CN211565521U

CN211565521U - A wandering star wheel piece for crystal polishing

Info

Publication number: CN211565521U
Application number: CN201922312046.8U
Authority: CN
Inventors: 丁言国; 汪新伟; 叶崇志
Original assignee: Shanghai Sim Crystals Material Technology Co ltd
Current assignee: Shanghai Sim Crystals Material Technology Co ltd
Priority date: 2019-12-20
Filing date: 2019-12-20
Publication date: 2020-09-25
Anticipated expiration: 2029-12-20

Abstract

The utility model discloses a wandering star wheel piece for crystal polishing, including circular base plate, base plate sawtooth, processing station, water conservancy diversion hole, wafer, the wafer that waits to polish and polish is placed in processing station, the base plate sawtooth is through meshing mutually with the inside and outside ring gear of polishing equipment, drives the wandering star wheel piece and rotates to make the wafer rotate together, the upper and lower surface that goes into the wafer through the water conservancy diversion hole from top to bottom of polishing solution in the pivoted process, under the effect of two upper and lower polishing disks, realize polishing two upper and lower crystal faces of wafer simultaneously, effectively improve the polishing efficiency of wafer, reduce the processing cost of wafer; the polishing precision is high, the polishing efficiency is high, and the flow guide holes can effectively avoid the edge breakage phenomenon of the wafer; the processing stations are uniformly distributed on the circular substrate in an axial symmetry shape, so that the uniformity of the strength of the circular substrate is facilitated, and the phenomenon that the circular substrate is damaged due to nonuniform strength in the polishing process is avoided.

Description

A wandering star wheel piece for crystal polishing

Technical Field

The utility model relates to an intraocular lens processing technology field, concretely relates to a wandering star wheel piece for crystal polishing, two planes that especially can realize the crystal carry out the wandering star wheel piece of polishing simultaneously.

Background

At present, the LYSO/LSO crystal array used on PET-CT medical equipment generally needs to be subjected to grinding and polishing treatment on 6 surfaces forming the array crystal, so that the overall performance of the PET-CT medical equipment is improved, but because thousands of LYSO/LSO crystal strips need to be used on one PET-CT medical equipment, the efficiency of sequentially grinding and polishing by adopting a single crystal face cannot meet the production of large-batch LYSO/LSO crystal arrays traditionally, the production efficiency of enterprises is low, the problems of edge breakage, poor crystal face processing precision and high crystal processing cost exist, and the application of six-surface polished LYSO/LSO crystal arrays on the PET-CT medical equipment is severely restricted.

Therefore, in order to improve the efficiency of polishing six faces of LYSO/LSO crystals and reduce the processing cost of polishing six faces of crystals, improvements in the existing LYSO/LSO crystal polishing technology are needed.

SUMMERY OF THE UTILITY MODEL

In order to solve the technical problem, the utility model provides a wandering star wheel piece for crystal polishing, which is characterized by comprising a circular base plate, base plate sawteeth and a processing station; a plurality of processing stations are arranged on the circular substrate; the circular substrate is characterized in that a plurality of substrate sawteeth are arranged on the outer side of the circumference of the circular substrate, and the substrate sawteeth are evenly distributed along the circumference of the circular substrate.

Furthermore, the processing stations are arranged longitudinally and/or transversely and/or annularly along the circular arc of the circular substrate, and the processing stations are uniformly distributed on the circular substrate and are in axisymmetric patterns, so that the force of the planetary wheel sheets is uniform.

Furthermore, the processing station is of a square structure and penetrates through the circular base plate, and four corners of the processing station are provided with a flow guide hole.

Furthermore, the substrate sawteeth and the circular substrate are integrally formed, and the substrate sawteeth are meshed with an inner gear ring and an outer gear ring of the polishing equipment so as to drive the planetary wheel piece to rotate.

Furthermore, the circular substrate is made of FR-4 glass fiber board, the diameter is 100 mm-800 mm, the thickness of the substrate is 1 mm-50 mm, and the flatness of the upper surface and the lower surface of the circular substrate is consistent.

Furthermore, the length of the processing station is 10 mm-60 mm, and the width is 1 mm-40 mm.

Furthermore, the flow guide holes are circular through holes, the inner diameter of each flow guide hole is 1-4 mm, and the flow guide holes are uniformly distributed on four vertexes of the rectangular processing station by taking the four vertexes of the processing station as the center of a circle.

Furthermore, a wafer is arranged in the processing station, the wafer and the processing station are in clearance fit, the clearance is 0.1-0.3 mm, and the thickness of the wafer is 1-30 mm higher than that of the round substrate.

