; this embodiment has specifically solved current main frame among the background art, and the radiating effect is not good, and the host computer produces the high heat quantity at the during operation, and the cooling treatment effeciency is low, influences the problem of the normal work of host computer easily.
As shown in fig. 1-2 and fig. 4-5, the heat dissipation functional computer host further includes a plurality of cooling pipes 9 horizontally disposed inside the third cavity 7, a fourth cavity 10 is disposed inside the cooling pipes 9, and the fourth cavity 10 is communicated with the liquid storage cavity 6;
adjacent two the interval of cooling tube 9 is greater than the external diameter of cooling tube 9, and adjacent two the interval of cooling tube 9 is less than the twice of cooling tube 9 external diameter can guarantee the intensity of stock solution chamber 6 when guaranteeing to get into 7 inside air current cooling effects of third cavity.
The implementation mode is specifically as follows: during the use, through setting up cooling tube 9 and fourth cavity 10, the inside coolant liquid of stock solution chamber 6 gets into inside the fourth cavity 10, and cooling tube 9 can carry out the heat absorption cooling to the inside air current of getting into third cavity 7 and handle, can increase the area of contact of the inside of third cavity 7 with the air current, further improves the radiating effect to the inside air current of getting into host computer body 1, reinforcing cooling treatment effeciency.
The utility model discloses the theory of operation:
referring to the attached drawings 1-5 of the specification, by arranging the cooling plate 2, the cooling fan 3, the first cavity 4, the second cavity 5, the liquid storage cavity 6, the third cavity 7 and the air outlet hole 8, multiple cooling treatment can be performed on air flow entering the interior of the host body 1, the cooling treatment effect on the interior of the host body 1 can be effectively enhanced, the cooling treatment efficiency is high, and the normal work of the host is ensured;
further, referring to the attached drawings 1-2 and 4-5 in the specification, by arranging the cooling pipe 9 and the fourth cavity 10, the contact area between the inside of the third cavity 7 and the air flow can be increased, the heat dissipation effect of the air flow entering the main body 1 is further improved, and the cooling treatment efficiency is enhanced.
The points to be finally explained are: first, in the description of the present application, it should be noted that, unless otherwise specified and limited, the terms "mounted," "connected," and "connected" should be understood broadly, and may be a mechanical connection or an electrical connection, or a communication between two elements, and may be a direct connection, and "upper," "lower," "left," and "right" are only used to indicate a relative positional relationship, and when the absolute position of the object to be described is changed, the relative positional relationship may be changed;
secondly, the method comprises the following steps: in the drawings of the disclosed embodiments of the present invention, only the structures related to the disclosed embodiments are referred to, and other structures can refer to the common design, and under the condition of no conflict, the same embodiment and different embodiments of the present invention can be combined with each other;
and finally: the above description is only for the preferred embodiment of the present invention and should not be taken as limiting the invention, and any modifications, equivalent replacements, improvements, etc. made within the spirit and principle of the present invention should be included in the protection scope of the present invention.
Claims (8)
1. The utility model provides a heat dissipation functional type main frame, includes host computer body (1) and two cooling plate (2), its characterized in that: the two cooling plates (2) are symmetrically arranged on two sides in the main body (1), the outer wall of each cooling plate (2) is close to one side of the inner wall of the main body (1) and is provided with a cooling fan (3), one side of the outer wall of each cooling plate (2) far away from the cooling fan (3) extends to the outer side of the main body (1), one side in the inner part of each cooling plate (2) is provided with a first cavity (4), the other side in the inner part of each cooling plate (2) is provided with a second cavity (5), a liquid storage cavity (6) is arranged between the first cavity (4) and the second cavity (5) in the cooling plate (2), the top of the liquid storage cavity (6) vertically penetrates through a third cavity (7), the cooling fan (3) is communicated with the bottom of the first cavity (4), and the top of the third cavity (7) are communicated with the first cavity (4), third cavity (7) bottom with second cavity (5) link up, cooling plate (2) outer wall is kept away from radiator fan (3) one side is equipped with a plurality of exhaust vent (8), exhaust vent (8) with second cavity (5) link up, the inside level of third cavity (7) is equipped with a plurality of cooling pipe (9), cooling pipe (9) inside is equipped with fourth cavity (10), fourth cavity (10) with stock solution chamber (6) link up.
2. The host computer of claim 1, wherein: the heat dissipation fan (3) is externally provided with a fixing frame (11), and the fixing frame (11) is fixedly connected with the outer wall of the main machine body (1).
3. The host computer of claim 2, wherein: the outer wall of the main body (1) is provided with a dust screen (12) outside the fixed frame (11).
4. The host computer of claim 1, wherein: the volumes of the first cavity (4) and the second cavity (5) are equal.
5. The host computer of claim 4, wherein: the volume of the third cavity (7) is greater than the volume of the first cavity (4).
6. The host computer of claim 1, wherein: the volume of the third cavity (7) is smaller than that of the liquid storage cavity (6).
7. The host computer of claim 1, wherein: the liquid storage cavity (6) comprises a first auxiliary liquid storage cavity (13) and a second auxiliary liquid storage cavity (14), and the first auxiliary liquid storage cavity (13) is communicated with the second auxiliary liquid storage cavity (14).
8. The host computer of claim 1, wherein: the distance between every two adjacent cooling pipes (9) is larger than the outer diameter of each cooling pipe (9), and the distance between every two adjacent cooling pipes (9) is smaller than twice of the outer diameter of each cooling pipe (9).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202020544183.4U CN211577836U (en) | 2020-04-14 | 2020-04-14 | Heat dissipation functional type main frame |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202020544183.4U CN211577836U (en) | 2020-04-14 | 2020-04-14 | Heat dissipation functional type main frame |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN211577836U true CN211577836U (en) | 2020-09-25 |
Family
ID=72527469
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202020544183.4U Expired - Fee Related CN211577836U (en) | 2020-04-14 | 2020-04-14 | Heat dissipation functional type main frame |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN211577836U (en) |
-
2020
- 2020-04-14 CN CN202020544183.4U patent/CN211577836U/en not_active Expired - Fee Related
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| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20200925 Termination date: 20210414 |
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| CF01 | Termination of patent right due to non-payment of annual fee |