The utility model has the positive improvement effects that the problems of lower polishing efficiency and higher polishing processing cost of LYSO/LSO crystal six surfaces can be effectively solved, the use of the wandering star wheel sheet is simple and convenient, and the polishing efficiency of the wafer is effectively improved by adopting the upper crystal face and the lower crystal face to polish and polish simultaneously; the same type of the planetary wheel piece is adopted to grind and polish a large amount of wafers of the same type, so that the processing cost of the wafers is reduced; the flow guide holes and the wafers are in clearance fit with the processing stations, so that polishing liquid can uniformly flow into the upper surface and the lower surface of the wafers, the polishing precision is high, the polishing efficiency is high, the flow guide holes uniformly distributed on the four vertexes of the processing stations can effectively avoid the occurrence of edge breakage of the wafers, and the polishing cost of the wafers is reduced; the processing stations are uniformly distributed on the circular substrate in an axially symmetric shape, so that the uniformity of the strength of the circular substrate is facilitated, and the phenomenon that the circular substrate is damaged due to nonuniform strength in the polishing process is avoided, so that the application of the six-surface polished LYSO/LSO crystal array on the PET-CT medical equipment is promoted, and the overall performance of the PET-CT medical equipment is improved.

Drawings

Fig. 1 is a schematic sectional structure of the present invention.

Fig. 2 is a schematic view of the cross-sectional structure of the processing station of the present invention.

Fig. 3 is a schematic cross-sectional view of the wafer according to the present invention.

Figure 4 is a schematic illustration of the wafer double side polishing of the present invention.

The various references in the drawings are: 1-a circular substrate; 11-substrate serrations; 2-processing stations; 21-diversion holes; 3-wafer.

Detailed Description

The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.

Referring to fig. 1, the embodiment provides a planetary wheel sheet for crystal polishing, which comprises a circular substrate 1, substrate sawteeth 11 and a processing station 2; a plurality of processing stations 2 are arranged on a circular substrate 1; set up a plurality of base plate sawtooth 11 in the circumference outside circular base plate 1, base plate sawtooth 11 is along circular base plate 1's circumference evenly distributed, as shown in figure 4 in this embodiment, base plate sawtooth 11 drives the wandering star wheel piece and rotates through the inside and outside ring gear with polishing equipment 4 mutually to, can realize that the wandering star wheel piece can polish, polish to the wafer of large batch same kind of model, reduce the processing cost of wafer.

Referring to fig. 1, fig. 2 and fig. 3, the processing stations 2 are arranged longitudinally and/or transversely and/or annularly along the circular arc of the circular substrate 1, the processing stations 2 are uniformly distributed on the circular substrate and are in axisymmetric patterns, so that the planetary wheel pieces are uniformly stressed, the processing stations 2 are in square structures and penetrate through the circular substrate 1, and the four corners of the processing stations 2 are provided with flow guide holes 21. In the rotating process, polishing liquid enters the upper surface and the lower surface of the wafer 3 from top to bottom through the diversion holes 21, the diversion holes 21 are circular through holes, so that the polishing liquid can enter the upper surface and the lower surface of the wafer 3 to be polished through the gaps and the diversion holes 21, the wafer 3 is protected at the same time, the corners of the wafer 3 are prevented from being damaged during polishing, and the upper crystal face and the lower crystal face of the wafer 3 are polished simultaneously under the action of the upper polishing disk and the lower polishing disk.

As shown in fig. 4, the substrate saw teeth 11 are integrally formed with the circular substrate 1, and the substrate saw teeth 11 are engaged with the inner and outer gear rings of the polishing device 4, so as to drive the planetary wheel plate to rotate.

Referring to fig. 1, in the embodiment, the circular substrate 1 is made of FR-4 glass fiber board, the diameter is 100mm to 800mm, the thickness of the substrate is 1mm to 50mm, the flatness of the upper and lower surfaces of the circular substrate 1 is consistent, which is beneficial to the consistency of the flatness of two-side polishing, the length of the processing station 2 is 10mm to 60mm, and the width is 1mm to 40 mm; the flow guide holes 21 are circular through holes with the inner diameter of 1 mm-4 mm, and are uniformly distributed on four vertexes of the processing station 2 by taking the four vertexes of the processing station 2 as the center of a circle. The wafer 3 is arranged in the processing station 2, the wafer 3 is in clearance fit with the processing station 2, the clearance is 0.1-0.3 mm, and the thickness of the wafer 3 is 1-30 mm higher than that of the round substrate. The polishing solution can enter the upper surface and the lower surface of the wafer 3 to be polished through the gap and the diversion hole 21, simultaneously protect the wafer 3, prevent the corner of the wafer 3 from being damaged during polishing, and simultaneously polish the upper crystal face and the lower crystal face of the wafer 3 under the action of the upper polishing disk and the lower polishing disk.

The utility model provides an optimal wandering star wheel piece for crystal polishing in practical application, which comprises a circular base plate 1, a base plate sawtooth 11, a processing station 2, a diversion hole 21 and a wafer 3, wherein the circular base plate 1 is made of FR-4 glass fiber board, the hardness is higher, the diameter is phi 235mm, the thickness of the base plate is 15mm, the upper surface and the lower surface of the circular base plate 1 are parallel and consistent, and the base plate sawtooth 11 and the circular base plate 1 are integrally formed; the wafer 3 to be polished is placed in a processing station 2, the processing station 2 is rectangular and penetrates through the circular substrate 1, the length of the processing station 2 is 50mm, the width of the processing station 2 is 20mm, the processing stations 2 are uniformly distributed on the circular substrate 1 and are in an axisymmetric pattern, and the strength of the planetary wheel sheet is uniform; the substrate sawtooth 11 is meshed with the inner gear ring and the outer gear ring of the polishing device 4 to drive the planetary wheel piece to rotate, so that the wafer 3 rotates together, polishing liquid enters the upper surface and the lower surface of the wafer 3 from top to bottom in the rotating process through the flow guide holes 21, the flow guide holes 21 are circular through holes, the inner diameter is phi 2mm, four vertexes of the rectangular processing station 2 are used as the circle center and are uniformly distributed on the four vertexes of the rectangular processing station 2, the wafer 3 is rectangular and is in clearance fit with the processing station 2, the clearance is 0.2mm, the thickness of the wafer 3 is 3mm, the thickness of the circular substrate is 2mm, the polishing liquid can enter the upper surface and the lower surface of the wafer 3 to be polished through the clearance and the flow guide holes 21, the wafer 3 is protected, the corners of the wafer 3 are prevented from being damaged during polishing, and the upper crystal face and the lower crystal face of the.

As an embodiment of the present invention, it is obvious to those skilled in the art that the present invention is not limited to the details of the above exemplary embodiments, and that the present invention can be implemented in other specific forms without departing from the spirit or essential characteristics of the present invention, and is also within the scope of the present invention. The present embodiments are therefore to be considered in all respects as illustrative and not restrictive, the scope of the invention being indicated by the appended claims rather than by the foregoing description, and all changes which come within the meaning and range of equivalency of the claims are therefore intended to be embraced therein. Any reference sign in a claim should not be construed as limiting the claim concerned.

Furthermore, it should be understood that although the present description refers to embodiments, not every embodiment may contain only a single embodiment, and such description is for clarity only, and those skilled in the art should integrate the description, and the embodiments may be combined as appropriate to form other embodiments understood by those skilled in the art.

Claims

1. The wandering star wheel sheet for crystal polishing is characterized by comprising a circular base plate, base plate sawteeth and a processing station; a plurality of processing stations are arranged on the circular substrate; the circular substrate is characterized in that a plurality of substrate sawteeth are arranged on the outer side of the circumference of the circular substrate, and the substrate sawteeth are evenly distributed along the circumference of the circular substrate.

2. The idler wheel segment for crystal polishing according to claim 1, wherein said processing stations are arranged longitudinally and/or transversely and/or annularly along an arc of said circular base plate, and said processing stations are uniformly distributed on said circular base plate in an axisymmetric pattern to provide uniform forces on said idler wheel segment.

3. The planetary wheel plate for crystal polishing as claimed in claim 1, wherein said processing station has a square configuration and extends through a circular base plate, and a flow guide hole is provided at each of four corners of said processing station.

4. The planetary wheel plate for crystal polishing as claimed in claim 1, wherein the substrate teeth are formed integrally with the circular substrate, and the substrate teeth are engaged with the inner and outer ring gears of the polishing apparatus to rotate the planetary wheel plate.

5. The planetary wheel plate for crystal polishing as claimed in claim 4, wherein the circular substrate is made of FR-4 glass fiber plate with a diameter of 100mm to 800mm and a thickness of 1mm to 50mm, and the flatness of the upper and lower surfaces of the circular substrate is uniform.

6. A planetary wheel plate for crystal polishing as claimed in claim 3, wherein said processing stations have a length of 10mm to 60mm and a width of 1mm to 40 mm.

7. The planetary wheel blade for crystal polishing as claimed in claim 3, wherein the guiding holes are circular through holes with an inner diameter of 1mm to 4mm, and are uniformly distributed on four vertexes of the processing station with the four vertexes of the processing station as a center.

8. The planetary wheel plate for crystal polishing as claimed in claim 6, wherein the wafer is disposed in the processing station in a clearance fit with the processing station, the clearance is 0.1mm to 0.3mm, and the thickness of the wafer is 1mm to 30mm higher than that of the circular substrate.